Press contact type power semiconductor device test fixture and test equipment

Abstract

A kind of compression type power semiconductor device test fixture and test equipment, comprising: first fixture and second fixture relative movement along first linear direction, second fixture includes first heating plate and at least one pressure head component, single pressure head component includes: seat body, with first heating plate fixed connection, accommodating cavity, located on seat body, one side of accommodating cavity is open structure, compression body, with the test circuit of test equipment electric connection, one end of compression body along first linear direction corresponds device, the other end of compression body along first linear direction is equipped with first limiting portion, open structure movably set in the outside of first limiting portion, and accommodating cavity is closed, first elastic piece, in accommodating cavity, before compression body and device contact first elastic piece is in initial compression state, compression direction is first linear direction, first limiting portion and accommodating cavity are elastically connected;Power semiconductor device is connected with test circuit using compression mode, and power semiconductor device is heated well at the same time.

Description

Technical Field

[0001] This utility model relates to the field of power semiconductor device testing technology, and in particular to a pressure-fit power semiconductor device testing fixture and testing equipment. Background Technology

[0002] When performing dynamic and static testing on press-fit power semiconductor devices (hereinafter referred to as "devices"), it is usually necessary to place the device on a heated base plate and apply uniform downward pressure to the upper surface through the pressure head to ensure uniform current through the power end surface of the device. At the same time, the device is heated from both the top and bottom sides to simulate the extreme temperature conditions of the device during actual use.

[0003] Most existing crimp-type device testing fixtures use metal probes and mechanical rigid drives (such as screws or cylinders) for direct crimping. This type of fixture is prone to damaging devices, has poor contact stability, and is not suitable for high-precision testing. Furthermore, the metal probe connection method has poor thermal conductivity and insufficient crimping force, which cannot meet the testing requirements for high-temperature device testing. Another method uses elastic materials (silicone / spring / air pressure) to buffer pressure and reduce impact, but it cannot transfer heat or electricity, requiring separate heat transfer and electrical conductivity structures. Utility Model Content

[0004] To address the shortcomings of the existing manufacturing technology, the applicant provides a press-fit power semiconductor device testing fixture and testing equipment, thereby achieving effective heating of the power semiconductor device while connecting it to the test circuit via a press-fit method.

[0005] The technical solution adopted in this utility model is as follows:

[0006] A press-fit power semiconductor device test fixture for use in testing equipment, comprising:

[0007] The first fixture is used to hold the device;

[0008] A second fixture is movable relative to the first fixture along a first linear direction. The second fixture includes a first heating plate and at least one pressure head assembly. The single pressure head assembly includes:

[0009] The base is fixedly connected to the first heating plate.

[0010] A receiving cavity is located on the seat body, and one side of the receiving cavity is an open structure.

[0011] A crimping body is electrically connected to the test circuit of the testing equipment. One end of the crimping body along the first straight line corresponds to the device, and the other end of the crimping body along the first straight line is provided with a first limiting part. The open structure is movably sleeved outside the first limiting part and closes the receiving cavity.

[0012] The first elastic element is located in the receiving cavity. Before the press-fitting body contacts the device, the first elastic element is in an initial compressed state, and the compression direction is the first straight line direction, which elastically connects the first limiting part to the receiving cavity.

[0013] In this process, after the first fixture and the second fixture move closer together to make the pressing body contact the device surface, the first elastic element is further compressed. The seat transfers the heat from the first heating plate to the pressing body and then to the device. After the first fixture and the second fixture move further apart to make the pressing body detach from the device, the first elastic element returns to its initial compressed state.

[0014] As a further improvement to the above technical solution:

[0015] The side wall of the receiving cavity opposite to the open structure is provided with a through hole penetrating the seat body, and also includes a guide rod fixed on the first limiting part, the guide rod being slidably connected to the through hole.

[0016] The first elastic element is a plurality of disc springs that are elastically stacked together. The disc springs are sleeved on the guide rod. One outer disc spring abuts against the receiving cavity at the through hole, and the other outer disc spring abuts against the first limiting part.

[0017] The dimensions of the receiving cavity are adapted to the external dimensions of the first elastic element.

[0018] An insulating heat-conducting plate is mounted on the first heating plate, and the second fixture further includes a pressure head mounting structure, the pressure head mounting structure comprising:

[0019] The limiting bracket is made of heat-resistant and insulating material. The limiting bracket has a through hole, the crimping body is inserted into the through hole, and the part of the crimping body that contacts the device is located outside the through hole.

[0020] The support part is fixedly connected at one end to the limiting bracket and at the other end to the base body, and is used to support and install the pressure head assembly on the limiting bracket;

[0021] The connecting assembly includes a first connector located on the first heating plate and a second connector located on the limiting bracket. The first connector and the second connector are detachably connected so that the seat body is in contact with the insulating heat-conducting plate.

[0022] A groove is provided at one end of the perforation facing the insulating heat-conducting plate. When the seat body is in contact with the insulating heat-conducting plate, the groove abuts against the middle of the pressing body, so that the first elastic element is in the initial compressed state.

[0023] The first fixture includes a second heating plate, on which a heat-conducting seat assembly is fixedly mounted. The heat-conducting seat assembly is used to place the device and transfer the heat from the second heating plate to the device.

[0024] The heat-conducting base assembly includes:

[0025] A base, wherein at least one groove is provided on the base, and the inner surface of the groove is a first spherical surface;

[0026] At least one floating seat is provided for placing the device. The floating seat has a protrusion on the side facing away from the device, and the protrusion has a second spherical surface that contacts the first spherical surface.

[0027] The limiting plate is detachably installed on the base;

[0028] At least one set of second elastic elements, each set of second elastic elements corresponds to a floating seat, and the number of second elastic elements in each set is multiple and they are evenly distributed in a ring around the protrusion. One end of each second elastic element is connected to the limiting plate and the other end is connected to the floating seat. The second elastic element is in a compressed state, which floats the floating seat and the base.

[0029] The base is provided with a set of elongated holes, the length direction of which is a second straight line direction. It also includes fasteners that connect the elongated holes to the second heating plate, and a servo linear drive mechanism. The moving end of the servo linear drive mechanism is fixedly connected to the second heating plate and is used to drive the second heating plate to move along a third straight line direction. The second straight line direction is perpendicular to the third straight line direction, and both the second straight line direction and the third straight line direction are perpendicular to the first straight line direction.

[0030] A press-fit power semiconductor device testing device includes any of the press-fit power semiconductor device testing fixtures described above.

[0031] The beneficial effects of this utility model are as follows:

[0032] This utility model has a compact and reasonable structure and is easy to operate. By setting a pressure head assembly on the second fixture and connecting it simultaneously with the first heating plate and the test circuit, the heating and electrical connection of the test device can be realized through a single component. In addition, the base and the pressing body of the pressure head assembly are fitted together to form a receiving cavity, and are elastically connected by a first elastic element located in the receiving cavity. This ensures good contact between the pressing body and the device while guaranteeing good heat transfer between the base and the pressing body. Thus, the power semiconductor device can be connected to the test circuit by pressing while the power semiconductor device is heated effectively.

[0033] This utility model also has the following advantages:

[0034] (1) The sliding connection between the seat and the first limiting part through the shaft hole structure ensures good directionality of the pressing body relative to the moving direction of the seat, and also facilitates the installation of the first elastic element. The stacked disc springs have better elasticity.

[0035] (2) A limiting bracket made of heat-resistant and insulating material that can be detachably and fixedly connected to the first heating plate is used to limit and press the pressure head assembly onto the insulating heat-conducting plate, thereby achieving the insulating and safe installation of the pressure head assembly.

[0036] (3) The floating seat with the device is tilted in multiple directions by connecting the spherical surface and the spherical protrusion. At the same time, the floating seat is elastically connected to the base to ensure that the device is in a fixed position when it is not in contact with the pressure head assembly, which facilitates the placement of the device. When the pressure head assembly presses on the device, the second spherical surface is rotated relative to the first spherical surface according to the current posture of the device to adjust the posture of the device, so that the pressure head assembly and the device are in good contact and the device is subjected to uniform force. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the structure of this utility model.

[0038] Figure 2 This is a schematic diagram of the structure of the second fixture of this utility model.

[0039] Figure 3 This is a schematic diagram of the pressure head assembly of this utility model.

[0040] Figure 4 This is a cross-sectional view of the pressure head assembly of this utility model.

[0041] Figure 5 This is a schematic diagram of the pressure head assembly and pressure head mounting structure of this utility model.

[0042] Figure 6 This is a schematic diagram of the structure of the first fixture of this utility model.

[0043] Figure 7This is a cross-sectional view of the first fixture of this utility model.

[0044] in:

[0045] 1. The second fixture;

[0046] 11. Insulating plate; 12. First heating plate; 13. Insulating heat-conducting plate;

[0047] 14. Press head assembly; 141. Seat; 1411. Through hole; 1412. Receiving cavity; 142. Pressing body; 1421. First limiting part; 1423. Pressing part; 143. Guide rod; 1431. Second limiting part; 144. First elastic element;

[0048] 15. Pressure head mounting structure; 151. Connecting assembly; 152. Support; 153. Limit bracket; 154. Settlement groove; 155. Perforation;

[0049] 16. Driver board; 17. Power supply connection structure;

[0050] 2. The first fixture;

[0051] 21. Second heating plate;

[0052] 22. Heat-conducting seat assembly; 221. Elongated hole; 222. Base; 223. Limiting plate; 224. Second elastic element; 225. Floating seat; 2251. Limiting block; 2252. Protrusion;

[0053] 3. Devices. Detailed Implementation

[0054] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0055] Example 1:

[0056] like Figures 1-4 As shown, the press-fit power semiconductor device test fixture of this embodiment is used for testing equipment and includes a first fixture 2 and a second fixture 1.

[0057] First fixture 2, used to hold device 3;

[0058] The second fixture 1 is movable relative to the first fixture 2 along a first straight line direction. The second fixture 1 includes a first heating plate 12 and at least one pressure head assembly 14.

[0059] The single pressure head assembly 14 includes a seat 141, a receiving cavity 1412, a pressing body 142, and a first elastic element 144.

[0060] The base 141 is fixedly connected to the first heating plate 12;

[0061] The receiving cavity 1412 is located on the seat 141, and one side of the receiving cavity 1412 is an open structure;

[0062] The crimping body 142 is electrically connected to the test circuit of the test equipment. One end of the crimping body 142 along the first straight line corresponds to the device 3. The other end of the crimping body 142 along the first straight line is provided with a first limiting part 1421. The open structure is movably sleeved on the outside of the first limiting part 1421 and closes the receiving cavity 1412.

[0063] Guide rod 143 is fixed on the first limiting part 1421 and slidably connected to the through hole 1411.

[0064] The first elastic element 144 is located in the receiving cavity 1412. Before the pressing body 142 contacts the device 3, the first elastic element 144 is in an initial compressed state, and the compression direction is the first straight line direction, which elastically connects the first limiting part 1421 to the receiving cavity 1412.

[0065] In this process, after the first fixture 2 and the second fixture 1 approach each other and the pressing body 142 contacts the surface of the device 3, the first elastic element 144 is further compressed. The seat 141 transfers the heat from the first heating plate 12 to the pressing body 142 and then to the device 3. After the first fixture 2 and the second fixture 1 move away from each other and the pressing body 142 is separated from the device 3, the first elastic element 144 returns to its initial compressed state.

[0066] Typically, testing equipment uses a linear drive mechanism to achieve relative movement between the first fixture 2 and the second fixture 1 (not shown in the figure). This is a conventional technique and will not be elaborated upon here. The second fixture 1 is located directly above the first fixture 2. The number of positions for placing the device 3 on the first fixture 2 is set according to the specific testing requirements, such as... Figure 6 As shown, there are three positions for placing device 3, which can be used for dynamic and static testing. One pressure head assembly 14 corresponds to one device 3.

[0067] The use of the pressure head assembly 14 can increase the pressure contact area between the fixture and the device 3, which facilitates the electrical connection between the testing equipment and the device 3, and also facilitates heat conduction.

[0068] Specifically, the first elastic element 144 is made of a thermally conductive material to facilitate heat conduction. The seat 141, the pressing body 142, and the guide rod 143 are all made of metal. The open structure is movably sleeved outside the first limiting part 1421. Usually, there is a certain gap between the open structure and the first limiting part 1421, that is, the receiving cavity 1412 is in a relatively closed state. The relatively closed receiving cavity 1412 transfers the heat of the seat 141 to the pressing body 142 through sufficient radiative heat transfer, thereby improving the heat transfer efficiency and heat transfer of the pressing head assembly 14. The seat 141 and the pressing body 142 are elastically connected by the first elastic element 144 to ensure that the pressure is consistent during pressing and will not damage the device 3. When multiple devices 3 are tested simultaneously after the pressing body 142 contacts the device 3, the pressing-type power semiconductor device 3 test fixture of this embodiment can ensure good contact between each device 3 and the pressing head assembly 14.

[0069] In addition, the second fixture 1 also includes an insulating plate 11, on which a first heating plate 12 is fixedly installed to improve the safety of the testing equipment.

[0070] By setting a pressure head assembly 14 on the second fixture 1, which is simultaneously connected to the first heating plate 12 and the test circuit, the heating and electrical connection of the test device 3 can be achieved through a single component. In addition, the seat 141 and the pressing body 142 of the pressure head assembly 14 are fitted together to form a receiving cavity 1412, and are elastically connected by the first elastic member 144 located in the receiving cavity 1412. This ensures good contact between the pressing body 142 and the device 3, while also ensuring good heat transfer between the seat 141 and the pressing body 142. Thus, the power semiconductor device 3 can be connected to the test circuit by pressing while the power semiconductor device 3 is heated effectively.

[0071] Furthermore, such as Figure 4 As shown, the side wall of the receiving cavity 1412 opposite to the open structure is provided with a through hole 1411 penetrating the seat body 141, and also includes a guide rod 143 fixed on the first limiting part 1421, the guide rod 143 being slidably connected to the through hole 1411.

[0072] In one specific implementation, such as Figure 4 As shown, a second limiting part 1431 is provided at the end of the guide rod 143. The second limiting part 1431 abuts against the seat 141, causing the first elastic member 144 to be in a compressed state. Specifically, it can be in an initial compressed state, which also facilitates the overall installation after separately assembling the pressure head assembly 14. Figure 5 As shown.

[0073] Furthermore, such as Figure 4As shown, the first elastic element 144 is a plurality of disc springs that are elastically stacked together. The disc springs are sleeved on the guide rod 143. One outer disc spring abuts against the receiving cavity 1412 at the through hole 1411, and the other outer disc spring abuts against the first limiting part 1421.

[0074] The sliding connection between the base 141 and the first limiting part 1421 via the shaft hole structure ensures good directional accuracy of the pressing body 142 relative to the base 141, and also facilitates the installation of the first elastic element 144.

[0075] Disc springs are said to be elastically stacked together when the openings of two adjacent disc springs face opposite directions, such as... Figure 4 As shown, there are six disc springs, and stacking them together provides better elasticity.

[0076] The size of the receiving cavity 1412 is adapted to the outer dimensions of the first elastic member 144, reducing the space of the receiving cavity 1412 and enabling the first elastic member 144 to act as a heat transfer channel, thereby improving the heat transfer efficiency.

[0077] Furthermore, such as Figure 4 As shown, the crimping body 142 also includes a crimping part 1423 that is detachably fixed to the crimping body 142, and the crimping part 1423 is in contact with the device 3.

[0078] The crimping part 1423 can be detachably installed on the crimping body 142, which facilitates the individual replacement of the crimping part 1423 after it is damaged, thereby improving the maintenance efficiency of the test fixture.

[0079] Example 2:

[0080] Based on Embodiment 1, considering the insulation and thermal conductivity between the pressure head assembly 14 and the first heating plate 12, in this embodiment of the pressure-fit power semiconductor device testing fixture, such as... Figure 2 , Figure 5 As shown, an insulating heat-conducting plate 13 is installed on the first heating plate 12, and the second fixture 1 also includes a pressure head mounting structure 15, which includes a limiting bracket 153, a support part 152, and a connecting component 151.

[0081] The limiting bracket 153 is made of heat-resistant and insulating material. The limiting bracket 153 has a through hole 155. The crimping body 142 is inserted into the through hole 155. The part of the crimping body 142 that contacts the device 3 is located outside the through hole 155.

[0082] The support part 152 is fixedly connected at one end to the limiting bracket 153 and at the other end to the base 141, and is used to support and install the pressure head assembly 14 on the limiting bracket 153.

[0083] The connecting assembly 151 includes a first connector located on the first heating plate 12 and a second connector located on the limiting bracket 153. The first connector and the second connector are detachably connected so that the seat 141 is in contact with the insulating heat-conducting plate 13.

[0084] The limiting bracket 153 is specifically made of heat-resistant and insulating plastic. The connecting component 151 is a locking hook assembly, with the first connecting member being a locking hook and the second connecting member being a locking buckle. The insulating heat-conducting plate 13 is a ceramic plate. When there are multiple pressure head assemblies 14, the insulating heat-conducting plate 13 separates the multiple pressure head assemblies 14 while achieving insulation between the first heating plate 12 and the pressure head assembly 14, thus achieving heat transfer between the first heating plate 12 and the pressure head assembly 14. Since the insulating heat-conducting plate 13 cannot bear weight, the pressure-fitting power semiconductor device test fixture of this embodiment uses a limiting bracket 153 made of heat-resistant and insulating material that is detachably and fixedly connected to the first heating plate 12 to limit and press the pressure head assembly 14 onto the insulating heat-conducting plate 13, thereby achieving the insulated and safe installation of the pressure head assembly 14.

[0085] Specifically, such as Figure 5 As shown, the support part 152 is a rod-shaped structure, and each seat 141 is fixedly connected to the limiting bracket 153 through at least two support parts 152.

[0086] like Figure 2 As shown, a drive board 16 is installed on the limiting bracket 153. The drive board 16 is specifically a PCB board. The drive board 16 is electrically connected to the pressing body 142, and specifically connected to the pressing part 1423 through wires. A power supply connection structure 17 is also installed on the limiting bracket 153. The power supply connection structure 17 is connected to the drive board 16. The power supply connection structure 17 includes a positive input copper bus and a negative input copper bus.

[0087] Furthermore, such as Figure 5 As shown, a groove 154 is provided at one end of the perforation 155 facing the insulating heat-conducting plate 13. When the seat 141 is in contact with the insulating heat-conducting plate 13, the groove 154 abuts against the middle of the pressing body 142, so that the first elastic member 144 is in the initial compressed state.

[0088] In a specific embodiment, the crimping portion 1423 on the crimping body 142 is located in the through hole 155, and the end is located outside the through hole 155. The groove 154 abuts against one end of the crimping body 142 where the crimping portion 1423 is installed. The diameter of the end of the crimping body 142 where the crimping portion 1423 is installed is larger than the through hole 155. When there are multiple crimping head assemblies 14, it can be ensured that the crimping bodies 142 of the crimping head assemblies 14 are at the same height.

[0089] Example 3:

[0090] In order to ensure good contact between the pressure head assembly 14 and the device 3 during pressing, the placement posture of the device 3 is required to be relatively high. In order to reduce the accuracy requirements of the placement posture of the device 3, the first fixture 2 for placing the device 3 is further designed based on the above embodiments.

[0091] like Figure 6 As shown, the first fixture 2 of the press-fit power semiconductor device test fixture in this embodiment includes a second heating plate 21. A heat-conducting seat assembly 22 is fixedly disposed on the second heating plate 21. The heat-conducting seat assembly 22 is used to place the device 3 and transfer the heat of the second heating plate 21 to the device 3.

[0092] like Figure 6 , Figure 7 As shown, the heat-conducting seat assembly 22 includes a base 222, at least one floating seat 225, a limiting plate 223, and at least one set of second elastic members 224.

[0093] The base 222 has at least one groove, and the inner surface of the groove is a first spherical surface;

[0094] At least one floating seat 225 is provided for placing the device 3. The side of the floating seat 225 facing away from the device 3 is provided with a protrusion 2252. The protrusion 2252 is provided with a second spherical surface that is in contact with the first spherical surface.

[0095] Limiting plate 223 is detachably installed on base 222;

[0096] At least one set of second elastic elements 224, each set of second elastic elements 224 corresponds to one floating seat 225, and the number of second elastic elements 224 in each set is multiple and they are evenly distributed in a ring around the protrusion 2252. One end of each second elastic element 224 is connected to the limiting plate 223 and the other end is connected to the floating seat 225. The second elastic element 224 is in a compressed state, which floats the floating seat 225 and the base 222.

[0097] The floating seat 225 is also provided with a limiting block 2251 for positioning the device 3. In this embodiment, the base 222, the floating seat 225, and the second heating plate 21 are all made of copper and are electrically connected to the test circuit through wires. Specifically, the second elastic element 224 is a columnar helical spring.

[0098] The floating seat 225 for placing device 3 can be adjusted in multiple directions by connecting the spherical surface with the spherical protrusion 2252. At the same time, the floating seat 225 is elastically connected to the base 222 to ensure that device 3 is in a fixed position when it is not in contact with the pressure head assembly 14, which facilitates the placement of device 3. When the pressure head assembly 14 presses on device 3, the second spherical surface rotates relative to the first spherical surface according to the current posture of device 3 to adjust the posture of device 3, so that the pressure head assembly 14 and device 3 make good contact and the device 3 is subjected to uniform force.

[0099] Furthermore, to ensure proper crimping, the crimping head assembly 14 must be positioned at the center of the device 3, directly above the center of the ball, when in contact with the device 3. Further, as... Figure 6 As shown, the base 222 is provided with a set of elongated holes 221. The length direction of the elongated holes 221 is the second straight line direction. It also includes fasteners that connect the elongated holes 221 to the second heating plate 21. It also includes a servo linear drive mechanism. The moving end of the servo linear drive mechanism is fixedly connected to the second heating plate 21 and is used to drive the second heating plate 21 to move along a third straight line direction. The second straight line direction is perpendicular to the third straight line direction. Both the second straight line direction and the third straight line direction are perpendicular to the first straight line direction.

[0100] The servo linear drive mechanism is not shown in the figure. Normally, the first fixture 2 is equipped with a servo linear drive mechanism to move the second heating plate 21 horizontally to the loading position, which facilitates the loading of the device 3. During the equipment debugging process, the movement of the servo linear drive mechanism can control the precise position of the second heating plate 21 in the third linear direction.

[0101] The position of the fastener in the elongated hole 221 is adjusted manually. The relative position between the center of the protrusion 2252 and the axis of the pressing body 142 is adjusted from the second straight line direction. Specifically, the position of the axis of the pressing part 1423 and the center of the protrusion 2252 is adjusted. The position of the second heating plate 21 in the third straight line direction is adjusted by the servo linear module to adjust the position of the axis of the pressing part 1423 and the center of the protrusion 2252. This ensures that the axis of the pressing part 1423 and the center of the protrusion 2252 coincide during pressing, and ensures that the upper surface of the device 3 and the end face of the pressing part 1423 are in uniform contact during pressing, thus ensuring the uniformity of pressing.

[0102] Example 4:

[0103] The press-fit power semiconductor device testing equipment of this embodiment includes the press-fit power semiconductor device testing fixture of any of the above embodiments, and also includes a testing circuit and a linear drive mechanism for driving the first fixture 2 and the second fixture 1 to move relative to each other. After the press-fit body 142 presses against the device 3, the device 3 is heated. The device 3 is connected to the measurement circuit to test the device 3.

[0104] The above description is an explanation of the present utility model and not a limitation thereof. The scope of the present utility model is defined by the claims. Within the protection scope of the present utility model, any form of modification may be made.

Claims

1. A pressure-fit power semiconductor device testing fixture, characterized in that: For testing equipment, including: The first fixture (2) is used to place the device (3); A second fixture (1) is movable relative to the first fixture (2) along a first linear direction. The second fixture (1) includes a first heating plate (12) and at least one pressure head assembly (14). The single pressure head assembly (14) includes: The base (141) is fixedly connected to the first heating plate (12). A receiving cavity (1412) is located on the seat (141), and one side of the receiving cavity (1412) is an open structure. A crimping body (142) is electrically connected to the test circuit of the test equipment. One end of the crimping body (142) along the first straight line corresponds to the device (3), and the other end of the crimping body (142) along the first straight line is provided with a first limiting part (1421). The open structure is movably sleeved on the outside of the first limiting part (1421) and closes the receiving cavity (1412). The first elastic element (144) is located in the receiving cavity (1412). Before the pressing body (142) contacts the device (3), the first elastic element (144) is in an initial compressed state, and the compression direction is the first straight line direction, so as to elastically connect the first limiting part (1421) with the receiving cavity (1412). Wherein, after the first fixture (2) and the second fixture (1) approach each other so that the pressing body (142) contacts the surface of the device (3), the first elastic element (144) is further compressed, and the seat (141) transfers the heat of the first heating plate (12) to the pressing body (142) and then to the device (3). After the first fixture (2) and the second fixture (1) move away from each other so that the pressing body (142) is separated from the device (3), the first elastic element (144) returns to the initial compressed state.

2. The press-fit power semiconductor device test fixture as described in claim 1, characterized in that: The side wall of the receiving cavity (1412) opposite to the open structure is provided with a through hole (1411) penetrating the seat (141), and also includes a guide rod (143) fixed on the first limiting part (1421), the guide rod (143) being slidably connected to the through hole (1411).

3. The press-fit power semiconductor device test fixture as described in claim 2, characterized in that: The first elastic element (144) is a plurality of disc springs that are elastically stacked together. The disc springs are sleeved on the guide rod (143). One outer disc spring abuts against the receiving cavity (1412) at the through hole (1411), and the other outer disc spring abuts against the first limiting part (1421).

4. The press-fit power semiconductor device test fixture as described in claim 1, characterized in that: The dimensions of the receiving cavity (1412) are adapted to the external dimensions of the first elastic element (144).

5. The press-fit power semiconductor device test fixture as described in any one of claims 1-4, characterized in that: An insulating heat-conducting plate (13) is mounted on the first heating plate (12), and the second fixture (1) further includes a pressure head mounting structure (15), the pressure head mounting structure (15) comprising: The limiting bracket (153) is made of heat-resistant and insulating material. The limiting bracket (153) has a through hole (155). The crimping body (142) passes through the through hole (155). The part of the crimping body (142) that contacts the device (3) is located outside the through hole (155). The support part (152) is fixedly connected at one end to the limiting bracket (153) and at the other end to the seat (141), and is used to support and install the pressure head assembly (14) on the limiting bracket (153); The connecting assembly (151) includes a first connector located on the first heating plate (12) and a second connector located on the limiting bracket (153). The first connector and the second connector are detachably connected so that the seat (141) is in contact with the insulating heat-conducting plate (13).

6. The press-fit power semiconductor device test fixture as described in claim 5, characterized in that: The perforation (155) has a groove (154) at one end facing the insulating heat-conducting plate (13). When the seat (141) is in contact with the insulating heat-conducting plate (13), the groove (154) abuts against the middle of the pressing body (142), so that the first elastic member (144) is in an initial compressed state.

7. The press-fit power semiconductor device test fixture as described in claim 1, characterized in that: The first fixture (2) includes a second heating plate (21), and a heat-conducting seat assembly (22) is fixedly disposed on the second heating plate (21). The heat-conducting seat assembly (22) is used to place the device (3) and transfer the heat from the second heating plate (21) to the device (3).

8. The press-fit power semiconductor device test fixture as described in claim 7, characterized in that: The heat-conducting base assembly (22) includes: A base (222) is provided with at least one groove, the inner surface of which is a first spherical surface; At least one floating seat (225) is provided for placing the device (3). The floating seat (225) has a protrusion (2252) on the side facing away from the device (3). The protrusion (2252) has a second spherical surface that contacts the first spherical surface. The limiting plate (223) is detachably installed on the base (222); At least one set of second elastic elements (224), each set of second elastic elements (224) corresponds to a floating seat (225), the number of each set of second elastic elements (224) is multiple and they are evenly distributed in a ring around the protrusion (2252). One end of each second elastic element (224) is connected to the limiting plate (223) and the other end is connected to the floating seat (225). The second elastic element (224) is in a compressed state, which floats the floating seat (225) and the base (222).

9. The press-fit power semiconductor device test fixture as described in claim 8, characterized in that: The base (222) is provided with a set of elongated holes (221), the length direction of which is a second straight line direction. It also includes fasteners that connect the elongated holes (221) to the second heating plate (21), and a servo linear drive mechanism. The moving end of the servo linear drive mechanism is fixedly connected to the second heating plate (21) and is used to drive the second heating plate (21) to move along a third straight line direction. The second straight line direction is perpendicular to the third straight line direction, and both the second straight line direction and the third straight line direction are perpendicular to the first straight line direction.

10. A pressure-fit power semiconductor device testing device, characterized in that: Includes the press-fit power semiconductor device test fixture as described in any one of claims 1-9.

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