Novel integrated circuit dispensing and bonding apparatus

Abstract

This utility model relates to the technical field of novel integrated circuit dispensing and bonding devices, and discloses a novel integrated circuit dispensing and bonding device, including a cover plate body. A cover plate connecting unit is fixedly connected to one side of the cover plate body, and a cover plate bonding unit is fixedly connected to the side of the cover plate body away from the cover plate connecting unit. Two sets of bonding frames are symmetrically arranged on the cover plate bonding unit at both ends of the cover plate body. A chip is arranged below the cover plate body, and positioning components and bonding components are also provided on the bonding frames for fixing the chip. A dispensing head is arranged above the cover plate body for dispensing adhesive. The positioning pin and pressure strip in the positioning component cooperate tightly to accurately position the chip, preventing the chip from shifting during dispensing, thereby avoiding silver paste tailing caused by chip movement. The bonding plate is pressed onto the chip, blocking the pins and limiting the flow range of the silver paste, reducing silver paste tailing.

Description

Technical Field

[0001] This utility model relates to the technical field of novel integrated circuit dispensing and pressing devices, specifically to novel integrated circuit dispensing and pressing devices. Background Technology

[0002] In the dispensing and bonding process of integrated circuit manufacturing, due to the fine and dense structure of chip products, silver paste tailing is prone to occur during dispensing, leading to silver paste bridging between leads and severely affecting the product's electrical performance and yield. Traditional dispensing and bonding equipment has significant shortcomings in handling this problem. It cannot accurately position the chip, causing it to easily shift during dispensing, resulting in silver paste dripping between leads and forming silver paste bridging. Furthermore, the poor structural stability of the equipment allows for dispensing position deviations due to loosening during dispensing and bonding, further exacerbating the silver paste tailing and bridging problems.

[0003] As integrated circuit manufacturing technology advances towards higher precision and yield, the demand for novel dispensing and bonding devices is becoming increasingly urgent. This invention presents a novel integrated circuit dispensing and bonding device that, by adding a pin-shielding unit and appropriately opening windows, effectively shields the pin area, preventing silver paste bridging between pins. Simultaneously, by optimizing the positioning and bonding components, the device's stability and accuracy are improved, reducing silver paste tailing, thereby increasing production yield and customer satisfaction, and providing crucial technical support for optimizing integrated circuit manufacturing processes. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a novel integrated circuit dispensing and pressing device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a novel integrated circuit dispensing and pressing device, comprising a cover plate body, a cover plate connecting unit fixedly connected to one side of the cover plate body, a cover plate pressing unit fixedly connected to the side of the cover plate body away from the cover plate connecting unit, and two sets of pressing frames symmetrically arranged on the cover plate pressing unit, respectively arranged at both ends of the cover plate body, a chip arranged below the cover plate body, and a positioning component and a pressing component are also provided on the pressing frame for fixing the chip.

[0006] As a further description of the above technical solution:

[0007] Bolts are provided above the cover plate connecting unit. There are two sets of bolts, which are arranged on both sides of the cover plate connecting unit to fix the position of the cover plate connecting unit.

[0008] As a further description of the above technical solution:

[0009] The positioning component includes:

[0010] Positioning bolts are placed on the pressed frame;

[0011] Pressure strips are fixedly arranged around the perimeter of the pressing frame and are used to press the chip.

[0012] As a further description of the above technical solution:

[0013] The pressing assembly includes:

[0014] The product pressing plate has multiple sets, which are connected between two sets of pressing frames;

[0015] The dispensing groove is located inside the product lamination plate and is used to limit the dispensing position.

[0016] As a further description of the above technical solution:

[0017] The positioning bolts are provided in several sets, and are threaded through the two sets of pressing frames to connect to the product pressing plate, for fixing the product pressing plate.

[0018] As a further description of the above technical solution:

[0019] The chip has several sets of pins fixedly connected to its periphery, and the product pressing plate is pressed onto the chip to cover each set of pins.

[0020] As a further description of the above technical solution:

[0021] A dispensing nozzle is arranged on the upper part of the cover plate body for dispensing adhesive.

[0022] This utility model has the following beneficial effects:

[0023] 1. The positioning pins and pressure strips in the positioning assembly work together tightly to accurately position the chip, preventing it from shifting during dispensing and thus avoiding silver paste tailing caused by chip movement. The product lamination plate is pressed onto the chip, blocking the pins and limiting the flow range of the silver paste, reducing silver paste tailing. The dispensing groove is arranged inside the product lamination plate, precisely limiting the dispensing position so that the silver paste can be accurately dispensed into the predetermined area, avoiding silver paste bridging between pins.

[0024] 2. Two sets of bolts are respectively arranged on both sides of the cover plate connecting unit to firmly fix the position of the cover plate connecting unit and ensure the stability of the entire device structure. The stable structure can avoid the deviation of the dispensing position caused by the loosening of the device during the dispensing process, thereby preventing the silver paste tailing and bridging problems. The product pressing plate is connected between the pressing frame by positioning bolts, which further enhances the structural strength of the device and ensures that the chip will not be displaced due to structural instability during the pressing process. Attached Figure Description

[0025] Fig. 1 This is an overall schematic diagram of the novel integrated circuit dispensing and pressing device proposed in this utility model;

[0026] Fig. 2 This is a schematic diagram of the dispensing head of the novel integrated circuit dispensing and pressing device proposed in this utility model;

[0027] Fig. 3 This is a schematic diagram of the chip in the novel integrated circuit dispensing and pressing device proposed in this utility model;

[0028] Fig. 4 This is a schematic diagram of the dispensing range of the novel integrated circuit dispensing and pressing device proposed in this utility model; Legend: 1. Cover plate body; 2. Cover plate connecting unit; 21. Bolt; 3. Cover plate pressing unit; 31. Pressing frame; 32. Positioning bolt; 33. Pressure strip; 4. Product pressing plate; 41. Dispensing groove; 5. Dispensing head; 6. Chip; 61. Pin. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Example 1:

[0031] like Figs. 1 to 4 As shown, the novel integrated circuit dispensing and pressing device provided in this embodiment includes a cover plate body 1. A cover plate connecting unit 2 is fixedly connected to one side of the cover plate body 1. A cover plate pressing unit 3 is fixedly connected to the side of the cover plate body 1 away from the cover plate connecting unit 2. Two sets of pressing frames 31 are symmetrically arranged on the cover plate pressing unit 3, respectively arranged at both ends of the cover plate body 1. A chip 6 is arranged below the cover plate body 1. A positioning component and a pressing component are also provided on the pressing frame 31 for fixing the chip 6.

[0032] In this embodiment, the entire device is fixed in a suitable position by the cover plate connecting unit 2, and the bolts 21 ensure a firm fixation. The dispensing head 5 dispenses adhesive onto the chip 6, and the positioning component and pressing component fix the chip 6, ensuring the stability of the dispensing and pressing process. The precise dispensing and pressing of the chip 6 ensures the stability and reliability of the chip 6 in subsequent use.

[0033] Specifically, bolts 21 are provided above the cover plate connecting unit 2. There are two sets of bolts 21, which are respectively arranged on both sides of the cover plate connecting unit 2 to fix the position of the cover plate connecting unit 2.

[0034] In this embodiment, the bolt 21 is tightened to make it tightly connected to the connection part, and the cover plate connecting unit 2 is firmly fixed in the designated position to ensure the stability of the cover plate connecting unit 2, thereby ensuring the stability of the entire device and preventing displacement during dispensing and pressing.

[0035] Specifically, the positioning component includes: a positioning bolt 32, arranged on the pressing frame 31; and a pressure strip 33, fixedly arranged around the pressing frame 31, for pressing the chip 6.

[0036] It should be noted that the positioning bolt 32 is inserted into the positioning hole of the pressing frame 31 to achieve positioning, and can be moved to adjust the position of the product pressing plate 4. The pressing strip 33 presses down to apply pressure to fix the chip 6, ensuring that the chip 6 is accurately positioned within the pressing frame 31 and preventing the chip 6 from shifting during dispensing and pressing.

[0037] Specifically, the pressing assembly includes: a product pressing plate 4, which is provided in multiple sets and connected between two sets of pressing frames 31; and a dispensing groove 41, which is arranged inside the product pressing plate to expose a single product on the strip and to limit the dispensing position.

[0038] As a preferred implementation, the product pressing plate 4 presses down to bond the chip 6, and the dispensing head 5 dispenses adhesive within the dispensing groove 41, limiting the adhesive distribution area, achieving uniform bonding of the chip 6, controlling the adhesive position, and avoiding contamination of key parts such as the pins 61 of the chip 6.

[0039] Specifically, the positioning bolts 32 are provided in several sets, and are threaded through the two sets of pressing frames 31 to connect to the product pressing plate 4, for fixing the product pressing plate 4.

[0040] It should be noted that tightening the positioning bolt 32 will fix the product pressing plate 4 in the designated position of the pressing frame 31, ensuring that the product pressing plate 4 is firmly installed and maintaining stable pressing force and positioning accuracy of the glue dispensing groove 41.

[0041] Specifically, the chip 6 has several sets of pins 61 fixedly connected to its periphery, and the product pressing plate 4 is pressed onto the chip 6 to cover each set of pins 61.

[0042] In this embodiment, the product pressing plate 4 applies pressure to bond the chip 6 to the substrate, while shielding the pins 61 to prevent adhesive contamination, ensuring a tight connection between the chip 6 and the substrate, and protecting the electrical performance of the pins 61 from the influence of adhesive.

[0043] Specifically, a dispensing nozzle 5 is arranged on the upper part of the cover plate body 1 for dispensing adhesive.

[0044] In this embodiment, the dispensing head 5 is driven by air pressure, and the adhesive is dripped into the dispensing tank 41 through the needle, flowing along the tank to the edge of the chip 6, so that the adhesive is accurately dispensed.

[0045] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel integrated circuit dispensing and bonding device, characterized in that: The cover plate includes a cover plate body (1), a cover plate connecting unit (2) is fixedly connected to one side of the cover plate body (1), a cover plate pressing unit (3) is fixedly connected to the side of the cover plate body (1) away from the cover plate connecting unit (2), and two sets of pressing frames (31) are symmetrically arranged on the cover plate pressing unit (3), which are respectively arranged at both ends of the cover plate body (1). A chip (6) is arranged below the cover plate body (1), and a positioning component and a pressing component are also provided on the pressing frame (31) for fixing the chip (6).

2. The novel integrated circuit dispensing and bonding device according to claim 1, characterized in that: The cover plate connecting unit (2) is provided with bolts (21) on the top. There are two sets of bolts (21), which are arranged on both sides of the cover plate connecting unit (2) to fix the position of the cover plate connecting unit (2).

3. The novel integrated circuit dispensing and pressing device according to claim 2, characterized in that: The positioning component includes: Positioning bolts (32) are arranged on the pressing frame (31); A pressure strip (33) is fixedly arranged around the pressing frame (31) for pressing the chip (6).

4. The novel integrated circuit dispensing and bonding device according to claim 3, characterized in that: The pressing assembly includes: The product pressing plate (4) is provided in multiple sets and is connected between two sets of pressing frame (31); A dispensing groove (41) is arranged inside the product pressing plate to limit the dispensing position.

5. The novel integrated circuit dispensing and bonding device according to claim 4, characterized in that: The positioning bolts (32) are provided in several sets, and are threaded through the two sets of pressing frames (31) and connected to the product pressing plate (4) for fixing the product pressing plate (4).

6. The novel integrated circuit dispensing and bonding device according to claim 5, characterized in that: The chip (6) has several sets of pins (61) fixedly connected to its periphery, and the product pressing plate (4) is pressed onto the chip (6) to cover each set of pins (61).

7. The novel integrated circuit dispensing and bonding device according to claim 5, characterized in that: A dispensing nozzle (5) is arranged above the cover plate body (1) for dispensing adhesive.

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