A grinding device for chip production

Abstract

The utility model relates to chip production technical field especially for a kind of grinding device for chip production, including processing station and chip workpiece, processing station is provided with processing mechanism and is used to process chip workpiece, processing mechanism includes: feed assembly, including the first feed table and the second feed table of fixed in the top front end left and right sides of processing station and is used to place the chip workpiece to be processed, and the top middle of processing station is provided with pick-and-place component and is used to chip workpiece pick-and-place;Positioning assembly, including the front positioning component of setting in the top middle of processing station and is used to place the chip workpiece with upside, and the top middle left side of processing station is provided with back positioning component and is used to place the chip workpiece with upside;Through automated process, chip feeding, positioning, overturning and grinding processing are realized, modular design ensures processing accuracy and efficiency;Multi-axis collaborative motion and pneumatic adsorption technology guarantee chip non-destructive transfer and accurate positioning.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, specifically a grinding device for chip manufacturing. Background Technology

[0002] In the semiconductor manufacturing field, chip polishing is a key process to ensure the surface flatness and dimensional accuracy of devices.

[0003] According to CN215240147U, a wafer grinding device for electronic chip processing is disclosed. This technology discloses a technical solution including "a support frame, a top frame at the top of the support frame, a motor installed inside the top frame, a rotating shaft sleeved at the output end of the motor, a grinding disc at the bottom end of the rotating shaft, and a base at the bottom end of the support frame". It has the technical effect of "setting up an electric push rod, a limiting frame, a placement frame, a pushing column, a spray pipe and a tray. The output end of the electric push rod pushes the limiting frame to rise, and the rising of the limiting frame drives the placement frame to rise. When the limiting frame contacts the bottom end of the pushing column, the limiting frame pushes the pushing column to rise, the first spring is compressed, and the sealing plug at the top of the pushing column pushes the grinding liquid inside the liquid storage tank to the spray pipe through the second one-way valve. The grinding liquid inside the spray pipe is sprayed onto the wafer at the top of the tray by pressure, so that the device can control the spraying time and spraying volume of the grinding liquid".

[0004] Existing chip grinding equipment suffers from discontinuous process flows, with a lack of effective coordination mechanisms between processing units. This results in chips requiring repeated positioning during loading, positioning, flipping, and grinding. This discontinuous processing mode prolongs the production cycle and easily leads to cumulative positioning errors during process transitions, affecting the final product's processing accuracy and consistency. Furthermore, the lack of unified control standards between functional modules makes it difficult to achieve stable process parameter transfer, hindering the improvement of overall processing efficiency. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a grinding device for chip production. It achieves chip loading, positioning, flipping, and grinding through an automated process. The modular design ensures processing accuracy and efficiency. Multi-axis coordinated motion and pneumatic adsorption technology ensure non-destructive chip transfer and precise positioning.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a grinding apparatus for chip production, comprising a processing table and a chip workpiece, wherein a processing mechanism is provided on the processing table for processing the chip workpiece, and the processing mechanism includes:

[0007] The feeding assembly includes a first feeding platform and a second feeding platform fixed on the left and right sides of the front end of the top of the processing table and used to place the chip workpiece to be processed. A pick-and-place component is provided in the middle of the top of the processing table and used to pick up and place the chip workpiece.

[0008] The positioning assembly includes a front positioning component located at the center of the top of the processing table for placing a chip workpiece with its front facing upwards, and a back positioning component located on the left side of the center of the top of the processing table for placing a chip workpiece with its back facing upwards.

[0009] A flipping assembly is located at the rear end of the top of the processing table and is used to flip the chip workpiece.

[0010] The grinding assembly is located at the rear end of the top of the processing table and is used for grinding chip workpieces.

[0011] Preferably, the pick-and-place component includes a pick-and-place rotary cylinder fixed on the processing table, a pick-and-place dual-axis cylinder installed at the output end above the pick-and-place rotary cylinder, a support arm fixed at the output end above the pick-and-place dual-axis cylinder, a mounting plate fixed at the bottom of the upper end of the support arm, and a plurality of suction cups installed on the mounting plate.

[0012] Preferably, the front positioning component includes a front positioning rotary cylinder fixed on the processing table, and a front positioning seat is fixed at the upper output end of the front positioning rotary cylinder for positioning the chip workpiece placed with its front side facing up.

[0013] Preferably, the back-side positioning component includes a first electric slide fixed on the processing table, a back-side positioning rotary cylinder mounted on the slider of the first electric slide, and a back-side positioning seat fixed at the upper output end of the back-side positioning rotary cylinder for positioning the chip workpiece placed with its back side facing up.

[0014] Preferably, the flipping assembly includes a second electric slide fixed on the processing table, a support is mounted on the slider of the second electric slide, a first dual-axis cylinder is mounted on the support, a second dual-axis cylinder is mounted on the output end above the first dual-axis cylinder, and a pneumatic rotary gripper is mounted on the front output end of the second dual-axis cylinder.

[0015] Preferably, the grinding assembly includes a gantry fixed on the processing table, a Y-axis electric slide is mounted on the upper end of the gantry, an X-axis electric slide is mounted on the slider of the Y-axis electric slide, a Z-axis electric slide is mounted on the slider of the X-axis electric slide, a motor is mounted on the slider of the Z-axis electric slide, and a grinding head is fixed at the lower output end of the motor.

[0016] Beneficial effects

[0017] This invention provides a grinding apparatus for chip manufacturing. Compared with the prior art, it has the following advantages:

[0018] 1. The first and second feeding tables of the feeding assembly store the chips to be processed. The pick-and-place component transfers the chips to the positioning component. After the front positioning component positions the chip, the flipping component performs the chip flipping action, and the back positioning component accurately positions the flipped chip.

[0019] Finally, the grinding assembly performs precision grinding on the positioned chip. The modular design realizes full automation of the entire process from chip loading, positioning, flipping to grinding. The reasonable layout of each component on the processing table optimizes the production cycle and ensures that the chip maintains stable positioning accuracy throughout the processing, thereby improving the efficiency and quality consistency of chip processing.

[0020] 2. Through the multi-degree-of-freedom motion mechanism and pneumatic adsorption of the pick-and-place components, the chip workpiece is transferred precisely without damage; the rotation adjustment function of the front and back positioning components ensures that the chip always maintains the optimal positioning angle during processing; the multi-axis linkage mechanism of the flipping component enables the chip to be flipped smoothly and placed accurately; the three-axis electric slide system of the grinding component, together with the high-precision grinding head, can perform uniform grinding on chips in different positioning states. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0022] Figure 2 This is a schematic diagram of the feeding assembly in this utility model;

[0023] Figure 3 This is a schematic diagram of the positioning component in this utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the flipping component in this utility model;

[0025] Figure 5 This is a schematic diagram of the grinding component in this utility model.

[0026] In the diagram: 1. Processing table; 2. Processing mechanism; 21. Feeding assembly; 211. First feeding table; 212. Second feeding table; 213. Picking and placing component; 2131. Picking and placing rotary cylinder; 2132. Picking and placing dual-axis cylinder; 2133. Support arm; 2134. Mounting plate; 2135. Suction cup; 22. Positioning assembly; 221. Front positioning component; 2211. Front positioning rotary cylinder; 2212. Front positioning seat; 222. Rear positioning component; 2221. 2222, Back-side positioning rotary cylinder; 2223, Back-side positioning seat; 23, Tilting assembly; 231, Second electric slide; 232, Support; 233, First dual-axis cylinder; 234, Second dual-axis cylinder; 235, Pneumatic rotary gripper; 24, Grinding assembly; 241, Gantry frame; 242, Y-axis electric slide; 243, X-axis electric slide; 244, Z-axis electric slide; 245, Motor; 246, Grinding head; 3, Chip workpiece. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1 - Figure 5 This utility model provides a technical solution: a grinding device for chip production, including a processing table 1 and a chip workpiece 3. The processing table 1 is provided with a processing mechanism 2 for processing the chip workpiece 3. The processing mechanism 2 includes:

[0029] The feeding assembly 21 includes a first feeding platform 211 and a second feeding platform 212 fixed on the left and right sides of the top front end of the processing table 1 and used to place the chip workpiece 3 to be processed. A pick-and-place component 213 is provided in the middle of the top of the processing table 1 and used to pick up and place the chip workpiece 3.

[0030] The positioning component 22 includes a front positioning component 221 disposed at the top center of the processing table 1 and used to place the chip workpiece 3 with the front facing upwards, and a back positioning component 222 disposed on the left side of the top center of the processing table 1 and used to place the chip workpiece 3 with the back facing upwards.

[0031] The flipping component 23 is disposed at the top rear end of the processing table 1 and is used to flip the chip workpiece 3;

[0032] The grinding assembly 24 is located at the top rear end of the processing table 1 and is used to grind the chip workpiece 3.

[0033] In this embodiment, the first feeding table 211 and the second feeding table 212 of the feeding component 21 respectively store the chips to be processed. The pick-and-place component 213 transfers the chips to the positioning component 22. After the front positioning component 221 positions the chip from the front, the flipping component 23 performs the chip flipping action, and the back positioning component 222 precisely positions the flipped chip. Finally, the grinding component 24 performs precision grinding on the positioned chip. The modular design realizes the full automation of the process from chip feeding, positioning, flipping to grinding. The reasonable layout of each component on the processing table 1 optimizes the production cycle and ensures that the chip maintains stable positioning accuracy during the processing, thereby improving the efficiency and quality consistency of chip processing.

[0034] Specifically, the pick-and-place component 213 includes a pick-and-place rotary cylinder 2131 fixed on the processing table 1, a pick-and-place dual-axis cylinder 2132 installed at the output end above the pick-and-place rotary cylinder 2131, a support arm 2133 fixed at the output end above the pick-and-place dual-axis cylinder 2132, a mounting plate 2134 fixed at the bottom of the upper end of the support arm 2133, and a plurality of suction cups 2135 installed on the mounting plate 2134.

[0035] In this embodiment, the output end of the pick-and-place rotary cylinder 2131 drives the pick-and-place dual-axis cylinder 2132 to rotate and position. The pick-and-place dual-axis cylinder 2132 drives the support arm 2133 through its dual-axis output to achieve a combined lifting and horizontal extension and retraction motion. Several suction cups 2135 arranged on the mounting plate 2134 at the end of the support arm 2133 can simultaneously adsorb the chip workpiece 3, so as to pick up and place the chip workpiece 3 placed in the first feeding table 211 and the second feeding table 212 into the front positioning seat 2212.

[0036] Specifically, the front positioning component 221 includes a front positioning rotary cylinder 2211 fixed on the processing table 1. The upper output end of the front positioning rotary cylinder 2211 is fixed with a front positioning seat 2212 and is used to position the chip workpiece 3 placed with its front side facing up.

[0037] In this embodiment, the front positioning seat 2212 driven by the upper output end of the front positioning rotary cylinder 2211 can be adjusted circumferentially. When the chip workpiece 3 is placed on the front positioning seat 2212 by the pick-and-place component 213, the rotary cylinder can drive the chip workpiece 3 to rotate to a specified angle position according to the process requirements.

[0038] Specifically, the back positioning component 222 includes a first electric slide 2221 fixed on the processing table 1. A back positioning rotary cylinder 2222 is installed on the slider of the first electric slide 2221. A back positioning seat 2223 is fixed at the upper output end of the back positioning rotary cylinder 2222 and is used to position the chip workpiece 3 with its back facing upward.

[0039] In this embodiment, the slider of the first electric slide 2221 drives the back positioning rotary cylinder 2222 to adjust the horizontal position, so that the back positioning seat 2223 can be flexibly moved to the optimal receiving position according to the chip size; the back positioning rotary cylinder 2222 drives the back positioning seat 2223 to perform rotational fine adjustment to ensure that the chip workpiece 3 can be accurately aligned when the back is facing up after being flipped.

[0040] Specifically, the flipping assembly 23 includes a second electric slide 231 fixed on the processing table 1. A support 232 is installed on the slider of the second electric slide 231. A first dual-axis cylinder 233 is installed on the support 232. A second dual-axis cylinder 234 is installed at the output end above the first dual-axis cylinder 233. A pneumatic rotary gripper 235 is installed at the front output end of the second dual-axis cylinder 234.

[0041] In this embodiment, the slider of the second electric slide table drives the support 232 to move horizontally. The first dual-axis cylinder 233 installed on the support 232 provides vertical lifting function, while the second dual-axis cylinder 234 connected above the first dual-axis cylinder 233 realizes the forward and backward extension movement. Finally, the pneumatic rotating gripper 235 completes the gripping and rotation of the chip workpiece 3; thus, the chip workpiece 3 on the front positioning seat 2212 is flipped 180° and placed on the back positioning seat 2223.

[0042] Specifically, the grinding assembly 24 includes a gantry 241 fixed on the processing table 1, a Y-axis electric slide 242 mounted on the upper end of the gantry 241, an X-axis electric slide 243 mounted on the slider of the Y-axis electric slide 242, a Z-axis electric slide 244 mounted on the slider of the X-axis electric slide 243, a motor 245 mounted on the slider of the Z-axis electric slide 244, and a grinding head 246 fixed at the lower output end of the motor 245.

[0043] In this embodiment, the grinding assembly 24 performs grinding processing on the chip workpiece 3 in the front positioning seat 2212 and the back positioning seat 2223 through its precise three-axis linkage structure.

[0044] The working principle and usage process of this utility model are as follows: First, the first feeding platform 211 and the second feeding platform 212 of the feeding assembly 21 respectively store the chips to be processed; the output end of the pick-and-place rotary cylinder 2131 drives the pick-and-place dual-axis cylinder 2132 to rotate and position. The pick-and-place dual-axis cylinder 2132 drives the support arm 2133 through its dual-axis output to achieve a combined lifting and horizontal extension and retraction motion. Several suction cups 2135 arranged on the mounting plate 2134 at the end of the support arm 2133 can simultaneously adsorb the chip workpiece 3, so as to pick up and place the chip workpiece 3 placed in the first feeding platform 211 and the second feeding platform 212 into the front positioning seat 2212.

[0045] Then, the front positioning seat 2212 driven by the upper output end of the front positioning rotary cylinder 2211 can be adjusted circumferentially. When the chip workpiece 3 is placed on the front positioning seat 2212 by the pick-and-place component 213, the rotary cylinder can drive the chip workpiece 3 to rotate to a specified angle according to the process requirements; thereby, the chip workpiece 3 facing upward in the front positioning seat 2212 can be ground by the grinding component 24.

[0046] Finally, the slider of the second electric slide moves the support 232 horizontally. The first dual-axis cylinder 233 installed on the support 232 provides vertical lifting function, while the second dual-axis cylinder 234 connected above the first dual-axis cylinder 233 realizes the forward and backward extension movement. Finally, the pneumatic rotary gripper 235 completes the gripping and rotation of the chip workpiece 3. This allows the chip workpiece 3 on the front positioning seat 2212 to be flipped 180° and placed on the back positioning seat 2223. The slider of the first electric slide 2221 drives the back positioning rotary cylinder 2222 to adjust the horizontal position, so that the back positioning seat 2223 can be flexibly moved to the optimal receiving position according to the chip size. The back positioning rotary cylinder 2222 drives the back positioning seat 2223 to rotate and fine-tune, ensuring that the chip workpiece 3 can be accurately aligned when the back is facing up after being flipped. Thus, the chip workpiece 3 with the back facing up in the back positioning seat 2223 can be ground by the grinding assembly 24.

[0047] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0048] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A grinding device for chip production, comprising a processing table (1) and a chip workpiece (3), characterized in that: The processing table (1) is equipped with a processing mechanism (2) for processing chip workpieces (3). The processing mechanism (2) includes: The feeding assembly (21) includes a first feeding platform (211) and a second feeding platform (212) fixed on the left and right sides of the top front end of the processing table (1) and used to place the chip workpiece (3) to be processed. A pick-and-place component (213) is provided in the middle of the top of the processing table (1) and used to pick up and place the chip workpiece (3). The positioning component (22) includes a front positioning component (221) disposed in the middle of the top of the processing table (1) and used to place the chip workpiece (3) with the front facing upward. A back positioning component (222) is disposed on the left side of the middle of the top of the processing table (1) and used to place the chip workpiece (3) with the back facing upward. A flipping assembly (23) is provided at the top rear end of the processing table (1) and is used to flip the chip workpiece (3); A grinding assembly (24) is set at the top rear end of the processing table (1) and is used to grind the chip workpiece (3).

2. The polishing apparatus for chip production according to claim 1, wherein: The pick-and-place component (213) includes a pick-and-place rotary cylinder (2131) fixed on the processing table (1), a pick-and-place dual-axis cylinder (2132) is installed at the output end above the pick-and-place rotary cylinder (2131), a support arm (2133) is fixed at the output end above the pick-and-place dual-axis cylinder (2132), a mounting plate (2134) is fixed at the bottom of the upper end of the support arm (2133), and a plurality of suction cups (2135) are installed on the mounting plate (2134).

3. The polishing apparatus for chip production according to claim 1, wherein: The front positioning component (221) includes a front positioning rotary cylinder (2211) fixed on the processing table (1). The front positioning rotary cylinder (2211) has a front positioning seat (2212) fixed at its upper output end and is used to position the chip workpiece (3) placed with its front facing upward.

4. The polishing apparatus for chip production according to claim 1, wherein: The back positioning component (222) includes a first electric slide (2221) fixed on the processing table (1). A back positioning rotary cylinder (2222) is installed on the slider of the first electric slide (2221). A back positioning seat (2223) is fixed at the upper output end of the back positioning rotary cylinder (2222) and is used to position the chip workpiece (3) with its back facing upward.

5. The polishing apparatus for chip production according to claim 1, wherein: The flipping assembly (23) includes a second electric slide (231) fixed on the processing table (1). A support (232) is installed on the slider of the second electric slide (231). A first dual-axis cylinder (233) is installed on the support (232). A second dual-axis cylinder (234) is installed at the output end above the first dual-axis cylinder (233). A pneumatic rotary gripper (235) is installed at the front output end of the second dual-axis cylinder (234).

6. The polishing apparatus for chip production according to claim 1, wherein: The grinding assembly (24) comprises a gantry (241) fixed on the machining table (1), a Y-axis electric sliding table (242) is installed on the upper end of the gantry (241), a X-axis electric sliding table (243) is installed on the sliding block of the Y-axis electric sliding table (242), a Z-axis electric sliding table (244) is installed on the sliding block of the X-axis electric sliding table (243), a motor (245) is installed on the sliding block of the Z-axis electric sliding table (244), and a grinding head (246) is fixed below the lower output end of the motor (245).

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