Ceramic conductive paste hole filling processing device

Abstract

The utility model discloses a ceramic conduction slurry hole filling processing device, including seal cover, the even several air holes of seal cover top surface are equipped with, the both sides of seal cover top surface near edge all have the bonding of clamping block, the movable joint of seal cover top surface has the bottom plate, the vacuum chuck of being equipped with in the bottom plate inside the air hole top, the both sides of bottom plate surface all are fixed with the mounting of connecting plate, the one side of connecting plate surface is located the fixed mounting of lantern ring in the position of screw hole, the both sides of lantern ring and connecting plate all are installed with the screw press bar of penetrating, the gasket of movable installation of screw press bar other end, the fixed mounting of holding lever of connecting plate top surface, this device is equipped with the vacuum chuck of soft texture in the air hole top, can effectively solve the problem of poor adsorption effect caused by the uneven surface of ceramic base.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrate processing technology, and in particular to a ceramic conductive paste filling device. Background Technology

[0002] An antenna is a transducer that converts guided waves propagating on a transmission line into electromagnetic waves propagating in an unbounded medium, or vice versa. In wireless equipment, used to transmit or receive electromagnetic waves, a ceramic substrate is an essential electronic component that carries the antenna. The manufacturing process involves using a laser to create micro-holes in the ceramic substrate, then placing it into a mold with vacuum suction. A printing press then applies ink while a vacuum is created below to help fill the substrate.

[0003] Traditional ceramic substrate processing equipment has the following drawbacks:

[0004] 1. Traditional ceramic substrates often require vacuum negative pressure devices to adsorb and fix them during printing and slurry processing to achieve the desired effect in subsequent processing. However, since there are circuits distributed on the bottom surface of the ceramic substrate, the bottom surface of the ceramic substrate may be uneven. This can lead to poor adsorption effect when the ceramic substrate is fixed under negative pressure due to the uneven adsorption surface.

[0005] 2. After the traditional ceramic substrate is processed, it needs to be removed. However, the removal can usually only be done manually one by one, which is not only cumbersome and time-consuming, but also cannot achieve the effect of removing a large number of ceramic substrates at once, making it inconvenient to use. Utility Model Content

[0006] The main purpose of this invention is to provide a ceramic conductive slurry filling device, which can effectively solve the problems in the background art.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0008] A ceramic conductive slurry filling device includes a sealing cover plate. The top surface of the sealing cover plate has a plurality of uniformly distributed air holes. Clamping blocks are adhered to both sides of the top surface of the sealing cover plate near its edge. A base plate is movably connected to the top surface of the sealing cover plate. A vacuum suction cup is located inside the base plate above the air holes. Connecting plates are fixedly installed on both sides of the base plate. A collar is fixedly installed on one side of the connecting plate at a threaded hole position. A threaded pressure rod is installed through the collar and the connecting plate. A washer is movably installed at the other end of the threaded pressure rod. A handle is fixedly installed on the top surface of the connecting plate.

[0009] Preferably, a frame is movably mounted on the top surface of the base plate via a fixing plate and a slot B. Fixing plates are fixedly mounted on both sides of the frame surface near the bottom. A slot B is provided at the bottom of the fixing plate and is fastened to the surface of the card block.

[0010] Preferably, the bottom of the sealing cover is movably mounted with a housing via hexagonal screws, and handles are movably mounted on the left and right sides of the sealing cover via fixing screws.

[0011] Preferably, the connecting plate has a slot A inside, and the slot A is fastened to the surface of the card block.

[0012] Preferably, a sealing seat is provided on one side of the box surface, and an air pipe is movably installed inside the sealing seat.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. This ceramic conductive slurry filling hole processing device, when in use, places the base plate on top of the sealing cover plate, aligns the vacuum suction cup with the air hole position vertically, and by tightening the threaded pressure rods on the left and right sides of the base plate, the gaskets on both sides can be moved inward until they are completely in contact with the surface of the sealing cover plate. Under pressure, the base plate can be fixed on the surface of the sealing cover plate, thereby fixing the vacuum suction cup on the outside of the air hole. Since the material of the vacuum suction cup is relatively soft, it can effectively solve the problem of poor adsorption effect caused by the unevenness of the ceramic base surface;

[0015] 2. This ceramic conductive slurry filling device fixes the frame to the top of the base plate by fastening the slot B to the surface of the card block. By additionally installing the frame structure on the surface of the base plate, and by making the frame structure flexibly detachable, the frame can be removed before processing the ceramic substrate, thus not affecting the adsorption and fixation of the ceramic substrate and subsequent processing. When the processing of the ceramic substrate is completed and it is necessary to remove the material, the frame is reinstalled on the base plate, and then the base plate is directly lifted. At the same time, due to the obstruction of the frame, the material removal of the ceramic substrate can be completed in one go, and the ceramic substrate will not fall. The operation is time-saving and labor-saving, and there is no need for staff to pick up the materials one by one. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0017] Figure 1This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the chassis structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the card block structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the suction cup structure of this utility model;

[0021] Figure 5 This is a schematic diagram of the frame structure of this utility model.

[0022] In the diagram: 1. Sealing cover; 2. Air vent; 3. Clamping block; 4. Base plate; 5. Vacuum suction cup; 6. Connecting plate; 7. Slot A; 8. Threaded pressure rod; 9. Collar; 10. Gasket; 11. Handle; 12. Frame; 13. Fixing plate; 14. Slot B; 15. Hex screw; 16. Box body; 17. Fixing screw; 18. Handle; 19. Sealing seat; 20. Air pipe. Detailed Implementation

[0023] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0024] In the description of the embodiments of this utility model, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0027] The following disclosure provides many different implementations or examples for different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0028] To better understand the purpose, structure, and function of this utility model, the following description, in conjunction with the accompanying drawings, provides a more detailed account of a ceramic conductive slurry filling device for processing holes.

[0029] like Figure 1-5 As shown, a ceramic conductive slurry filling device includes a sealing cover plate 1. The top surface of the sealing cover plate 1 has a plurality of uniformly distributed air holes 2. Clamping blocks 3 are adhered to both sides of the top surface of the sealing cover plate 1 near the edge. A base plate 4 is movably connected to the top surface of the sealing cover plate 1. A vacuum suction cup 5 is provided inside the base plate 4 above the air holes 2. Connecting plates 6 are fixedly installed on both sides of the surface of the base plate 4. A collar 9 is fixedly installed on one side of the connecting plate 6 at the threaded hole position. The collar 9 and the connecting plate 6 are both internally connected. A threaded pressure rod 8 is installed on the connecting plate 6, and a gasket 10 is movably installed on the other end of the threaded pressure rod 8. A handle 11 is fixedly installed on the top surface of the connecting plate 6. In use, the base plate 4 is placed on top of the sealing cover plate 1, so that the vacuum suction cup 5 is vertically aligned with the air hole 2. By tightening the threaded pressure rods 8 on the left and right sides of the base plate 4, the gaskets 10 on both sides can be moved inward until they are completely in contact with the surface of the sealing cover plate 1. Under pressure, the base plate 4 can be fixed to the surface of the sealing cover plate 1, thereby fixing the vacuum suction cup 5 to the outside of the air hole 2.

[0030] A frame 12 is movably mounted on the top surface of the base plate 4 via a fixing plate 13 and a slot B14. Fixing plates 13 are fixedly mounted on both sides of the frame 12 near the bottom. The bottom of the fixing plate 13 is provided with a slot B14, which is fastened to the surface of the slot 3. By fastening the slot B14 to the surface of the slot 3, the frame 12 can be fixed to the top of the base plate 4, thereby preventing the ceramic substrate from falling off.

[0031] The bottom of the sealing cover 1 is movably mounted with a box 16 via hexagonal screws 15, and handles 18 are movably mounted on the left and right sides of the surface of the sealing cover 1 via fixing screws 17; the installation of handles 18 makes it easier for users to move this device.

[0032] The connecting plate 6 has a slot A7 inside, which is fastened to the surface of the card block 3. By using the slot A7 to fasten the card block 3, it is easier to position the base plate 4 when fixing it.

[0033] A sealing seat 19 is provided on one side of the surface of the box 16, and an air pipe 20 is movably installed inside the sealing seat 19; negative pressure adsorption can be performed inside the box 16 through the air pipe 20.

[0034] It should be noted that this utility model is a ceramic conductive slurry filling hole processing device. In use, first connect the vacuum pump to the air pipe 20, then hold the handle 11 and place the base plate 4 on top of the sealing cover plate 1. Snap the slot A7 onto the surface of the clamping block 3. Then, turn the threaded pressure rods 8 on both sides of the base plate 4 to the left, causing the threaded pressure rods 8 to move the gasket 10 inwards until it is completely in contact with the surface of the sealing cover plate 1. After fixing the base plate 4, place the ceramic substrate on top of the vacuum suction cup 5, then turn on the vacuum pump. Under negative pressure, the ceramic substrate can be fixed. At the top of the vacuum suction cup 5, the printing and slurry filling work can then begin. When the ceramic substrate needs to be collected and moved after the slurry filling work is completed, the vacuum pump can be turned off first, and then the frame 12 can be placed on the top of the base plate 4, so that the slot B14 is fastened to the surface of the card block 3, thus fixing the frame 12 on the top of the base plate 4. Then, turn the threaded pressure rod 8 to the right to move the pad 10 outward, thus loosening the base plate 4. Then, hold the handle 11 and lift it upward, thus lifting the base plate 4 together with the ceramic substrate, achieving the purpose of one-time material picking. Finally, move it to the appropriate position.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A ceramic conductive slurry filling device, comprising a sealing cover plate (1), characterized in that: The top surface of the sealing cover (1) is uniformly provided with several air holes (2). The top surface of the sealing cover (1) is bonded with two clips (3) near the edge. The top surface of the sealing cover (1) is movably connected to a base plate (4). The bottom plate (4) is provided with a vacuum suction cup (5) above the air holes (2). The bottom plate (4) is fixedly installed with connecting plates (6) on both sides. A collar (9) is fixedly installed on one side of the connecting plate (6) at the threaded hole position. A threaded pressure rod (8) is installed through the collar (9) and the connecting plate (6). A gasket (10) is movably installed at the other end of the threaded pressure rod (8). A handle (11) is fixedly installed on the top surface of the connecting plate (6).

2. The ceramic conductive slurry filling device according to claim 1, characterized in that: The top surface of the base plate (4) is movably mounted with a frame (12) via a fixing plate (13) and a slot B (14). Fixing plates (13) are fixedly mounted on both sides of the frame (12) near the bottom. The bottom of the fixing plate (13) is provided with a slot B (14), which is fastened to the surface of the card block (3).

3. The ceramic conductive slurry filling device according to claim 1, characterized in that: The bottom of the sealing cover (1) is movably mounted with a box (16) by a hexagonal screw (15), and handles (18) are movably mounted on the left and right sides of the surface of the sealing cover (1) by fixing screws (17).

4. The ceramic conductive slurry filling device according to claim 1, characterized in that: The connecting plate (6) has a slot A (7) inside, and the slot A (7) is fastened to the surface of the card block (3).

5. The ceramic conductive slurry filling device according to claim 3, characterized in that: A sealing seat (19) is provided on one side of the surface of the box (16), and an air pipe (20) is movably installed inside the sealing seat (19).

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