A standard emmc package adapter board, chip clamp and debugging tool set

Abstract

The utility model discloses a standard EMMC encapsulation adapter bottom plate, chip clamp and debugging tool suit, the standard EMMC encapsulation adapter bottom plate, including the board body, the board body includes the first side and second side on the thickness direction, the first side is suitable for with EMMC chip adaptation or simulation EMMC chip, the other side is provided with pin interface, by this, through setting debugging main body module, standard EMMC encapsulation adapter bottom plate, and the cooperation FPGA platform adapter soft board, EMMC chip clamp and logic analyzer interface, realized the integration of early chip parameter debugging, simulation and later whole platform verification debugging, utilize the standard EMMC encapsulation interface adaptation of standard EMMC encapsulation adapter bottom plate all EMMC platform's storage device, solved the poor problem of compatibility of existing debugging tool, greatly improved the debugging efficiency, reduced the debugging cost.

Description

Technical Field

[0001] This utility model relates to the field of EMMC testing technology, and in particular to a standard EMMC packaging adapter baseboard, chip fixture and debugging tool kit. Background Technology

[0002] With the continuous development of electronic technology, eMMC, as a commonly used storage device, has been widely applied in various electronic products. During the development and use of eMMC, verification and debugging are required. However, existing eMMC debugging tools are often only applicable to specific eMMC development platforms and cannot achieve compatibility debugging across all eMMC platforms. This leads to the need to frequently change debugging tools when debugging eMMC on different platforms, increasing debugging costs and time, and reducing work efficiency.

[0003] For example, in traditional eMMC development, simulation debugging via an FPGA platform is typically conducted independently. First, simulation debugging is performed on the FPGA platform to establish basic theoretical parameter configurations. Then, the theoretical parameters are programmed onto a sample chip for verification testing. Therefore, in the eMMC chip verification and testing phase, the sample chip needs to be directly soldered onto the corresponding motherboard, and then connected to a dedicated debugging mode via a custom adapter board, primarily using indirect debugging. Furthermore, multiple rounds of adjustments are generally required, resulting in a longer development cycle, higher sample investment, lower process efficiency, and a longer verification period. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a standard EMMC packaging adapter baseboard, chip fixture and debugging tool kit.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] In a first aspect, this application discloses a standard EMMC package adapter baseboard, including a board body. The board body includes a first side and a second side in the thickness direction. The first side is adapted to adapt to or simulate an EMMC chip, and the other side is provided with a pin interface. Solder balls are arranged in an array on the first side. The solder ball layout is an overall 14×14 array arrangement. Some of the solder balls are connected to pins to form corresponding signal definitions, so as to externally connect data signals, command signals, clock signals, power supplies, ground, and synchronization signals through the pins. Some of the solder balls are not connected to pins.

[0007] Furthermore, in the solder ball layout: no solder balls are set in columns 5 to 11 of row 4; no solder balls are set in columns 4 to 11 of row 11; no solder balls are set in columns 5 to 11 of column 5; no solder balls are set in columns 5 to 11 of column 11; and a 4×4 array area at the center is left without solder balls.

[0008] Furthermore, this includes: solder balls connected to the pin for external data signals: solder ball in row 1, column 3, signal defined as DAT0; solder ball in row 1, column 4, signal defined as DAT1; solder ball in row 1, column 5, signal defined as DAT2; solder ball in row 2, column 2, signal defined as DAT3; solder ball in row 2, column 3, signal defined as DAT4; solder ball in row 2, column 4, signal defined as DAT5; solder ball in row 2, column 5, signal defined as DAT6; solder ball in row 2, column 6, signal defined as DAT7; solder ball in row 12, column 5, signal defined as CMD; solder ball in row 12, column 6, signal defined as CLK; solder ball in row 10, column 5, signal defined as RST_n. The solder balls connected to the pin in the 8th row and 5th column are designated as follows: DS (for external synchronization signals); VDDIM (for external power supplies); VccQ (for external power supplies); VccQ (for external power supplies); VccQ (for external power supplies); VccQ (for external power supplies); Vss (for external power supplies); Vss (for external power supplies); Vss (for external power supplies). The following solder balls are also connected to the pin: VDDIM (for external power supplies); VccQ ...

[0009] Secondly, this application discloses a chip fixture, comprising: a fixture body, a logic analyzer adapter soft board, and the aforementioned standard EMMC package adapter base plate, wherein the standard EMMC package adapter base plate is disposed within the fixture; the pin interface is connected to a circuit disposed inside the logic analyzer adapter soft board, and a first circuit interface is disposed at the other end of the logic analyzer adapter soft board.

[0010] Furthermore, the fixture body includes: a housing, wherein a cover plate is connected to one edge of the housing, the cover plate being adapted to open and close relative to the housing; a first cavity is defined inside the housing, the first cavity being provided with the standard EMMC package adapter base plate, the housing having an opening on the side facing the cover plate, and the area where the solder balls are disposed on the first side of the standard EMMC package adapter base plate is exposed at the opening; the housing also includes a first opening through which the logic analyzer adapter cable passes.

[0011] Furthermore, the housing has a recess on the side facing the cover plate, the bottom wall of the recess has the opening, the cover plate has a protrusion on the side facing the housing, the protrusion matches the recess, and after the cover plate is switched to close with the housing, a first gap is left between the protrusion and the bottom wall of the recess.

[0012] Furthermore, a first fastening member is provided on the cover plate at the edge away from the side connected to the housing; a second fastening member is provided on the housing at the edge away from the side connected to the cover plate, and the first fastening member is adapted to fasten with the second fastening member.

[0013] Thirdly, this application discloses a debugging tool kit, including: the standard EMMC package adapter baseboard and the FPGA adapter soft board, wherein one end of the FPGA adapter soft board is engaged with the pin interface on the second side of the standard EMMC package adapter baseboard, and the other side is provided with a second circuit interface.

[0014] The beneficial effects of this invention are as follows: By setting up a debugging main module, a standard EMMC package adapter baseboard, and combining it with an FPGA platform adapter flexible board, EMMC chip fixture, and logic analyzer interface, this invention achieves integrated chip parameter debugging, simulation, and full-platform verification debugging. Utilizing the standard EMMC package interface of the standard EMMC package adapter baseboard, it adapts to storage devices on all EMMC platforms, solving the problem of poor compatibility in existing debugging tools, greatly improving debugging efficiency, and reducing debugging costs. Furthermore, the multiple interfaces of the communication interface unit enable the debugging tool to connect to various external devices, further improving its versatility and applicability. Attached Figure Description

[0015] Figure 1 A top view of a standard EMMC package adapter baseplate according to some embodiments of this application;

[0016] Figure 2 This is a schematic diagram of the structure of a standard EMMC package adapter baseboard according to some embodiments of this application;

[0017] Figure 3 This is an FPGA-to-softboard adapter according to some embodiments of this application;

[0018] Figure 4 This is a schematic diagram of the debugging tooling structure according to some embodiments of this application;

[0019] Figure 5 This is a schematic diagram of a chip fixture structure according to some embodiments of this application;

[0020] Figure 6 This is a schematic diagram of a chip fixture structure according to some embodiments of this application from another angle.

[0021] In the picture:

[0022] 100-standard EMMC packaged adapter baseplate;

[0023] 110 - Plate body, 111 - First side, 11 - Solder ball, 112 - Second side;

[0024] 200 - FPGA platform adapter soft board, 210 - Second circuit interface;

[0025] 300-Chip clamp, 310-Clamp body, 311-Housing, 3111-Recess, 3112-Second fastener, 312-Hinge, 313-Cover plate, 3131-Protrusion, 3132-First fastener, 320-Logic analyzer adapter board, 321-First circuit interface. Detailed Implementation

[0026] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] See Figures 1-6 This utility model provides a technical solution:

[0028] According to an embodiment of this application, a standard EMMC packaged adapter base plate 100 is provided, with reference to... Figures 1-2The system includes a board body 110, which has a first side 111 and a second side 112 in the thickness direction. The first side 111 is adapted to be compatible with or simulate the EMMC chip, and the other side is provided with a pin interface (not shown in the figure). Except for the thickness, the length and width of the board body 110 are completely matched with the existing EMMC chip package size, and the layout of the bottom solder balls 11 and the ball signal definition are also completely consistent with the EMMC chip, thus allowing for in-situ replacement of the EMMC chip on any motherboard that uses it.

[0029] Specifically, solder balls 11 are arrayed on the first side 111 in a 14×14 array. Some of the solder balls 11 are connected to pins to form corresponding signal definitions, allowing external connection of data signals, command signals, clock signals, power supplies, grounding, and synchronization signals. Other solder balls 11 are not connected to pins. By arranging the pins and solder balls 11, and combining them with a standard EMMC package adapter baseboard and an FPGA platform adapter soft board 200, early-stage chip parameter debugging and simulation development can be achieved. Later, by combining the standard EMMC package adapter baseboard 100 with an EMMC chip (not shown in the figure) and a logic analyzer adapter soft board 320, verification and debugging of all EMMC platforms can be achieved, thus solving the problem of poor compatibility of existing debugging tools.

[0030] For example, refer to Figure 2As shown; in the layout of solder balls 11: no solder balls 11 are set in columns 5 to 11 of row 4; no solder balls 11 are set in columns 4 to 11 of row 11; no solder balls 11 are set in rows 5 to 11 of column 5; no solder balls 11 are set in rows 5 to 11 of column 11; a 4×4 array area at the center is left without solder balls 11. Among them, the solder balls 11 connected to the external data signal via the pin are: solder ball 11 in the 1st row and 3rd column, signal defined as DAT0; solder ball 11 in the 1st row and 4th column, signal defined as DAT1; solder ball 11 in the 1st row and 5th column, signal defined as DAT2; solder ball 11 in the 2nd row and 2nd column, signal defined as DAT3; solder ball 11 in the 2nd row and 3rd column, signal defined as DAT4; solder ball 11 in the 2nd row and 4th column, signal defined as DAT5; solder ball 11 in the 2nd row and 5th column, signal defined as DAT6; solder ball 11 in the 2nd row and 6th column, signal defined as DAT7; solder ball 11 in the 12th row and 5th column, signal defined as CMD; solder ball 11 in the 12th row and 6th column, signal defined as CLK; solder ball 11 in the 10th row and 5th column, signal defined as RST_n; and solder ball 11 in the 12th row and 5th column, signal defined as RST_n; and solder ball 11 in the 12th row and 5th column, signal defined as RST_n. The solder ball 11 in row 8, column 5 of the aforementioned pin, which is connected to an external synchronization signal, is defined as DS; the solder ball 11 connected to the external power supply through the aforementioned pin: the solder ball 11 in row 3, column 2, is defined as VDDIM, which is the interface power supply identifier; the solder ball 11 in row 3, column 6, is defined as VccQ, which is ground; the solder balls 11 in row 5, column 6; row 9, column 10; row 10, column 9; row 12, column 4; row 13, column 4; and the solder ball 11 in row 12, column 4; and the solder ball 11 in ...3, column 4; and the solder ball 11 in row 13, column 4; and the solder ball 11 in row 13, column 4; and the solder ball 11 in row 13, column 4; and the solder ball 11 in row 13, Solder balls 11 in row 4, column 3 and row 14, column 5 are defined as Vcc; solder balls 11 grounded through the pins: solder balls 11 in row 1, column 6; row 3, column 4; row 5, column 7; row 7, column 5; row 8, column 10; row 9, column 5; row 10, column 8; row 13, column 2; row 13, column 5; row 14, column 4 and row 14, column 6 are defined as Vss; the remaining solder balls 11 are not connected to pins.

[0031] Compared to traditional eMMC development, FPGA platform simulation and debugging are typically conducted independently. First, simulation and debugging are performed on the FPGA platform to establish basic theoretical parameter configurations. Then, these theoretical parameters are programmed onto a chip sample for verification testing. This usually requires multiple rounds of adjustments, resulting in a longer development cycle and greater sample production.

[0032] In this embodiment, through the connection relationship between the solder balls 11 and the pins, the EMMC adapter baseboard can be mounted on the motherboard requiring debugging. On the top surface of the adapter board, a dedicated FPGA adapter soft busbar is connected to the FPGA debugging platform, allowing the FPGA platform to be gradually debugged and connected to the motherboard via computer control. Simulation experiments can be performed to simulate various parameters. Thus, through the standard packaged EMMC adapter baseboard, the FPGA platform can be directly connected to the verification motherboard, enabling simultaneous real-time simulation and verification. This saves development time and reduces the number of chip samples required, thereby lowering overall development costs. Similarly, during later verification, the chip to be tested can be set on the standard packaged EMMC adapter baseboard and then connected and tested via the logic analyzer adapter soft busbar 320.

[0033] Furthermore, refer to Figure 3 and 4 According to an embodiment of this application, a debugging tool kit includes: the standard EMMC package adapter baseboard 100 and the FPGA adapter soft board described in the foregoing embodiment. One end of the FPGA adapter soft board is engaged with the pin interface of the second side 112 of the standard EMMC package adapter baseboard 100, and the other side is provided with a second circuit interface 210.

[0034] Therefore, during the development and design of EMMC, in the early stages of chip parameter debugging and simulation, one end of the FPGA platform adapter board can be connected to the adapter circuit of the standard EMMC package adapter board, and the other end can be connected to the FPGA platform through the second circuit interface 210. Then, the host computer controls the FPGA platform and the EMMC host respectively, and the power management unit supplies power to the entire debugging tool. The computer controls the FPGA interface unit to send debugging commands to the host, and the host control signal processing unit processes and converts the signals transmitted from the FPGA platform through the FPGA platform adapter board and the standard EMMC package adapter board to realize chip parameter debugging and simulation. At the same time, the host transmits relevant information to the computer for display.

[0035] According to an embodiment of this application, a chip fixture 300 is provided, with reference to... Figures 5-6 The understanding includes: a fixture body 310, a logic analyzer adapter soft board 320, and the standard EMMC package adapter base plate 100 described in the foregoing embodiments, wherein the standard EMMC package adapter base plate 100 is disposed within the fixture; the pin interface is connected to the circuit disposed inside the logic analyzer adapter soft board 320, and the other end of the logic analyzer adapter soft board 320 is provided with a first circuit interface 321.

[0036] In this way, after mounting a standard EMMC adapter baseboard on the motherboard being tested, the EMMC chip to be tested and verified can be directly installed into the chip fixture 300. The motherboard can then initiate the verification test process. During the test, a logic analyzer can be directly connected via the first circuit interface 321 to monitor the test data and the operating status of various signals in real time. If any signal abnormalities or quality defects are detected, parameters can be corrected in real time to achieve optimal performance. Furthermore, the fixture allows for easy replacement of the EMMC chip under test, eliminating the need to solder each chip to the motherboard separately for testing, thus improving testing efficiency and convenience.

[0037] Compared to the conventional eMMC chip verification and testing phase, which requires directly soldering the sample chip onto the corresponding motherboard and then connecting it to a dedicated debugging mode via a custom adapter board, relying primarily on indirect debugging, this process is less efficient and has a longer verification cycle.

[0038] In this embodiment, a standard EMMC adapter baseboard assembly is used, and the standard chip fixture 300 eliminates the need for repeated soldering and removal of sample chips. The kit is directly connected to a logic analysis instrument for real-time monitoring of the operating status. This creates a direct debugging environment, significantly improving debugging and verification efficiency. Furthermore, in conjunction with the previous embodiment, since development, debugging, and verification can all share the standard EMMC package adapter baseboard 100, reverse engineering is supported. If any flaws or anomalies are discovered during testing and verification, the FPGA simulation development kit can be quickly switched for simulation verification, rapidly leading to improvement solutions.

[0039] Therefore, during the later verification and debugging of the general-purpose EMMC platform, the EMMC chip is fixed using the EMMC chip fixture 300 and connected to the standard EMMC package interface of the standard EMMC package adapter board. The logic analyzer interface is connected to the logic analyzer. The debugging main module is connected to the external control device via HSOT, and powered by the power management unit. The external control device sends debugging commands, and the HOST control signal processing unit processes and converts the signals transmitted from the EMMC chip through the adapter circuit. Simultaneously, the logic analyzer analyzes the signals through its interface. The HOST transmits the debugging process information to the computer for display, showing whether the debugged EMMC chip achieves optimal matching with different general-purpose platforms. If not, parameters can be modified on-site for verification. If problems are found during debugging, the HOST feeds back the problem information to the external control device through the communication interface unit for further analysis and handling by the operator. Through these steps, debugging work at different stages of all EMMC platforms is achieved.

[0040] For example, such as Figure 5As shown, the fixture body 310 includes a housing 311. A hinge portion 312 is provided at the edge where the side wall and top wall meet in the illustrated direction of the housing 311. A cover plate 313 is connected via the hinge portion 312, and the cover plate 313 is adapted to open and close relative to the housing 311. Furthermore, the housing 311 is generally a cuboid structure, defining a first cavity within it. This first cavity is a cuboid cavity that precisely accommodates a standard EMMC package adapter base plate 100, allowing the standard EMMC package adapter base plate 100 to be placed within the first cavity. The housing 311 has an opening on the side facing the cover plate 313. The area where the solder balls 11 are located on the first side 111 of the standard EMMC package adapter base plate 100 is exposed at this opening, ensuring that the chip contacts each solder ball 11 when the chip is placed within the fixture. The housing 311 also includes a first opening through which the logic analyzer adapter board 320 extends.

[0041] Furthermore, the housing 311 has a recess 3111 on the side facing the cover plate 313, and the bottom wall of the recess 3111 has the opening. The cover plate 313 has a protrusion 3131 on the side facing the housing 311, and the protrusion 3131 matches the recess 3111. In this way, the protrusion 3131 presses the EMMC chip onto the standard EMMC package adapter base plate 100, ensuring good contact between the two. Furthermore, when the cover plate 313 is switched to be closed with the housing 311, a first gap remains between the protrusion 3131 and the bottom wall of the recess 3111, and this first gap is suitable for matching the thickness of the EMMC chip.

[0042] Continue to refer to Figure 5 A first fastening member 3132 is provided on the cover plate 313 at one edge away from the side connected to the housing 311; in this example, the first fastening member 3132 is an elastic hook. A second fastening member 3112 is provided on the housing 311 at one edge away from the side connected to the cover plate 313; in this example, the second fastening member 3112 is a rod provided on the side wall of the housing 311. The first fastening member 3132 is adapted to fasten with the second fastening member 3112, that is, the hook is adapted to spring back and fasten with the rod after pressing over it.

[0043] As can be seen from the above embodiments, this utility model, by setting up a debugging main module, a standard EMMC package adapter baseboard, and combining it with an FPGA platform adapter flexible board, an EMMC chip fixture 300, and a logic analyzer interface, achieves integrated chip parameter debugging, simulation, and full-platform verification debugging. Utilizing the standard EMMC package interface of the standard EMMC package adapter baseboard, it adapts to storage devices on all EMMC platforms, solving the problem of poor compatibility in existing debugging tools, greatly improving debugging efficiency, and reducing debugging costs. Furthermore, the multiple interfaces of the communication interface unit enable the debugging tool to connect to various external devices, further improving the versatility and applicability of the debugging tool.

[0044] The above description is merely a preferred embodiment of this utility model. It should be understood that this utility model is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related technologies or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of this utility model should be protected within the scope of the appended claims.

Claims

1. A standard eMMC packaged adapter baseboard, characterized in that, The board includes a first side and a second side in the thickness direction. The first side is adapted to be compatible with or simulate the EMMC chip, and the other side is provided with a pin interface. The first side upper array is provided with solder balls, and the solder ball layout is an overall 14×14 array arrangement. Some of the solder balls are connected to pins to form corresponding signal definitions, so as to externally connect data signals, command signals, clock signals, power supply, ground and synchronization signals through the pins; some of the solder balls are not connected to pins.

2. The standard EMMC package adapter baseboard according to claim 1, characterized in that, In the solder ball layout: No solder balls are set in columns 5 through 11 of row 4; No solder balls are set in columns 4 through 11 of row 11; No solder balls are set in rows 5 through 11 of column 5; No solder balls are set in rows 5 to 11 of column 11; A 4×4 array area in the center was left unfilled with solder balls.

3. A standard EMMC package adapter baseboard according to claim 1 or 2, characterized in that, include: The solder balls connected to the external data signals via the pins are as follows: solder ball in row 1, column 3, signal defined as DAT0; solder ball in row 1, column 4, signal defined as DAT1; solder ball in row 1, column 5, signal defined as DAT2; solder ball in row 2, column 2, signal defined as DAT3; solder ball in row 2, column 3, signal defined as DAT4; solder ball in row 2, column 4, signal defined as DAT5; solder ball in row 2, column 5, signal defined as DAT6; solder ball in row 2, column 6, signal defined as DAT7. The signal is defined as CMD, which is connected to the solder ball in the 12th row and 5th column of the external command signal pin. The signal is defined as CLK via the solder ball in the 12th row and 6th column of the external clock signal connected to the pin. The signal is defined as RST_n, which is connected to the solder ball in the 10th row and 5th column of the external reset signal pin. The signal is defined as DS, which is connected to the solder ball in the 8th row and 5th column of the external synchronization signal pin. The solder balls connected to the external power supply via the aforementioned pins are: the solder ball in row 3, column 2, with the signal defined as VDDIM; the solder ball in row 3, column 6, with the signal defined as VccQ; and the solder balls in rows 5, columns 6, 6, 5, 9, 10, 10, 9, 12, 4, 13, 4, 14, 3, and 14, 5, with the signal defined as Vcc. Solder balls grounded via the pins in the following rows: row 1, column 6; row 3, column 4; row 5, column 7; row 7, column 5; row 8, column 10; row 9, column 5; row 10, column 8; row 13, column 2; row 13, column 5; row 14, column 4; and row 14, column 6, are defined as having a signal of Vss. The remaining solder balls are not connected to the pins.

4. A chip fixture, characterized in that, include: Fixture body, logic analyzer adapter board; And the standard EMMC package adapter base plate according to any one of claims 1-3, wherein the standard EMMC package adapter base plate is disposed within the fixture; The pin interface is connected to the circuitry inside the logic analyzer adapter board, and the other end of the logic analyzer adapter board has a first circuit interface.

5. The chip fixture according to claim 4, characterized in that, The clamp body includes: a housing, wherein a cover plate is connected to one edge of the housing, and the cover plate is adapted to open and close relative to the housing; The housing defines a first cavity, in which the standard EMMC package adapter base plate is disposed. The housing has an opening on the side facing the cover plate, and the area on the first side of the standard EMMC package adapter base plate where the solder ball is disposed is exposed at the opening. The housing also includes a first opening through which the logic analyzer adapter cable extends.

6. The chip fixture according to claim 5, characterized in that, The housing has a recess on the side facing the cover plate, and the bottom wall of the recess has an opening. The cover plate has a protrusion on the side facing the housing, which matches the recess. When the cover plate is switched to close with the housing, a first gap is left between the protrusion and the bottom wall of the recess.

7. The chip fixture according to claim 6, characterized in that, A first fastening element is provided on the edge of the cover plate away from the side connected to the housing; A second fastening member is provided on the edge of the housing away from the side connected to the cover plate, and the first fastening member is adapted to fasten with the second fastening member.

8. A debugging tool kit, characterized in that, include: The standard EMMC packaged adapter baseboard described in any one of claims 1-3; And an FPGA adapter soft board, one end of which mates with the pin interface on the second side of the standard EMMC package adapter base plate, and the other side is provided with a second circuit interface.

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