Variable pitch silicon wafer lift and wafer transport apparatus

Abstract

The utility model belongs to the technical field of silicon wafer processing, concretely relates to a variable distance silicon wafer lifting device and silicon wafer conveying device. The variable distance silicon wafer lifting device includes: lifting plate, is driven lifting by lifting mechanism, a plurality of silicon wafer lifting assembly, sets up on the lifting plate, the silicon wafer lifting assembly includes two opposite silicon wafer supporting members, is movably installed on the lifting plate respectively, two opposite silicon wafer supporting members are used for setting on the both sides of conveying line respectively, and supporting member variable distance mechanism is used for driving opposite silicon wafer supporting member to move towards or reverse. The variable distance silicon wafer lifting device of the utility model can lift the silicon wafer on the conveying line by the lifting plate driving silicon wafer supporting member to supply adsorption mechanism positioning, grabbing, or receiving the unloading of adsorption mechanism grabbing, and the lifting plate drives silicon wafer supporting member to drop to place the silicon wafer on the conveying line.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer processing technology, specifically relating to a variable-pitch silicon wafer lifting device and a silicon wafer conveying device. Background Technology

[0002] In recent years, laser cutting has rapidly replaced mechanical cutting for silicon wafer dicing. Laser cutting is more conducive to improving chip yield and large-scale production, while mechanical cutting is inefficient, produces large edge chips, and incurs extremely high costs for consumables such as cutting wheels and cutting fluid, as well as high machine maintenance costs. Laser cutting is a non-contact processing method with many advantages that mechanical processing cannot match. Laser processing is environmentally friendly, highly efficient, and produces less edge chipping. The mainstream laser cutting technologies are stealth cutting and ablation cutting.

[0003] To increase production capacity, silicon wafer conveyor lines typically have multiple laser processing stations, each with a mechanism for loading and unloading wafers between the conveyor line and the processing table. Current equipment requires the silicon wafer conveyor line to pause during loading to stop the wafer transport, then the loading mechanism grabs the wafer, and the conveyor line resumes transport after the wafer is grabbed. However, wafers are generally grabbed directly from the conveyor line using suction nozzles, which takes a long time to position and grab. Therefore, this method causes the entire conveyor line to pause while loading at one station, affecting the supply of wafers to other processing stations and impacting production efficiency. The same issue arises during unloading; the conveyor line also needs to wait when unloading the processed wafers. Utility Model Content

[0004] The purpose of this invention is to provide a variable-pitch silicon wafer lifting device and a silicon wafer conveying device to solve the technical problem that the existing technology requires too long a pause time in the conveying line when directly picking up or placing silicon wafers.

[0005] This application provides a variable-pitch silicon wafer lifting device, comprising:

[0006] The lifting platform is raised and lowered by a lifting mechanism;

[0007] Several silicon wafer lifting assemblies are mounted on a lifting plate; each silicon wafer lifting assembly includes two oppositely arranged silicon wafer support members, which are movably mounted on the lifting plate; the two oppositely arranged silicon wafer support members are respectively used to be positioned on both sides of the conveyor line; and

[0008] The variable pitch mechanism for the support component is used to drive the silicon wafer support components that are positioned opposite each other to move in opposite directions.

[0009] In one embodiment of this application, the lifting mechanism includes:

[0010] Base;

[0011] The mounting plate is fixedly mounted on the base.

[0012] A lead screw is rotatably mounted on a fixed plate; the lifting plate is threadedly engaged with the lead screw; and

[0013] The lead screw drive assembly is used to drive the lead screw to rotate, thereby raising and lowering the lifting plate.

[0014] In one embodiment of this application, a plurality of guide rods are mounted on the fixing plate;

[0015] The lifting plate is slidably mounted on the guide rod;

[0016] A bearing seat is installed at the upper end of the guide rod;

[0017] The upper end of the lead screw is rotatably fitted with the bearing housing.

[0018] In one embodiment of this application, the lead screw drive assembly includes:

[0019] The first motor is mounted on the base, and its output end is equipped with a first drive wheel;

[0020] The first driven wheel is mounted on the lead screw; and

[0021] The first synchronous belt is used to connect the first driving pulley and the first driven pulley.

[0022] In one embodiment of this application, an installation space is provided between the fixing plate and the base;

[0023] The lower end of the lead screw passes through the fixed plate and extends into the installation space, and is provided with the first driven wheel.

[0024] In one embodiment of this application, a slide rail is provided on the lifting plate;

[0025] The lower end of the silicon wafer support is mounted on a slide rail, and the upper end is provided with a support plate.

[0026] In one embodiment of this application, the support member pitch-changing mechanism includes:

[0027] The second motor is mounted on the lifting plate, and its output end is equipped with a second drive wheel;

[0028] The second driven wheel is mounted on the lifting plate; and

[0029] The second synchronous belt is arranged parallel to the slide rail, and its two ends are respectively connected to the second driving pulley and the second driven pulley; wherein

[0030] The two silicon wafer support components of the silicon wafer support assembly are fixedly connected to the two sides of the second synchronous belt, respectively.

[0031] In one embodiment of this application, the number of silicon wafer lifting assemblies is two, respectively disposed at both ends of the lifting plate;

[0032] The number of the support member pitch-changing mechanism is two, each used to drive the corresponding silicon wafer lifting assembly.

[0033] In one embodiment of this application, the lifting plate is provided with an avoidance notch in the middle to avoid the first motor.

[0034] Accordingly, this application provides a silicon wafer conveying device, comprising:

[0035] Conveyor lines are used to transport silicon wafers; and

[0036] The variable-pitch silicon wafer lifting device described above.

[0037] The beneficial effects of this utility model are:

[0038] Unlike existing technologies, this application provides a variable-pitch silicon wafer lifting device and a silicon wafer conveying device. The variable-pitch silicon wafer lifting device includes: a lifting plate, driven to rise and fall by a lifting mechanism; several silicon wafer lifting assemblies, disposed on the lifting plate; each silicon wafer lifting assembly includes two oppositely arranged silicon wafer support members, movably mounted on the lifting plate; the two oppositely arranged silicon wafer support members are respectively positioned on both sides of the conveyor line; and a support member pitch-changing mechanism, used to drive the oppositely arranged silicon wafer support members to move towards or in opposite directions. This variable-pitch silicon wafer lifting device can lift silicon wafers on the conveyor line by the lifting plate driving the silicon wafer support members for positioning and gripping by an adsorption mechanism; or receive unloaded wafers gripped by the adsorption mechanism, with the lifting plate driving the silicon wafer support members to descend and place the silicon wafers on the conveyor line. Compared to the adsorption mechanism directly gripping or placing wafers on the conveyor line, the time the conveyor line is interrupted by lifting or placing silicon wafers by the silicon wafer support members is extremely short, effectively improving production efficiency.

[0039] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0040] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0041] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0042] Figure 1 This is a perspective view of a preferred embodiment of the variable-pitch silicon wafer lifting device of this utility model;

[0043] Figure 2 This is a schematic diagram of a lifting mechanism according to a preferred embodiment of the present invention;

[0044] Figure 3 This is a schematic diagram of a preferred embodiment of the support member pitch-changing mechanism of this utility model;

[0045] Figure 4 This is a schematic diagram of a silicon wafer conveying device according to a preferred embodiment of the present invention.

[0046] In the picture:

[0047] Lifting plate 1, slide rail 11, lifting mechanism 2, base 21, fixing plate 22, guide rod 221, bearing seat 222, lead screw 23, lead screw drive assembly 24, first motor 241, first driving wheel 2411, first driven wheel 242, first synchronous belt 243, silicon wafer lifting assembly 3, silicon wafer support 31, support plate 32, support pitch changing mechanism 4, second motor 41, second driving wheel 411, second driven wheel 42, second synchronous belt 43;

[0048] Conveyor line 100, silicon wafer conveyor 200, and variable-pitch silicon wafer lifting device 300. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0050] This application provides a variable-pitch silicon wafer lifting device and a silicon wafer conveying device, which are described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0051] See Figure 1 In one embodiment, the variable-pitch silicon wafer lifting device includes: a lifting plate 1, which is driven to lift by a lifting mechanism 2; a plurality of silicon wafer lifting assemblies 3, which are disposed on the lifting plate 1; the silicon wafer lifting assembly 3 includes two oppositely disposed silicon wafer support members 31, which are movably mounted on the lifting plate 1; the two oppositely disposed silicon wafer support members 31 are respectively used to be disposed on both sides of the conveyor line 100; and a support member pitch changing mechanism 4, which is used to drive the oppositely disposed silicon wafer support members 31 to move towards or in opposite directions.

[0052] In one application scenario, when the conveyor line 100 is used for loading, the lifting mechanism 2 drives the lifting plate 1 to rise, thereby lifting the corresponding silicon wafers off the surface of the conveyor line 100 through the silicon wafer lifting assembly 3. The lifting time is extremely short, and the conveyor line only needs to pause for a very short time, such as about 0.1 seconds, before it can continue to transport other silicon wafers forward. Then, the loading mechanism can perform positioning and suction operations on the silicon wafers on the silicon wafer lifting assembly 3. Afterward, the support member pitch changing mechanism 4 can widen the distance between the two silicon wafer support members 31 of the silicon wafer lifting assembly 3 to avoid the silicon wafers on the conveyor line 100. The lifting mechanism 2 drives the lifting plate 1 to descend, causing the silicon wafer lifting assembly 3 to descend below the silicon wafers. The support member pitch changing mechanism 4 then narrows the distance between the two silicon wafer support members 31 of the silicon wafer lifting assembly 3 to perform the next silicon wafer lifting.

[0053] Similarly, when the conveyor line 100 is a feeding conveyor line, the silicon wafer lifting assembly 3 is located above the conveyor line. After the feeding mechanism places the silicon wafer on the silicon wafer lifting assembly 3, the lifting mechanism 2 drives the lifting plate 1 to descend. After the silicon wafer lifting assembly 3 places the silicon wafer on the conveyor line 100, the support member pitch changing mechanism 4 can widen the distance between the two silicon wafer support members 31 of the silicon wafer lifting assembly 3 to avoid the silicon wafer on the conveyor line 100. The lifting mechanism 2 drives the lifting plate 1 to rise, thereby reaching the waiting position above the conveyor line 100. The support member pitch changing mechanism 4 can narrow the distance between the two silicon wafer support members 31 of the silicon wafer lifting assembly 3 to prepare to receive the next silicon wafer.

[0054] In this embodiment, the variable-pitch silicon wafer lifting device can be connected between the conveyor line 100 and the loading / unloading mechanism. The lifting and lowering actions between the device and the conveyor line 100 are extremely short and do not affect the conveyor line 100's transport to other workstations. Furthermore, the positioning, picking up, or placing of the loading / unloading mechanism all occur on the variable-pitch silicon wafer lifting device, eliminating the need for the conveyor line 100 to pause for an extended period, thus improving production efficiency.

[0055] See Figure 2Optionally, the lifting mechanism 2 includes: a base 21; a fixed plate 22 fixedly mounted on the base 21; a lead screw 23 rotatably mounted on the fixed plate 22; the lifting plate 1 being threadedly engaged with the lead screw 23; and a lead screw drive assembly 24 for driving the lead screw 23 to rotate, thereby driving the lifting plate 1 to rise and fall.

[0056] In this embodiment, the lead screw 23 and the lifting plate 1 can be directly threaded together or connected via a lead screw and nut. When the lead screw drive assembly 24 drives the lead screw 23 to rotate, the lifting plate 1 can move up and down on the lead screw 23.

[0057] Furthermore, a plurality of guide rods 221 are installed on the fixed plate 22; the lifting plate 1 is slidably disposed on the guide rods 221; a bearing seat 222 is installed at the upper end of the guide rod 221; and the upper end of the lead screw 23 is rotatably engaged with the bearing seat 222.

[0058] For details, see Figure 2 There can be two guide rods 221, located on both sides of the lead screw 23, which can provide stable guidance. The lower end of the guide rod 221 is fixed to the fixed plate 22, and the upper end is connected through the bearing seat 222, which can improve the structural stability. The lower part of the lead screw 23 can cooperate with the fixed plate 22 through a bearing, and the upper end can cooperate with the bearing seat 222 through a bearing.

[0059] Furthermore, the lead screw drive assembly 24 includes: a first motor 241, mounted on the base 21, with a first drive wheel 2411 at its output end; a first driven wheel 242, mounted on the lead screw 23; and a first synchronous belt 243 for connecting the first drive wheel 2411 and the first driven wheel 242.

[0060] In this embodiment, the rotation of the first motor 241 can drive the lead screw 23 to rotate through the first driving wheel 2411, the first synchronous belt 243, and the first driven wheel 242.

[0061] In this embodiment, in order to make effective use of space, an installation space is provided between the fixing plate 22 and the base 21; the lower end of the lead screw 23 passes through the fixing plate 22 and extends into the installation space, and is provided with the first driven wheel 242.

[0062] See Figure 3 Furthermore, the lifting plate 1 is provided with a slide rail 11; the lower end of the silicon wafer support 31 is mounted on the slide rail 11, and the upper end is provided with a support plate 32. By providing the slide rail 11, the silicon wafer support 31 can move on the slide rail 11.

[0063] Optionally, the support member pitch-changing mechanism 4 includes: a second motor 41, mounted on the lifting plate 1, with a second driving wheel 411 at its output end; a second driven wheel 42, mounted on the lifting plate 1; and a second synchronous belt 43, arranged parallel to the slide rail 11, with its two ends respectively connected to the second driving wheel 411 and the second driven wheel 42; wherein the two silicon wafer support members 31 of the silicon wafer lifting assembly 3 are respectively fixedly connected to the two sides of the belt body of the second synchronous belt 43.

[0064] In this embodiment, the second motor 41 can rotate the second synchronous belt 43 via the second driving wheel 411 and the second driven wheel 42. Since the two silicon wafer support members 31 of the silicon wafer lifting assembly 3 are fixedly connected to the two sides of the second synchronous belt 43 respectively, when the second synchronous belt 43 rotates, the two silicon wafer support members 31 of the silicon wafer lifting assembly 3 can move towards or in opposite directions simultaneously.

[0065] See Figure 1 Optionally, the number of silicon wafer lifting assemblies 3 is two, respectively disposed at both ends of the lifting plate 1; the number of variable pitch support mechanisms 4 is two, each used to drive the corresponding silicon wafer lifting assembly 3. In this embodiment, the variable pitch silicon wafer lifting device can lift or receive two silicon wafers at a time, improving production efficiency.

[0066] Further, see Figure 1 The lifting plate 1 has a clearance notch in the middle to allow the first motor 241 to pass, which can reduce the overall space occupied.

[0067] Based on the above embodiments, see Figure 4 An embodiment of this application also provides a silicon wafer conveying device, including: a conveying line 100 for conveying silicon wafers 200; and a variable-pitch silicon wafer lifting device 300 as described above.

[0068] In this embodiment, multiple variable-pitch silicon wafer lifting devices 300 can be set along the conveyor line 100, which are used to cooperate with the loading and unloading of each processing station.

[0069] It should be noted that all the devices (parts whose specific structures are not specified) selected in this application are general standard parts or parts known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0070] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections.

[0071] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0072] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification.

Claims

1. A variable pitch silicon wafer lifting device, comprising: include: The lifting plate (1) is lifted by the lifting mechanism (2); Several silicon wafer lifting assemblies (3) are arranged on the lifting plate (1); the silicon wafer lifting assembly (3) includes two oppositely arranged silicon wafer support members (31), which are movably installed on the lifting plate (1); the two oppositely arranged silicon wafer support members (31) are respectively used to be arranged on both sides of the conveyor line (100); as well as The support pitch mechanism (4) is used to drive the silicon wafer support (31) that are arranged opposite to each other to move in opposite directions.

2. The variable-pitch silicon wafer lifting device according to claim 1, characterized in that, The lifting mechanism (2) includes: Base (21); A fixing plate (22) is fixedly mounted on the base (21); A lead screw (23) is rotatably mounted on a fixed plate (22); the lifting plate (1) is threadedly engaged with the lead screw (23); and The lead screw drive assembly (24) is used to drive the lead screw (23) to rotate so as to lift the lifting plate (1) up and down.

3. The variable-pitch silicon wafer lifting device according to claim 2, characterized in that, A number of guide rods (221) are installed on the fixed plate (22); The lifting plate (1) is slidably mounted on the guide rod (221); The upper end of the guide rod (221) is equipped with a bearing seat (222); The upper end of the lead screw (23) is rotatably engaged with the bearing housing (222).

4. The variable-pitch silicon wafer lifting device according to claim 2, characterized in that, The lead screw drive assembly (24) includes: The first motor (241) is mounted on the base (21), and its output end is provided with a first drive wheel (2411). The first driven wheel (242) is mounted on the lead screw (23); and The first synchronous belt (243) is used to connect the first driving pulley (2411) and the first driven pulley (242).

5. The variable-pitch silicon wafer lifting device according to claim 4, characterized in that, An installation space is provided between the fixing plate (22) and the base (21); The lower end of the lead screw (23) extends through the fixing plate (22) into the installation space and is provided with the first driven wheel (242).

6. The variable-pitch silicon wafer lifting device according to claim 1, characterized in that, The lifting plate (1) is provided with a slide rail (11); The lower end of the silicon wafer support (31) is mounted on the slide rail (11), and the upper end is provided with a support plate (32).

7. The variable-pitch silicon wafer lifting device according to claim 6, characterized in that, The support member pitch mechanism (4) includes: The second motor (41) is installed on the lifting plate (1), and its output end is provided with a second drive wheel (411). The second driven wheel (42) is mounted on the lifting plate (1); and The second synchronous belt (43) is arranged parallel to the slide rail (11), and its two ends are respectively connected to the second driving wheel (411) and the second driven wheel (42); wherein The two silicon wafer support members (31) of the silicon wafer support assembly (3) are fixedly connected to the two sides of the second synchronous belt (43).

8. The variable-pitch silicon wafer lifting device according to claim 1, characterized in that, The number of the silicon wafer lifting assemblies (3) is two, which are arranged at the two ends of the lifting plate (1) respectively; The number of the supporting piece distance changing mechanisms (4) is two, which are used for driving the corresponding silicon wafer lifting assemblies (3) respectively.

9. The variable distance silicon wafer lifting device according to claim 4, characterized in that, The middle part of the lifting plate (1) is provided with a avoiding gap for avoiding the first motor (241).

10. A silicon wafer conveying device, characterized in that, Comprising: A conveying line (100) for conveying silicon wafers (200); and The variable distance silicon wafer lifting device (300) according to any one of claims 1-9. ​

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