Anti-shake structure, camera module and electronic device
By using a flexible substrate component instead of a stabilization motor in the camera module, and controlling the electrical signal to adjust the degree of deformation, the problems of large size and complex circuitry of the stabilization motor are solved, achieving a larger stabilization angle and a smaller size.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN YI ZHAO TECHNOLOGY CO LTD
- Filing Date
- 2025-06-12
- Publication Date
- 2026-06-09
AI Technical Summary
Existing OIS image stabilization solutions suffer from high complexity in terms of the size and circuit design of the stabilization motor, and have limited stabilization angles. They are particularly ineffective in scenarios with large-angle shaking, which affects the user experience.
By replacing the anti-shake motor with a flexible substrate component, the deformation degree of the flexible substrate component can be adjusted by controlling the magnitude of the electrical signal, thereby achieving a larger anti-shake angle and reducing the volume footprint.
It achieves a larger stabilization angle and a significantly reduced size, minimizing the space occupied inside the device and improving the user experience.
Smart Images

Figure CN224343291U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of camera stabilization technology, and in particular to a stabilization structure, camera module and electronic device. Background Technology
[0002] Current mobile phone camera image stabilization functions use an OIS (Optical Image Stabilization) motor to control the lens and compensate for image shift caused by the user's hand shaking during shooting by driving the lens or the camera's CMOS chip (Complementary Metal-Oxide-Semiconductor).
[0003] However, both of the current mainstream OIS (Optical Image Stabilization) solutions have some obvious drawbacks. The first solution stabilizes the lens itself. As mobile phone lenses become increasingly larger and heavier, the power requirements for the OIS motor also increase, leading to a larger motor size. This makes the design of the stabilization electromagnetic system more complex and increases the magnetic field interference to surrounding components. The second solution stabilizes the CMOS chip. This method involves complex module circuit design, high requirements for circuit board routing, and higher costs. Furthermore, because the stabilization angle applicable to OIS motors is relatively small (e.g., ±1 degree), the stabilization effect is poor in scenarios with larger shaking angles (±4 degrees, ±5 degrees), affecting the user experience. Utility Model Content
[0004] This utility model provides an image stabilization structure, a camera module, and an electronic device, which can solve at least one of the above problems.
[0005] In a first aspect, this utility model provides an anti-shake structure, including: a top circuit board; and a base circuit board, wherein a flexible substrate is disposed between the top circuit board and the base circuit board, the top circuit board, the flexible substrate and the base circuit board are electrically connected, and the flexible substrate can deform to a corresponding degree based on the magnitude of the electrical signal when energized.
[0006] The anti-shake structure of this utility model uses a flexible substrate between the top circuit board and the base circuit board to replace the anti-shake motor. The deformation degree of the flexible substrate is adjusted by controlling the magnitude of the electrical signal received by the flexible substrate, thereby achieving anti-shake control. Compared with the anti-shake motor, the deformation degree of the flexible substrate is adjustable, which can achieve a larger anti-shake angle, while significantly reducing the volume and the space occupied by the device.
[0007] Optionally, the image stabilization structure also includes an image sensor, which is disposed on the side of the top circuit board away from the base circuit board and electrically connected to the top circuit board. When the flexible substrate is deformed, the image sensor is displaced along with the top circuit board.
[0008] Optionally, the flexible substrate also includes multiple flexible control circuits, which are disposed within the flexible substrate and electrically connect the top board to the base board.
[0009] Optionally, multiple flexible control circuits are arranged at intervals within the flexible substrate. When any flexible control circuit is energized, the portion of the flexible substrate adjacent to the energized flexible control circuit undergoes a corresponding degree of deformation according to the magnitude of the electrical signal.
[0010] Optionally, the flexible substrate also includes a hollow cavity located between the top circuit board and the base circuit board, and the flexible control circuit is disposed in the hollow cavity.
[0011] Optionally, an insulating layer is provided between each flexible control circuit and at least a portion of adjacent flexible control circuits.
[0012] Optionally, the flexible substrate is electrically connected to the top circuit board along the edge portion of the top circuit board.
[0013] Optionally, the anti-shake structure also includes a connector electrically connected to the base circuit board, the connector being configured to be electrically connected to an external device.
[0014] Secondly, this utility model provides a camera module, including: a lens and an image stabilization structure according to any of the foregoing embodiments of the first aspect of this utility model, wherein the lens is disposed on the side of the top circuit board away from the base circuit board.
[0015] The camera module of this utility model includes a stabilization structure. The stabilization structure uses a flexible substrate between the image sensor and the base circuit board to replace the stabilization motor. The deformation degree of the flexible substrate is adjusted by controlling the magnitude of the electrical signal received by the flexible substrate, thereby achieving stabilization control of the image sensor. Compared with the stabilization motor, the deformation degree of the flexible substrate is adjustable, which can achieve a larger stabilization angle. Moreover, the volume of the flexible substrate is significantly reduced compared with the stabilization motor, so that the camera module can solve the problem of excessive space occupation due to the large size of the stabilization structure.
[0016] Thirdly, the present invention provides an electronic device, which includes the camera module of the second aspect of the present invention.
[0017] The electronic device of this utility model embodiment includes a camera module. The image stabilization structure in the camera module can adjust the degree of deformation of the flexible substrate by controlling the magnitude of the electrical signal received by the flexible substrate, thereby realizing image stabilization control of the image sensor. Compared with the image stabilization motor, the degree of deformation of the flexible substrate is adjustable, which can achieve a larger image stabilization angle. Moreover, the volume of the flexible substrate is significantly reduced compared with the image stabilization motor, thereby significantly reducing the internal space occupied by the camera module in the electronic device. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of one embodiment of the anti-shake structure of this utility model;
[0020] Figure 2 This is a schematic diagram of the flexible substrate component of the first embodiment of the anti-shake structure of this utility model;
[0021] Figure 3 This is a cross-sectional schematic diagram of the flexible substrate component of the first embodiment of the anti-shake structure of this utility model;
[0022] Figure 4 This is a schematic diagram of the flexible substrate component of the second embodiment of the anti-shake structure of this utility model;
[0023] Figure 5 This is a cross-sectional schematic diagram of the flexible substrate of the second embodiment of the anti-shake structure of this utility model.
[0024] Explanation of icon numbers:
[0025] 110 - Base circuit board; 120 - Top circuit board; 130 - Image sensor; 140 - Connector;
[0026] 200 - Flexible substrate; 210 - Flexible control circuit; 220 - Flexible transmission circuit; A1 - Hollow cavity; B1 - Insulating layer. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0028] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0029] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. If the combination of technical solutions is contradictory or impossible to implement, the user should consider such a combination of technical solutions to be non-existent and not within the scope of protection claimed by this utility model.
[0030] In the embodiments of this utility model, such as Figure 1 As shown, the image stabilization structure includes a top circuit board 120 and a base circuit board 110. A flexible substrate 200 is disposed between the top circuit board 120 and the base circuit board 110. The top circuit board 120, the flexible substrate 200 and the base circuit board 110 are electrically connected. When energized, the flexible substrate 200 can deform to a corresponding degree based on the magnitude of the electrical signal.
[0031] In this embodiment of the invention, the flexible substrate 200 is an insulating dielectric elastomer. When stimulated by an electrical signal transmitted from the base circuit board 110, the flexible substrate 200 compresses, thins, and expands laterally. The greater the current or voltage received by the flexible substrate 200, the greater the deformation. Therefore, by controlling the input of electrical signals to the corresponding parts of the flexible substrate 200 and controlling the intensity of the input electrical signals, precise control can be achieved over the location and degree of deformation of the flexible substrate 200. This allows for precise control over the displacement of the top circuit board 120 located on the flexible substrate 200, thus achieving anti-shake functionality.
[0032] For example, the image stabilization structure also includes an image sensor 130, which is disposed on the side of the top circuit board 120 away from the base circuit board 110 and is electrically connected to the top circuit board 120. When the flexible substrate 200 is deformed, the image sensor 130 is displaced along with the top circuit board 120.
[0033] When the image sensor 130 shakes, the direction and angle of the shaking are detected. Based on the shaking direction and angle, the magnitude of the corresponding electrical signal (i.e., current or voltage) can be calculated and transmitted to the part of the flexible substrate 200 corresponding to the shaking direction. This causes the part of the flexible substrate 200 to deform according to the shaking angle, thereby achieving anti-shake control of the image sensor 130.
[0034] The anti-shake structure in this embodiment achieves anti-shake function by controlling the deformation of the flexible substrate 200. Compared with the OIS motor, it has a larger anti-shake adjustment angle. For example, the maximum range of anti-shake angle that the OIS motor can achieve is generally ±1° or ±1.5°, while the maximum range of anti-shake angle that the anti-shake structure of this application can achieve is ±5°.
[0035] In this embodiment of the utility model, a flexible substrate 200 is provided between the top circuit board 120 and the base circuit board 110 to replace the anti-shake motor. The deformation degree of the flexible substrate 200 is adjusted by controlling the magnitude of the electrical signal received by the flexible substrate 200, thereby realizing anti-shake control. Compared with the anti-shake motor, the deformation degree of the flexible substrate 200 is adjustable, which can achieve a larger anti-shake angle, while significantly reducing the volume and reducing the space occupied by the device.
[0036] Furthermore, the flexible substrate 200 also includes a plurality of flexible control circuits 210, which are disposed within the flexible substrate 200 and electrically connect the top circuit board 120 to the base circuit board 110.
[0037] In this embodiment, the flexible control circuit 210 is embedded in the flexible substrate 200. The flexible control circuit 210 is configured to transmit electrical signals for controlling the deformation of the flexible substrate 200. That is, after the external electrical signal flows to the base circuit board 110, it can flow to the flexible substrate 200 through the flexible control circuit 210, so that the flexible substrate 200 deforms after receiving current stimulation, thereby realizing the anti-shake function.
[0038] If the control circuit uses solid metal materials such as copper wire, when the flexible substrate 200 deforms, the control circuit can easily hinder the deformation of the flexible substrate 200, resulting in poor anti-shake performance. At the same time, solid metal materials such as copper wire are also prone to breakage during repeated deformation.
[0039] Therefore, by using flexible materials to form the flexible control circuit 210, when the flexible substrate 200 deforms, the flexible control circuit 210 can deform together with the flexible substrate 200, thereby ensuring precise control over the degree of deformation of the flexible substrate 200, while ensuring the service life of the flexible control circuit 210 and preventing circuit disconnection.
[0040] In some embodiments, a plurality of flexible control circuits 210 are disposed at intervals within the flexible substrate 200. When any flexible control circuit 210 is energized, the portion of the flexible substrate 200 adjacent to the energized flexible control circuit 210 undergoes a corresponding degree of deformation according to the magnitude of the electrical signal.
[0041] In this embodiment, multiple flexible control circuits 210 are respectively disposed at different positions in the flexible substrate 200, so that each part of the flexible substrate 200 is provided with a corresponding flexible control circuit 210. When any flexible control circuit 210 transmits an electrical signal, the corresponding part of the flexible substrate 200 will generate a deformation corresponding to the magnitude of the electrical signal, thereby realizing the adjustment of the jitter generated in different directions.
[0042] like Figure 2 and Figure 3 As shown, in the first embodiment of this utility model, the flexible substrate 200 further includes a hollow cavity A1 located between the top circuit board 120 and the base circuit board 110, and the flexible control circuit 210 is disposed in the hollow cavity A1.
[0043] In this embodiment, the flexible substrate 200 has a hollowed-out center, forming a hollow cavity A1 within the flexible substrate 200. The flexible control circuit 210 is disposed in the hollow cavity A1, and the flexible substrate 200 around the hollow cavity A1 forms sidewalls. When any flexible control circuit 210 transmits an electrical signal, the corresponding sidewall deforms, thereby achieving the anti-shake function.
[0044] Furthermore, an insulating layer B1 is provided between each flexible control circuit 210 and at least a portion of adjacent flexible control circuits 210.
[0045] In this embodiment, when the flexible substrate 200 has a hollow cavity A1, the insulating layer B1 can be the same insulating dielectric elastomer material as the flexible substrate 200, or it can be other insulating flexible materials; this application does not limit this. For example, the insulating flexible material can be wrapped around the outer peripheral surface of the flexible control circuit 210 to form the insulating layer B1 of the flexible control circuit 210.
[0046] Furthermore, the flexible substrate 200 also includes a plurality of flexible transmission circuits 220, which are disposed within the flexible substrate 200 and electrically connect the top circuit board 120 to the base circuit board 110. The flexible transmission circuits 220 are used to transmit image information generated by the image sensor 130 outward and to supply power to the top circuit board 120 and the image sensor 130.
[0047] Among them, the flexible transmission circuit 220 and the flexible control circuit 210 can be carbon paste, silver nanowire coating or liquid metal material, which can deform together with the flexible substrate 200 while having excellent conductivity.
[0048] In this embodiment, the flexible transmission circuit 220 and the flexible control circuit 210 are disposed together in the hollow cavity A1, and the outer peripheral surface of the flexible transmission circuit 220 is also provided with an insulating layer B1.
[0049] In some embodiments, the flexible substrate 200 is electrically connected to the top circuit board 120 along the edge portion of the top circuit board 120.
[0050] In this embodiment, when the flexible substrate 200 is not deformed, the surface area of the flexible substrate 200 facing the top circuit board 120 is the same as the surface area of the top circuit board 120 facing the flexible substrate 200. In this way, when the flexible substrate 200 deforms, the top circuit board 120 will generate a corresponding displacement, thereby ensuring precise control of the anti-shake angle.
[0051] In some embodiments, the anti-shake structure further includes a connection portion 140 electrically connected to the base circuit board 110, and the connection portion 140 is configured to be electrically connected to an external device.
[0052] In this embodiment, the connecting part 140 is used to connect the base circuit board 110 to an external device, so that the electrical signals and power supply current generated by the external device can be transmitted to the base circuit board 110 through the connecting part 140, and the image information generated by the image sensor 130 can also be transmitted to the external device.
[0053] like Figure 4 and Figure 5As shown, in the second embodiment of this utility model, the flexible substrate 200 is solid, and the flexible control circuit 210 passes through the flexible substrate 200 to electrically connect the top circuit board 120 and the base circuit board 110.
[0054] In this embodiment, the flexible control circuit 210 and the flexible transmission circuit 220 are embedded in a solid flexible substrate 200. An insulating layer B1 is provided between the flexible transmission circuit 220 and the flexible substrate 200. The material of the insulating layer B1 can be different from or the same as that of the flexible substrate 200. When the material of the insulating layer B1 is the same as that of the flexible substrate 200, the flexible substrate 200 can directly serve as the insulating layer B1, forming insulating layers B1 between different flexible control circuits 210 and between flexible transmission circuits 220.
[0055] Furthermore, when the flexible substrate 200 is directly used as the insulating layer B1, the flexible substrate 200 can directly receive the electrical signal transmitted by any flexible control circuit 210, thereby generating corresponding deformation at the corresponding part and realizing the anti-shake function.
[0056] This utility model also proposes a camera module, which includes a lens and an image stabilization structure according to any of the foregoing embodiments.
[0057] The image stabilization structure includes a top circuit board 120 and a base circuit board 110. A flexible substrate 200 is disposed between the top circuit board 120 and the base circuit board 110. The top circuit board 120, the flexible substrate 200, and the base circuit board 110 are electrically connected. The flexible substrate 200 can deform to a corresponding degree based on the magnitude of the electrical signal when energized. The lens is disposed on the side of the top circuit board 120 away from the base circuit board 110. When an image sensor 130 is disposed on the top circuit board 120, the image sensor 130 is positioned below the lens, forming the camera module of this embodiment.
[0058] In this embodiment of the camera module, the image stabilization structure replaces the image stabilization motor by setting a flexible substrate 200 between the image sensor 130 and the base circuit board 110. The deformation degree of the flexible substrate 200 is adjusted by controlling the magnitude of the electrical signal received by the flexible substrate 200, thereby achieving image stabilization control of the image sensor 130. Compared with the image stabilization motor, the deformation degree of the flexible substrate 200 is adjustable, which can achieve a larger stabilization angle. Furthermore, the volume of the flexible substrate 200 is significantly reduced compared with the image stabilization motor, enabling the camera module to solve the problem of excessive space occupation due to the large size of the image stabilization structure.
[0059] This utility model also proposes an electronic device, which includes the camera module described in the foregoing embodiments of this utility model. The electronic device can be a mobile phone, camera, tablet computer, AR (Augmented Reality), or VR (Virtual Reality) device, or other device equipped with a camera module capable of recording images.
[0060] Specifically, when the camera module of this application embodiment is installed in an electronic device, during user shooting, the gyroscope of the electronic device detects shaking. This signal is transmitted to the ISP module (Image Signal Processor). The ISP calculates the stabilization angle that the camera needs to compensate for and the direction of the shaking. It then sends the stabilization angle information and stabilization direction information to the camera's driver IC. The camera's driver IC sends an electrical signal to the flexible substrate 200 (i.e., the voltage / current magnitude calculated based on the stabilization angle and the direction that needs to be stabilized), causing the flexible substrate 200 to deform accordingly at the part corresponding to the stabilization direction to compensate for the amount of shaking of the user's hand, thereby ensuring the stability of the camera's captured image.
[0061] The electronic device of this utility model embodiment includes a camera module. The image stabilization structure in the camera module can adjust the degree of deformation of the flexible substrate 200 by controlling the magnitude of the electrical signal received by the flexible substrate 200, thereby realizing image stabilization control of the image sensor 130. Compared with the image stabilization motor, the degree of deformation of the flexible substrate 200 is adjustable, which can achieve a larger image stabilization angle. Moreover, the volume of the flexible substrate 200 is significantly smaller than that of the image stabilization motor, thereby significantly reducing the internal space occupied by the camera module in the electronic device.
[0062] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A stabilization structure, characterized in that, The image stabilization structure includes: Top-level circuit board; and A base circuit board, with a flexible substrate disposed between the top circuit board and the base circuit board, the top circuit board, the flexible substrate and the base circuit board being electrically connected, the flexible substrate being able to deform to a corresponding degree based on the magnitude of the electrical signal when energized.
2. The anti-shake structure as described in claim 1, characterized in that, The image stabilization structure also includes an image sensor, which is disposed on the side of the top circuit board away from the base circuit board and electrically connected to the top circuit board. When the flexible substrate is deformed, the image sensor is displaced along with the top circuit board.
3. The image stabilization structure as described in claim 1, characterized in that, The flexible substrate also includes multiple flexible control circuits, which are disposed within the flexible substrate and electrically connect the top circuit board to the base circuit board.
4. The anti-shake structure as described in claim 3, characterized in that, Multiple flexible control circuits are arranged at intervals within the flexible substrate. When any of the flexible control circuits is energized, the portion of the flexible substrate adjacent to the energized flexible control circuit undergoes a corresponding degree of deformation according to the magnitude of the electrical signal.
5. The anti-shake structure as described in claim 3 or 4, characterized in that, The flexible substrate also includes a hollow cavity located between the top circuit board and the base circuit board, and the flexible control circuit is disposed in the hollow cavity.
6. The anti-shake structure as described in claim 3 or 4, characterized in that, Each of the flexible control circuits is provided with an insulating layer between itself and at least a portion of the adjacent flexible control circuits.
7. The anti-shake structure as described in claim 2, characterized in that, The flexible substrate is electrically connected to the top circuit board along the edge portion of the top circuit board.
8. The image stabilization structure as described in claim 1, characterized in that, The anti-shake structure also includes a connecting part that is electrically connected to the base circuit board and is configured to be electrically connected to an external device.
9. A camera module, characterized in that, include: Lens; as well as In the image stabilization structure as described in any one of claims 1 to 8, the lens is disposed on the side of the top circuit board away from the base circuit board.
10. An electronic device, characterized in that, Includes the camera module as described in claim 9.