Movable leveling type semiconductor detection support

Abstract

The utility model discloses mobile leveling type semiconductor detection support relates to semiconductor detection technical field. The detection support includes sliding base frame, probe adjustment sliding block, mobile installation on the sliding base frame, probe adjustment sliding block is used for directly or indirectly with detection probe fixed connection, support positioning leveling assembly is used for with the detection window positioning, fixed connection and leveling of sliding base frame, support positioning leveling assembly includes detection window positioning assembly and micro distance adjusting assembly, through detection window positioning assembly fixed connection of the through sliding base frame with the opening on the detection window, through micro distance adjusting assembly fine adjustment sliding base frame and the distance of detection window. Through support positioning leveling assembly realizes integral leveling and inhibits the influence of thermal expansion, realizes that detection probe can install positioning at any position, and test position is positioned at will, and compatible with the change of various size substrate and tray.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor testing technology, specifically relating to a movable leveling semiconductor testing bracket. Background Technology

[0002] Metal-organic chemical vapor deposition (MOCVD) equipment, as the core equipment for the development and mass production of compound semiconductor epitaxial materials, possesses unique advantages for large-scale industrial production and is irreplaceable in the manufacturing of optoelectronic devices such as LEDs and laser diodes. This equipment achieves vapor-phase epitaxial film formation on substrates such as sapphire and gallium arsenide by thermally decomposing group III metal-organic compounds (such as trimethylgallium) and group V hydrides (such as ammonia) under hydrogen or nitrogen atmospheres. The growth rate can be precisely controlled to the nanometer scale. Because thin film growth involves atomic-level precision, process parameters must be strictly monitored, including temperature (affecting growth rate and crystal quality), reflectivity (reflecting film thickness uniformity), emissivity, and warpage (related to substrate stress distribution). In-situ monitoring technologies (such as real-time temperature measurement using infrared pyrometers, optical reflectivity-corrected film thickness, and warpage monitoring equipment) are crucial for ensuring process stability, providing real-time feedback and optimization of the growth process.

[0003] The epitaxial growth process of thin films on substrates using MOCVD equipment requires processing temperatures between 500°C and 1300°C. Therefore, monitoring equipment is typically located outside the reaction chamber to avoid the high temperatures, high pressures, and corrosive chemicals within the chamber. The detector head of the monitoring equipment can be fixedly mounted and corresponds to the aperture-type quartz window 1 of the monitoring section at the top of the reaction chamber for non-contact monitoring of process parameters such as temperature, reflectivity, emissivity, and tortuosity, thereby precisely controlling the epitaxial film growth process.

[0004] In the prior art, the perforated quartz window 1 is a fixed porous structure, see [link to previous text]. Figure 1 To fix the size of the monitoring window and match it with the optical path channel size of the monitoring equipment, ensuring measurement accuracy and reducing the thermal impact of heat inside the cavity on the outside; however, different substrate sizes and changes in substrate size and position make it impossible to adjust the test position, and it is not compatible with various substrate and tray sizes (for example, some ideal monitoring positions are between adjacent holes in the fixed porous structure, which affects the monitoring process). Existing technologies have systems that use movable monitoring probes to adjust the position of the monitoring probe, but such systems involve motion structures, control systems, etc., significantly increasing costs and making the systems too complex for large-scale applications. Moreover, they also do not solve the problem of the fixed porous structure's hole type quartz window 1.

[0005] In addition, the detector head of the monitoring equipment is affected by different thermal effects of different deposition temperatures in the chamber (processing temperature between 500℃ and 1300℃), resulting in large fluctuations in the probe measurement accuracy. The monitoring window and probe mounting components are also affected by heat, causing large deformations that affect the accurate determination of the probe installation position. Furthermore, the probe position may undergo slight deformations during use, reducing measurement accuracy.

[0006] It should be noted that this part of the present invention only provides background technology related to the present invention, and does not necessarily constitute prior art or known technology. Utility Model Content

[0007] The purpose of this invention is to overcome the problems of existing technologies, such as different substrate sizes, changes in substrate size and position, inability to adjust the test position, incompatibility with various substrate and tray sizes, large deformation of the monitoring window and probe mounting components due to heat affecting the accurate determination of the probe installation position, and slight deformation of the probe position during use, which reduces measurement accuracy. This invention provides a movable, leveling semiconductor testing bracket that achieves overall leveling and suppresses the effects of thermal expansion through a sliding base and bracket positioning and leveling components, reducing deformation due to force and heat. This allows the testing probe to be installed and positioned at any location, and the test position to be arbitrary, compatible with various substrate and tray sizes.

[0008] To achieve the above objectives, this utility model provides a movable leveling semiconductor testing bracket, comprising:

[0009] A sliding base frame is fixedly connected to the detection window on the deposition chamber cover;

[0010] The probe adjustment slider is movably mounted on the sliding base and can be fixed at any position along the length of the sliding base; the probe adjustment slider is used for direct or indirect fixed connection with the detection probe;

[0011] A bracket positioning and leveling assembly is used to position, fix, and level the sliding base frame and the detection window; the bracket positioning and leveling assembly includes a detection window positioning assembly and a micro-distance adjustment assembly; the detection window positioning assembly is fixedly connected to the sliding base frame through an opening on the detection window; the micro-distance adjustment assembly finely adjusts the distance between the sliding base frame and the detection window.

[0012] Optionally, the probe adjustment slider is used to indirectly and fixedly connect to the detection probe by: setting a transition connector and a probe fine-tuning component; the transition connector is used for the transition connection between the probe adjustment slider and the probe fine-tuning component; the probe fine-tuning component is used for fixed connection with the detection probe, leveling, and force buffering.

[0013] Optionally, the probe fine-tuning assembly includes a probe mounting plate, a lower connecting plate, a tensioning buffer, a leveling rod, and a fulcrum ball; the probe mounting plate is used to be fixedly connected to the detection probe; the lower connecting plate is used to be fixedly connected to the transition connector; the tensioning buffer is used to tension the probe mounting plate and the lower connecting plate; the leveling rod enables fine-tuning of the distance between different positions of the probe mounting plate and the lower connecting plate; and the fulcrum ball is used to achieve a fixed interval between the probe mounting plate and the lower connecting plate.

[0014] Optionally, the detection window positioning components are respectively arranged in the bracket positioning and leveling components at both ends of the sliding base frame, and the detection window positioning components are arranged diagonally.

[0015] Optionally, the detection window positioning assembly includes a positioning rod, a fastening nut, a detection window threaded sleeve, a lower inclined block, and an upper inclined block; the micro-distance adjustment assembly includes a fine-tooth adjustment rod, an adjustment cap, and a sliding base threaded sleeve.

[0016] Optionally, the sliding base frame includes a base frame body, a sliding protrusion, a viewing window groove, and a sliding groove; the sliding groove is provided at the junction of the sliding protrusion and the base frame body, and the sliding protrusion protrudes from the base frame body to support the movable probe adjustment slider.

[0017] Optionally, the probe adjustment slider is externally fitted to the groove of the sliding groove, and the sliding groove is one of a triangular groove, a rectangular groove, a trapezoidal groove, or an arc groove; the width of the viewing window groove is 15-30mm.

[0018] Optionally, the fine-thread adjusting rod is a fine-thread screw with a thread pitch of 0.15-0.30mm.

[0019] Optionally, the probe adjustment slider further includes an adjustment protrusion, a slider base, a slider sidewall, a slider top wall, a sidewall adjustment hole, and a top wall fixing component. The adjustment protrusion includes an adjustment protrusion sidewall and an adjustment protrusion inclined surface. The top wall fixing component provided on the slider top wall positions the adjustment protrusion. The sidewall adjustment hole is provided on the slider sidewall. By engaging the threaded rod with the threaded hole, the adjustment protrusion sidewall can be tightened and loosened, thereby achieving fine adjustment of the slider base position.

[0020] Optionally, the sliding base frame further includes a base frame sidewall, which is spaced apart from the detection window and extends to below the top of the detection window.

[0021] Beneficial effects:

[0022] This utility model provides a movable leveling semiconductor testing bracket. The bracket positioning and leveling components include a testing window positioning component and a micro-distance adjustment component. The testing window positioning component is connected to the testing window to match the thermal and stress effects of the testing window, which facilitates precise matching and positioning. The micro-distance adjustment component finely adjusts the distance between the sliding base and the testing window, enabling overall leveling when unevenness is found after the sliding base is installed on the testing window.

[0023] In summary, a movable leveling semiconductor testing bracket achieves overall leveling and suppresses the effects of thermal expansion through a sliding base and bracket positioning and leveling components, reducing deformation under stress and thermal influence. This allows the testing probe to be installed and positioned at any location, and the testing position to be arbitrarily located, compatible with substrates and trays of various sizes. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A schematic diagram of a perforated quartz window in the prior art;

[0026] Figure 2 This is a schematic diagram of the structure of the movable leveling semiconductor detection bracket provided in an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the structure of the top of the detection window provided in an embodiment of the present utility model;

[0028] Figure 4 This is a schematic diagram of the structure of the sliding base frame provided in an embodiment of the present utility model;

[0029] Figure 5 A partially enlarged schematic diagram of the bracket positioning and leveling assembly provided in an embodiment of this utility model;

[0030] Figure 6 This is a schematic cross-sectional view of the bracket positioning and leveling assembly provided in an embodiment of the present utility model.

[0031] Figure 7 This is a schematic diagram of the probe fine-tuning component provided in an embodiment of the present invention;

[0032] Figure 8 This is a schematic diagram of the structure of the adjusting protrusion provided in an embodiment of the present invention.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1-Aperture quartz window; 2-Deposition chamber cover; 3-Detection window; 4-Sliding base; 41-Base body; 42-Sliding protrusion; 43-Viewing window slot; 44-Sliding groove; 45-Base sidewall; 5-Probe adjusting slider; 50-Adjusting protrusion; 51-Slider base; 52-Slider sidewall; 53-Slider top wall; 54-Side wall adjusting hole; 55-Top wall fixing component; 501-Adjusting protrusion sidewall; 502-Adjusting protrusion inclined surface; 6-Support positioning and leveling assembly; 1-Detection window positioning assembly; 62-Micro-distance adjustment assembly; 611-Positioning rod; 612-Fastening nut; 613-Detection window threaded sleeve; 614-Lower inclined block; 615-Upper inclined block; 616-Gap; 621-Fine thread adjustment rod; 622-Adjusting cap; 623-Sliding base threaded sleeve; 7-Transition connecting block; 8-Probe fine adjustment assembly; 81-Probe mounting plate; 82-Lower connecting plate; 83-Tightening buffer; 84-Leveling rod; 85-Pivot ball. Detailed Implementation

[0035] In this utility model, unless otherwise stated, directional terms such as "up," "down," "left," and "right" are generally understood in conjunction with the accompanying drawings and the directions shown in actual applications.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the ranges, the endpoint values ​​of the ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein. The terms "optional" and "discretionary" mean that they may or may not be included (or may or may not be present).

[0039] To overcome the problems of existing technologies, such as inconsistent substrate sizes and positions leading to unadjustable test positions, incompatibility with various substrate and tray sizes, significant deformation of the monitoring window and probe mounting components due to heat affecting accurate probe positioning, and micro-deformation of the probe position during use reducing measurement accuracy, this invention is proposed based on further research.

[0040] Combined with reference Figures 2 to 8 This utility model embodiment provides a movable leveling semiconductor testing bracket, comprising:

[0041] A detection window 3 is located on the deposition chamber cover 2. This window communicates with the deposition chamber, enabling monitoring of the epitaxial film growth on the substrate within the chamber. By real-time acquisition of multi-dimensional process parameters such as temperature distribution, optical reflection characteristics, thermal radiation parameters, and substrate deformation data, closed-loop precise control of the film epitaxial growth process is achieved. The detection window 3 employs an innovative integrated design, with its top consisting of a single, integral quartz window 31 supported by a frame 32. This structure overcomes the limitations of traditional multi-hole windows. The integral quartz window 31 uses a single piece of high-purity quartz glass without any physical barriers, significantly increasing the effective light-transmitting area. This allows for continuous panoramic observation of the substrate surface, eliminating the visual blind spots of traditional multi-hole windows. The integrated design significantly improves the monitoring integrity and data reliability of the MOCVD process.

[0042] The sliding base frame 4 is supported on the top of the detection window 3 and is fixedly connected to the detection window 3. It serves as a movable support platform to support the movement of the probe mounting components and their positioning at any position, thereby achieving precise positioning and stable holding of the detection probe within the process plane and meeting the process requirements of semiconductor equipment for adjusting the position of the detection components.

[0043] The probe adjustment slider 5 is movably mounted on the sliding base 4 and can be fixed at any position along the length of the sliding base 4; the probe adjustment slider 5 is used to directly or indirectly fix and connect to the detection probe.

[0044] The sliding base frame 4 includes a base frame body 41, a sliding protrusion 42, a viewing window groove 43, and a sliding groove 44. The base frame body 41 is used to be fixedly connected to the detection window 3. The base frame body 41 spans across the top of the detection window 3 and can be rectangular. There is no gap between the base frame body 41 and the top of the detection window 3, and the detection window 3 provides stable support for the sliding base frame 4. The sliding protrusion 42 protrudes from the base frame body 41 and is used to support the movable probe adjustment slider 5. There are multiple probe adjustment sliders 5, which are used to connect and support the detection probe, adjust the installation position, and realize the movable positioning of the detection probe in any position.

[0045] A sliding groove 44 is provided at the junction of the sliding protrusion 42 and the base frame 41. The probe adjustment slider 5 is externally wrapped and engages with the groove of the sliding groove 44. The sliding groove 44 and the probe adjustment slider 5 provide stable sliding support and prevent slippage. At the same time, the sliding protrusion 42 and the sliding groove 44 reduce the contact between the probe adjustment slider 5 and the sliding base frame 4, which can reduce the thermal impact of the deposition chamber, thereby suppressing the thermal expansion of the upper component connected to the detection probe and improving detection accuracy. The viewing window groove 43 penetrates the base frame 41 and the sliding protrusion 42 to provide a detection channel. It is known that the probe adjustment slider 5 is fixedly connected to the base frame 41; the fixing method can be a detachable fixing connection such as bolt connection. The sliding groove 44 can be a triangular groove, rectangular groove, trapezoidal groove, arc groove, etc., and is not specifically limited here; the width of the viewing window groove is 15-30mm. Preferably, the sliding groove 44 is a triangular groove, which provides a stable sliding structure and has a smaller contact area with the lower part. As can be seen, the probe adjustment slider 5 has a matching sliding structure that matches the shape of the sliding groove 44 to achieve stable sliding.

[0046] The bracket positioning and leveling assembly 6 is used to position, fix, and level the sliding base 4 and the detection window 3. Because the sliding base 4 is directly fixed to the detection window 3, the detection window 3 is susceptible to deformation due to heat. The detection window 3 employs an innovative integrated design with a large window; while the integral quartz window 31 provides a large viewing window, it also increases the heat transmitted from the deposition chamber, increasing the thermal impact on the upper part. The large viewing window, with its dispersed support from the multi-hole window, increases the possibility of deformation under pressure, leading to greater potential for thermal impact and stress deformation in the detection window 3. By setting up the bracket positioning and leveling assembly 6 to level the sliding base 4, the potential for greater thermal impact and stress deformation in the detection window 3 can be greatly reduced. The bracket positioning and leveling assembly 6 consists of two sets, respectively located at both ends of the sliding base 4 for fixation.

[0047] The bracket positioning and leveling assembly 6 includes a detection window positioning assembly 61 and a micro-distance adjustment assembly 62. The detection window positioning assembly 61 is fixedly connected to the detection window 3 through the opening on the sliding base 4, thus connecting with the base of the detection window 3 and facilitating stable positioning of the sliding base 4. Furthermore, the connection between the detection window positioning assembly 61 and the detection window 3 allows for matching with the thermal and stress effects of the detection window 3, facilitating precise positioning. The micro-distance adjustment assembly 62 fine-tunes the distance between the sliding base 4 and the detection window 3, allowing the sliding base 4 to partially not contact the top of the detection window 3. This micro-adjustment moves the sliding base 4 away from or closer to the top of the detection window 3, enabling leveling when unevenness is found after the sliding base 4 is installed on the detection window 3, thereby improving the measurement accuracy of the detection equipment.

[0048] Furthermore, in the bracket positioning and leveling components 6 respectively set at both ends of the sliding base frame 4, the detection window positioning component 61 is diagonally arranged, that is, located at opposite corners of the rectangular sliding base frame 4; the detection window positioning component 61 is fixed to the detection window 3 at the farthest corner of the rectangular sliding base frame 4, which facilitates accurate positioning of the sliding base frame 4 as a whole, and also facilitates overall matching with the top of the detection window 3, achieving a generally tight fit and stable support positioning even if the detection window 3 is deformed; at the same time, the leveling of the sliding base frame 4 is achieved through the cooperation of the micro-distance adjustment component 62, which is also set diagonally. The detection window positioning component 61 and the micro-distance adjustment component 62 can be existing structures for achieving positioning and leveling.

[0049] For example, a preferred adjustment structure is as follows: the detection window positioning assembly 61 includes a positioning rod 611, a fastening nut 612, a detection window threaded sleeve 613, a lower inclined block 614, and an upper inclined block 615. The detection window threaded sleeve 613 is fixedly connected to the opening on the detection window 3, and the detection window threaded sleeve 613 is threaded; the threaded positioning rod 611 passes through the opening on the sliding base 4 and is fixedly connected to the threaded detection window threaded sleeve 613 by engaging with the thread; the lower inclined block 614 and the upper inclined block 615 are pressed down by the fastening nut 612 on the upper part of the sliding base 4, thereby realizing the positioning and fixed connection between the sliding base 4 and the detection window 3; the threaded positioning rod 611 passes through the opening on the sliding base 4 and engages with the threaded detection window threaded sleeve 613 by engaging with the thread. The two ends of the detection window 3 are fixedly connected. The positioning rod 611 extends into the base of the detection window 3, which can achieve stable support and positioning. At the same time, extending into the base can disperse the deformation feedback of the detection window 3 to the sliding base 4, reducing the impact on the sliding base 4. The two ends and the middle part of the detection window 3 are heated differently, which makes them prone to deformation. At the end of the sliding base 4, where the bracket positioning and leveling component 6 is located, there is a gap 616, which helps to reduce the impact of the different heating of the two ends and the middle part of the detection window 3 on the level of the sliding base 4, and helps to improve the measurement accuracy.

[0050] The micro-distance adjustment component 62 includes a fine-pitch adjustment rod 621, an adjustment cap 622, and a sliding base threaded sleeve 623. The sliding base threaded sleeve 623 is fixedly connected to an opening on the sliding base 4. The fine-pitch adjustment rod 621 abuts against the top of the detection window 3, which facilitates more sensitive reflection of the deformation of the detection window 3, thus enabling precise horizontal adjustment. The adjustment cap 622 is fixedly connected to the fine-pitch adjustment rod 621. By rotating the adjustment cap 622, the sliding base 4 moves closer to or further away from the detection window 3 through the threaded engagement of the fine-pitch adjustment rod 621 and the sliding base threaded sleeve 623, thereby achieving leveling. This method allows for rapid leveling and features a simple and stable structure. The fine-pitch adjustment rod is a fine-pitch screw with a pitch of 0.15-0.30 mm, preferably 0.25 mm. The fine pitch allows for precise adjustment.

[0051] The movable leveling semiconductor testing bracket also includes a transition connector 7 and a probe fine-tuning assembly 8. This allows the probe adjustment slider 5 to be indirectly and fixedly connected to the testing probe via the transition connector 7 and the probe fine-tuning assembly 8.

[0052] The transition connector 7 is used for the transition connection between the probe adjustment slider 5 and the probe fine-tuning component 8; it is understood that the transition connector 7 is provided with connecting holes and other components (not shown) for fixing the connection, which are not specifically limited here and can be set according to the connection needs.

[0053] The probe fine-tuning assembly 8 is used for fixed connection with the detection probe, leveling, and force buffering. The probe fine-tuning assembly 8 includes a probe mounting plate 81, a lower connecting plate 82, a tensioning buffer 83, a leveling rod 84, and a fulcrum ball 85. The probe mounting plate 81 is used for fixed connection with the detection probe; the lower connecting plate 82 is used for fixed connection with the transition connector 7; the tensioning buffer 83, which consists of multiple components and is a spring-like structure, is used to tension the probe mounting plate 81 and the lower connecting plate 82, thus buffering the downward impact force of the detection probe. The positions of the probe mounting plate 81 and the lower connecting plate 82 are adjustable. Simultaneously, by tensioning the lower connecting plate 82 through the probe mounting plate 81, the downward pressure of the detection probe on the lower support can be reduced, thereby reducing lower deformation and improving measurement accuracy; the leveling rod 84 is located on the probe... On the head mounting plate 81, a threaded engagement with the probe mounting plate 81 and abutting against the lower connecting plate 82 is provided. Multiple fine-pitch adjusting screws are provided, located at different positions on the probe mounting plate 81 (as needed, such as the four corners). By adjusting the leveling rod 84, the distance between different positions of the probe mounting plate 81 and the lower connecting plate 82 can be finely adjusted, thereby achieving secondary micro-level adjustment of the upper part and local level fine-tuning, which helps to improve measurement accuracy. The fulcrum ball 85 is used to maintain a fixed interval between the probe mounting plate 81 and the lower connecting plate 82, preventing them from connecting.

[0054] Optionally, the probe adjustment slider 5 also includes an adjustment protrusion 50, a slider base 51, a slider sidewall 52, a slider topwall 53, a sidewall adjustment hole 54, and a topwall fixing member 55. The adjustment protrusion 50 includes an adjustment protrusion sidewall 501 and an adjustment protrusion inclined surface 502. The adjusting protrusion 50 is designed to be separate from the slider base 51. The adjusting protrusion 50 is positioned by a top wall fixing member 55 (which can be a screw fixing structure) on the top wall 53 of the slider. The side wall adjusting hole 54 (with internal thread) is opened on the side wall 52 of the slider. The threaded push rod engages with the thread of the side wall adjusting hole 54 to tighten and loosen the side wall 501 of the adjusting protrusion, thereby achieving micro-adjustment of the position of the slider base 51. This is beneficial for the precise installation, positioning and adjustment of the probe, and for the tight fit between the adjusting protrusion 50 and the sliding groove 44. In particular, the tight fit between the inclined surface 502 of the adjusting protrusion and the inclined surface of the sliding groove 44 suppresses the deformation of the sliding protrusion 42 due to heat and stress after the groove is opened.

[0055] It is known that each sliding base 4 can be equipped with one or more probe adjustment sliders 5. When multiple probe adjustment sliders 5 are used, there are gaps between them, which facilitates the individual adjustment of multiple probe adjustment sliders 5, and allows for more precise adjustment of the position of the sliding base 4, thus facilitating accurate adjustment of the probe position. The multiple probe adjustment sliders 5 are spaced apart and heated separately, avoiding the problem of large deformation caused by heat in long strip probe adjustment sliders 5, and suppressing the adverse effects of thermal expansion. Each sliding base 4 has sliding grooves 44 on the left and right sides, and the probe adjustment sliders 5 can be set on one or both sides for adjusting the position of the sliding base 4.

[0056] The temperature difference between the central and sidewall portions of the deposition chamber results in different thermal effects on the middle and ends of the detection window 3. The middle portion has a higher temperature, while the ends have a lower temperature. This uneven thermal effect on the sliding base 4 increases the risk of deformation due to heat, especially affecting the stability of measurement accuracy over long-term use. The sliding base 4 also includes a base sidewall 45, which is spaced apart from the detection window 3 and extends below the top of the detection window 3.

[0057] A panoramic continuous observation of the substrate surface is achieved through the integral quartz window 31, eliminating the visual blind spots of traditional multi-hole windows. A sliding groove 44 is provided at the junction of the sliding bump 42 and the base frame 41. The probe adjustment slider 5 is externally wrapped and cooperates with the groove of the sliding groove 44. The sliding groove 44 and the probe adjustment slider 5 provide stable sliding support and prevent slippage. At the same time, the setting of the sliding bump 42 and the sliding groove 44 reduces the contact between the probe adjustment slider 5 and the sliding base frame 4, which can reduce the thermal impact of the deposition chamber, thereby reducing the thermal expansion of the components connected to the detection probe. The viewing window groove 43 runs through the base frame 41 and the sliding bump 42 to provide a detection channel. The bracket positioning and leveling assembly 6 includes a detection window positioning assembly 61 and a micro-distance adjustment assembly 62. The detection window positioning assembly 61 connects to the detection window 3, allowing for matching with the thermal and stress effects of the detection window 3, facilitating precise positioning. The micro-distance adjustment assembly 62 fine-tunes the distance between the sliding base 4 and the detection window 3, enabling overall leveling when unevenness is found after the sliding base 4 is installed on the detection window 3. A transition connector 7 is used for the transition connection between the probe adjustment slider 5 and the probe micro-adjustment assembly 8. The probe micro-adjustment assembly 8 is used for fixed connection with the detection probe, local secondary micro-adjustment, and stress buffering.

[0058] In summary, a movable leveling semiconductor testing bracket achieves local and overall leveling and suppresses the effects of thermal expansion through a probe fine-tuning component for local leveling and buffering, a sliding base, transition connectors, and a bracket positioning and leveling component. This results in stress buffering, reduced stress deformation and thermal-affected deformation, and allows the testing probe to be installed and positioned at any location, with arbitrary testing positions, and compatibility with substrates and trays of various sizes.

[0059] The preferred embodiments of this utility model have been described in detail above; however, this utility model is not limited thereto. Within the scope of the technical concept of this utility model, various simple modifications can be made to the technical solution of this utility model, including combining the various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed by this utility model and are all within the protection scope of this utility model.

Claims

1. A movable leveling semiconductor testing bracket, characterized in that, include: A sliding base frame is fixedly connected to the detection window on the deposition chamber cover; The probe adjustment slider is movably mounted on the sliding base and can be fixed at any position along the length of the sliding base; the probe adjustment slider is used for direct or indirect fixed connection with the detection probe; A bracket positioning and leveling assembly is used to position, fix, and level the sliding base frame and the detection window; the bracket positioning and leveling assembly includes a detection window positioning assembly and a micro-distance adjustment assembly; the detection window positioning assembly is fixedly connected to the sliding base frame through an opening on the detection window; the micro-distance adjustment assembly finely adjusts the distance between the sliding base frame and the detection window.

2. The movable leveling semiconductor testing bracket according to claim 1, characterized in that, The probe adjustment slider is used for indirect fixed connection with the detection probe by setting a transition connector and a probe fine-tuning component; the transition connector is used for the transition connection between the probe adjustment slider and the probe fine-tuning component; the probe fine-tuning component is used for fixed connection with the detection probe, leveling, and force buffering.

3. The movable leveling semiconductor testing bracket according to claim 2, characterized in that, The probe fine-tuning assembly includes a probe mounting plate, a lower connecting plate, a tensioning buffer, a leveling rod, and a fulcrum ball. The probe mounting plate is used to fix the probe to the detection probe. The lower connecting plate is used to fix the transition connector to the detection probe. The tensioning buffer is used to tighten the probe mounting plate and the lower connecting plate. The leveling rod allows for fine-tuning of the distance between the probe mounting plate and the lower connecting plate at different positions. The fulcrum ball is used to maintain a fixed interval between the probe mounting plate and the lower connecting plate.

4. The movable leveling semiconductor testing bracket according to claim 1, characterized in that, The detection window positioning components are respectively arranged in the bracket positioning and leveling components at both ends of the sliding base frame, and the detection window positioning components are arranged diagonally.

5. The movable leveling semiconductor testing bracket according to claim 1, characterized in that, The detection window positioning assembly includes a positioning rod, a fastening nut, a detection window threaded sleeve, a lower inclined block, and an upper inclined block; the micro-distance adjustment assembly includes a fine-tooth adjustment rod, an adjustment cap, and a sliding base threaded sleeve.

6. The movable leveling semiconductor testing bracket according to claim 1, characterized in that, The sliding base frame includes a base frame body, a sliding protrusion, a viewing window groove, and a sliding groove; the sliding groove is provided at the joint between the sliding protrusion and the base frame body, and the sliding protrusion protrudes from the base frame body to support the movable probe adjustment slider.

7. The movable leveling semiconductor testing bracket according to claim 6, characterized in that, The probe adjustment slider is externally wrapped to cooperate with the groove of the sliding groove, which is one of the following: triangular groove, rectangular groove, trapezoidal groove, and arc groove; the width of the viewing window groove is 15-30mm.

8. The movable leveling semiconductor testing bracket according to claim 5, characterized in that, The fine-thread adjusting rod is a fine-thread screw with a thread pitch of 0.15-0.30 mm.

9. The movable leveling semiconductor testing bracket according to claim 1, characterized in that, The probe adjustment slider also includes an adjustment protrusion, a slider base, a slider sidewall, a slider top wall, a sidewall adjustment hole, and a top wall fixing component. The adjustment protrusion includes an adjustment protrusion sidewall and an adjustment protrusion inclined surface. The top wall fixing component provided on the slider top wall positions the adjustment protrusion. The sidewall adjustment hole is provided on the slider sidewall. By engaging the threaded rod with the threaded hole, the adjustment protrusion sidewall can be tightened and loosened, thereby achieving fine adjustment of the slider base position.

10. The movable leveling semiconductor testing bracket according to claim 1, characterized in that, The sliding base frame also includes a base frame sidewall, which is spaced apart from the detection window and extends to below the top of the detection window.

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