Worktable and laser dicing apparatus
The design of detachable connecting components solves the problem of the ingot bottom being tightly attached to the carrier and difficult to separate, and realizes the convenient separation of the ingot bottom from the support, ensuring the smooth progress of subsequent processes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HANS SEMICONDUCTOR EQUIPMENT TECHNOLOGY CO LTD
- Filing Date
- 2025-03-14
- Publication Date
- 2026-06-09
AI Technical Summary
During the process of peeling off ingots to form wafers, the bottom of the ingot is in close contact with the bearing surface of the stage, making it difficult to separate and affecting the subsequent processes.
A workbench is provided in which a support is detachably mounted on a mounting base via a connecting assembly. After the separation process is completed, the support can be detached and replaced to proceed with the next ingot separation process, thus avoiding disruption to the production cycle.
This allows for easy separation of the ingot bottom from the support, ensuring that subsequent processes are not affected and meeting production cycle requirements.
Smart Images

Figure CN224333700U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of laser processing technology, and more specifically, relates to a worktable and a laser stripping device. Background Technology
[0002] In the process of separating a crystal ingot into a wafer, a modified layer is first formed inside the ingot by laser irradiation, followed by a separation process to obtain the wafer. Currently, the conventional method is to fix the ingot with the modified layer on a stage before performing the separation process. During the separation process, it is necessary to ensure a tight fit between the bottom of the ingot and the supporting surface of the stage. After the separation process, the remaining ingot needs to be removed from the stage. However, in actual production, if the supporting surface of the stage is too tightly fitted to the bottom of the ingot, it may be difficult to separate the bottom of the ingot from the supporting surface of the stage, thus affecting subsequent processes. Utility Model Content
[0003] This application provides a worktable and a laser stripping device to facilitate the separation of the bottom of the ingot from the bearing surface of the stage, so as to prevent affecting the subsequent processes.
[0004] The technical solution adopted in this application embodiment is: providing a workbench, including:
[0005] Mounting base;
[0006] A fixing component includes a support member for supporting a workpiece, the support member being detachably mounted on the mounting base;
[0007] A connecting component, connected to the mounting base and the support member, for detachably mounting the support member onto the mounting base.
[0008] Optionally, the connecting component includes a mounting member and a fastener. The side wall of the support member is provided with a connecting portion, and the connecting portion is provided with a limiting groove. The mounting member is disposed on the mounting base, and the fastener is disposed on the mounting member. The fastener can engage with the limiting groove of the connecting portion to connect the support member to the mounting base.
[0009] Optionally, the connecting assembly includes a lifting drive and a pressing member, the pressing member being used to abut against the support member, the lifting drive being kinetically connected to the pressing member to drive the pressing member to move closer to or away from the support member in a vertical direction.
[0010] Optionally, the fixing component further includes an adhesive layer disposed on the supporting surface of the support member, the adhesive layer being used to fix the workpiece.
[0011] Optionally, the mounting base includes a lifting drive assembly and a mounting plate. The lifting drive assembly is connected to the mounting plate to drive the mounting plate to move vertically. The support member is mounted on the mounting plate.
[0012] Optionally, the lifting drive assembly includes a rotary drive component, a transmission component, a lifting component, and a limiting component. The lifting component is connected to the mounting plate. The rotary drive component is connected to the lifting component via the transmission component. The transmission component is used to convert rotational motion into linear motion. The limiting component is connected to the lifting component to prevent the lifting component from rotating.
[0013] Optionally, the transmission component includes a lead screw and a synchronous transmission part. The rotary drive component is connected to the lead screw via the synchronous transmission part to drive the lead screw to rotate. The lead screw is threadedly connected to the lifting component.
[0014] Optionally, the limiting member includes a plurality of limiting secondary plates, which are arranged to form a limiting cavity for accommodating the lifting member.
[0015] Optionally, a guide is provided on the limiting plate, and the guide is connected to the lifting component.
[0016] Optionally, the lifting drive assembly may further include a translation drive component, a first sliding component, a second sliding component, and a guide block. The translation drive component is connected to the first sliding component to drive the first sliding component to move in the horizontal direction. The first sliding component is provided with a sliding inclined surface. The second sliding component is slidably disposed on the sliding inclined surface. The second sliding component is connected to the mounting plate. The guide block is connected to the mounting plate to enable the mounting plate to move in the vertical direction.
[0017] This application also provides a laser stripping device for obtaining wafers from ingots, including the aforementioned worktable.
[0018] The beneficial effects of the workbench and laser stripping equipment provided in this application embodiment are as follows:
[0019] In this embodiment of the application, the workbench detachably mounts the support component onto the mounting base via a connecting assembly. After the separation process is completed, the support component, which is tightly connected to the bottom of the crystal ingot, can be removed from the mounting base by disassembling the connecting assembly. Then, the bottom of the crystal ingot is separated from the support component. During the separation process, another support component can be mounted on the mounting base via the connecting assembly to facilitate the next crystal ingot separation process. In this way, the subsequent processes are not affected, and the production cycle requirements are met.
[0020] The laser stripping device of this application includes the aforementioned worktable, and therefore has the beneficial effects brought about by the aforementioned worktable, which will not be repeated here. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 A three-dimensional structural schematic diagram of the workbench provided in Embodiment 1 of this application;
[0023] Figure 2 A three-dimensional structural schematic diagram of the workbench provided in Embodiment 2 of this application;
[0024] Figure 3 A three-dimensional structural schematic diagram of the workbench provided in Embodiment 3 of this application;
[0025] Figure 4 A simplified structural diagram of one embodiment of the lifting drive assembly provided in this application.
[0026] The following are the labeling elements in the figure:
[0027] 1. Mounting base; 11. Lifting drive assembly; 111. Rotary drive component; 112. Transmission component; 1121. Lead screw; 1122. Synchronous transmission unit; 113. Lifting component; 114. Limiting component; 1141. Limiting secondary plate; 1142. Limiting cavity; 1143. Guide component; 12. Mounting plate;
[0028] 2. Supporting component; 21. Connecting part; 211. Limiting groove;
[0029] 3. Connecting components; 31. Mounting components; 32. Fasteners; 33. Lifting drive components; 34. Pressing components; 35. Adsorption plates. Detailed Implementation
[0030] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0031] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0032] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0034] Please see Figure 1 and Figure 4 The workbench provided in the embodiments of this application will now be described. The workbench provided in the embodiments of this application includes a mounting base 1, a fixing component, and a connecting component 3. The fixing component includes a support member 2, which is used to support a workpiece and is mounted on the mounting base 1. The connecting component 3 is connected to the mounting base 1 and the support member 2, and is used to detachably mount the support member 2 on the mounting base 1.
[0035] The workpiece in the embodiments of this application can be a crystal ingot or a wafer, or other products to be processed.
[0036] The support 2 can be a suction plate with suction holes and connected to an external vacuum device. The suction holes are located on the side of the suction plate that contacts the workpiece. The external vacuum device creates a negative pressure in the suction holes to adsorb the workpiece and fix it on the support 2.
[0037] The connecting component 3 may include a first clamping member and a second clamping member, which are mounted opposite each other on the mounting base 1. When the fixing component is placed between the first and second clamping members, the first and second clamping members move closer together to clamp the fixing component, and move further apart to release the fixing component. The connecting component 3 may also be a quick-release clamp, which secures the fixing component to the mounting base. Alternatively, please refer to [link to relevant documentation]. Figure 2The connecting component 3 can also be an adsorption plate 35 connected to an external vacuum device. The adsorption plate 35 is installed on the mounting base, and the support 2 is placed on the adsorption plate 35. The adsorption plate 35 forms a negative pressure through the external vacuum device to adsorb and fix the support 2.
[0038] In this embodiment of the application, the workbench uses a connecting assembly to detachably mount the support component onto the mounting base. After the separation process is completed, the support component, which is tightly connected to the bottom of the workpiece, can be removed from the mounting base by disassembling the connecting assembly. Then, the bottom of the workpiece can be separated from the support component. During the separation process, another support component can be mounted on the mounting base using the connecting assembly to proceed with the next process. This does not affect the subsequent processes and meets the requirements of the production cycle.
[0039] Preferably, the fixing component further includes an adhesive layer disposed on the supporting surface of the support member 2, the adhesive layer being used to fix the workpiece.
[0040] The adhesive layer can be a double-sided pyrolytic film, a UV film, etc. The double-sided pyrolytic film can be removed from the support 2 by heating. The UV film can be removed from the support 2 by UV irradiation to destroy the internal properties of the film, thereby separating the workpiece from the support 2.
[0041] The adhesive layer on the support member 2 of the workbench in this embodiment can adhere to the bottom of the workpiece. When processing the workpiece, it ensures that the support member 2 is completely adhered to the bottom of the workpiece, preventing the bottom of the workpiece from detaching from the support member 2.
[0042] In addition, the support 2 is detachably mounted on the mounting base 1 via the connecting assembly 3, so that the support 2 can be removed from the mounting base 1 after the workpiece is processed, which facilitates the timely replacement of the adhesive layer.
[0043] Preferably, the connecting component 3 includes a mounting member 31 and a fastener 32. The side wall of the support member 2 is provided with a connecting part 21, and the connecting part 21 is provided with a limiting groove 211. The mounting member 31 is provided on the mounting base 1, and the fastener 32 is provided on the mounting member 31. The fastener 32 can engage with the limiting groove 211 of the connecting part 21 so that the support member is connected to the mounting base.
[0044] The connecting component 3 connects to the side wall of the support component 2 to prevent the connecting component 3 from occupying the support area of the support component 2, and at the same time prevents the connecting component 3 from interfering with the workpiece.
[0045] Please see Figure 3 The connecting component 3 may also include a lifting drive and a pressing component. The pressing component is used to abut against the support component 2. The lifting drive and the pressing component are connected in a transmission manner to drive the pressing component to move closer to or away from the support component 2 in the vertical direction (i.e., the thickness direction H of the workpiece).
[0046] The lifting drive component is mounted on the mounting base 1. The lifting drive component can be a cylinder, an electric cylinder, or a linear motor, and the pressing component can be a pressure block or a pressure plate. When processing the workpiece, the lifting drive component drives the pressing component to press the support component 2 to prevent the support component 2 from separating from the mounting base 1. After processing is completed, the lifting drive component drives the pressing component away from the support component 2 to facilitate the removal of the support component 2 and replacement of the adhesive layer.
[0047] The mounting base 1 includes a lifting drive assembly 11 and a mounting plate 12. The lifting drive assembly 11 is connected to the mounting plate 12 to drive the mounting plate 12 to move in the vertical direction. The support member 2 is mounted on the mounting plate 12.
[0048] When machining a workpiece, it is necessary to maintain a consistent distance between the upper surface of the workpiece and the machining device. When the workpiece thickness changes, the lifting drive assembly 11 can drive the mounting plate 12 to adjust the distance between the upper surface of the workpiece and the machining device in the vertical direction (i.e., the thickness direction H of the workpiece), so that the distance between the upper surface of the workpiece and the machining device meets the machining requirements, thereby improving the adaptability of the worktable.
[0049] The lifting drive assembly 11 can be a cylinder, an electric cylinder, or a linear motor.
[0050] Please see Figure 4 The lifting drive assembly 11 includes a rotary drive component 111, a transmission component 112, a lifting component 113, and a limiting component 114. The lifting component 113 is connected to the mounting plate 12. The rotary drive component 111 is connected to the lifting component 113 via the transmission component 112. The transmission component 112 is used to convert the rotary motion into linear motion. The limiting component 114 is connected to the lifting component 113 to prevent the lifting component 113 from rotating.
[0051] The transmission component 112 may include a driving gear, a driven gear, and a rotating rod. The driving gear is connected to the rotary drive component 111, the driven gear is connected to the rotating rod, and the rotating rod is threadedly connected to the lifting component 113. The driving gear and the driven gear mesh. The rotary drive component 111 can rotate the rotating rod through the driving gear and the driven gear. During the rotation of the rotating rod, the lifting component 113 moves linearly in the vertical direction to realize the lifting and lowering of the mounting plate 12.
[0052] The rotary drive 111 can be a rotary motor or a rotary cylinder.
[0053] The limiting member 114 may include a limiting plate and a guide rail. The guide rail is installed on the limiting plate and its length direction is vertical. The side wall of the lifting member 113 is provided with a guide groove, and the guide rail is locked in the guide groove to limit the movement direction of the lifting member 113 and make the lifting member 113 move in a straight line.
[0054] Compared to directly driving the mounting plate 12 to rise and fall via cylinders or linear motors, the transmission component 112 converts rotational motion into linear motion, reducing the space occupied by the lifting drive assembly 11 and making the worktable suitable for environments with relatively compact production spaces.
[0055] The transmission component 112 includes a lead screw 1121 and a synchronous transmission part 1122. The rotary drive component 111 is connected to the lead screw 1121 through the synchronous transmission part 1122 to drive the lead screw 1121 to rotate. The lead screw 1121 is threadedly connected to the lifting component 113.
[0056] The synchronous transmission unit 1122 includes a driving wheel, a driven wheel, and a synchronous belt. The driving wheel is connected to the rotary drive member 111, and the driven wheel is connected to the lead screw 1121. The synchronous belt is sleeved on the driving wheel and the driven wheel. The rotary drive member 111 can rotate the lead screw 1121 through the synchronous transmission unit 1122. During the rotation of the lead screw 1121, the lifting member 113 moves linearly in the vertical direction to realize the lifting and lowering of the mounting plate 12.
[0057] Compared to the synchronous transmission method of gear meshing, the synchronous transmission unit 1122 of this application embodiment has a higher adaptability to the distance between the lifting member 113 and the rotary drive member 111.
[0058] Preferably, the limiting member 114 includes a plurality of limiting secondary plates 1141, which are arranged to form a limiting cavity 1142 for accommodating the lifting member 113.
[0059] In this embodiment, the lifting member 113 can be a square prism, a triangular prism, or a prism of other shapes. The limiting secondary plate 1141 is configured to form a limiting cavity 1142 to prevent the lifting member 113 from rotating with the lead screw 1121, thereby forcing the lifting member 113 to move in the vertical direction, thus realizing the lifting of the mounting plate 12.
[0060] The limiting plate 1141 is provided with a guide 1143, which is connected to the lifting member 113.
[0061] The guide member 1143 includes a guide rail and a slider. The guide rail is mounted on the limiting secondary plate 1141, and the length direction of the guide rail is parallel to the length direction of the lead screw 1121. The slider is slidably mounted on the guide rail and is connected to the lifting member 113. The guide member 1143 can further restrict the movement direction of the lifting member 113 and prevent the lifting member 113 from rotating.
[0062] The lifting drive assembly 11 may further include a translation drive, a first sliding member, a second sliding member, and a guide block. The translation drive is connected to the first sliding member to drive the first sliding member to move in the horizontal direction. The first sliding member is provided with a sliding inclined surface. The second sliding member is slidably disposed on the sliding inclined surface. The second sliding member is connected to the mounting plate 12. The guide block is connected to the mounting plate 12 to make the mounting plate 12 move in the vertical direction.
[0063] The guide block can be equipped with a guide rail, the length of which is vertical. The mounting plate 12 is provided with a slot that engages with the guide rail, and the guide rail is engaged in the slot.
[0064] When the translation drive unit drives the first slider to move horizontally, the second slider can slide on the sliding slope of the first slider, so that the mounting plate 12 moves vertically. In this way, the space occupied by the lifting drive unit in the vertical direction can be reduced.
[0065] The workbench in this embodiment can also be used for loading or unloading materials.
[0066] This application also provides a laser stripping device for obtaining wafers from ingots, including the aforementioned worktable.
[0067] The laser stripping device of this application includes the worktable in any of the above embodiments, and therefore has the beneficial effects brought by the worktable in any of the above embodiments, which will not be repeated here.
[0068] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A workbench, characterized in that, include: Mounting base; A fixing component includes a support member for supporting a workpiece, the support member being detachably mounted on the mounting base; A connecting component, connected to the mounting base and the support member, for detachably mounting the support member onto the mounting base.
2. The workbench according to claim 1, characterized in that, The connecting assembly includes a mounting component and a fastener. The side wall of the support component is provided with a connecting portion, and the connecting portion is provided with a limiting groove. The mounting component is disposed on the mounting base, and the fastener is disposed on the mounting component. The fastener can engage with the limiting groove of the connecting portion to connect the support component to the mounting base.
3. The workbench according to claim 1, characterized in that, The connecting assembly includes a lifting drive and a pressing component. The pressing component is used to abut against the support component. The lifting drive is kinetically connected to the pressing component to drive the pressing component to move closer to or away from the support component in a vertical direction.
4. The workbench according to claim 1, characterized in that, The fixing component also includes an adhesive layer disposed on the supporting surface of the support member, the adhesive layer being used to fix the workpiece.
5. The worktable according to any one of claims 1-4, characterized in that, The mounting base includes a lifting drive assembly and a mounting plate. The lifting drive assembly is connected to the mounting plate to drive the mounting plate to move in a vertical direction. The support member is mounted on the mounting plate.
6. The workbench according to claim 5, characterized in that, The lifting drive assembly includes a rotary drive component, a transmission component, a lifting component, and a limiting component. The lifting component is connected to the mounting plate. The rotary drive component is connected to the lifting component via the transmission component. The transmission component is used to convert rotational motion into linear motion. The limiting component is connected to the lifting component to prevent the lifting component from rotating.
7. The workbench according to claim 6, characterized in that, The transmission component includes a lead screw and a synchronous transmission part. The rotary drive component is connected to the lead screw through the synchronous transmission part to drive the lead screw to rotate. The lead screw is threadedly connected to the lifting component.
8. The workbench according to claim 6, characterized in that, The limiting component includes several limiting secondary plates, which are arranged to form a limiting cavity for accommodating the lifting component.
9. The workbench according to claim 8, characterized in that, The limiting plate is provided with a guide member, which is connected to the lifting member.
10. The workbench according to claim 5, characterized in that, The lifting drive assembly includes a translation drive component, a first sliding component, a second sliding component, and a guide block. The translation drive component is connected to the first sliding component to drive the first sliding component to move horizontally. The first sliding component is provided with a sliding inclined surface. The second sliding component is slidably disposed on the sliding inclined surface. The second sliding component is connected to the mounting plate. The guide block is connected to the mounting plate to enable the mounting plate to move vertically.
11. A laser stripping device for obtaining wafers from ingots, characterized in that, Includes the worktable as described in any one of claims 1-10.