Vacuum robot
CN224334473UActive Publication Date: 2026-06-09WUXI FUCHUANGDE INTELLIGENT TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI FUCHUANGDE INTELLIGENT TECH CO LTD
- Filing Date
- 2025-05-19
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
Existing robotic arms cannot be used in high-cleanliness environments and cannot meet the sealing requirements of vacuum environments, affecting the accuracy of wafer transfer.
Method used
A vacuum manipulator was designed, which uses a box with a telescopic cavity, a mounting frame, a rotating shaft, a drive unit and a lifting mechanism, combined with sealing components and flexible components to ensure sealing effect in a high-cleanliness environment and improve wafer transfer accuracy.
Benefits of technology
It achieves vacuum sealing in a high-cleanliness environment, improves wafer transfer accuracy and handling efficiency, and meets the wafer handling requirements in a vacuum environment.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224334473U_ABST
Abstract
The utility model relates to the technical field of semiconductor processing, especially a vacuum manipulator, including box, mounting bracket, first pivot, second pivot, sealing shaft sleeve, first drive unit, second drive unit, lifting mechanism, first sealing assembly and second sealing assembly, the top of first pivot is connected with first big arm, the top of second pivot is connected with second big arm, install at least two symmetrical arrangement telescopic arms between first big arm and second big arm, the telescopic arm is two -armed structure, the utility model can guarantee manipulator to use under high clean environment smoothly, can satisfy the sealing demand of vacuum environment, benefit wafer in vacuum environment handling, promote wafer transmission precision.
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