Laser head module and laser processing device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN CREALITY ECOSYSTEM TECHNOLOGY CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-06-09
Smart Images

Figure CN224333709U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of laser processing technology, and in particular to a laser head module and laser processing equipment. Background Technology
[0002] Laser processing equipment is a technological tool that utilizes the high energy density of laser beams to precisely process materials. Its core function is to achieve various processing techniques such as cutting, marking, welding, drilling, and surface treatment through the interaction between the laser and the material. Laser processing equipment incorporates a Z-axis drive mechanism on the laser processing head to achieve precise control and dynamic adjustment of the laser head in the normal direction of the workpiece surface. However, existing Z-axis drive mechanisms are bulky and occupy a large amount of space, limiting the movement speed of the laser processing head. Therefore, it is essential to provide a laser head module and laser processing equipment that is smaller in size, reduces space requirements, and increases movement speed. Utility Model Content
[0003] The purpose of this application is to solve the above problems and provide a laser head module and laser processing equipment, wherein the laser head module is smaller in size, occupies less space, and improves the moving speed of the laser head module.
[0004] To solve the above-mentioned technical problems, the technical solution adopted in this application is as follows:
[0005] In a first aspect, this application provides a laser head module, which includes a z-axis drive assembly and a laser processing head driven by the z-axis drive assembly. The z-axis drive assembly is configured to drive the laser processing head to move along a first direction. The z-axis drive assembly includes a drive member disposed along a second direction, a first transmission member disposed at the output end of the drive member, a second transmission member cooperating with and connected to the first transmission member and disposed along the first direction, and a mounting plate fixedly connected to the second transmission member. The laser processing head is disposed on the mounting plate. The second direction and the first direction are perpendicular to each other in space.
[0006] Optionally, the first transmission component is a transmission gear, and the second transmission component is a rack that meshes with the first transmission component.
[0007] Optionally, the z-axis drive assembly further includes a guide shaft, which is arranged along the first direction. The mounting plate is slidably connected to the guide shaft. The mounting plate includes a mounting plate body and a sliding connection portion disposed on the side of the mounting plate body. The sliding connection portion has a first hole structure, and the guide shaft passes through the first hole structure.
[0008] Optionally, the cross-sectional thickness of the mounting plate body is less than the cross-sectional thickness of the sliding connection portion, and the second transmission member is disposed close to the sliding connection portion; the cross-section refers to the plane of the mounting plate perpendicular to the first direction.
[0009] Optionally, the z-axis drive assembly further includes a housing, in which the drive component, the first transmission component, the second transmission component, the mounting plate, and the guide shaft are housed.
[0010] Optionally, the z-axis drive assembly further includes an elastic limiting member disposed along the first direction; one end of the elastic limiting member is connected to the inner wall of the housing, and the other end is connected to the mounting plate.
[0011] Optionally, the elastic limiting member is a compression spring, which is sleeved on the guide shaft, and its two ends are respectively connected to the inner wall of the housing and the sliding connection portion; the compression spring extends into the first hole structure, and the first hole structure is provided with a limiting protrusion.
[0012] Optionally, the laser head module further includes a reset switch, which is configured to detect the position of the laser processing head to reset the laser processing head to zero.
[0013] Optionally, the laser head module further includes a flame detection component, which includes a flame detection motherboard, a flame detection sensor disposed on the flame detection motherboard, and a limit switch; the flame detection sensor is configured to detect whether a fire has occurred, and the limit switch is configured to detect whether the movement of the laser processing head exceeds a predetermined stroke and to issue an alarm signal after exceeding the predetermined stroke.
[0014] Optionally, the laser head module further includes a cooling system connected to the laser processing head, the cooling system being configured to cool the laser processing head.
[0015] Secondly, this application provides a laser processing device, which includes the laser head module as described above.
[0016] The beneficial effects of this application include at least the following:
[0017] This application provides a laser head module, which includes a z-axis drive assembly for driving the laser processing head to move along a first direction. The z-axis drive assembly converts the rotational motion of the drive component into linear motion of the mounting plate along the first direction, providing a driving force for the laser processing head to move along the first direction. The drive component in the z-axis drive assembly is arranged along a second direction perpendicular to the first direction, which reduces the space occupied by the laser head module in the first direction, provides sufficient installation space for other components, improves the utilization rate of the limited installation space, helps to reduce the overall volume of the laser head module, and increases the moving speed of the laser head module. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of the laser head module of this application from the first angle.
[0019] Figure 2 This is a schematic diagram of the overall structure of the laser head module of this application from the second angle.
[0020] Figure 3 This is a schematic diagram of the assembly of the z-axis drive assembly and the laser processing head.
[0021] Figure 4 This is a schematic diagram of the assembly of the z-axis drive assembly and the mounting plate at the first angle.
[0022] Figure 5 This is a schematic diagram of the assembly of the z-axis drive assembly and the mounting plate at the second angle.
[0023] Figure 6 For along Figure 5 The diagram shows a cross-section along the AA direction.
[0024] Figure 7 This is a schematic diagram of the z-axis drive assembly.
[0025] Figure 8 This is a schematic diagram of the assembly of the mounting plate and the elastic limiting component.
[0026] Among them, 1-z-axis drive assembly, 11-drive component, 12-first transmission component, 13-second transmission component, 14-mounting plate, 141-mounting plate body, 142-sliding connection, 143-first hole structure, 144-limiting protrusion, 15-guide shaft, 16-housing, 17-elastic limiting component, 18-drag chain box, 2-laser processing head, 3-reset switch, 4-flame detection assembly, 41-flame detection main board, 42-flame detection sensor, 43-limit switch, 5-cooling system; z-first direction, y-second direction. Detailed Implementation
[0027] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.
[0028] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.
[0029] In this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. It should be noted that the first direction z and the second direction y in this application are respectively parallel to the z-axis and y-axis in the spatial coordinate system.
[0030] Example:
[0031] In a first aspect, embodiments of this application provide a laser head module, see [link to relevant documentation]. Figures 1 to 7 As shown, the device includes a z-axis drive assembly 1 and a laser processing head 2 driven by the z-axis drive assembly 1. The z-axis drive assembly 1 is configured to drive the laser processing head 2 to move along a first direction z. The z-axis drive assembly 1 includes a drive member 11 arranged along a second direction y, a first transmission member 12 disposed at the output end of the drive member 11, a second transmission member 13 connected to the first transmission member 12 and arranged along the first direction z, and a mounting plate 14 fixedly connected to the second transmission member 13. The laser processing head 2 is disposed on the mounting plate 14, and the drive member 11 is disposed on the side of the mounting plate 14 opposite to the laser processing head 2. The second direction y and the first direction z are perpendicular to each other in space.
[0032] This application provides a laser head module, which includes a z-axis drive assembly 1 for driving the laser processing head 2 to move along a first direction z. The z-axis drive assembly 1 transmits the rotational motion of the drive member 11 into the linear motion of the mounting plate 14 along the first direction z, providing the laser processing head 2 with a driving force to move along the first direction z. The drive member 11 in the z-axis drive assembly 1 is arranged along a second direction y perpendicular to the first direction z, which reduces the space occupied by the laser head module in the first direction z, provides sufficient installation space for other components, improves the utilization rate of the limited installation space, helps to reduce the overall volume of the laser head module, and increases the moving speed of the laser head module.
[0033] It is understood that the z-axis drive assembly 1 provided in this application can be applied not only to the laser head module, but also to other devices used for linear drive of workpieces, so as to reduce the space occupied by the device and reduce production costs.
[0034] Optionally, the first transmission component 12 is a transmission gear, and the second transmission component 13 is a rack that meshes with the first transmission component 12. In this application, the first transmission component 12 and the second transmission component 13 are connected by the meshing of the transmission gear and the rack to transmit the driving force of the driving component 11 to the mounting plate 14, thereby driving the mounting plate 14 to move along the first direction z. Compared with the screw drive structure, the gear meshing structure has lower precision requirements, lower processing difficulty, and lower manufacturing cost, and also lower requirements for environmental cleanliness.
[0035] Optionally, the z-axis drive assembly 1 further includes a guide shaft 15, which is disposed along the first direction z, and the mounting plate 14 is slidably connected to the guide shaft 15. Specifically, in some embodiments, the mounting plate 14 includes a mounting plate body 141 and a sliding connection portion 142 disposed on the side of the mounting plate body 141. The sliding connection portion 142 has a first hole structure 143, and the guide shaft 15 is disposed through the first hole structure 143. The arrangement of the guide shaft 15 guides the movement of the mounting plate 14 along the first direction z, improving the stability of the movement of the mounting plate 14 along the first direction z, thereby improving the stability of the movement of the laser processing head 2 along the first direction z. Optionally, in other embodiments, a linear bearing is provided between the first hole structure 143 and the guide shaft 15. The arrangement of the linear bearing improves the smoothness and stability of the movement of the mounting plate 14 in the first direction z.
[0036] Optionally, the cross-sectional thickness of the mounting plate body 141 is smaller than the cross-sectional thickness of the sliding connection portion 142, and the second transmission member 13 is disposed close to the sliding connection portion 142; the cross-section refers to the plane of the mounting plate 14 perpendicular to the first direction z. The structural configuration of the mounting plate 14 makes the thickness of the mounting plate body 141 relatively thinner than the thickness of the sliding connection portion 142. While ensuring that the mounting plate 14 supports the laser processing head 2 and cooperates with the guide shaft 15, it avoids occupying the installation space of the mounting plate 14 and further ensures the effective utilization of the installation space of the laser head module.
[0037] Optional, see Figure 1 and Figure 2As shown, the z-axis drive assembly 1 further includes a housing 16, and the drive member 11, the first transmission member 12, the second transmission member 13, the mounting plate 14, and the guide shaft 15 are housed within the housing 16. The drive member 11 is fixedly connected to the inner wall of the housing 16, and both ends of the guide shaft 15 are respectively connected to the housing 16.
[0038] Optional, see Figures 3 to 8 As shown, the z-axis drive assembly 1 further includes an elastic limiting member 17 disposed along the first direction z. The elastic limiting member 17 is configured to limit the movement of the laser processing head 2 along the first direction z. One end of the elastic limiting member 17 is connected to the inner wall of the housing 16, and the other end is connected to the mounting plate 14. In the case of power failure, the elastic limiting member 17 is in a naturally relaxed state, and the mounting plate 14 is supported on the elastic limiting member 17.
[0039] In the event of a power outage, the elastic limiting member 17 suspends the laser processing head 2 mounted on the mounting plate 14 by supporting the mounting plate 14, preventing the laser processing head 2 from falling or colliding, thus protecting the laser processing head 2. When the mounting plate 14 moves along the first direction z, the mounting plate 14 and the laser processing head 2 mounted on it move synchronously. The movement of the mounting plate 14 applies a force to the elastic limiting member 17. When the mounting plate 14 moves to a set stroke, the elastic limiting member 17 prevents the mounting plate 14 from moving further by applying a reaction force to the mounting plate 14, thereby achieving a mechanical limiting effect on the mounting plate 14. In addition, the elastic limiting member 17 provides a restoring force to the mounting plate 14 during its return movement, improving return efficiency and reducing energy waste.
[0040] Optional, see Figure 8 As shown, the elastic limiting member 17 is a compression spring, which is sleeved on the guide shaft 15. Both ends of the compression spring are connected to the inner wall of the housing 16 and the sliding connection portion 142, respectively. The compression spring extends into the first hole structure 143, which has a limiting protrusion 144. The first hole structure 143 limits the end of the compression spring by restricting the end of the elastic limiting member 17 while preventing the end of the compression spring from twisting.
[0041] Optional, see Figures 2 to 4As shown, the laser head module also includes a reset switch 3 and a flame detection component 4. The flame detection component includes a flame detection main board 41 and a flame detection sensor 42 and a limit switch 43 disposed on the flame detection main board 41. The reset switch 3 is configured to detect the position of the laser processing head 2 to reset the laser processing head 2 to zero. The flame detection sensor 42 is configured to detect whether there is a fire. The limit switch 43 is configured to detect whether the movement of the laser processing head 2 exceeds a predetermined stroke and to issue an alarm signal after exceeding the predetermined stroke.
[0042] The sensor system ensures that the laser processing head 2 maintains a consistent position during each startup or reset by setting the reset switch 3, thus guaranteeing the operational accuracy of the laser head module. The flame detection sensor 42 monitors the status of the laser head module in real time, detecting whether there is fire in the environment, thereby improving safety and reliability. The limit switch 43 prevents the laser processing head 2 from moving beyond the safe range, thus avoiding mechanical damage to the laser processing head 2.
[0043] Optional, see Figure 2 As shown, the laser head module also includes a cooling system 5, which is connected to the laser processing head 2 and configured to cool the laser processing head 2. In some embodiments, the cooling system 5 is an air-cooled system, which includes an air duct and a cooling fan. The air duct is connected between the laser processing head 2 and the cooling fan. The cooling system 5 cools the laser processing head 2, maintaining its stability and preventing damage to the laser head module due to overheating. Furthermore, the laser head module also includes a cable chain box 18 disposed on the housing 16, which houses the air duct and connecting wires. The cable chain box 18 improves the integration and aesthetics of the laser head module.
[0044] Secondly, embodiments of this application provide a laser processing device, which includes the laser head module as described above.
[0045] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0046] The above embodiments merely illustrate preferred implementations of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.
Claims
1. A laser head module, characterized in that, The device includes a z-axis drive assembly and a laser processing head driven by the z-axis drive assembly. The z-axis drive assembly is configured to drive the laser processing head to move along a first direction. The z-axis drive assembly includes a drive member arranged along a second direction, a first transmission member disposed at the output end of the drive member, a second transmission member cooperating with and connected to the first transmission member and arranged along the first direction, and a mounting plate fixedly connected to the second transmission member. The laser processing head is disposed on the mounting plate. The second direction and the first direction are perpendicular to each other in space.
2. The laser head module according to claim 1, characterized in that, The first transmission component is a transmission gear, and the second transmission component is a rack that meshes with the first transmission component.
3. The laser head module according to claim 1, characterized in that, The z-axis drive assembly further includes a guide shaft, which is arranged along the first direction. The mounting plate is slidably connected to the guide shaft. The mounting plate includes a mounting plate body and a sliding connection portion disposed on the side of the mounting plate body. The sliding connection portion has a first hole structure, and the guide shaft passes through the first hole structure.
4. The laser head module according to claim 3, characterized in that, The cross-sectional thickness of the mounting plate body is less than the cross-sectional thickness of the sliding connection portion, and the second transmission component is disposed close to the sliding connection portion; the cross-section refers to the plane of the mounting plate perpendicular to the first direction.
5. The laser head module according to claim 3, characterized in that, The z-axis drive assembly further includes a housing, in which the drive component, the first transmission component, the second transmission component, the mounting plate, and the guide shaft are housed.
6. The laser head module according to claim 5, characterized in that, The z-axis drive assembly further includes an elastic limiting member disposed along the first direction; one end of the elastic limiting member is connected to the inner wall of the housing, and the other end is connected to the mounting plate.
7. The laser head module according to claim 6, characterized in that, The elastic limiting component is a compression spring, which is sleeved on the guide shaft. The two ends of the compression spring are respectively connected to the inner wall of the housing and the sliding connection part; the compression spring extends into the first hole structure, and the first hole structure is provided with a limiting protrusion.
8. The laser head module according to claim 1, characterized in that, The laser head module also includes a reset switch, which is configured to detect the position of the laser processing head and reset the laser processing head to zero.
9. The laser head module according to claim 1, characterized in that, The laser head module also includes a flame detection component, which includes a flame detection motherboard, a flame detection sensor mounted on the flame detection motherboard, and a limit switch. The flame detection sensor is configured to detect whether a fire has occurred, and the limit switch is configured to detect whether the movement of the laser processing head exceeds a predetermined stroke and to issue an alarm signal after exceeding the predetermined stroke.
10. The laser head module according to claim 1, characterized in that, The laser head module also includes a cooling system connected to the laser processing head, the cooling system being configured to cool the laser processing head.
11. A laser processing device, characterized in that, The laser processing equipment includes the laser head module as described in any one of claims 1-10.