A miniature host circuit board assembly

Abstract

This utility model embodiment provides a microcomputer circuit board assembly, including a motherboard with a first PCI-E interface and a second PCI-E interface, a first memory slot and a second memory slot, and corresponding fixing components on its first side; a graphics card slot and a CPU soldered via BGA on the second side of the motherboard; multiple I / O interfaces along the edge of the motherboard; the height of the first PCI-E interface is higher than that of the second PCI-E interface; the height of the first memory slot is higher than that of the second memory slot. By reasonably setting the height difference between the interfaces and slots, a compact layout of the expansion cards and memory modules is achieved, increasing the number of expandable components without increasing the motherboard area, effectively utilizing the limited internal space of the microcomputer, and helping to reduce the overall size of the microcomputer.

Description

Technical Field

[0001] This utility model relates to the field of microcomputer accessories technology, and in particular to a microcomputer mainframe circuit board assembly. Background Technology

[0002] A microcomputer is a small electronic computer composed of large-scale integrated circuits. It is a bare machine based on a microprocessor, equipped with internal memory, input / output (I / O) interface circuits, and corresponding auxiliary circuits.

[0003] Current microcomputer motherboards fall into two categories. Some use desktop motherboards, which, due to their larger size, make the microcomputers relatively large as well. The smaller size of the microcomputer itself results in limited internal space, leading to poor heat dissipation. Others use motherboards similar to those in microcomputers, but to reduce size, the CPU, memory, and graphics cards are all soldered to the motherboard using BGA. This means that in case of a malfunction, the entire motherboard needs to be repaired, making it inconvenient to replace parts for quick repairs. Furthermore, it's not convenient to upgrade the configuration by replacing or adding cards. Therefore, this invention proposes a microcomputer circuit board assembly to at least partially address these user pain points in the current usage environment. Utility Model Content

[0004] In view of the above problems, the present invention provides a micro-host circuit board assembly that overcomes or at least partially solves the above problems.

[0005] To address the aforementioned issues, this utility model discloses a micro-host circuit board assembly, comprising: a motherboard having at least one first PCI-E interface and at least one second PCI-E interface, at least one first memory slot and at least one second memory slot, and corresponding fixing components on its first side;

[0006] The second side of the motherboard has a graphics card slot and a CPU soldered via BGA.

[0007] The motherboard has multiple I / O interfaces along its edge;

[0008] The height of the first PCI-E interface is higher than that of the second PCI-E interface, so that the board connected to the second PCI-E interface can be located in the space between the board connected to the first PCI-E interface and the motherboard.

[0009] The height of the first memory slot is higher than that of the second memory slot, so that the memory module connected to the second memory slot can be located in the space between the memory module connected to the first memory slot and the motherboard.

[0010] Optionally, the fixing component includes a long stud adapted to the first PCI-E interface and a short stud adapted to the second PCI-E interface;

[0011] The first and second memory slots are provided with memory clips on their sides.

[0012] Optionally, a graphics card is installed in the graphics card slot.

[0013] Independent heat dissipation components are attached to the upper part of the CPU and the upper part of the graphics card.

[0014] Optionally, the heat dissipation component includes: a heat pipe, a fan, and a first heat dissipation fin with ventilation gaps;

[0015] The bottom of the heat pipe is attached to the top of the CPU and the top of the graphics card;

[0016] The heat pipe extends and connects to the first heat dissipation fin;

[0017] The air outlet of the fan is opposite to the ventilation gap of the first heat dissipation fin.

[0018] Optionally, the fan includes a single-outlet fan and a dual-outlet fan;

[0019] The single-outlet fan is located at the top of the CPU; the dual-outlet fan is located at the top of the graphics card, and one outlet of the dual-outlet fan is adapted to the first heat sink fin, while the other outlet is adapted to the second heat sink fin.

[0020] Optionally, the heat pipe is a copper pipe, and the first and second heat dissipation fins are made of aluminum or copper.

[0021] The embodiments of this utility model have the following advantages:

[0022] The motherboard has at least one first PCI-E interface and at least one second PCI-E interface, at least one first memory slot and at least one second memory slot, and corresponding mounting components on its first side. On the second side of the motherboard, there is a graphics card slot and a CPU soldered via BGA. Multiple I / O interfaces are located along the edge of the motherboard. The height of the first PCI-E interface is higher than that of the second PCI-E interface, allowing expansion cards connected to the second PCI-E interface to be positioned in the space between the expansion cards connected to the first PCI-E interface and the motherboard. The height of the first memory slot is higher than that of the second memory slot, allowing memory modules connected to the second memory slot to be positioned in the space between the memory modules connected to the first memory slot and the motherboard. By rationally setting the height difference between the interfaces and slots, a compact layout of expansion cards and memory modules is achieved. Without increasing the motherboard area, the number of expandable components is increased, effectively utilizing the limited internal space of the microcomputer and helping to reduce the overall size of the microcomputer. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the first side structure of a micro-host circuit board assembly provided in an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the second side structure of a micro-host circuit board assembly provided in one embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of a first-side mounting board accessory of a micro-host circuit board assembly provided in an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of a micro-host circuit board assembly with a heat dissipation component mounted on the second side, according to an embodiment of the present invention.

[0027] The attached diagram is described below:

[0028] 100. Motherboard; 101. First PCI-E interface; 102. Second PCI-E interface; 103. First memory slot; 104. Second memory slot; 105. Long stud; 106. Short stud; 107. Memory clip; 108. Graphics card slot; 109. Graphics card; 111. Memory module; 112. Solid state drive; 201. Heat pipe; 202. Single exhaust fan; 203. Dual exhaust fan; 204. First heatsink fin; 205. Second heatsink fin. Detailed Implementation

[0029] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Reference Figures 1 to 4 As shown in some embodiments of this utility model, a micro-host circuit board assembly includes: a motherboard 100, the first side of which is provided with at least one first PCI-E interface 101 and at least one second PCI-E interface 102, at least one first memory slot 103 and at least one second memory slot 104, and corresponding fixing components; the second side of the motherboard 100 is provided with a graphics card slot 108 and a CPU soldered via BGA; the edge of the motherboard 100 is provided with multiple I / O interfaces; the height of the first PCI-E interface 101 is higher than that of the second PCI-E interface 102, so that the board connected to the second PCI-E interface 102 can be located in the space between the board connected to the first PCI-E interface 101 and the motherboard 100; the height of the first memory slot 103 is higher than that of the second memory slot 104, so that the memory module 111 connected to the second memory slot 104 can be located in the space between the memory module 111 connected to the first memory slot 103 and the motherboard 100. The aforementioned first PCI-E interface 101 can be used to connect a solid-state drive 112.

[0031] In this application, the first side of the motherboard 100 is equipped with a first PCI-E interface 101 and a second PCI-E interface 102 of different heights, as well as a first memory slot 103 and a second memory slot 104 of different heights, and corresponding fixing components. This allows for a more efficient layout of expansion cards and memory modules 111 within a limited space. For example, the height of the first PCI-E interface 101 is higher than that of the second PCI-E interface 102, allowing expansion cards connected to the second PCI-E interface 102 to be positioned between the expansion cards connected to the first PCI-E interface 101 and the motherboard 100. Similarly, the layout of the memory modules is more compact and efficient. The second side of the motherboard 100 has a graphics card slot 108 and a CPU soldered via BGA, with multiple I / O interfaces along the edge. This layout reduces the overall size of the motherboard 100 to some extent, thus helping to reduce the size of the microcomputer. It also allows for more efficient use of internal space and has a positive impact on solving heat dissipation problems. Moreover, by setting up multiple slots, it is convenient for users to connect different expansion cards and memory modules according to their needs. Compared with soldering all components onto the motherboard 100, this greatly improves the convenience of configuration upgrades. In case of failure, it is also convenient to replace individual parts, instead of having to repair the entire motherboard 100 once a problem occurs, as is the case with existing motherboards 100 in the form of microcomputers.

[0032] By rationally setting the height difference between the interfaces and slots, a compact layout of the expansion cards and memory modules (111) is achieved. This increases the number of expandable components without increasing the motherboard area (100), effectively utilizing the limited internal space of the microcomputer and helping to reduce its overall size. For example, in small office scenarios or home living room computer scenarios where size is extremely important, the smaller computer size can be more easily placed in confined spaces, such as a corner of a desk or next to a television, without taking up too much space.

[0033] The multiple independent slots allow users to easily replace or add expansion cards according to their needs. For example, if a user needs to upgrade the computer's graphics processing capabilities later, a higher-performance graphics card can be easily installed in graphics card slot 108. If a card or memory module 111 malfunctions, only the corresponding component needs to be replaced, without replacing the entire motherboard 100, greatly reducing repair costs and time. In enterprise office environments, when software upgrades demand higher computer performance, configuration upgrades are convenient. In personal use scenarios, such as gamers upgrading their graphics cards and other components as game graphics requirements increase, this approach balances the size, configuration, and compatibility of a mini-computer.

[0034] It should be noted that the aforementioned I / O interfaces are the interfaces on a computer for connecting peripherals, such as USB interfaces, audio interfaces, and video interfaces.

[0035] In some embodiments of this application, the fixing component includes a long stud 105 adapted to the first PCI-E interface 101 and a short stud 106 adapted to the second PCI-E interface 102; memory clips 107 are provided on the sides of the first memory slot 103 and the second memory slot 104. The fixing component, including the long stud 105 adapted to the first PCI-E interface 101 and the short stud 106 adapted to the second PCI-E interface 102, can more securely fix the board connected to the interface, preventing the board from loosening due to vibration or other reasons, and ensuring the stability of data transmission. The memory clips 107 provided on the sides of the first memory slot 103 and the second memory slot 104 can firmly fix the memory module 111, preventing the memory module 111 from becoming loose and causing the computer to fail to recognize the memory or experience unstable operation. For example, in industrial control computers, where the working environment may be subject to vibration, long studs 105 and short studs 106 can ensure a stable connection of circuit boards (such as solid-state drives 112, wireless network cards, etc.), and memory clips 107 can ensure the stable operation of memory modules 111, thereby ensuring the stable operation of industrial control software, avoiding data transmission errors or system crashes caused by loose components, and ensuring the continuity of industrial production.

[0036] It should be noted that the aforementioned PCI-E interface is PCI-Express (peripheral component interconnect express), a high-speed serial computer expansion bus standard. Its original name was "3GIO". It includes the following types that can be expanded and supported: ExpressCard, PCI Express ExpressModule (hot-swappable modular design for servers and workstations), XQD card, XMC card, AdvancedTCA board, general-purpose I / O board, serial digital video output board, M.2 (also known as NGFF), M-PCIe board (brings PCIe 3.0 to mobile devices such as tablets and smartphones through the M-PHY physical layer), and U.2 (also known as SFF-8639).

[0037] In some embodiments of this application, a graphics card 109 is installed in the graphics card slot 108; independent heat dissipation components are attached to the upper ends of the CPU and the graphics card 109. Installing the graphics card 109 in the graphics card slot 108 and attaching independent heat dissipation components to the upper ends of the CPU and the graphics card 109 allows for specialized cooling of the CPU and graphics card 109, which generate significant heat. This effectively reduces the temperature of the CPU and graphics card 109, improving their operational stability and performance, and preventing issues such as throttling or crashes due to overheating. The independent cooling system allows for independent adjustment of fan speeds based on heat generation, ensuring operational stability. For example, in gaming PCs, when running large 3D games or performing 3D graphics rendering, the CPU and graphics card 109 experience extremely high loads, generating a large amount of heat. The independent heat dissipation components can dissipate this heat promptly, keeping the CPU and graphics card 109 at suitable operating temperatures, ensuring smooth gameplay and preventing stuttering due to overheating, thus enhancing the gaming experience.

[0038] Furthermore, the heat dissipation assembly includes: a heat pipe 201, a fan, and a first heat dissipation fin 204 with ventilation gaps; the bottom of the heat pipe 201 is attached to the upper end of the CPU and the upper end of the graphics card 109; the heat pipe 201 extends and connects to the first heat dissipation fin 204; the air outlet of the fan is opposite to the ventilation gap of the first heat dissipation fin 204. The bottom of the heat pipe 201 in the heat dissipation assembly is attached to the upper end of the CPU and the upper end of the graphics card 109, which can quickly conduct the heat generated by the CPU and the graphics card 109 away; the heat pipe extends and connects to the first heat dissipation fin 204 with ventilation gaps; the air outlet of the fan is opposite to the ventilation gap of the first heat dissipation fin 204, which can accelerate airflow, remove heat, and greatly improve heat dissipation efficiency.

[0039] Furthermore, the fan includes a single-outlet fan 202 and a dual-outlet fan 203; the single-outlet fan 202 is positioned above the CPU; the dual-outlet fan 203 is positioned above the graphics card 109, and one outlet of the dual-outlet fan 203 is adapted to the first heatsink fin 204, while the other outlet is adapted to the second heatsink fin 205. Figure 4 As shown, a single-exhaust fan 202 is positioned at the top of the CPU for targeted and efficient CPU cooling; a dual-exhaust fan 203 is positioned at the top of the graphics card 109. One exhaust vent is adapted to the first heatsink fin 204 to assist in cooling the graphics card 109, while the other exhaust vent is adapted to the second heatsink fin 205 to further expand the cooling area and improve the overall cooling effect. In other words, the CPU's cooling system generates less heat than the display, so its cooling system only needs one first heatsink fin 204 and a single-exhaust fan 202. The graphics card 109, which generates more heat, has its cooling area increased by the first heatsink fin 204 and the second heatsink fin 205, allowing the graphics card 109 to maintain stable operation. For microcomputers with limited space, setting up a dedicated display can effectively improve the computer's graphics processing capabilities. Simultaneously, configuring a high-efficiency cooling system ensures stable operation and improves work efficiency.

[0040] The heat pipe 201 is made of copper, and the first heat sink 204 and the second heat sink 205 are made of aluminum or copper. The copper heat pipe 201 has excellent thermal conductivity, enabling it to quickly transfer heat from the CPU and graphics card 109. The aluminum or copper heat sink 204 and the second heat sink 205 also have excellent heat dissipation properties, helping to quickly dissipate heat into the air and further enhancing the cooling system's heat dissipation capacity. Because the internal space of a microcomputer is more compact, the requirements for heat dissipation are higher. Using copper heat pipes and aluminum or copper heat sinks allows for efficient heat dissipation within a limited space, ensuring that the CPU and graphics card 109 do not experience performance degradation due to overheating when running large software or performing multitasking, thus ensuring both portability and high performance of the computer.

[0041] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0042] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0043] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0044] The present invention provides a detailed description of a micro-host circuit board assembly. Specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A micro-host circuit board assembly, characterized in that, include: The motherboard (100) has at least one first PCI-E interface (101) and at least one second PCI-E interface (102), at least one first memory slot (103) and at least one second memory slot (104) on its first side, as well as corresponding fixing components; The second side of the motherboard (100) is provided with a graphics card slot (108) and a CPU soldered via BGA; The motherboard (100) has multiple I / O interfaces along its edge; The height of the first PCI-E interface (101) is higher than that of the second PCI-E interface (102), so that the board connected to the second PCI-E interface (102) can be located in the space between the board connected to the first PCI-E interface (101) and the motherboard (100); The height of the first memory slot (103) is higher than that of the second memory slot (104), so that the memory module (111) connected to the second memory slot (104) can be located in the space between the memory module (111) connected to the first memory slot (103) and the motherboard (100).

2. The micro-host circuit board assembly according to claim 1, characterized in that, The fixing component includes a long stud (105) adapted to the first PCI-E interface (101) and a short stud (106) adapted to the second PCI-E interface (102). The first memory slot (103) and the second memory slot (104) are provided with memory clips (107) on their sides.

3. The micro-host circuit board assembly according to claim 1, characterized in that, A graphics card (109) is installed in the graphics card slot (108). Independent heat dissipation components are attached to the upper end of the CPU and the upper end of the graphics card (109).

4. The micro-host circuit board assembly according to claim 3, characterized in that, The heat dissipation component includes: a heat pipe (201), a fan, and a first heat dissipation fin (204) with a ventilating gap. The bottom of the heat pipe (201) is attached to the upper end of the CPU and the upper end of the graphics card (109); The heat pipe (201) extends and connects to the first heat dissipation fin (204). The air outlet of the fan is opposite to the ventilation gap of the first heat dissipation fin (204).

5. The micro-host circuit board assembly according to claim 4, characterized in that, The fan includes a single-outlet fan (202) and a dual-outlet fan (203). The single-outlet fan (202) is located at the top of the CPU; the dual-outlet fan (203) is located at the top of the graphics card (109), and one outlet of the dual-outlet fan (203) is adapted to the first heat sink (204), and the other outlet is adapted to the second heat sink (205).

6. The micro-host circuit board assembly according to claim 5, characterized in that, The heat pipe (201) is a copper pipe, and the first heat dissipation fin (204) and the second heat dissipation fin (205) are made of aluminum or copper.

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