A substrate processing apparatus

Abstract

This utility model provides a substrate processing device, relating to the field of photovoltaic wafer or crystal processing. The substrate processing device includes a base, a suction cup assembly, a lifting assembly, and a robotic arm. The suction cup assembly is mounted on and connected to the base, and has a vacuum chamber. The suction cup assembly includes a suction cup for adsorbing and stopping the adsorption of substrates. The lifting assembly includes a push rod for raising, lowering, and adsorbing substrates located on the suction cup. The robotic arm is used for loading and unloading substrates. Through the coordinated operation of the lifting assembly, the suction cup assembly, and the robotic arm, the substrate processing device ensures high-precision positioning and non-destructive transfer of substrates throughout the entire transmission and processing process.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic wafer or crystal processing, and more specifically, to a substrate processing device. Background Technology

[0002] An exposure machine is a device that transfers patterns from a photomask / film onto a substrate coated with photosensitive material (such as wafers or photovoltaic cells) using a light source of a specific wavelength (or laser scanning using LDI technology). In conventional exposure processes, the material to be exposed must be placed on the surface of a special chuck and secured before exposure can be performed. However, materials such as photovoltaic cells or wafers are highly brittle and thin (typically 50-500 μm), making them extremely prone to breakage during loading and unloading. In particular, after exposure, the gap between the material and the chuck is usually small, and conventionally, a nozzle or hook is used to directly grip the substrate. However, due to the brittleness and thinness of the material, mechanical contact can easily lead to microcracks or breakage, making it difficult for robotic arms to handle the material. Utility Model Content

[0003] This invention provides a substrate processing apparatus that enables stable loading and unloading of material substrates and fixation of the substrates during exposure, thereby improving the operational reliability of the substrate processing flow and increasing the process efficiency of the exposure process.

[0004] The embodiments of this utility model can be implemented as follows:

[0005] An embodiment of this utility model provides a substrate processing device, including a base, a suction cup assembly, a lifting assembly, and a robot arm; the suction cup assembly is disposed on and connected to the base, the suction cup assembly has a vacuum cavity, the suction cup assembly includes a suction cup, and the suction cup assembly is used to adsorb and stop adsorbing substrates; the lifting assembly includes a top rod, the top rod is used to raise, lower, and adsorb substrates located on the suction cup; the robot arm is used to load and unload the substrates.

[0006] Optionally, the lifting assembly further includes a lifting device and an adapter. The top rod is disposed on one side of the adapter and connected to the adapter. The lifting device is disposed on the other side of the adapter. One end of the lifting device is connected to the base, and the other end is connected to the adapter. The lifting device is used to drive the adapter to lift and lower, thereby realizing the lifting and lowering of the top rod.

[0007] Optionally, the lifting device, the adapter, and the top rod are all hollow structures, and the internal cavities of the top rod, the adapter, and the lifting device are interconnected.

[0008] Optionally, the push rod includes a conductive element and a suction nozzle connected to each other. The conductive element is connected to the adapter. Both the conductive element and the suction nozzle are hollow structures, and the internal cavities of the adapter, the conductive element, and the suction nozzle are interconnected.

[0009] Optionally, the substrate processing device further includes a support member disposed opposite to the substrate, one end of which is connected to the base and the other end of which is connected to the suction cup assembly. The support member, the suction cup assembly, and the base form a mounting cavity, and the lifting assembly is disposed within the mounting cavity.

[0010] Optionally, the substrate processing apparatus further includes a first exhaust component, which is disposed on the side wall of the suction cup and communicates with the vacuum chamber. The suction cup has a plurality of micropores, which communicate with the vacuum chamber.

[0011] Optionally, the substrate processing apparatus further includes a second exhaust component, which is disposed on the side wall of the adapter and communicates with the internal cavity of the adapter.

[0012] Optionally, the substrate processing apparatus further includes a third exhaust component, which is connected to the lifting device and is used to control the lifting speed of the lifting device.

[0013] Optionally, the substrate processing device further includes a first interface, one end of which is connected to the lifting device, and the other end of which is connected to the third exhaust component via a pipe.

[0014] Optionally, the lifting assembly further includes a plurality of guide members distributed circumferentially along the lifting device and connected to the adapter. The plurality of guide members are used to ensure that the adapter remains horizontal during lifting and to prevent the adapter from tilting.

[0015] The beneficial effects of the substrate processing apparatus of this utility model embodiment include, for example:

[0016] The substrate processing unit, through the coordinated operation of a lifting assembly, a suction cup assembly, and a robotic arm, ensures high-precision positioning and stable fixation of the substrate throughout the entire transfer and processing process. The lifting assembly provides smooth support and lifting control for the substrate, while the suction cup assembly effectively eliminates displacement deviations during processing through reliable adsorption and fixation. The robotic arm performs non-destructive transfer of the substrate during processing. The entire system achieves safe and non-destructive transfer of the substrate while maintaining positioning accuracy. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the substrate processing apparatus provided in this embodiment from a first-view perspective;

[0019] Figure 2 This is a schematic diagram of the lifting assembly provided in this embodiment from a first-view perspective;

[0020] Figure 3 This is a structural schematic diagram of the lifting assembly (some guide components omitted) provided in this embodiment from a second perspective.

[0021] Figure 4 This is a schematic diagram of the substrate processing apparatus provided in this embodiment from a third-person perspective (excluding the lifting components).

[0022] Icons: 10-Substrate processing device; 20-Substrate; 100-Base; 200-Suction cup assembly; 300-Lifting assembly; 400-Robot arm; 210-Suction cup; 130-Support component; 101-Mounting cavity; 310-Push rod; 330-Adapter component; 350-Lifting device; 311-Transmission component; 313-Suction nozzle; 510-First exhaust component; 520-Second exhaust component; 530-Third exhaust component; 550-First interface; 360-Guide component. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0027] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0028] It should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or connections that allow for communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] Where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0030] Please refer to Figures 1-4 A substrate processing device 10 includes a base 100, a suction cup assembly 200, a lifting assembly 300, and a robot arm 400. The suction cup assembly 200 is disposed on and connected to the base 100, and has a vacuum chamber. The suction cup assembly 200 includes a suction cup 210 and is used to adsorb and stop adsorbing a substrate 20. The lifting assembly 300 includes a top rod 310, which is used to lift and adsorb the substrate 20 located on the suction cup 210. The robot arm 400 is used to load and unload the substrate 20.

[0031] The substrate processing device 10, through the coordinated operation of the lifting assembly 300, the suction cup assembly 200, and the robotic arm 400, ensures high-precision positioning and stable fixation of the substrate 20 throughout the entire transfer and processing process. The lifting assembly 300 provides stable support and lifting control for the substrate 20, the suction cup assembly 200 effectively eliminates displacement deviations during processing through reliable adsorption fixation, and the robotic arm 400 performs non-destructive transfer of the substrate 20 during processing. The entire system achieves safe and non-destructive transfer of the substrate 20 while ensuring positioning accuracy.

[0032] During the loading stage, the lifting assembly 300's push rod 310 mechanism rises to a predetermined height, smoothly receiving the substrate 20 conveyed by the robot arm 400 and adsorbing and fixing it. The push rod 310 descends at a certain speed, allowing the substrate 20 to fall smoothly onto the surface of the suction cup 210. At this time, the suction cup 210 activates its adsorption function to fix the substrate 20, ensuring that the position of the substrate 20 is completely locked during exposure, preventing any micron-level displacement. After the exposure process is completed, the system first releases the adsorption state of the suction cup assembly 200, and the lifting assembly 300 then performs a lifting action, smoothly lifting the substrate 20 off the surface of the suction cup 210 to a designated height. Finally, the robot arm 400 completes the non-destructive gripping and transfer of the substrate 20, realizing non-destructive and high-precision automated processing throughout the entire process, effectively ensuring the positioning accuracy and transmission stability of the substrate 20 during substrate processing.

[0033] In this specific embodiment, the suction cup 210 is a porous ceramic plate. As a mature porous material, porous ceramics have uniform pore size distribution, interconnected internal structures, and a smooth, delicate surface after grinding, exhibiting good flatness. It is widely used in the manufacturing of semiconductor wafers such as silicon, sapphire, and gallium arsenide. Its adsorption principle utilizes vacuum adsorption to fix the workpiece. The vacuum-transmitting part of the vacuum suction cup assembly 200 is the porous ceramic plate, which is assembled in the countersunk hole of the base. Its periphery is bonded and sealed to the base, which is made of precision ceramic or metal. Through the combination of the metal or ceramic base 100 and the special porous ceramic material, along with the design of the internal precision air channels, when negative pressure is applied, the workpiece can be smoothly and stably adsorbed onto the suction cup 210.

[0034] It is understood that in other embodiments of this example, the choice of material for suction cup 210 is not limited to porous ceramic plate, and other high-performance materials such as porous glass, anodized aluminum or porous silicon carbide can also be selected according to actual processing requirements.

[0035] Optionally, the lifting assembly 300 further includes a lifting device 350 and an adapter 330. The top rod 310 is disposed on one side of the adapter 330 and connected to the adapter 330. The lifting device 350 is disposed on the other side of the adapter 330. One end of the lifting device 350 is connected to the base 100 and the other end is connected to the adapter 330. The lifting device 350 is used to drive the adapter 330 to lift and lower, thereby realizing the lifting and lowering of the top rod 310.

[0036] In this specific embodiment, to ensure the stable fixation of the substrate 20 during the exposure process while also accommodating the lifting function of the lifting assembly 300, the suction cup 210 only has a through hole at the corresponding position of the push rod 310. This ensures the free lifting and lowering movement of the push rod 310 while maximizing the suction force of the suction cup 210 on the substrate 20. Specifically, the mating parts of the suction cup 210, the base, and the through hole are sealed to effectively isolate the vacuum chamber from the outside environment, thereby ensuring the reliable operation of the vacuum adsorption function of the suction cup 210. This structure fully preserves the vacuum adsorption performance of the suction cup 210 while achieving the lifting function of the lifting assembly 300.

[0037] This embodiment uses a cylinder as the lifting drive device. The reciprocating motion of the cylinder drives the adapter 330 to generate displacement, which in turn drives the rigidly connected push rod 310 to achieve vertical lifting motion. It should be noted that in practical applications, other linear drive devices such as electric cylinders and lead screw modules can be flexibly selected according to different working conditions to meet the specific requirements of the equipment in terms of accuracy, speed, or load.

[0038] Optionally, the lifting device 350, the adapter 330, and the top rod 310 are all hollow structures, and the internal cavities of the top rod 310, the adapter 330, and the lifting device 350 are interconnected.

[0039] In this embodiment, there are three push rods 310, which are symmetrically distributed in an equilateral triangle. This three-point support structure ensures the stability and positioning accuracy of the substrate 20 during transfer. A vacuum channel is formed inside each push rod 310, creating a connected airway system with the adapter 330 and lifting device 350. This allows for vacuum adsorption during lifting, further enhancing the fixation of the substrate 20. This design ensures both the stability of the mechanical support and the dual fixation of the substrate 20 through vacuum-assisted adsorption.

[0040] It is easy to understand that the adapter 330 adopts a lightweight design, effectively reducing the overall weight of the adapter plate by symmetrically opening weight-reducing holes on both sides of the central axis of the adapter plate. This symmetrical weight-reducing structure not only maintains the mechanical balance of the components, but also significantly reduces the load on the lifting device 350, thereby improving the motion accuracy and response speed of the system and ensuring the positioning stability of the substrate 20 during the lifting process.

[0041] The robotic arm 400 used in this embodiment has a sheet-like hollow structure. Multiple air holes are evenly distributed on its contact surface with the substrate 20, and each air hole is equipped with a flexible silicone buffer layer. During the transfer of the substrate 20, the vacuum control system integrated inside the robotic arm 400 is activated, forming a uniform negative pressure field through the air hole array to achieve stable and precise adsorption and transfer of the substrate 20 without damage.

[0042] Optionally, the push rod 310 includes a conductor 311 and a suction nozzle 313 connected to each other. The conductor 311 is connected to the adapter 330. Both the conductor 311 and the suction nozzle 313 are hollow structures. The internal cavities of the adapter 330, the conductor 311 and the suction nozzle 313 are interconnected to form a vacuum adsorption channel.

[0043] Once the lifting rod 310 mechanism is raised to the predetermined height and smoothly receives the substrate 20 transferred by the robot arm 400, the lifting component 300 activates the vacuum adsorption function, which generates negative pressure inside the suction nozzle 313, thereby accurately adsorbing and fixing the substrate 20 to ensure its positional stability in subsequent processes.

[0044] To effectively prevent surface damage during the contact between the substrate 20 and the suction nozzle 313, the top contact area of ​​the suction nozzle 313 is made of flexible silicone. Utilizing the elastic deformation properties of silicone, contact stress is buffered during adsorption, and local pressure is evenly distributed, thereby significantly reducing the risk of mechanical scratches on the surface of the substrate 20. Simultaneously, the silicone material has excellent sealing properties, which further enhances the stability of vacuum adsorption and ensures reliable fixation of the substrate 20 during transport and positioning.

[0045] Optionally, the substrate processing apparatus 10 also has a support member 130 disposed opposite to it. One end of the support member 130 is connected to the base 100, and the other end of the support member 130 is connected to the suction cup assembly 200. The support member 130, the suction cup assembly 200 and the base 100 form a mounting cavity 101, and the lifting assembly 300 is disposed in the mounting cavity 101.

[0046] like Figure 1 and Figure 4 As shown, in this embodiment, the base 100 is provided with multiple fixing holes, and the support member 130 and the lifting device 350 form a detachable connection structure with the base 100 through the fixing holes. The support member 130, together with the suction cup assembly 200 and the base 100, not only defines the mounting cavity 101 for accommodating the lifting assembly 300, but also provides a stable and reliable installation position for the subsequent installation and operation of the lifting device 350, thus providing a structural basis for achieving precise control of the lifting speed. The specific implementation method and control mechanism will be further described in detail later.

[0047] Optionally, the substrate processing apparatus 10 further includes a first exhaust member 510, which is disposed on the side wall of the suction cup 210 and communicates with the vacuum chamber. The suction cup 210 has multiple micro-holes that communicate with the vacuum chamber. When the substrate 20 falls onto the upper surface of the suction cup 210, the first exhaust member 510 evacuates air to create a vacuum in the vacuum chamber and micro-holes, thereby achieving adsorption and fixation of the substrate 20 above the suction cup 210. This process ensures the stability and accuracy of the substrate 20 in subsequent exposure operations.

[0048] In the actual operation, an air pump or similar device can be used for evacuation. The air pump is connected to the vacuum chamber via a connecting pipe. After starting, it can quickly extract the air from the vacuum chamber, creating a negative pressure environment. This negative pressure environment is transmitted to the upper surface of the suction cup 210 through micropores, thereby firmly adhering to the substrate 20 and preventing the substrate 20 from shifting its position, providing a reliable guarantee for subsequent processing and handling.

[0049] Furthermore, to further improve the adsorption effect and system reliability, a pressure sensor can be added to the system to monitor pressure changes within the vacuum chamber. Once the pressure reaches a preset value, the system will automatically stop pumping to avoid increased energy consumption or equipment damage caused by over-pumping. Simultaneously, the pressure sensor can also monitor the vacuum level in real time, ensuring that the substrate 20 maintains a stable adsorption state throughout the entire operation.

[0050] Optionally, the substrate processing apparatus 10 further includes a second exhaust member 520, which is disposed on the side wall of the adapter 330 and communicates with the internal cavity of the adapter 330.

[0051] Similar to the principle by which the vacuum assembly fixes the substrate 20 through adsorption, the lifting assembly 300 also uses vacuum adsorption to adsorb the substrate 20 placed above the lifting rod 310. Specifically, the second exhaust component 520 achieves vacuum adsorption through the following path: second exhaust component 520 - internal cavity of the adapter 330 - internal cavity of the lifting rod 310 - substrate 20.

[0052] In the actual operation, the second exhaust component 520 can be equipped with an air pump or other equipment for air extraction. When it is necessary to adsorb and fix the substrate 20, the second exhaust component 520 is activated and the air in the internal cavity of the adapter 330 is extracted through the connecting pipe, forming a negative pressure environment. This negative pressure environment is transmitted to the upper surface of the push rod 310 through the internal cavity of the push rod 310, thereby adsorbing the substrate 20 placed above the push rod 310.

[0053] Optionally, the substrate processing apparatus 10 further includes a third exhaust member 530, which is connected to the lifting device 350 and is used to control the lifting of the lifting device 350.

[0054] In this embodiment, the lifting device 350 is a cylinder, and the third exhaust component 530 is a throttle valve, which is located at the cylinder's air inlet (also serving as the exhaust outlet). By adjusting the opening of the throttle valve, the gas flow rate can be controlled, thereby adjusting the cylinder's movement speed. Specifically, the intake throttle controls the extension speed of the lifting device 350, while the exhaust throttle controls its retraction speed. When the lifting device 350 is an electric cylinder and a lead screw module, the adjustment of its lifting speed typically involves setting the parameters of the motor control or servo drive, which can be configured according to actual application requirements.

[0055] Optionally, the substrate processing device 10 further includes a first interface 550, one end of which is connected to the lifting device 350, and the other end is connected to the third exhaust component 530 through a pipe.

[0056] In this embodiment, to improve operational convenience, a first interface 550 is provided on the lifting device 350, and the third exhaust component 530 is fixedly mounted on the support member 130. The first interface 550 and the third exhaust component 530 are connected through a pipe, thereby enabling the third exhaust component 530 to control the lifting speed of the cylinder.

[0057] Optionally, the lifting assembly 300 also includes a plurality of guide members 360, which are distributed circumferentially along the lifting device 350 and connected to the adapter 330. The plurality of guide members 360 are used to ensure that the adapter 330 remains horizontal during the lifting process and to prevent the adapter 330 from tilting.

[0058] In this embodiment, there are three guide members 360; of course, in other embodiments of this utility model, the number of guide members 360 can be adjusted according to actual needs, and is not limited here. Similar to the arrangement of the top rod 310, the guide members 360 are symmetrically distributed in an equilateral triangle, and the three-point support structure ensures that the adapter plate above the guide member 360 is subjected to uniform force and moves smoothly during the lifting process.

[0059] Specifically, each guide member 360 includes a fixing part and a lifting part, wherein the fixing part and the lifting part are slidably engaged. The top of the lifting part is connected to the bottom of the adapter 330, while the fixing part is connected to the base 100. Under the force of the cylinder, the guide member 360 enables the adapter 330 to move vertically along a specific path, further ensuring the positional accuracy of the substrate 20 during the lifting process.

[0060] The working principle of the substrate processing apparatus 10 provided in this embodiment is as follows:

[0061] 1. The lifting assembly 300 is in the initial state, the lifting rod 310 is raised upward and the top of the lifting rod 310 extends out of the upper surface of the suction cup 210, and the robotic arm 400 carries the substrate 20 to be exposed and accurately places it on the top of the lifting rod 310;

[0062] 2. Activate the adsorption function of the lifting component 300 to achieve adsorption and fixation of the substrate 20 by the lifting component 300;

[0063] 3. The push rod 310 performs a downward movement until the substrate 20 is transferred to the working surface of the suction cup 210, completing the loading process;

[0064] 4. Activate the suction function of the suction cup assembly 200 to achieve suction and fixation of the substrate 20 by the suction cup assembly 200;

[0065] 5. Execute the preset exposure process flow;

[0066] 6. After the exposure process is completed, the suction function of the suction cup assembly 200 is released, and the push rod 310 performs an upward movement to detach the substrate 20 from the surface of the suction cup 210 to the predetermined position;

[0067] 7. The robotic arm 400 extends into the operating space between the substrate 20 and the suction cup 210 to complete the safe transfer and unloading process of the substrate 20.

[0068] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A substrate processing apparatus, characterized in that, include: Base (100); A suction cup assembly (200) is disposed on the base (100) and connected to the base (100). The suction cup assembly (200) has a vacuum chamber and includes a suction cup (210). The suction cup assembly (200) is used to adsorb and stop adsorbing the substrate (20). Lifting assembly (300), the lifting assembly (300) includes a push rod (310) for lifting and adsorbing the substrate (20) located on the suction cup (210). A robotic arm (400) is used to load and unload the substrate (20).

2. The substrate processing apparatus according to claim 1, characterized in that, The lifting assembly (300) also includes a connector (330) and a lifting device (350). The top rod (310) is disposed on one side of the connector (330) and connected to the connector (330). The lifting device (350) is disposed on the other side of the connector (330). One end of the lifting device (350) is connected to the base (100), and the other end is connected to the connector (330). The lifting device (350) is used to drive the connector (330) to lift and lower, thereby realizing the lifting and lowering of the top rod (310).

3. The substrate processing apparatus according to claim 2, characterized in that, The lifting device (350), the adapter (330) and the top rod (310) are all hollow structures, and the internal cavities of the top rod (310), the adapter (330) and the lifting device (350) are interconnected.

4. The substrate processing apparatus according to claim 3, characterized in that, The push rod (310) includes a conductor (311) and a suction nozzle (313) connected to each other. The conductor (311) is connected to the adapter (330). The conductor (311) and the suction nozzle (313) are both hollow structures. The internal cavities of the adapter (330), the conductor (311) and the suction nozzle (313) are interconnected.

5. The substrate processing apparatus according to claim 3, characterized in that, The substrate processing device (10) also has a support member (130) arranged opposite to it. One end of the support member (130) is connected to the base (100), and the other end of the support member (130) is connected to the suction cup assembly (200). The support member (130), the suction cup assembly (200) and the base (100) form a mounting cavity (101), and the lifting assembly (300) is disposed in the mounting cavity (101).

6. The substrate processing apparatus according to claim 5, characterized in that, The substrate processing device (10) further includes a first exhaust component (510), which is disposed on the side wall of the suction cup assembly (200) and communicates with the vacuum chamber. The suction cup (210) has a plurality of micropores, which communicate with the vacuum chamber.

7. The substrate processing apparatus according to claim 6, characterized in that, The substrate processing device (10) further includes a second exhaust component (520), which is disposed on the side wall of the adapter (330) and communicates with the internal cavity of the adapter (330).

8. The substrate processing apparatus according to claim 7, characterized in that, The substrate processing device (10) also includes a third exhaust component (530), which is connected to the lifting device (350) and is used to control the lifting speed of the lifting device (350).

9. The substrate processing apparatus according to claim 8, characterized in that, The substrate processing device (10) further includes a first interface (550), one end of which is connected to the lifting device (350), and the other end is connected to the third exhaust component (530) through a pipe.

10. The substrate processing apparatus according to claim 2, characterized in that, The lifting assembly (300) also includes a plurality of guide members (360), which are distributed circumferentially along the lifting device (350) and connected to the adapter (330). The plurality of guide members (360) are used to ensure that the adapter (330) remains horizontal during the lifting process and to prevent the adapter (330) from tilting.

Images