A wafer box pre-cleaning pretreatment device

Abstract

This invention provides a pre-treatment device for wafer cassette cleaning, comprising: a base, a top plate fixedly connected to the upper surface of the base via a fixing column, a main motor and a servo cylinder fixedly connected to the upper surface of the top plate, a telescopic rod of the servo cylinder fixedly connected to the upper surface of a receiving column, and a main lead screw movably connected to the base and the top plate via bearings at both ends, the top plate connected to the main motor via a coupling, and a moving block screwed to the main lead screw, the moving block fixedly connected to a mounting frame, a secondary cleaning component fixedly connected to the inner side of the mounting frame, and a transmission groove formed inside the receiving column, with a set of transmission rods movably connected to both ends of the transmission groove via bearings, and a secondary motor fixedly connected to the lower surface of the receiving column. This invention, through the cooperation of the mounting frame, secondary cleaning component, receiving column, transmission rods, mounting plate, and main cleaning component, enables the device to conveniently and quickly complete the wiping of multiple surfaces inside and outside the wafer cassette, thereby improving the pre-treatment efficiency of the wafer cassette.

Description

Technical Field

[0001] This utility model relates to the field of wafer cell cleaning technology, specifically to a pretreatment device for wafer cell cleaning. Background Technology

[0002] A wafer cassette is a transfer device used to store and transport wafers. To ensure the cleanliness of the wafers stored inside, the wafer cassette needs to be cleaned. Before cleaning the wafer cassette, a series of pretreatments are required to ensure the cleaning effect and avoid adverse effects such as contamination of the wafer cassette or subsequent processes. The wafer cassette pretreatment steps usually include removing surface deposits, that is, first blowing the surface of the wafer cassette and then wiping it. However, during the wiping process, workers need to wipe at least eight sides of the wafer cassette, both inside and out, in sequence, making the pretreatment process inconvenient and reducing the efficiency of wafer cassette pretreatment. This prolongs the total time required for wafer cassette cleaning and thus reduces the efficiency of wafer cassette cleaning. Utility Model Content

[0003] To overcome the shortcomings of the existing technology, a pretreatment device for wafer cell cleaning is provided to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, a pretreatment device for wafer cassette cleaning is provided, comprising: a base, a top plate fixedly connected to the upper surface of the base via a fixing column, a main motor and a servo cylinder fixedly connected to the upper surface of the top plate, a telescopic rod of the servo cylinder fixedly connected to the upper surface of a receiving column, and the two ends of a main lead screw movably connected to the base and the top plate via bearings, the upper end of the top plate connected to the main motor via a coupling, and a moving block screwed to the main lead screw, the moving block fixedly connected to a mounting frame, a secondary cleaning component fixedly connected to the inner side of the mounting frame, a transmission groove formed inside the receiving column, a set of transmission rods movably connected to the two ends of the transmission groove via bearings, a secondary motor fixedly connected to the lower surface of the receiving column, the secondary motor meshing with two sets of transmission rods via bevel gears, and a first active plate and a second active plate connected to the two ends of the receiving column via transmission rods, the first active plate and the second active plate fixedly connected to a set of mounting plates via fixing plates, and a main cleaning component fixedly connected to the lower surface of the mounting plates.

[0005] Preferably, a positioning groove is formed on the upper surface of the base, and a vacuum chamber is formed inside the base. The vacuum chamber has a square structure, and multiple sets of adsorption holes are evenly formed on the top of the vacuum chamber. The adsorption holes are connected to the positioning groove. At the same time, a vacuum generator is fixedly connected to the side of the base, and the vacuum generator is connected to the vacuum chamber through a gas supply pipe.

[0006] Preferably, the four sets of fixing columns fixedly connected at the four corners of the upper surface of the base are all cylindrical structures, while the base and the top plate are both rectangular structures. The top plate surface is provided with four sets of guide holes corresponding to the position of the mounting frame, and the upper surface of the mounting frame is connected with four sets of guide rods corresponding to the position of the guide holes. At the same time, the four sets of guide rods are all cylindrical structures.

[0007] Preferably, the mounting frame has a U-shaped structure, and the auxiliary cleaning component, which is fixedly connected to the inner side of the mounting frame by a buckle, has a U-shaped structure. The size of the inner side of the auxiliary cleaning component is adapted to the size of the outer side of the wafer box. At the same time, there are two sets of moving blocks symmetrically arranged at both ends of the outer side of the mounting frame, and both sets of moving blocks have a square structure.

[0008] Preferably, the storage column has a cylindrical structure, and the two active plates connected at both ends of the storage column by the transmission rod are both circular. Two sets of driven rings are symmetrically sleeved in the middle of the outer side of the storage column, and both sets of driven rings are circular ring structures.

[0009] Preferably, the mounting plate has a long strip structure, and the main cleaning component is fixedly connected to the lower surface of the mounting plate by a buckle. There are two sets of mounting plates. The two ends of the upper surface of one set of mounting plates are fixedly connected to the first active plate and a set of driven rings by fixing plates, respectively. The two ends of the upper surface of the other set of mounting plates are fixedly connected to the second active plate and another set of driven rings by fixing plates, respectively. At the same time, the fixing plate has a Z-shaped structure.

[0010] Preferably, a positioning rod is fixedly connected to the side of the driven ring surface away from the fixed plate. The positioning rod has a cylindrical structure, and two sets of baffles are symmetrically connected to the outer side of the receiving column relative to the positioning rod. Both sets of baffles have a rectangular structure, and the baffles, transmission rod and positioning rod are arranged at right angles.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: through the cooperation of the main motor, main lead screw, moving block, mounting frame and auxiliary cleaning components, the device can simultaneously wipe and clean multiple surfaces on the outer side of the wafer cassette. Furthermore, through the cooperation of the servo cylinder, receiving column, transmission rod, auxiliary motor, active plate one, active plate two, fixing plate, mounting plate and main cleaning plate, the device can simultaneously wipe and clean multiple surfaces inside the wafer cassette. Consequently, the device can simultaneously wipe multiple surfaces inside and outside the wafer cassette, thereby effectively improving the efficiency of the device's pre-processing of the wafer cassette, shortening the total time required for wafer cassette cleaning, and ultimately improving the overall cleaning efficiency of the wafer cassette. Attached Figure Description

[0012] Figure 1 This is a front view schematic diagram of an embodiment of the present utility model.

[0013] Figure 2 This is a side view of an embodiment of the present utility model.

[0014] Figure 3 This is a side view of an embodiment of the present invention.

[0015] Figure 4 This is a top view of an embodiment of the present utility model.

[0016] In the diagram: 1. Base; 2. Main lead screw; 3. Fixed column; 4. Main cleaning component; 5. Mounting plate; 6. Fixed plate; 7. Active plate 1; 8. Secondary cleaning component; 9. Moving block; 10. Mounting frame; 11. Main motor; 12. Guide rod; 13. Top plate; 14. Storage column; 15. Transmission rod; 16. Driven ring; 17. Servo electric cylinder; 18. Secondary motor; 19. Vacuum chamber; 20. Vacuum generator. Detailed Implementation

[0017] Reference Figures 1 to 4 As shown, this utility model provides a pretreatment device for wafer cassette cleaning, comprising: a base 1, the upper surface of which is fixedly connected to a top plate 13 via a fixing column 3, and the upper surface of the top plate 13 is respectively fixedly connected to a main motor 11 and a servo cylinder 17. The telescopic rod of the servo cylinder 17 is fixedly connected to the upper surface of a receiving column 14, and the two ends of a main lead screw 2 are respectively movably connected to the base 1 and the top plate 13 via bearings. The upper end of the top plate 13 is connected to the main motor 11 via a coupling, and the main lead screw 2 is screwed to a moving block 9, which is fixedly connected to a mounting frame 10. The inner side of the mounting frame 10 is fixedly connected to the auxiliary cleaning component 8. At the same time, a transmission groove is opened inside the storage column 14. The two ends of the transmission groove are movably connected to a set of transmission rods 15 through bearings. The lower surface of the storage column 14 is fixedly connected to the auxiliary motor 18. The auxiliary motor 18 is connected to the two sets of transmission rods 15 through bevel gear meshing. The two ends of the storage column 14 are connected to the first active plate 7 and the second active plate 2 through the transmission rods 15. The first active plate 7 and the second active plate 2 are fixedly connected to a set of mounting plates 5 through the fixing plate 6. The lower surface of the mounting plate 5 is fixedly connected to the main cleaning component 4.

[0018] In this embodiment, the wafer cassette is first placed in the positioning groove on the upper surface of the base 1. The vacuum generator 20 is then turned on, and the vacuum generator 20 extracts gas from the vacuum chamber 19, creating a negative pressure environment within the vacuum chamber 19. The positioning groove then adsorbs and fixes the wafer cassette through the adsorption holes. Initial cleaning is completed by an external blowing device. The main motor 11 is then turned on, and its output shaft drives the main lead screw 2 to rotate via a coupling. The main lead screw 2 drives the mounting frame 1 via a screw-connected moving block 9. The mounting frame 10 and the auxiliary cleaning component 8 move down synchronously, allowing the inner surface of the auxiliary cleaning component 8 to abut against and wipe the outer surface of the wafer cassette. The main lead screw 2 is a reciprocating lead screw, enabling the mounting frame 10 and the auxiliary cleaning component 8 to automatically reset with the moving block 9, thus completing the wiping of the outer surface of the wafer cassette. Then, the servo cylinder 17 is activated, and its extension rod pushes the receiving column 14 down. The receiving column 14, through the cooperation of the first active plate 7, the second active plate, and the fixed plate 6, can synchronously push the mounting plate 5 and the main cleaning component 8. The main cleaning component 4 moves downward, allowing it to contact the side and bottom of the wafer cassette cavity. Then, the switch of the auxiliary motor 18 is activated. The output shaft of the auxiliary motor 18 synchronously drives two sets of meshing transmission rods 15 to rotate in opposite directions via bevel gears. The two sets of transmission rods 15 can then drive the corresponding fixed plate 6, mounting plate 5, and main cleaning component 4 to rotate synchronously via the active plate 1 7 and active plate 2, respectively. Subsequently, the main cleaning component 4 can rotate 90 degrees against the bottom of the wafer cassette cavity, changing from a vertical to a horizontal state. At this time, the reset switch of the servo cylinder 17 is activated again. The extension rod of the servo cylinder 17 can drive the receiving column 14 and the main cleaning component 4 to reset synchronously. During the reset process, the main cleaning component 4 can simultaneously wipe and clean multiple surfaces of the wafer cassette cavity, thereby effectively improving the pre-processing efficiency of the device for the wafer cassette and also helping to enhance the pre-processing effect of the wafer cassette, shortening the total time required for wafer cassette cleaning. Then, the vacuum generator 20 is turned off, the base 1 is released from fixing the wafer cassette, and the pre-processed wafer cassette can be removed.

[0019] In a preferred embodiment, a positioning groove is provided on the upper surface of the base 1, and a vacuum chamber 19 is provided inside the base 1. The vacuum chamber 19 has a square structure, and multiple sets of adsorption holes are evenly provided on the top of the vacuum chamber 19. The adsorption holes are connected to the positioning groove. At the same time, a vacuum generator 20 is fixedly connected to the side of the base 1, and the vacuum generator 20 is connected to the vacuum chamber 19 through a gas supply pipe.

[0020] In this embodiment, as Figure 1 , Figure 2 and Figure 4The positioning groove helps to enhance the positioning effect of the wafer box on the surface of the base 1, thereby ensuring that the main cleaning component 4 and the auxiliary cleaning component 8 can smoothly wipe the corresponding surface of the wafer box. The vacuum generator 20, vacuum chamber 19 and adsorption hole help to enhance the stability of the fixed connection between the base 1 and the wafer box, and avoid the wafer box from accidentally shaking or shifting in position during the pre-processing process.

[0021] In a preferred embodiment, the four sets of fixing columns 3 fixedly connected at the four corners of the upper surface of the base 1 are all cylindrical in shape, while the base 1 and the top plate 13 are both rectangular in shape. The top plate 13 has four sets of guide holes corresponding to the position of the mounting frame 10, and the upper surface of the mounting frame 10 is connected to four sets of guide rods 12 corresponding to the position of the guide holes. At the same time, the four sets of guide rods 12 are all cylindrical in shape.

[0022] In this embodiment, as Figure 1 , Figure 2 and Figure 4 The setting of the fixed column 3 can help enhance the overall structural strength of the device, and the size of the guide rod 12 and the guide hole are matched to help enhance the stability of the mounting frame 10 when it moves, so as to avoid the mounting frame 10 being accidentally shaken or shifted in position during the process of wiping the outer surface of the wafer box, and ensure that the device can successfully complete the wiping process.

[0023] In a preferred embodiment, the mounting frame 10 has a U-shaped structure, and the auxiliary cleaning component 8, which is fixedly connected to the inner side of the mounting frame 10 by a snap fastener, has a U-shaped structure. The size of the inner side of the auxiliary cleaning component 8 is adapted to the size of the outer side of the wafer box. At the same time, two sets of moving blocks 9 are symmetrically placed at both ends of the outer side of the mounting frame 10, and both sets of moving blocks 9 have a square structure.

[0024] In this embodiment, as Figure 1 , Figure 2 and Figure 4 The mounting frame 10 is fixedly connected to the auxiliary cleaning component 8 by a snap-fit, which allows the device to easily replace the auxiliary cleaning component 8 with one of the same size according to the size of the outer side of the wafer box, thereby ensuring the wiping effect of the auxiliary cleaning component 8. The wiping part of the auxiliary cleaning component 8 is made of dust-free sponge material, and the setting of the moving block 9 allows the main screw 2 to smoothly drive the mounting frame 10 and the auxiliary cleaning component 8 to move synchronously.

[0025] As a preferred embodiment, the storage column 14 has a cylindrical structure. The two ends of the storage column 14 are connected by the transmission rod 15 to the first and second driving plates, which are both circular. Two sets of driven rings 16 are symmetrically sleeved on the middle of the outer side of the storage column 14, and both sets of driven rings 16 are circular ring structures.

[0026] In this embodiment, as Figure 1 ,Figure 2 and Figure 4 The dimensions of the inner cavity of the driven ring 16 are adapted to the dimensions of the outer side of the storage column 14, which helps to enhance the stability of the driven ring 16 when it rotates. Furthermore, the arrangement of the active plate 1 7 and the active plate 2 allows the two sets of mounting plates 5 below the storage column 14 to rotate in different directions, thereby helping to enhance the wiping effect of the device on different surfaces of the wafer cassette cavity.

[0027] In a preferred embodiment, the mounting plate 5 has a long strip structure. The lower surface of the mounting plate 5 is fixedly connected to the main cleaning component 4 by a snap fastener. There are two sets of mounting plates 5. The two ends of the upper surface of one set of mounting plates 5 are fixedly connected to the active plate 7 and a set of driven rings 16 by the fixing plate 6, respectively. The two ends of the upper surface of the other set of mounting plates 5 are fixedly connected to the active plate 2 and another set of driven rings 16 by the fixing plate 6, respectively. Meanwhile, the fixing plate 6 has a Z-shaped structure.

[0028] In this embodiment, as Figure 1 , Figure 2 and Figure 3 The cooperation between the mounting plate 5 and the fixing plate 6 enables the active plate 1 7 and the active plate 2 to drive a set of mounting plates 5 to rotate synchronously, so that the two sets of main cleaning parts 4 can smoothly unfold to both sides against the bottom of the wafer box cavity, thereby completing the wiping treatment of multiple surfaces in the wafer box cavity. At the same time, the wiping parts of the main cleaning parts 4 that abut against the wafer box cavity are all made of dust-free sponge material.

[0029] In a preferred embodiment, a positioning rod is fixedly connected to the side of the driven ring 16 away from the fixed plate 6. The positioning rod has a cylindrical structure, and two sets of baffles are symmetrically connected to the outer side of the receiving column 14 relative to the positioning rod. Both sets of baffles have a rectangular structure, and the baffles, transmission rod 15 and positioning rod are arranged at right angles.

[0030] In this embodiment, as Figure 1 , Figure 2 and Figure 3 Figure 1 Figure 2 Figure 3 The positioning rod and baffle effectively limit the rotation range of the driven ring 16, thereby ensuring that the main cleaning component 4 can be smoothly adjusted from a vertical state to a horizontal state, and preventing the main cleaning component 4 from rotating too much and separating from the inner surface of the wafer cassette.

[0031] The wafer cassette pretreatment device of this utility model, through the cooperation of the mounting frame 10, the auxiliary cleaning component 8, the storage column 14, the transmission rod 15, the mounting plate 5 and the main cleaning component 4, enables the device to conveniently and quickly complete the wiping treatment of multiple surfaces inside and outside the wafer cassette, thereby improving the pretreatment efficiency of the wafer cassette and shortening the total time required for wafer cassette cleaning.

Claims

1. A pretreatment apparatus for wafer cassette cleaning, comprising: The base (1) is characterized in that: the upper surface of the base (1) is fixedly connected to the top plate (13) by the fixing column (3), and the upper surface of the top plate (13) is fixedly connected to the main motor (11) and the servo cylinder (17), the telescopic rod of the servo cylinder (17) is fixedly connected to the upper surface of the storage column (14), and the two ends of the main screw (2) are movably connected to the base (1) and the top plate (13) by bearings, the upper end of the top plate (13) is connected to the main motor (11) by the coupling, and the main screw (2) is screwed to the moving block (9), the moving block (9) is fixedly connected to the mounting frame (10), and the mounting frame (10) is located inside the moving block (9). The auxiliary cleaning component (8) is fixedly connected to the side, and a transmission groove is opened inside the storage column (14). The two ends of the transmission groove are movably connected to a set of transmission rods (15) through bearings. The auxiliary motor (18) is fixedly connected to the lower surface of the storage column (14). The auxiliary motor (18) is connected to the two sets of transmission rods (15) through bevel gear meshing. The two ends of the storage column (14) are connected to the first active plate (7) and the second active plate (2) through the transmission rods (15). The first active plate (7) and the second active plate (2) are fixedly connected to a set of mounting plates (5) through the fixing plate (6). The main cleaning component (4) is fixedly connected to the lower surface of the mounting plate (5).

2. The wafer cassette pretreatment apparatus according to claim 1, characterized in that, The upper surface of the base (1) is provided with a positioning groove, and a vacuum chamber (19) is provided inside the base (1). The vacuum chamber (19) has a square structure, and multiple sets of adsorption holes are evenly provided on the top of the vacuum chamber (19). The adsorption holes are connected to the positioning groove. At the same time, a vacuum generator (20) is fixedly connected to the side of the base (1). The vacuum generator (20) is connected to the vacuum chamber (19) through a gas supply pipe.

3. The wafer cassette pretreatment apparatus according to claim 1, characterized in that, The four sets of fixed columns (3) fixedly connected at the four corners of the upper surface of the base (1) are all cylindrical structures, while the base (1) and the top plate (13) are both rectangular structures. The top plate (13) has four sets of guide holes corresponding to the position of the mounting frame (10), and the mounting frame (10) has four sets of guide rods (12) corresponding to the position of the upper surface of the mounting frame (10) relative to the guide holes. At the same time, the four sets of guide rods (12) are all cylindrical structures.

4. The wafer cassette pretreatment apparatus according to claim 1, characterized in that, The mounting frame (10) has a square-shaped structure. The auxiliary cleaning component (8) connected to the inner side of the mounting frame (10) by a snap fastener has a U-shaped structure. The size of the inner side of the auxiliary cleaning component (8) is compatible with the size of the outer side of the wafer box. At the same time, there are two sets of moving blocks (9) symmetrically arranged at both ends of the outer side of the mounting frame (10). Both sets of moving blocks (9) have a square structure.

5. The wafer cassette pretreatment apparatus according to claim 1, characterized in that, The storage column (14) has a cylindrical structure. The active plate 1 (7) and active plate 2 connected at both ends of the storage column (14) through the transmission rod (15) are both circular. Two sets of driven rings (16) are symmetrically sleeved on the middle of the outer side of the storage column (14). Both sets of driven rings (16) are circular ring structures.

6. The wafer cassette pretreatment apparatus according to claim 1, characterized in that, The mounting plate (5) has a long strip structure. The lower surface of the mounting plate (5) is fixedly connected to the main cleaning component (4) by a buckle. There are two sets of mounting plates (5). The two ends of the upper surface of one set of mounting plates (5) are fixedly connected to the active plate one (7) and a set of driven rings (16) respectively by the fixing plate (6). The two ends of the upper surface of the other set of mounting plates (5) are fixedly connected to the active plate two and another set of driven rings (16) respectively by the fixing plate (6). At the same time, the fixing plate (6) has a Z-shaped structure.

7. The wafer cassette pretreatment apparatus according to claim 5, characterized in that, The driven ring (16) is fixedly connected to a positioning rod on the side away from the fixed plate (6). The positioning rod has a cylindrical structure, and two sets of baffles are symmetrically connected to the outer side of the receiving column (14) relative to the positioning rod. Both sets of baffles have a rectangular structure, and the baffles, transmission rod (15) and positioning rod are arranged at right angles.

Images