Rectifier diode die current aging detection apparatus

The rectifier diode die current aging test device uses ceramic plates and electrodes to simulate the electrical environment of the bridge core, and performs aging test directly at the die stage. This solves the problems of low efficiency and resource waste in the existing technology, and achieves efficient and practical test results.

CN224341626UActive Publication Date: 2026-06-09SILING ELECTRONICS YANGZHOU CITY
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Utility models(China)
Current Assignee / Owner
SILING ELECTRONICS YANGZHOU CITY
Filing Date
2025-06-17
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

In the existing technology, during the production of rectifier diode chips, it is impossible to screen inferior chips before sintering, resulting in low efficiency, waste of resources, and lack of quality prediction. Furthermore, it is impossible to identify batch defects before sintering.

Method used

A current aging detection device for rectifier diode chips was designed. By combining ceramic plates, electrode plates and conductive posts, the electrical environment of the bridge core is simulated, and the current aging detection is performed directly at the chip stage. The chip is fixed by the spring pressure of the conductive posts, avoiding welding and achieving reliable current contact.

Benefits of technology

This enables efficient testing at the die stage, avoiding resource waste after defective chips are sintered into bridge cores, shortening the testing cycle, and ensuring that the test results closely reflect actual application scenarios.

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Abstract

This utility model discloses a device for testing the current aging of rectifier diode chips, including a housing, a base plate below the housing, and a screw connection between the base plate and the housing. Symmetrically arranged ceramic plates are fixed to the top surface of the base plate, located inside the housing. Each ceramic plate has an L-shaped electrode plate on top, including a horizontal section and a vertical section. The horizontal section is fixed to the top surface of the ceramic plate, and the top end of the vertical section penetrates the top plate and extends above it. A diode chip to be tested is placed on the top surface of each horizontal section. An epoxy block is fixed to the top of the top plate, and two conductive posts, designated as a first conductive post and a second conductive post, are inserted and fixed onto the epoxy block. The lower ends of both the first and second conductive posts penetrate the top plate and make contact with the two diode chips respectively. The top end of the first conductive post is connected to the top end of the second electrode plate via a wire. Using this device can shorten the testing process for the diode chips and reduce testing costs.
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