A split-type heat dissipation system for a UV exposure machine used for ink printing.

Abstract

This utility model relates to the field of ultraviolet (UV) exposure machine technology, and discloses a split-type heat dissipation system for a UV exposure machine used for ink printing. The system includes an equipment housing, with a transparent plate fixedly connected to the top of the inner wall. A cooling and heat dissipation mechanism is located in the upper middle part of the inner wall of the equipment housing. A cover plate is rotatably connected to the rear top of the equipment housing. Locking components are located on both the left and right sides of the top front of the equipment housing. A monitoring component is located in the middle of the front side of the equipment housing, used to monitor data from various important areas within the device. In this utility model, heat is rapidly absorbed by an aluminum alloy heat dissipation substrate and a graphene coating, activating a semiconductor cooling chip for cooling. A honeycomb guide plate divides the equipment housing into two parts, with the UV lamp assembly and structure located in the upper area, filled with nitrogen to prevent oxidation, thereby rapidly absorbing the heat generated by the UV lamp assembly.

Description

Technical Field

[0001] This utility model relates to the field of ultraviolet exposure machine technology, and in particular to a split heat dissipation system for an ultraviolet exposure machine used for ink printing. Background Technology

[0002] In the field of ink printing, ultraviolet (UV) exposure machines expose printing plates by emitting ultraviolet light through lamps. However, during operation, the lamps and electronic components generate a large amount of heat. If heat dissipation is not timely, it can lead to equipment aging, shortened lamp life, and even affect printing accuracy. Traditional exposure machine cooling systems are mostly integrated structures, which have problems such as a single heat dissipation path, inconvenient maintenance, and difficulty in flexibly adjusting the heat dissipation efficiency according to different power and ambient temperature. A single air-cooling mode will encounter heat dissipation bottlenecks in high-temperature workshops, while integrated water-cooling systems require the entire machine to be shut down for maintenance, affecting production continuity. In addition, traditional cooling systems lack intelligent temperature control design, leading to energy waste due to excessive heat dissipation or malfunctions due to insufficient heat dissipation. As the printing industry increases its requirements for equipment stability and energy efficiency to meet the high-efficiency and stable production needs of modern ink printing, these challenges are being addressed.

[0003] A search revealed Chinese Patent Publication No. CN210951230U, which discloses a heat dissipation system for an ultraviolet exposure machine. The system includes a chassis, inside which an exposure lamp is installed. The exposure lamp includes a lamp holder and a light source. The lamp holder has a mounting groove, and the light source is installed within the mounting groove. A liquid cooling tank is located on the side of the lamp holder opposite to the mounting groove, containing coolant for cooling the exposure lamp. This invention effectively dissipates the heat generated by the exposure lamp, preventing damage due to overheating. However, in actual use, the coolant can be heated and turn into steam, potentially causing short circuits or burnouts in other electrical components within the chassis, thus damaging the equipment. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a split-type heat dissipation system for a UV exposure machine for ink printing, aiming to improve the problem in the prior art where the coolant turns into steam when heated, thereby causing short circuits or burnouts to other electrical components inside the machine.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a split-type heat dissipation system for a UV exposure machine for ink printing, comprising an equipment box, a transparent plate fixedly connected to the top of the inner wall of the equipment box, a cooling and heat dissipation mechanism provided in the upper middle part of the inner wall of the equipment box, a cover plate rotatably connected to the rear top of the equipment box, locking components provided on both the left and right sides of the top front of the equipment box, a monitoring component provided in the middle of the front side of the equipment box, the monitoring component being used to monitor data of various important areas within the device, a ventilation component provided on the rear side of the equipment box, and a circulating heat conduction mechanism provided at the bottom of the inner wall of the equipment box;

[0006] The cooling and heat dissipation mechanism includes an aluminum alloy heat dissipation substrate. The outer wall of the aluminum alloy heat dissipation substrate is fixedly connected to the upper part of the inner wall of the equipment box. A graphene coating is fixedly connected to the top of the aluminum alloy heat dissipation substrate. Multiple ultraviolet lamps are fixedly connected to the top of the graphene coating. Multiple semiconductor cooling chips are fixedly connected to the bottom of the aluminum alloy heat dissipation substrate. A honeycomb guide plate is fixedly connected to the middle part of the inner wall of the equipment box.

[0007] The above technical solution works as follows: When the UV exposure machine is started, the UV lamps are used to dry the printed ink. The UV lamps generate heat during operation, and the aluminum alloy heat sink and graphene coating absorb the heat quickly due to their high thermal conductivity. At this time, the semiconductor cooling chip is activated, and the Peltier effect is used for active cooling to reduce the temperature above the aluminum alloy heat sink. Furthermore, the honeycomb baffle divides the equipment box into two parts. The UV lamps and the structure above them are located in the area above the honeycomb baffle, and the area is filled with nitrogen to isolate oxygen from the outside air. This prevents the UV lamps from undergoing an oxidation reaction with oxygen in the air at high temperatures, which would cause the lamp tubes to blacken and reduce light transmittance. At the same time, the small holes above the honeycomb baffle guide the airflow generated by the temperature change within the nitrogen gas along a specific path, thereby preventing the nitrogen gas above from being carried out by the airflow and mixing with the outside air, and also preventing the air below from flowing back into the space above.

[0008] As a further description of the above technical solution:

[0009] The circulating heat conduction mechanism includes a cooling box. The bottom of the cooling box is fixedly connected to the bottom of the inner wall of the equipment box. A water pump is fixedly connected to the top of the cooling box. One end of the water pump passes through the bottom of the honeycomb guide plate and is connected to a distribution pipe. The top of the distribution pipe is connected to multiple copper water cooling heads. The bottom left side of each of the multiple copper water cooling heads is connected to a gathering pipe. The bottom of the gathering pipe passes through the top of the honeycomb guide plate and is connected to a finned heat sink. The front side of the finned heat sink is connected to the rear side of the cooling box. A filling assembly is provided on the right side of the cooling box.

[0010] The above technical solution involves storing a large amount of coolant in a cooling tank, then starting a water pump to extract the coolant from the cooling tank and send it into a distribution pipe, which then flows into a copper water cooling head. This allows for heat exchange between the hot end of the semiconductor cooling chip. The coolant that has absorbed heat then enters a collecting pipe and flows into a finned heat sink. Under the blowing action of the ventilation components, the coolant dissipates heat and then flows back into the cooling tank.

[0011] As a further description of the above technical solution:

[0012] The filling assembly includes an L-shaped tube, the left side of which is connected to the right side of the cooling box. The outer wall of the L-shaped tube penetrates the right side of the equipment box and is connected to a conical collecting block. The inner wall of the conical collecting block is threaded with a rubber stopper.

[0013] The above technical solution involves rotating the rubber stopper to pour the replenished coolant into the conical collection block, which then enters the cooling box under the guidance of the L-shaped tube, thereby improving heat dissipation.

[0014] As a further description of the above technical solution:

[0015] The engaging assembly includes two fixing plates, the rear sides of which are respectively fixedly connected to the left and right sides of the front top of the equipment box. A rotating block is rotatably connected to the front side of the fixing plate, and a U-shaped hanging post is rotatably connected to the outer wall of the rotating block. Hook blocks are fixedly connected to the top left and right sides of the cover plate, and the outer wall of the U-shaped hanging post engages with the inner wall of the hook block.

[0016] The above technical solution involves rotating the rotating block, which in turn drives the U-shaped hanging column to engage with the inner wall of the hook block. Then, the rotating block is rotated in the opposite direction, causing the U-shaped hanging column to firmly engage with the hook block, thereby closing the equipment box and the cover.

[0017] As a further description of the above technical solution:

[0018] The monitoring component includes a trapezoidal block, the rear side of which is fixedly connected to the middle of the front side of the equipment box. A barometric pressure monitor is fixedly connected to the top left side of the trapezoidal block, a voltage monitor is fixedly connected to the top center of the trapezoidal block, and an emergency stop button is fixedly connected to the top right side of the trapezoidal block.

[0019] The above technical solution provides installation space for the instrument through a trapezoidal block, monitors the pressure of nitrogen gas above using a pressure monitor, and monitors the operation of the ultraviolet lamp group in real time under the monitoring of a voltage monitor. In case of malfunction, the device can be stopped in time by pressing the emergency stop button.

[0020] As a further description of the above technical solution:

[0021] The ventilation assembly includes multiple ventilation openings, the outer walls of which are respectively opened on the rear side of the equipment box. An intercepting net is fixedly connected to the inner wall of each ventilation opening, and a fan is fixedly connected to the middle of the rear side of the inner wall of the equipment box.

[0022] The above technical solution allows the air below to be blown outwards from the equipment box when the fan is started, while the cold air from the outside enters the lower area of ​​the equipment box through the ventilation openings on both sides.

[0023] As a further description of the above technical solution:

[0024] The equipment box is rotatably connected to both the left and right sides with telescopic rods, and one end of each telescopic rod is rotatably connected to the left and right sides of the cover plate.

[0025] The above technical solution allows the cover to be opened and closed more easily by means of a telescopic rod, and prevents the cover from closing on its own due to gravity.

[0026] As a further description of the above technical solution:

[0027] The top of the outer wall of each of the copper water cooling heads is fixedly connected to the bottom of the corresponding semiconductor cooling chip, and the outer wall size of the copper water cooling head is the same as the outer wall size of the semiconductor cooling chip.

[0028] The above technical solution involves fixing the top of the outer wall of multiple copper water cooling heads to the bottom of the corresponding thermoelectric coolers, which can transfer the heat generated by the thermoelectric coolers during operation to the copper water cooling heads, greatly improving the heat conduction efficiency. The outer wall size of the copper water cooling heads is the same as that of the thermoelectric coolers, so that the two can fit tightly together and minimize the contact thermal resistance.

[0029] This utility model has the following beneficial effects:

[0030] 1. In this utility model, heat is rapidly absorbed by the aluminum alloy heat dissipation substrate and graphene coating, activating the semiconductor cooling chip and utilizing the Peltier effect to cool down the temperature above the substrate. The honeycomb guide plate divides the equipment box into two parts: the ultraviolet lamp group and the upper area. The interior is filled with nitrogen to prevent oxidation. Small holes on the upper part of the honeycomb guide plate guide the flow of nitrogen to avoid mixing with the outside air. The fan blows out the air below, and the cold air enters the lower part of the equipment box through the ventilation port, quickly absorbing the heat generated by the ultraviolet lamp group.

[0031] 2. In this utility model, by starting the water pump, the coolant is drawn from the cooling tank and flows into the copper water cooling head through the diversion pipe to exchange heat with the hot end of the semiconductor cooling chip. After absorbing heat, the coolant flows into the finned heat sink through the collection pipe and dissipates heat under the action of the ventilation component. Then it returns to the cooling tank. If it is necessary to add coolant, turn the rubber stopper to pour the new coolant into the conical collection block and let it re-enter the cooling tank through the L-shaped pipe to maintain the heat dissipation effect. Attached Figure Description

[0032] Figure 1 This is a perspective view of a split-type heat dissipation system for a UV exposure machine for ink printing, as proposed in this utility model.

[0033] Figure 2 This is a front view of a split-type heat dissipation system for an ultraviolet exposure machine for ink printing proposed in this utility model.

[0034] Figure 3 This is a side view of a split-type heat dissipation system for an ultraviolet exposure machine for ink printing proposed in this utility model.

[0035] Figure 4 A cross-sectional view of the equipment box of a split-type heat dissipation system for an ultraviolet exposure machine for ink printing proposed in this utility model.

[0036] Figure 5 This is a schematic diagram of the cooling and heat dissipation mechanism of a split-type heat dissipation system for an ultraviolet exposure machine for ink printing, as proposed in this utility model.

[0037] Legend:

[0038] 1. Equipment housing; 2. Cooling and heat dissipation mechanism; 201. Aluminum alloy heat dissipation substrate; 202. Graphene coating; 203. Ultraviolet lamp assembly; 204. Semiconductor cooling chip; 205. Honeycomb guide plate; 3. Circulating heat conduction mechanism; 301. Cooling tank; 302. Water pump; 303. Diverter pipe; 304. Copper water cooling head; 305. Gathering pipe; 306. Finned heat sink; 307. Filling assembly; 3071. L-shaped tube; 30 72. Conical collecting block; 3073. Rubber plug; 4. Transparent plate; 5. Cover plate; 6. Locking assembly; 601. Fixing plate; 602. Rotating block; 603. U-shaped hanging post; 604. Hook block; 7. Monitoring assembly; 701. Trapezoidal block; 702. Air pressure monitor; 703. Voltage monitor; 704. Emergency stop button; 8. Ventilation assembly; 801. Ventilation opening; 802. Interception net; 803. Fan; 9. Telescopic pole. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0040] Reference Figure 3 , Figure 4 and Figure 5 This utility model provides an embodiment of a split-type heat dissipation system for a UV exposure machine for ink printing, comprising an equipment box 1, a transparent plate 4 fixedly connected to the top of the inner wall of the equipment box 1, a cooling and heat dissipation mechanism 2 provided in the upper middle part of the inner wall of the equipment box 1, a cover plate 5 rotatably connected to the rear top of the equipment box 1, locking components 6 provided on both the left and right sides of the top front of the equipment box 1, a monitoring component 7 provided in the middle of the front side of the equipment box 1, the monitoring component 7 being used to monitor data of various important areas within the device, a ventilation component 8 provided on the rear side of the equipment box 1, and a circulating heat conduction mechanism 3 provided at the bottom of the inner wall of the equipment box 1; the cooling and heat dissipation mechanism 2 includes an aluminum alloy heat dissipation substrate 201, the outer wall of the aluminum alloy heat dissipation substrate 201 fixedly connected to the upper middle part of the inner wall of the equipment box 1, a graphene coating 202 fixedly connected to the top of the aluminum alloy heat dissipation substrate 201, and multiple UV lamp groups 203 fixedly connected to the top of the graphene coating 202, the UV lamp groups 203 generating heat during operation, and the aluminum alloy heat dissipation substrate 201... The graphene coating 202 rapidly absorbs heat due to its high thermal conductivity. Multiple semiconductor cooling chips 204 are fixedly connected to the bottom of the aluminum alloy heat dissipation substrate 201. Activating the semiconductor cooling chips 204 utilizes the Peltier effect for active cooling, reducing the temperature above the aluminum alloy heat dissipation substrate 201. A honeycomb baffle 205 is fixedly connected to the middle of the inner wall of the equipment housing 1. The honeycomb baffle 205 divides the equipment housing 1 into two parts, while the ultraviolet lamp assembly 203 and the structure above it are located within the honeycomb baffle. The area above the deflector plate 205 is filled with nitrogen; the ventilation assembly 8 includes multiple vents 801, the outer walls of which are respectively opened on the rear side of the equipment box 1, the inner walls of the vents 801 are fixedly connected to the interception net 802, and the middle of the rear side of the inner wall of the equipment box 1 is fixedly connected to the fan 803. When the fan 803 is started, the air below is blown out to the outside of the equipment box 1, while the cold air from the outside enters the lower area of ​​the equipment box 1 through the vents 801 on both sides.

[0041] Specifically, when the UV exposure machine is started, the UV lamp assembly 203 dries the printed ink. The UV lamp assembly 203 generates heat during operation, which is rapidly absorbed by the aluminum alloy heat dissipation substrate 201 and the graphene coating 202 due to their high thermal conductivity. At this time, the semiconductor cooling chip 204 is activated, utilizing the Peltier effect for active cooling, reducing the temperature above the aluminum alloy heat dissipation substrate 201. Furthermore, the honeycomb baffle 205 divides the equipment housing 1 into two parts. The UV lamp assembly 203 and the structure above it are located in the area above the honeycomb baffle 205 and are filled with nitrogen to isolate them from the outside air. The oxygen in the ultraviolet lamp assembly 203 is prevented from undergoing oxidation at high temperatures, which would cause the lamp tubes to blacken and reduce light transmittance. At the same time, the small holes above the honeycomb guide plate 205 guide the airflow generated by temperature changes within the nitrogen gas along a specific path, thereby preventing the nitrogen gas above from being carried out by the airflow and mixing with the outside air. It also prevents the air below from flowing back into the space above. With the start of the fan 803, the air below is blown out to the outside of the equipment box 1, while the cold air from the outside enters the lower area of ​​the equipment box 1 through the ventilation openings 801 on both sides, thereby quickly absorbing the heat generated by the ultraviolet lamp assembly 203 during operation.

[0042] Reference Figure 2 , Figure 4 and Figure 5The circulating heat conduction mechanism 3 includes a cooling tank 301 containing a large amount of coolant. The bottom of the cooling tank 301 is fixedly connected to the bottom of the inner wall of the equipment box 1. A water pump 302 is fixedly connected to the top of the cooling tank 301. One end of the water pump 302 passes through the bottom of the honeycomb guide plate 205 and is connected to a distribution pipe 303. When the water pump 302 is started, the coolant in the cooling tank 301 is drawn out and sent into the distribution pipe 303. The top of the distribution pipe 303 is connected to multiple copper water cooling heads 304. The bottom left side of each of the multiple copper water cooling heads 304 is connected to a gathering pipe 305, and the coolant flows into the copper water cooling head 304, thereby exchanging heat with the hot end of the semiconductor cooling chip 204. The bottom of the gathering pipe 305 passes through the top of the honeycomb guide plate 205 and is connected to a scale. The heat sink 306 has its front side connected to the rear side of the cooling box 301, and then the coolant flows into the heat sink 306. Under the blowing of the ventilation component 8, the coolant that has absorbed heat is dissipated, and then flows back into the cooling box 301. A filling component 307 is provided on the right side of the cooling box 301. The filling component 307 includes an L-shaped tube 3071. The left side of the L-shaped tube 3071 is connected to the right side of the cooling box 301. The outer wall of the L-shaped tube 3071 penetrates the right side of the equipment box 1 and is connected to a conical collecting block 3072. A rubber stopper 3073 is threaded onto the inner wall of the conical collecting block 3072. By rotating the rubber stopper 3073, the replenished coolant is poured into the conical collecting block 3072 and enters the cooling box 301 under the guidance of the L-shaped tube 3071.

[0043] Specifically, a large amount of coolant is stored in the cooling tank 301. By starting the water pump 302, the coolant in the cooling tank 301 is extracted and sent into the distribution pipe 303, and then flows into the copper water cooling head 304, where it exchanges heat with the hot end of the semiconductor cooling chip 204. The coolant that has absorbed heat then enters the collecting pipe 305 and flows into the finned heat sink 306. Under the blowing of the ventilation component 8, the coolant that has absorbed heat is dissipated, and then flows back into the cooling tank 301. When it is necessary to replenish the coolant in the cooling tank 301, the rubber stopper 3073 can be rotated to pour the replenished coolant into the conical collecting block 3072, and then it enters the cooling tank 301 under the guidance of the L-shaped pipe 3071, thereby better dissipating heat.

[0044] Reference Figure 1 , Figure 2 and Figure 4The engaging assembly 6 includes two fixing plates 601. The rear sides of the two fixing plates 601 are fixedly connected to the left and right sides of the front top of the equipment box 1, respectively. A rotating block 602 is rotatably connected to the front side of the fixing plate 601. A U-shaped hanging post 603 is rotatably connected to the outer wall of the rotating block 602. Hook blocks 604 are fixedly connected to the left and right sides of the top of the cover plate 5. The outer wall of the U-shaped hanging post 603 engages with the inner wall of the hook block 604. Rotating the rotating block 602 drives the U-shaped hanging post 603 to engage with the inner wall of the hook block 604. Then, rotating the rotating block 602 in the opposite direction causes the U-shaped hanging post 603 to drive the hook block 604 to engage firmly. This allows the equipment box 1 and cover plate 5 to close; the monitoring component 7 includes a trapezoidal block 701, the rear side of which is fixedly connected to the front middle of the equipment box 1, a pressure monitor 702 is fixedly connected to the top left side of the trapezoidal block 701, a voltage monitor 703 is fixedly connected to the top middle of the trapezoidal block 701, and an emergency stop button 704 is fixedly connected to the top right side of the trapezoidal block 701. The pressure monitor 702 is used to monitor the pressure of nitrogen above, and the operation of the ultraviolet lamp group 203 is monitored in real time under the monitoring of the voltage monitor 703. When a fault occurs, the device can be stopped in time by using the emergency stop button 704.

[0045] Specifically, rotating the rotating block 602 drives the U-shaped hanging column 603 to engage with the inner wall of the hook block 604. Then, rotating the rotating block 602 in the opposite direction causes the U-shaped hanging column 603 to engage firmly with the hook block 604, thereby closing the equipment box 1 and the cover plate 5. At the same time, the trapezoidal block 701 provides installation space for the instrument. The pressure monitoring instrument 702 monitors the pressure of the nitrogen gas above, and the voltage monitoring instrument 703 monitors the operation of the ultraviolet lamp group 203 in real time. In case of malfunction, the device can be stopped in time by pressing the emergency stop button 704.

[0046] Reference Figure 1 , Figure 2 and Figure 5 Telescopic rods 9 are rotatably connected to both the left and right sides of the equipment box 1. One end of each telescopic rod 9 is rotatably connected to the left and right sides of the cover plate 5. The telescopic rods 9 make it easier to open and close the cover plate 5 and prevent the cover plate 5 from closing by gravity. The top of the outer wall of multiple copper water cooling heads 304 is fixedly connected to the bottom of the corresponding semiconductor cooling chip 204. This allows the heat generated by the semiconductor cooling chip 204 during operation to be transferred to the copper water cooling head 304, greatly improving the heat conduction efficiency. The outer wall size of the copper water cooling head 304 is the same as the outer wall size of the semiconductor cooling chip 204, so that the two fit tightly together and minimize the contact thermal resistance.

[0047] Specifically, the telescopic rod 9 makes it easier to open and close the cover plate 5 and prevents the cover plate 5 from closing by gravity. The top of the outer wall of the multiple copper water cooling heads 304 is fixedly connected to the bottom of the corresponding semiconductor cooling chip 204, which can transfer the heat generated by the semiconductor cooling chip 204 during operation to the copper water cooling head 304, greatly improving the heat conduction efficiency. The outer wall size of the copper water cooling head 304 is the same as the outer wall size of the semiconductor cooling chip 204, so that the two are tightly fitted and the contact thermal resistance is minimized.

[0048] Working principle: First, during the startup of the UV exposure machine, the UV lamp assembly 203 is responsible for drying the ink-printed materials. During operation, it generates heat, which is quickly absorbed by the aluminum alloy heat dissipation substrate 201 and the graphene coating 202. At this time, the semiconductor cooling chip 204 is activated, utilizing the Peltier effect for active cooling to reduce the temperature above the aluminum alloy heat dissipation substrate 201. The honeycomb guide plate 205 divides the interior of the equipment housing 1 into two areas. The UV lamp assembly 203 and its upper structure are located in the area above the honeycomb guide plate 205, and this area is filled with nitrogen. The gas is used to isolate the oxygen in the outside air and prevent the ultraviolet lamp assembly 203 from undergoing an oxidation reaction with oxygen at high temperatures, thereby avoiding the lamp tube from blackening and the light transmittance from decreasing. The small holes above the honeycomb guide plate 205 guide the airflow generated by the temperature change of nitrogen along a specific path to prevent the nitrogen above from being carried out by the airflow and mixing with the outside air. At the same time, it prevents the air below from flowing back into the space above. After the fan 803 is started, it blows the air below to the outside of the equipment box 1, while the cold air outside enters the lower area of ​​the equipment box 1 through the ventilation holes 801 on both sides to quickly absorb the heat generated by the ultraviolet lamp assembly 203 during operation.

[0049] Furthermore, a large amount of coolant is stored in the cooling tank 301 through the circulating heat conduction mechanism 3. After the water pump 302 is started, the coolant is drawn out from the cooling tank 301 and transported to the copper water cooling head 304 through the diversion pipe 303 to exchange heat with the hot end of the semiconductor cooling chip 204. After absorbing heat, the coolant flows into the collecting pipe 305 and further flows to the finned heat sink 306. Under the action of the ventilation component 8, the heat in the coolant is dissipated, and then the coolant returns to the cooling tank 301. When the coolant in the cooling tank 301 needs to be replenished, the replenished coolant is poured into the conical collecting block 3072 by rotating the rubber stopper 3073. With the guidance of the L-shaped pipe 3071, the coolant can re-enter the cooling tank 301 to ensure heat dissipation efficiency.

[0050] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A split-type heat dissipation system for a UV exposure machine for ink printing, comprising an equipment housing (1), characterized in that: A transparent plate (4) is fixedly connected to the top of the inner wall of the equipment box (1). A cooling and heat dissipation mechanism (2) is provided in the upper middle part of the inner wall of the equipment box (1). A cover plate (5) is rotatably connected to the rear top of the equipment box (1). A locking component (6) is provided on both the left and right sides of the top front of the equipment box (1). A monitoring component (7) is provided in the middle front of the equipment box (1). The monitoring component (7) is used to monitor the data of various important areas inside the device. A ventilation component (8) is provided on the rear side of the equipment box (1). A circulating heat conduction mechanism (3) is provided at the bottom of the inner wall of the equipment box (1). The cooling and heat dissipation mechanism (2) includes an aluminum alloy heat dissipation substrate (201). The outer wall of the aluminum alloy heat dissipation substrate (201) is fixedly connected to the upper part of the inner wall of the equipment box (1). A graphene coating (202) is fixedly connected to the top of the aluminum alloy heat dissipation substrate (201). Multiple ultraviolet lamp groups (203) are fixedly connected to the top of the graphene coating (202). Multiple semiconductor cooling chips (204) are fixedly connected to the bottom of the aluminum alloy heat dissipation substrate (201). A honeycomb guide plate (205) is fixedly connected to the middle part of the inner wall of the equipment box (1).

2. The split-type heat dissipation system for a UV exposure machine for ink printing according to claim 1, characterized in that: The circulating heat conduction mechanism (3) includes a cooling box (301). The bottom of the cooling box (301) is fixedly connected to the bottom of the inner wall of the equipment box (1). A water pump (302) is fixedly connected to the top of the cooling box (301). One end of the water pump (302) passes through the bottom of the honeycomb guide plate (205) and is connected to a diversion pipe (303). The top of the diversion pipe (303) is connected to multiple copper water cooling heads (304). The bottom left side of the multiple copper water cooling heads (304) is connected to a gathering pipe (305). The bottom of the gathering pipe (305) passes through the top of the honeycomb guide plate (205) and is connected to a scale heat sink (306). The front side of the scale heat sink (306) is connected to the rear side of the cooling box (301). A filling component (307) is provided on the right side of the cooling box (301).

3. The split-type heat dissipation system for a UV exposure machine for ink printing according to claim 2, characterized in that: The filling assembly (307) includes an L-shaped tube (3071), the left side of which is connected to the right side of the cooling box (301). The outer wall of the L-shaped tube (3071) penetrates the right side of the equipment box (1) and is connected to a conical collecting block (3072). The inner wall of the conical collecting block (3072) is threaded with a rubber stopper (3073).

4. The split-type heat dissipation system for a UV exposure machine for ink printing according to claim 1, characterized in that: The engaging assembly (6) includes two fixing plates (601). The rear sides of the two fixing plates (601) are respectively fixedly connected to the left and right sides of the front top of the equipment box (1). A rotating block (602) is rotatably connected to the front side of the fixing plate (601). A U-shaped hanging post (603) is rotatably connected to the outer wall of the rotating block (602). Hook blocks (604) are fixedly connected to the top left and right sides of the cover plate (5). The outer wall of the U-shaped hanging post (603) engages with the inner wall of the hook block (604).

5. A split-type heat dissipation system for a UV exposure machine for ink printing according to claim 1, characterized in that: The monitoring component (7) includes a trapezoidal block (701), the rear side of which is fixedly connected to the front middle of the equipment box (1), a barometric pressure monitor (702) is fixedly connected to the top left side of the trapezoidal block (701), a voltage monitor (703) is fixedly connected to the top middle of the trapezoidal block (701), and an emergency stop button (704) is fixedly connected to the top right side of the trapezoidal block (701).

6. The split-type heat dissipation system for a UV exposure machine for ink printing according to claim 1, characterized in that: The ventilation assembly (8) includes multiple ventilation openings (801), the outer walls of the multiple ventilation openings (801) are respectively opened on the rear side of the equipment box (1), the inner wall of the ventilation openings (801) is fixedly connected with a net (802), and a fan (803) is fixedly connected to the middle of the rear side of the inner wall of the equipment box (1).

7. A split-type heat dissipation system for a UV exposure machine for ink printing according to claim 1, characterized in that: The equipment box (1) is rotatably connected to telescopic rods (9) on both the left and right sides, and one end of each of the two telescopic rods (9) is rotatably connected to the left and right sides of the cover plate (5).

8. A split-type heat dissipation system for a UV exposure machine for ink printing according to claim 2, characterized in that: The top of the outer wall of each of the copper water cooling heads (304) is fixedly connected to the bottom of the corresponding semiconductor cooling chip (204), and the outer wall size of the copper water cooling head (304) is the same as the outer wall size of the semiconductor cooling chip (204).

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