Quartz wafer etching jig

Abstract

This utility model discloses a quartz wafer etching fixture, including a handle and several fixture units for placing wafers. The fixture units are connected to the handle, and each fixture unit has a rotating shaft with movable pressure blocks to prevent wafers from falling out. The areas on the fixture units used for placing wafers have several pairs of symmetrically arranged dividing grooves corresponding to the wafers, with the dividing grooves inclined at a preset angle. This utility model enables the etching solution to form a more uniform laminar flow on the wafer surface, reducing localized corrosion differences caused by buoyancy or uneven flow. Combined with increased circulation flow, this utility model can accelerate the removal of gases generated during the etching reaction from the wafer surface, reducing the problem of gas adhesion blocking the reaction. This utility model increases the contact area between the etching solution and the wafer, resulting in a more uniform heat distribution and thus improving the stability of the etching solution's temperature field. This utility model achieves a dynamic balance between the wafer surface etching rate and the etching solution flow rate, avoiding localized over-etching or under-etching.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing, and in particular to a quartz wafer etching fixture. Background Technology

[0002] Etching is an essential step in wafer fabrication. During wafer etching, the wafer is typically placed in an etching fixture and then immersed in the etching solution. Traditional quartz wafer etching fixtures have poor etching speed and effectiveness. To improve the etching process, the etching fixture needs to be modified to enhance the wafer etching effect. Utility Model Content

[0003] The technical problem to be solved by this utility model embodiment is to provide a quartz wafer etching fixture to improve the wafer etching effect.

[0004] To solve the above-mentioned technical problems, this utility model provides a quartz wafer etching fixture, including a handle and several fixture units for placing wafers. The fixture units are connected to the handle, and each fixture unit is provided with a rotating shaft. The rotating shaft is provided with a movable pressure block for preventing wafers from falling out of the fixture unit. Several pairs of dividing grooves corresponding to the wafers are symmetrically provided on both sides of the area on the fixture unit for placing the wafers. The dividing grooves are inclined at a preset angle.

[0005] Furthermore, the fixture unit consists of a bottom support member, two sets of side support blocks, and two sets of dividing blocks. The two sets of side support blocks are respectively located on the front and rear sides of the bottom support member, and the two sets of dividing blocks are respectively located on the left and right sides of the side support blocks. Each pair of the two sets of dividing blocks has a number of dividing grooves on one side.

[0006] Furthermore, the side support blocks, bottom support components, and dividing blocks are all hollowed out.

[0007] Furthermore, the dividing slots on the dividing blocks are set at equal intervals.

[0008] Furthermore, the movable pressure block is provided with a slot, and the fixture unit is provided with a corresponding locking pin.

[0009] Furthermore, the angle between the dividing groove and the vertical direction is 25°.

[0010] Furthermore, the handle consists of a handle bracket and a handle rod.

[0011] Furthermore, the movable pressure block adopts a hollow design.

[0012] The beneficial effects of this invention are as follows: This invention enables the etching solution to form a more uniform laminar flow on the wafer surface, reducing local corrosion differences caused by buoyancy or uneven flow; This invention, combined with increased circulation flow, can accelerate the removal of gases generated by the corrosion reaction from the wafer surface, reducing the problem of gas adhesion blocking the reaction; This invention increases the contact area between the etching solution and the wafer, resulting in a more uniform heat distribution and thus improving the stability of the temperature field of the etching solution; This invention creates a dynamic balance between the etching rate on the wafer surface and the flow rate of the etching solution, avoiding local over-etching or under-etching. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the movable pressure block of the quartz wafer etching fixture in Embodiment 1 of this utility model when it is closed.

[0014] Figure 2 This is a three-dimensional structural diagram of the movable pressure block of the quartz wafer etching fixture in Embodiment 1 of this utility model when it is opened.

[0015] Figure 3 This is an exploded view of the quartz wafer etching fixture of Embodiment 1 of this utility model.

[0016] Figure 4 This is a three-dimensional structural diagram of the separator block according to an embodiment of the present utility model.

[0017] Figure 5 This is a front view of the separator block in an embodiment of this utility model.

[0018] Figure 6 This is a schematic diagram of the tilt angle of the dividing groove in an embodiment of the present invention.

[0019] Figure 7 This is a three-dimensional structural diagram of the movable pressure block of the quartz wafer etching fixture in Embodiment 2 of this utility model when it is closed.

[0020] Figure 8 This is a three-dimensional structural diagram of the movable pressure block of the quartz wafer etching fixture in Embodiment 2 of this utility model when it is opened.

[0021] Figure 9 This is a three-dimensional structural diagram of the movable pressure block of the quartz wafer etching fixture in Embodiment 3 of this utility model when it is closed.

[0022] Figure 10 This is a three-dimensional structural diagram of the movable pressure block of the quartz wafer etching fixture in Embodiment 3 of this utility model when it is opened.

[0023] Explanation of icon numbers

[0024] 1. Wafer; 2. Shaft; 3. Divider block; 4. Bottom support; 5. Side support block; 6. Handle bracket; 7. Lifting rod; 8. Movable pressure block; 9. Slot; 10. Locking pin; 11. Middle divider block; 12. Dividing groove; 13. Middle support block. Detailed Implementation

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other. The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] In this embodiment of the invention, directional indicators (such as up, down, left, right, front, back, etc.) are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indicators will also change accordingly.

[0027] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0028] Please refer to Figures 1-10 The quartz wafer etching fixture of this embodiment includes a handle and several fixture units for placing wafers. The fixture units are connected to the handle, which consists of a handle bracket and a lifting rod. Each fixture unit has a rotating shaft with a movable pressure block on it to prevent wafers from falling out. Preferably, the movable pressure block has a hollow design, i.e., a hollow center. The movable pressure block has a slot, and the fixture unit has a corresponding locking pin. That is, the rotating shaft and the locking pin are respectively located on the front and rear sides of the area on the fixture unit used for placing wafers. The movable pressure block prevents the quartz wafers from falling out of the fixture during movement and facilitates the loading and unloading of quartz wafers.

[0029] The fixture unit has several pairs of dicing slots symmetrically arranged on both sides of the area for placing the wafer. The dicing slots on the dicing block are evenly spaced. The dicing slots have a preset tilt angle; please refer to [reference needed]. Figure 5 Preferably, the angle between the dividing groove and the vertical direction is 25°.

[0030] This invention employs a tilted angle design, which allows the etchant to form a more uniform laminar flow on the wafer surface, reducing localized corrosion differences caused by buoyancy or uneven flow. The tilted angle, combined with increased circulation flow, accelerates the removal of gases generated during the corrosion reaction from the wafer surface, reducing the problem of gas adhesion blocking the reaction. The tilted design increases the contact area between the etchant and the wafer, resulting in more uniform heat distribution and improved stability of the etchant's temperature field. Compared to traditional vertical etching, which is prone to incomplete removal of the damaged layer due to stress concentration at the wafer edges, the tilted angle reduces edge stress through mechanical balance, allowing the etchant to penetrate more easily to the bottom of the wafer, effectively eliminating the damaged layer generated during grinding and reducing resonant resistance. In the tilted state, the etching rate on the wafer surface and the etchant flow rate achieve a dynamic balance, avoiding localized over-etching or under-etching.

[0031] The fixture unit consists of a bottom support, two sets of side support blocks, and two sets of dividing blocks. The two sets of side support blocks are respectively located on the front and rear sides of the bottom support, and the two sets of dividing blocks are respectively located on the left and right sides of the side support blocks. Each pair of dividing blocks has several dividing grooves on one side. Preferably, the side support blocks, bottom support, and dividing blocks are all hollowed out, i.e., hollowed out in the middle. The fixture unit is open on all four sides, allowing the etching solution to penetrate the fixture more easily and ensuring more thorough contact between the etching solution and the quartz wafer.

[0032] Example 1, please refer to Figures 1-3 The quartz wafer etching fixture includes a handle and a fixture unit. When there are multiple fixture units, adjacent parts can be integrated into one. For Example 2, please refer to... Figures 7-8 The quartz wafer etching fixture includes a handle and two fixture units, with two adjacent partition blocks forming an intermediate partition block. See Example 3 for details. Figures 9-10 The quartz wafer etching fixture includes a handle and four fixture units. Two adjacent partition blocks form an intermediate partition block, and four adjacent side support blocks form an intermediate support block.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A quartz wafer etching fixture, characterized in that, It includes a handle and several fixture units for placing wafers. The fixture units are connected to the handle and have a rotating shaft. The rotating shaft has a movable pressure block to prevent wafers from falling out of the fixture unit. Several pairs of dividing grooves corresponding to wafers are symmetrically arranged on both sides of the area on the fixture unit for placing wafers. The dividing grooves are tilted at a preset angle.

2. The quartz wafer etching fixture as described in claim 1, characterized in that, The fixture unit consists of a bottom support member, two sets of side support blocks, and two sets of dividing blocks. The two sets of side support blocks are respectively located on the front and rear sides of the bottom support member, and the two sets of dividing blocks are respectively located on the left and right sides of the side support blocks. Each pair of the two sets of dividing blocks has several dividing grooves on one side.

3. The quartz wafer etching fixture as described in claim 2, characterized in that, The side support blocks, bottom support components, and dividing blocks are all hollowed out.

4. The quartz wafer etching fixture as described in claim 2, characterized in that, The dividing slots on the dividing blocks are set at equal intervals.

5. The quartz wafer etching fixture as described in claim 1, characterized in that, The movable pressure block is provided with a slot, and the fixture unit is provided with a corresponding locking pin.

6. The quartz wafer etching fixture as described in claim 1, characterized in that, The angle between the dividing groove and the vertical direction is 25°.

7. The quartz wafer etching fixture as described in claim 1, characterized in that, The handle consists of a handle bracket and a handle rod.

8. The quartz wafer etching fixture as described in claim 1, characterized in that, The movable pressure block features a hollow design.

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