A silicon carbide chip package structure

Abstract

The utility model relates to chip packaging technical field, concretely is a silicon carbide chip packaging structure, include: fin frame and shell, the shell is located fin frame left side's lower extreme, insulating ceramic sheet, the left side of insulating ceramic sheet is provided with prefabricated groove body, the inboard sputtering of prefabricated groove body has copper plating seed layer, one side of copper plating seed layer is coated with adhesive material layer, chip main part, the lower extreme of chip main part one side is provided with lands groove. The utility model discloses through the setting of prefabricated groove body in insulating ceramic sheet, after the prefabricated groove body of chip main part enters insulating ceramic sheet and the adhesive material layer bonding, can limit the position of chip main body, and after pouring epoxy resin, forms the epoxy resin filling layer, further can avoid the silicon carbide chip under the action of external force and will not displace, and then guarantee the performance of chip packaging structure.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically a silicon carbide chip packaging structure. Background Technology

[0002] Silicon carbide is an inorganic material produced by high-temperature smelting of raw materials such as quartz sand, petroleum coke, and sawdust in an electric resistance furnace. Silicon carbide is a very common material in chip manufacturing. After silicon carbide chips are manufactured, they need to be packaged in a casing. The casing plays a role in placing, fixing, sealing, and protecting the chip, as well as enhancing its electrothermal performance. It also serves as a bridge between the internal world of the silicon carbide chip and the external circuitry. Therefore, packaging plays an important role in CPUs and other LSI integrated circuits.

[0003] Currently, after silicon carbide chips are manufactured, they need to be encapsulated in a packaging shell to protect them. However, before the molding compound is formed, the silicon carbide chip is directly bonded to the surface of the substrate. This causes the silicon carbide chip to shift under external force during the molding compound formation and subsequent processes, which in turn affects the performance of the chip packaging structure. To address this, we propose a silicon carbide chip packaging structure. Utility Model Content

[0004] The purpose of this invention is to provide a silicon carbide chip packaging structure that has the advantage of good chip packaging effect. It solves the problem that when the silicon carbide chip is directly bonded to the surface of the substrate before the molding layer is formed, the silicon carbide chip will be displaced under the action of external force during the formation of the molding layer and subsequent processes, which will affect the performance of the chip packaging structure.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a silicon carbide chip packaging structure, comprising:

[0006] A heat sink bracket and a housing, wherein the housing is located at the lower left end of the heat sink bracket;

[0007] An insulating ceramic sheet, wherein a prefabricated groove is provided on the left side of the insulating ceramic sheet, a copper-plated seed layer is sputtered on the inner side of the prefabricated groove, and an adhesive material layer is coated on one side of the copper-plated seed layer;

[0008] The chip body has a solder pad groove at the lower end of one side, and lead wires are soldered to the inner side of the solder pad groove through the solder pad. An epoxy resin potting layer is provided between the inner side of the heat sink frame and the outer shell, and between the insulating ceramic sheet and the outer wall of the chip body.

[0009] Preferably, the insulating ceramic sheet is disposed at the lower left end of the outer casing, and the insulating ceramic sheet is located inside the outer casing.

[0010] Preferably, the chip body is bonded to one side of the adhesive material layer in the prefabricated groove.

[0011] Preferably, the adhesive material layer is made of silicone gel.

[0012] Preferably, the upper end of the lead is provided with a wavy connecting part.

[0013] Preferably, a thermally conductive adhesive block is applied between the lower end of the inner side of the insulating ceramic sheet and the upper end of the lead.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] This invention, through the setting of a pre-formed groove inside the insulating ceramic sheet, can limit the position of the chip body after it enters the pre-formed groove and is bonded to the adhesive material layer. Furthermore, after the epoxy resin is poured in to form an epoxy resin potting layer, it can prevent the silicon carbide chip from shifting under the action of external force, thereby ensuring the performance of the chip packaging structure. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a schematic diagram of the exploded structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the mating structure between the chip body and the lead pins of this utility model;

[0019] Figure 4 This is a schematic diagram of the combined structure of the insulating ceramic sheet and the thermally conductive adhesive block of this utility model.

[0020] In the diagram: 1. Heat sink bracket; 2. Outer shell; 3. Insulating ceramic sheet; 301. Precast groove; 302. Copper-plated seed layer; 303. Adhesive material layer; 304. Thermally conductive adhesive block; 4. Chip body; 401. Solder pad groove; 402. Lead; 403. Wavy connector; 5. Epoxy resin potting layer. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] The heat sink bracket 1, outer shell 2, insulating ceramic sheet 3, prefabricated groove 301, copper-plated seed layer 302, adhesive material layer 303, thermally conductive adhesive block 304, chip body 4, solder pad groove 401, lead pin 402, corrugated connection part 403, and epoxy resin potting layer 5 components in this application are all general standard parts or components known to those skilled in the art. Their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0025] Example 1

[0026] Please see Figures 1-4 As shown, this utility model provides a technical solution: a silicon carbide chip packaging structure, comprising:

[0027] Heat sink bracket 1 and outer casing 2, with outer casing 2 located at the lower left side of heat sink bracket 1;

[0028] An insulating ceramic sheet 3 is provided on the left side of the insulating ceramic sheet 3. A prefabricated groove 301 is provided on the inner side of the prefabricated groove 301. A copper-plated seed layer 302 is sputtered on the inner side of the prefabricated groove 301. An adhesive material layer 303 is coated on one side of the copper-plated seed layer 302.

[0029] The chip body 4 has a solder pad groove 401 at the lower end of one side. Lead pins 402 are soldered to the inner side of the solder pad groove 401 through solder pads. An epoxy resin potting layer 5 is provided between the inner side of the heat sink bracket 1 and the outer shell 2, and between the insulating ceramic sheet 3 and the outer wall of the chip body 4.

[0030] The insulating ceramic sheet 3 is disposed at the lower left side of the outer casing 2 and is located inside the outer casing 2. The chip body 4 is bonded to one side of the adhesive material layer 303 in the prefabricated groove 301. The adhesive material layer 303 is made of silicone gel.

[0031] This technical solution involves setting a pre-formed groove 301 for the insulating ceramic sheet 3. After sputtering to form a copper seed layer 302, a silicone gel adhesive layer 303 is applied. After the chip body 4 enters the pre-formed groove 301 of the insulating ceramic sheet 3 and bonds with the adhesive layer 303, the position of the chip body 4 can be defined. Then, the insulating ceramic sheet 3 is welded to one side of the heat sink frame 1. Next, the heat sink frame 1 and the outer shell 2 are welded. Finally, epoxy resin is poured into the inner side of the heat sink frame 1 and the outer shell 2 to form an epoxy resin potting layer 5. This prevents the silicon carbide chip from shifting under external force, thereby ensuring the performance of the chip packaging structure. The silicone gel adhesive layer 303 has high shear strength and can buffer vibration impact through material elasticity after fixing the chip. The epoxy resin potting layer 5 can fill the gap between the chip body 4 and the outer shell 2, which helps to distribute vibration stress throughout the package, thereby improving the vibration resistance of this packaging structure.

[0032] It should be noted that the circuit structure of the chip body 4 used in this structure has not been changed and is a conventional chip. If the size of the chip body 4 is adjusted, the shape of the heat sink bracket 1, the outer shell 2, and the insulating ceramic sheet 3 can be adjusted appropriately according to the size of the chip body 4. Therefore, it will not be described in detail here.

[0033] Example 2

[0034] Based on Embodiment 1, this utility model is as follows: Figures 1-4 As shown, a wavy connecting part 403 is provided at the upper end of the lead 402.

[0035] This technical solution: By setting a wavy connecting part 403 at the upper end of the lead 402, it can reduce stress concentration and avoid stress concentration causing the material in a local area to bear stress far higher than the average level. When the stress exceeds the material strength limit, it is easy to cause cracks.

[0036] Example 3

[0037] Based on Embodiment 1, this utility model is as follows: Figures 1-4 As shown, a thermally conductive adhesive block 304 is coated between the lower end of the inner side of the insulating ceramic sheet 3 and the upper end of the lead 402.

[0038] This technical solution: By setting the thermally conductive adhesive block 304, after the chip body 4 enters the pre-formed groove 301 of the insulating ceramic sheet 3 and is bonded to the adhesive material layer 303, thermally conductive adhesive is applied to the lower end of the pre-formed groove 301, so that it forms a block structure between the upper ends of the lead pins 402, thereby further improving the ability to buffer vibration and impact through material elasticity, and ensuring the normal use of this structure.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the essence and scope of the technical solutions of this utility model.

Claims

1. A silicon carbide chip packaging structure, characterized in that, include: Heat sink bracket (1) and outer casing (2), the outer casing (2) being located at the lower left side of the heat sink bracket (1); An insulating ceramic sheet (3) is provided with a prefabricated groove (301) on the left side of the insulating ceramic sheet (3), and a copper-plated seed layer (302) is sputtered on the inner side of the prefabricated groove (301), and an adhesive material layer (303) is coated on one side of the copper-plated seed layer (302). The chip body (4) has a solder pad groove (401) at the lower end of one side. Lead pins (402) are soldered to the inner side of the solder pad groove (401) through the solder pad. An epoxy resin potting layer (5) is provided between the inner side of the heat sink bracket (1) and the outer shell (2) and between the insulating ceramic sheet (3) and the outer wall of the chip body (4).

2. The silicon carbide chip packaging structure according to claim 1, characterized in that: The insulating ceramic sheet (3) is disposed at the lower end of the left side of the outer shell (2), and the insulating ceramic sheet (3) is located inside the outer shell (2).

3. The silicon carbide chip packaging structure according to claim 1, characterized in that: The chip body (4) is bonded to one side of the adhesive material layer (303) inside the prefabricated groove (301).

4. The silicon carbide chip packaging structure according to claim 1, characterized in that: The adhesive material layer (303) is made of silicone gel.

5. A silicon carbide chip packaging structure according to claim 1, characterized in that: The upper end of the lead (402) is provided with a wavy connecting part (403).

6. A silicon carbide chip packaging structure according to claim 1, characterized in that: A thermally conductive adhesive block (304) is applied between the lower end of the inner side of the insulating ceramic sheet (3) and the upper end of the lead (402).

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