A heat dissipating insulation packaging assembly

Abstract

The utility model relates to electronic device technical field, concretely relates to a heat dissipation insulating packaging assembly, including plastic package body, heat conducting insulating layer and radiator, the plastic package body is used to package power device, the back of plastic package body is provided with the raised frame, the radiator is installed on the plastic package body closely raised frame, and with raised frame commonly enclose the heat conducting insulating groove of half closed structure, the heat conducting insulating layer fills and sets up in heat conducting insulating groove, this heat dissipation insulating packaging assembly not only simplifies the structure of heat dissipation insulating packaging assembly, makes the interval of plastic package body and radiator smaller, and the heat conduction heat dissipation effect of assembly is better, and simultaneously, still have the advantages such as more simple and quick, the quality is more stable of assembly process, heat conducting insulating effect is good, is suitable for large -scale popularization and application.

Description

Technical Field

[0001] This utility model relates to the field of electronic device technology, specifically to a heat dissipation packaging structure for semiconductor devices, and particularly to a heat dissipation and insulation packaging component. Background Technology

[0002] Packaging heat dissipation structure refers to a series of structural designs used in electronic device packaging to effectively conduct and dissipate heat. The design and technological innovation of packaging heat dissipation structure play an important role in the current development of semiconductor technology.

[0003] With advancements in semiconductor technology, chip sizes are continuously shrinking, and packaging technologies are evolving accordingly. Current power device designs are characterized by low inductance, high heat dissipation, and high insulation. As device packaging structures become more compact, chip voltage levels and power density in package modules continue to increase, posing challenges to packaging insulation and device heat dissipation. Within limited packaging space, how to efficiently and promptly release the chip's heat dissipation to the external environment to reduce chip junction temperature and the operating temperature of internal packaging materials has become one of the key issues to consider in the current power device packaging design phase.

[0004] Existing packaged heat dissipation structures (such as Figure 1 As shown in the diagram, typically, a molding compound 1 is mounted on a heat sink 2, and a three-layer material consisting of a thermally conductive layer 301 (thermal conductive), an insulating layer 302 (insulating pad), and a thermally conductive silicone resin layer 301 is placed between the molding compound 1 and the heat sink 2 to achieve the functions of heat conduction, insulation, and heat dissipation. This three-layer thermally conductive and insulating structure not only increases the thermal conduction distance but also reduces the thermal conductivity, severely affecting the rapid conduction of heat and hindering rapid heat dissipation from the package. Simultaneously, the multi-layer structure increases structural complexity and installation difficulty, which is detrimental to improving production efficiency and reducing production costs. Therefore, optimizing the heat dissipation path of the device package and simplifying the heat dissipation packaging structure plays a positive role in solving the heat dissipation problem of power devices under high voltage, high current, and high power density conditions and reducing chip junction temperature. Utility Model Content

[0005] The purpose of this invention is to address the problems of complex structure and troublesome assembly in existing heat dissipation packaging structures by providing a heat dissipation and insulation packaging component.

[0006] This utility model provides a heat dissipation and insulation encapsulation assembly, including a molding compound, a thermally conductive insulating layer, and a heat sink; the molding compound is used to encapsulate a power device; a raised frame is provided on the back side of the molding compound; the heat sink is mounted on the molding compound in close contact with the raised frame, and together with the raised frame, forms a semi-closed thermally conductive insulating groove; the thermally conductive insulating layer is filled in the thermally conductive insulating groove.

[0007] This utility model discloses a heat dissipation and insulation encapsulation component. A plastic encapsulation body with a thermally conductive insulating groove on its back, filled with a thermally conductive insulating layer, is directly connected to a heat sink. This not only simplifies the structure of the heat dissipation and insulation encapsulation component, reducing the distance between the plastic encapsulation body and the heat sink, and improving the component's heat conduction and dissipation performance, but also utilizes the limiting effect of the thermally conductive insulating groove to directly inject thermally conductive insulating adhesive into the groove to form a thermally conductive insulating layer. This makes the assembly process simpler, faster, and provides better quality stability. The heat dissipation and insulation encapsulation component has a simple structure, is easy and quick to assemble, and has good thermal conductivity and insulation performance, making it suitable for large-scale application.

[0008] The higher the raised frame, the thicker the thermally conductive insulating layer, and the better its insulation effect. However, if the thickness is too large, the thermal conductivity will be reduced. Preferably, the height of the raised frame is 0.1-3mm; more preferably, the height of the raised frame is 0.5-2.5mm; and even more preferably, the height of the raised frame is 1-2mm.

[0009] The wider the raised frame, the easier it is to install the heat sink. However, if the width is too large, the area of ​​the thermally conductive insulation layer will be reduced, resulting in poorer thermal conductivity and insulation, and thus poorer heat dissipation. Preferably, the width of the raised frame is 0.2-3mm; more preferably, the width of the raised frame is 0.5-2.5mm; and even more preferably, the width of the raised frame is 1-2mm.

[0010] The thermally conductive insulating layer is formed by curing thermally conductive insulating adhesive; preferably, the volume resistivity of the thermally conductive insulating layer is not less than 2×10⁻⁶. 15 The thermal conductivity is not less than 1.0 W / (m·K), and more preferably, the volume resistivity of the thermally conductive insulating layer is not less than 5 × 10⁻⁶ Ω·cm. 15 Ω∙cm, thermal conductivity not less than 2.0 W / (m·K).

[0011] Preferably, the encapsulation body is provided with a frame, and the opening of the thermally conductive insulating groove is in the same direction as the frame on the encapsulation body.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. The present invention provides a heat dissipation and insulation encapsulation assembly in which a heat-conducting insulating groove is provided on the back and a plastic encapsulation body filled with a thermally conductive insulating layer is directly connected to the heat sink. This not only simplifies the structure of the heat dissipation and insulation encapsulation assembly and reduces the distance between the plastic encapsulation body and the heat sink, resulting in better heat conduction and heat dissipation, but also utilizes the limiting effect of the thermally conductive insulating groove to directly inject thermally conductive insulating adhesive into the thermally conductive insulating groove to form a thermally conductive insulating layer. This makes the assembly process simpler, faster, and results in better quality stability.

[0014] 2. The heat dissipation and insulation encapsulation component of this utility model has a simple structure, is easy and quick to assemble, and has good thermal conductivity and insulation effect, making it suitable for large-scale promotion and application. Attached Figure Description

[0015] Figure 1 This is a side view diagram of an existing thermal insulation encapsulation assembly.

[0016] Figure 2 This is a side view of the heat dissipation and insulation encapsulation assembly in Embodiment 1 of this utility model;

[0017] Figure 3 This is a three-dimensional schematic diagram of the heat dissipation and insulation encapsulation assembly in Embodiment 1 of this utility model;

[0018] Figure 4 This is a three-dimensional schematic diagram of the encapsulation body and the thermally conductive insulating layer in Embodiment 1 of this utility model;

[0019] Figure 5 This is a three-dimensional schematic diagram of the encapsulation body in Embodiment 1 of this utility model;

[0020] Figure 6 This is a three-dimensional schematic diagram of the encapsulation body in Embodiment 2 of this utility model;

[0021] Figure 7 This is a three-dimensional schematic diagram of the encapsulation body in Embodiment 3 of this utility model.

[0022] Reference numerals: 1-molded body, 101-frame, 102-thermal conductive and insulating groove, 103-raised frame, 2-heat sink, 3-thermal conductive and insulating layer; 301-thermal conductive layer; 302-insulating layer. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to specific embodiments. However, it should not be construed as limiting the scope of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0024] Unless otherwise specified, the use of terms such as "upper," "lower," "left," "right," "center," "inner," and "outer" to indicate orientation or positional relationships in the description of specific embodiments of the present invention is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the product / equipment / device is typically placed during use. These terms are merely for the purpose of facilitating the description of the present invention or simplifying the description in specific embodiments, enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a particular device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on the present invention.

[0025] Furthermore, the use of terms such as "horizontal," "vertical," "suspended," and "parallel" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, suspended, or parallel, but rather that it can be slightly tilted or have a deviation. For example, "horizontal" merely means that its direction is more horizontal relative to "vertical," not that the structure must be completely horizontal, but that it can be slightly tilted. Alternatively, it can be simplified to mean that the corresponding device / component / element, when set in a "horizontal," "vertical," "suspended," or "parallel" direction, can have an error / deviation of ±10% relative to the corresponding direction, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the present invention.

[0026] Furthermore, in the description of the technical solution of this invention, unless otherwise explicitly specified / limited / restricted, the terms "set up," "install," "connect," "link," "provided with," "laid out," and "arranged" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to common connection methods in the art, such as welding, riveting, bolting, and threaded connections. Such connections can be mechanical, electrical, or communication connections; they can be direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components.

[0027] Example 1

[0028] A thermal insulation encapsulation component (such as Figure 2 , Figure 3 As shown), it is made of encapsulated body 1 (as shown) Figure 4 The package consists of a thermally conductive insulating layer 3 and a heat sink 2; the molding compound 1 is used to encapsulate the power device (TO247-3L package); a raised frame 103 is provided on the back of the molding compound 1; the heat sink 2 is mounted on the molding compound 1 in close contact with the raised frame 103, and together with the raised frame 103, forms a semi-closed thermally conductive insulating groove 102; the thermally conductive insulating layer 3 is filled in the thermally conductive insulating groove 102 (as shown). Figure 5 (As shown); a frame 101 (linear type) is provided on the encapsulation body 1, and the opening of the thermally conductive insulating groove 102 is in the same direction as the frame 101 on the encapsulation body 1; the height of the raised frame 103 is 2mm and the width is 2mm; the resistivity of the thermally conductive insulating layer 3 is 5×10⁻⁶. 15 Ω∙cm, thermal conductivity is 2.0 W / (m·K).

[0029] The assembly process of the heat dissipation and insulation encapsulation assembly is as follows: the molded body 1 is fixedly installed on the heat sink 2, so that the raised frame 103 on the molded body 1 is in close contact with the heat sink 2 and forms a semi-closed thermally conductive and insulating groove 102; thermally conductive insulating adhesive is injected into the thermally conductive and insulating groove 102 and cured to form a thermally conductive and insulating layer 3, thus obtaining the heat dissipation and insulation encapsulation assembly.

[0030] This heat dissipation and insulation encapsulation component has a simple structure, is easy and quick to assemble, and has good thermal conductivity and insulation performance, making it suitable for large-scale application.

[0031] Example 2

[0032] A heat-dissipating and insulating encapsulation assembly, comprising a molding compound 1 (such as...) Figure 6 The device consists of a thermally conductive insulating layer 3 and a heat sink 2; the molding compound 1 is used to encapsulate the power device (TO220 package); a raised frame 103 is provided on the back of the molding compound 1; the heat sink 2 is mounted on the molding compound 1 in close contact with the raised frame 103, and together with the raised frame 103, they form a semi-closed thermally conductive insulating groove 102; the thermally conductive insulating layer 3 is filled in the thermally conductive insulating groove 102; a frame 101 (linear type) is provided on the molding compound 1, and the opening of the thermally conductive insulating groove 102 is in the same direction as the frame 101 on the molding compound 1; the height of the raised frame 103 is 0.1 mm and the width is 0.2 mm; the resistivity of the thermally conductive insulating layer 3 is 6 × 10⁻⁶. 15 Ω∙cm, thermal conductivity is 8.0 W / (m·K).

[0033] The assembly process of the heat dissipation and insulation encapsulation assembly is as follows: the molded body 1 is fixedly installed on the heat sink 2, so that the raised frame 103 on the molded body 1 is in close contact with the heat sink 2 and forms a semi-closed thermally conductive and insulating groove 102; thermally conductive insulating adhesive is injected into the thermally conductive and insulating groove 102 and cured to form a thermally conductive and insulating layer 3, thus obtaining the heat dissipation and insulation encapsulation assembly.

[0034] This heat dissipation and insulation encapsulation component has a simple structure, is easy and quick to assemble, and has good thermal conductivity and insulation performance, making it suitable for large-scale application.

[0035] Example 3

[0036] A heat-dissipating and insulating encapsulation assembly, comprising a molding compound 1 (such as...) Figure 7The package consists of a thermally conductive insulating layer 3 and a heat sink 2; the molded body 1 is used to encapsulate the power device (TO263-3L package); a raised frame 103 is provided on the back of the molded body 1; the heat sink 2 is mounted on the molded body 1 in close contact with the raised frame 103, and together with the raised frame 103, they form a semi-closed thermally conductive insulating groove 102; the thermally conductive insulating layer 3 is filled in the thermally conductive insulating groove 102; a frame 101 (bent type) is provided on the molded body 1, and the opening of the thermally conductive insulating groove 102 and the frame 101 are in the same direction as the molded body 1; the height of the raised frame 103 is 3mm and the width is 3mm; the resistivity of the thermally conductive insulating layer 3 is 2×10⁻⁶. 15 Ω∙cm, thermal conductivity is 1.0 W / (m·K).

[0037] The assembly process of the heat dissipation and insulation encapsulation assembly is as follows: the molded body 1 is fixedly installed on the heat sink 2, so that the raised frame 103 on the molded body 1 is in close contact with the heat sink 2 and forms a semi-closed thermally conductive and insulating groove 102; thermally conductive insulating adhesive is injected into the thermally conductive and insulating groove 102 and cured to form a thermally conductive and insulating layer 3, thus obtaining the heat dissipation and insulation encapsulation assembly.

[0038] This heat dissipation and insulation encapsulation component has a simple structure, is easy and quick to assemble, and has good thermal conductivity and insulation performance, making it suitable for large-scale application.

[0039] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation and insulation encapsulation assembly, characterized in that, The device includes a molding compound (1), a thermally conductive insulating layer (3), and a heat sink (2); the molding compound (1) is used to encapsulate power devices; a raised frame (103) is provided on the back side of the molding compound (1); the heat sink (2) is mounted on the molding compound (1) in close contact with the raised frame (103) and together with the raised frame (103) forms a semi-closed thermally conductive insulating groove (102); the thermally conductive insulating layer (3) is filled in the thermally conductive insulating groove (102).

2. The heat dissipation and insulation encapsulation assembly according to claim 1, characterized in that, The height of the raised frame (103) is 0.1-3mm.

3. The heat dissipation and insulation encapsulation assembly according to claim 2, characterized in that, The height of the raised frame (103) is 0.5-2.5mm.

4. The heat dissipation and insulation encapsulation assembly according to claim 3, characterized in that, The height of the raised frame (103) is 1-2mm.

5. The heat dissipation and insulation encapsulation assembly according to claim 1, characterized in that, The width of the raised frame (103) is 0.2-3mm.

6. The heat dissipation and insulation encapsulation assembly according to claim 5, characterized in that, The width of the raised frame (103) is 1-2.5mm.

7. The heat dissipation and insulation encapsulation assembly according to claim 6, characterized in that, The width of the raised frame (103) is 1-2 mm.

8. The heat dissipation and insulation encapsulation assembly according to claim 1, characterized in that, The volume resistivity of the thermally conductive insulating layer (3) is not less than 2×10⁻⁶. 15 Ω∙cm, thermal conductivity not less than 1.0 W / (m·K).

9. The heat dissipation and insulation encapsulation assembly according to claim 8, characterized in that, The volume resistivity of the thermally conductive insulating layer (3) is not less than 5 × 10⁻⁶. 15 Ω∙cm, thermal conductivity not less than 2.0 W / (m·K).

10. The heat dissipation and insulation encapsulation assembly according to any one of claims 1-9, characterized in that, A frame (101) is provided on the encapsulated body (1), and the opening of the thermally conductive insulating groove (102) is in the same direction as the frame (101) on the encapsulated body (1).

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