Heat-resistant and yellowing-resistant LED lamp bead

Abstract

The utility model discloses a kind of heat-resistant and yellowing-resistant LED lamp beads, to provide a kind of heat-resistant and yellowing-resistant LED lamp beads with good heat resistance and high lighting quality, its technical solution main point is including mounting seat and LED chip, the mounting groove for installing LED chip and the lens compatible with mounting groove are equipped in the mounting seat, the mounting groove is also equipped with the silica gel fluorescent layer of LED chip cladding and the transparent protective silica gel layer outside the silica gel fluorescent layer, the mounting seat bottom is also equipped with welding structure. The utility model is applicable to LED lamp bead technical field.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, and more specifically, it relates to a heat-resistant and yellowing-resistant LED lamp bead. Background Technology

[0002] Existing LED chips face serious heat resistance issues during use. LED chips generate heat during operation, especially under high power or prolonged continuous operation, where heat accumulates. High temperatures negatively impact LED chip performance in several ways. First, it reduces luminous efficiency, resulting in less luminous flux emitted with the same electrical input and poorer lighting performance. Second, high temperatures affect color stability, causing the emitted light color to deviate from design requirements. Furthermore, excessively high temperatures accelerate the aging and damage of internal materials, shortening their lifespan and increasing operating costs and maintenance workload. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a heat-resistant and yellowing-resistant LED lamp bead with good heat resistance and high lighting quality.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a heat-resistant and yellowing-resistant LED bead, comprising a mounting base and an LED chip, wherein the mounting base is provided with a mounting groove for mounting the LED chip and a lens adapted to the mounting groove, the mounting groove is also provided with a silicone fluorescent layer covering the LED chip and a transparent protective silicone layer disposed outside the silicone fluorescent layer, and the bottom of the mounting base is also provided with a welding structure.

[0005] The present invention is further configured such that the refractive index of the silicone fluorescent layer is 1.41-1.53.

[0006] The present invention is further configured such that the thickness of the transparent protective silicone layer is 0.1-0.5 mm.

[0007] The present invention is further configured such that the welding structure includes three sets of weld points symmetrically distributed on the bottom side of the mounting base, wherein the outer set of weld points extends to the outside of the mounting base.

[0008] The present invention is further provided with a thermally conductive silicone grease layer between the LED chip and the base.

[0009] The present invention is further configured such that: the mounting base is made of aluminum nitride material, and its surface is provided with a high reflectivity aluminum layer.

[0010] The beneficial effects of this utility model are:

[0011] 1. The mounting slot within the mounting base precisely matches the LED chip, facilitating chip installation and positioning. This ensures the chip is accurately placed in the correct position, guaranteeing normal light emission and performance stability. Simultaneously, the lens, compatible with the mounting slot, works well with the chip to effectively focus and diffuse light, improving light utilization and illumination effect. The LED chip's mounting slot contains a silicone fluorescent layer covering the LED chip and an outer transparent protective silicone layer. These two silicone layers play a crucial role in enhancing heat resistance. The silicone material itself possesses excellent thermal stability and insulation properties. The silicone fluorescent layer provides the fluorescent material needed for LED chip emission while effectively preventing the rapid dissipation of heat generated by the chip, avoiding excessive heat concentration around the chip. The transparent protective silicone layer further enhances the insulation effect, allowing the heat generated by the chip during operation to be transferred to the external environment more slowly, thereby reducing the chip's operating temperature. The welding structure at the bottom of the mounting base facilitates the connection between the LED chip and external circuitry. Through welding, the LED chip can be firmly fixed to the circuit board, achieving a stable electrical connection.

[0012] 2. When light propagates through different media, reflection and refraction occur due to differences in refractive index. When the refractive index of the silicone phosphor layer is within the specific range of 1.41-1.53, it can better match the refractive index of the LED chip and other surrounding media, significantly reducing light reflection loss at the silicone phosphor layer interface. For example, if the refractive index difference is too large, some light will be reflected back at the interface and cannot propagate effectively, resulting in reduced luminous efficiency of the LED. A suitable refractive index allows more light to pass through the silicone phosphor layer smoothly, thereby improving the overall luminous efficiency of the LED and allowing it to emit brighter light while consuming the same amount of electrical energy.

[0013] 3. The thickness of the transparent protective silicone layer is set between 0.1-0.5mm, achieving a delicate balance between protective performance and light transmittance. From a protective perspective, this thickness range is sufficient to form an effective barrier, preventing external dust, moisture, oxygen, and other contaminants from corroding the internal silicone fluorescent layer and LED chip. Regarding light transmittance, an excessively thick protective layer increases light loss during propagation, reducing the luminous efficiency of the LED. A thickness of 0.5mm or less ensures that most light passes through smoothly, preventing a significant reduction in the luminous intensity of the LED due to the protective layer. The welding structure employs a three-set symmetrical solder joint design on the bottom side of the mounting base, providing a stable mechanical connection for the LED. The symmetrically distributed solder joints ensure even stress distribution when the LED is soldered to the circuit board, reducing the likelihood of loosening or tilting and guaranteeing the stability of the LED during use. One set of solder joints extends beyond the mounting base, allowing for more flexible installation on different types of circuit boards, enhancing the LED's versatility and adaptability.

[0014] 4. LED chips generate a significant amount of heat during operation, and rapid heat dissipation is crucial for chip performance and lifespan. A thermal grease layer, located between the LED chip and its socket, possesses excellent thermal conductivity. This grease fills the tiny gaps between the chip and socket, eliminating air. Air is a poor conductor of heat, hindering heat transfer, while the grease allows heat to flow more smoothly from the chip to the socket, and then dissipate into the surrounding environment. Aluminum nitride (Anitride) has high thermal conductivity, making it an excellent heat dissipation material. A mounting base made of Anitride can quickly conduct the heat generated by the chip, reducing its operating temperature. Compared to traditional mounting base materials, Anitride mounting bases allow the LED to maintain good performance even at high temperatures, reducing light decay and color drift caused by high temperatures, and improving the stability and reliability of the LED. The high-reflectivity aluminum layer on the mounting base surface reflects the light emitted by the LED chip towards the desired illumination direction, minimizing light loss. Attached Figure Description

[0015] Figure 1 This is the front view of the present invention;

[0016] Figure 2 This is a cross-sectional view of the present invention;

[0017] Figure 3 This is a rear view of the present invention;

[0018] Figure 1-3 Reference numerals: 1. Mounting base; 2. LED chip; 3. Mounting groove; 4. Lens; 5. Silicone fluorescent layer; 6. Transparent protective silicone layer; 7. Solder joint; 8. Thermal grease layer. Detailed Implementation

[0019] Reference Figures 1 to 3 The embodiments of this utility model will be further described below.

[0020] For ease of explanation, spatial relative terms such as “up,” “down,” “left,” and “right” are used in the embodiments to describe the relationship of one element or feature shown in the figures relative to another element or feature. It should be understood that, in addition to the orientations shown in the figures, spatial terms are intended to include different orientations of the device in use or operation. For example, if the device in the figures is inverted, an element described as being “down” of other elements or features would be positioned “up” of those other elements or features. Therefore, the exemplary term “down” can encompass both up and down orientations. The device may be positioned in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0021] Moreover, relational terms such as “first” and “second” are used merely to distinguish one component from another that has the same name, without necessarily requiring or implying any such actual relationship or order between the components.

[0022] Figures 1 to 3 The illustrated heat-resistant and yellowing-resistant LED bead includes a mounting base 1 and an LED chip 2. The mounting base 1 has a mounting groove 3 for mounting the LED chip 2 and a lens 4 adapted to the mounting groove 3, facilitating chip installation and positioning, ensuring the chip is accurately placed in the appropriate position, and guaranteeing normal light emission and performance stability of the LED bead. Simultaneously, the lens 4 adapted to the mounting groove 3 works well with the chip to achieve effective focusing and diffusion of light, improving light utilization and illumination effect. The mounting groove 3 also contains a silicone fluorescent layer covering the LED chip 2 and a transparent protective silicone layer 6 disposed outside the silicone fluorescent layer. The bottom of the mounting base 1 also has a welding structure. These two silicone layers play a key role in improving heat resistance. The silicone material itself has good thermal stability and heat insulation properties. The silicone fluorescent layer provides the fluorescent material required for LED chip 2 to emit light while effectively preventing the rapid outward diffusion of heat generated by the chip, avoiding excessive heat concentration around the chip. The transparent protective silicone layer 6 further enhances the heat insulation effect, allowing the heat generated by the chip during operation to be transferred to the external environment more slowly, thereby reducing the chip's operating temperature. The welding structure at the bottom of the mounting base 1 facilitates the connection between the LED beads and the external circuit. By welding, the LED beads can be firmly fixed on the circuit board and a stable electrical connection can be achieved.

[0023] The refractive index of the silicone phosphor layer is 1.41-1.53. Within this specific range, it can better match the refractive index of the LED chip 2 and other surrounding media, significantly reducing light reflection loss at the silicone phosphor layer interface. The refractive index is directly related to the propagation, reflection, and refraction properties of light. If it is too high or too low, the absorption, conduction, or emission efficiency of the phosphor layer may decrease, affecting the intensity and stability of the fluorescence effect. For example, if the refractive index difference is too large, some light will be reflected back at the interface and cannot propagate effectively, leading to a reduction in the luminous efficiency of the LED. A refractive index that is too low may prevent some of the fluorescence generated by the phosphor layer from effectively "emitting" out of the material, instead being absorbed after multiple internal reflections, further weakening the fluorescence effect. A suitable refractive index allows more light to pass smoothly through the silicone phosphor layer, thereby improving the overall luminous efficiency of the LED and allowing it to emit brighter light while consuming the same amount of electrical energy.

[0024] The thickness of the transparent protective silicone layer 6 is 0.1-0.5mm. Within this suitable thickness range, it allows the LED bead to transmit pure and bright light with high light transmittance, creating a clear and comfortable lighting atmosphere. It is not too thick, which would result in excessive absorption or scattering of light, leading to loss of luminous flux and poor light uniformity, and would also hinder heat dissipation, causing the internal temperature of the LED bead to rise. Conversely, it is not too thin, which would fail to provide a stable optical environment, significantly reducing its protective capabilities. It would be difficult to effectively block external dust, moisture, and tiny particles, which can easily penetrate the silicone layer and enter the LED bead, adhering to the chip surface and affecting the chip's normal light emission, leading to reduced luminous efficiency and the appearance of light spots.

[0025] The welding structure includes three sets of solder points 7 symmetrically distributed on the bottom side of the mounting base 1, providing a stable mechanical connection for the LED chips. The symmetrically distributed solder points 7 ensure even stress distribution when the LED chips are soldered onto the circuit board, reducing the likelihood of loosening or tilting and guaranteeing the stability of the LED chips during use. The outer set of solder points 7 extends beyond the mounting base 1, allowing for more flexible installation of the LED chips on different types of circuit boards, enhancing their versatility and adaptability.

[0026] A thermally conductive grease layer 8 is also provided between the LED chip 2 and the base, which has good thermal conductivity. The thermally conductive grease can fill the tiny gaps between the chip and the base, excluding the air. Because air is a poor conductor of heat, it will hinder the transfer of heat, while the thermally conductive grease allows heat to be conducted more smoothly from the chip to the base, and then dissipated into the surrounding environment through the base.

[0027] The mounting base 1 is made of aluminum nitride, which has high thermal conductivity and is an excellent heat dissipation material. The mounting base 1 made of aluminum nitride can quickly conduct away the heat generated by the chip, reducing the chip's operating temperature. Compared to traditional mounting base materials, the aluminum nitride mounting base 1 allows the LED chip to maintain good performance even in high-temperature environments, reducing light decay and color drift caused by high temperatures, and improving the stability and reliability of the LED chip. The high-reflectivity aluminum layer on the surface of the mounting base 1 can reflect the light emitted by the LED chip 2 towards the direction requiring illumination, reducing light loss. The above description is only a preferred embodiment of this utility model and is not intended to limit the utility model. Ordinary variations and substitutions made by those skilled in the art within the scope of this utility model's technical solution should be included within the protection scope of this utility model.

Claims

1. A heat-resistant and yellowing-resistant LED bead, comprising a mounting base (1) and an LED chip (2), characterized in that, The mounting base (1) is provided with a mounting groove (3) for mounting LED chip (2) and a lens (4) adapted to the mounting groove (3). The mounting groove (3) is also provided with a silicone fluorescent layer covering the LED chip (2) and a transparent protective silicone layer (6) disposed outside the silicone fluorescent layer. The bottom of the mounting base (1) is also provided with a welding structure.

2. The heat-resistant and yellowing-resistant LED bead according to claim 1, characterized in that, The refractive index of the silicone fluorescent layer is 1.41-1.

53.

3. The heat-resistant and yellowing-resistant LED bead according to claim 1, characterized in that, The thickness of the transparent protective silicone layer (6) is 0.1-0.5 mm.

4. The heat-resistant and yellowing-resistant LED bead according to claim 1, characterized in that, The welding structure includes three sets of weld points (7) symmetrically distributed on the bottom side of the mounting base (1), and the outer set of weld points (7) extends to the outside of the mounting base (1).

5. The heat-resistant and yellowing-resistant LED bead according to claim 1, characterized in that, A thermally conductive silicone grease layer (8) is also provided between the LED chip (2) and the base.

6. The heat-resistant and yellowing-resistant LED bead according to claim 1, characterized in that, The mounting base (1) is made of aluminum nitride and has a high reflectivity aluminum layer on its surface.

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