Ion source driving board structure of gas leak detector

Abstract

This utility model discloses a structure for an ion source drive board of a gas leak detector, relating to the field of gas leak detection technology. It solves the problems of excessive size and difficult maintenance associated with existing single-layer circuit board designs for ion source drive boards in gas leak detectors. The solution mainly includes: a stacked upper circuit board and a lower circuit board, connected by an inter-board connector for electrical and signal connections; large components are mounted on the upper circuit board; and control components are mounted on the lower circuit board. The stacked design using the inter-board connector improves space utilization, effectively reduces the size requirements of the ion source drive board, and facilitates maintenance and replacement.

Description

Technical Field

[0001] This utility model relates to the field of gas leak detection technology, specifically to an ion source drive board structure for a gas leak detector. Background Technology

[0002] The ion source drive board of the gas leak detector is designed to provide a stable heating current to ensure the filament works properly and to provide the necessary high voltage to the anode, cathode, and inhibitor, thus ensuring the stable operation of the ion source.

[0003] Existing gas leak detectors use a single-layer circuit board design for their ion source drive boards, integrating large components such as transformers onto a single board. This results in an excessively large board size, hindering the miniaturization design of the gas leak detector. Furthermore, the single-layer circuit board design means that damage to one part requires repairing the entire board, increasing the complexity of maintenance.

[0004] Therefore, this application provides a structure for an ion source drive board for a gas leak detector to solve the above problems. Utility Model Content

[0005] The technical problem to be solved by this utility model is that the existing gas leak detector ion source drive board adopts a single-layer circuit board design, which has the problems of excessive size and difficult maintenance. The purpose is to provide a gas leak detector ion source drive board structure that uses inter-board connectors for stacking design, improves space utilization, effectively reduces the size requirement of the ion source drive board, and the stacking design is also conducive to maintenance and replacement.

[0006] This utility model is achieved through the following technical solution:

[0007] A gas leak detector ion source drive board structure includes: an upper circuit board and a lower circuit board with a stacked design, the upper circuit board and the lower circuit board are connected by an inter-board connector to realize electrical connection and signal connection; large components are arranged on the upper circuit board; and control components are arranged on the lower circuit board.

[0008] In one optional embodiment, the lower circuit board is provided with: an ion source anode and cathode interface, an inhibitor interface, a motherboard power supply interface, a control signal interface, an inter-board connector, a molecular pump interface, and a main power supply interface.

[0009] In one alternative embodiment, the upper circuit board is provided with: an inter-board connector, a high-voltage module, and a transformer.

[0010] In one alternative embodiment, two inter-board connectors are provided on both the upper and lower circuit boards.

[0011] In one alternative embodiment, the two inter-board connectors are arranged symmetrically.

[0012] In one optional embodiment, the ion source drive board structure of the gas leak detector further includes: a metal shell, an upper circuit board and a lower circuit board with a stacked design fixed inside the metal shell, and a heat dissipation structure provided outside the metal shell.

[0013] In one alternative embodiment, the metal casing is made of aluminum alloy.

[0014] In one alternative embodiment, the heat dissipation structure employs a heat sink.

[0015] In one optional embodiment, the upper circuit board and the lower circuit board are provided with window structures on their edges, so that the ground plane of the upper and lower circuit boards is connected to the metal casing. The window structures are used to conduct heat from the upper and lower circuit boards to the metal casing for heat dissipation.

[0016] In one alternative embodiment, a semiconductor cooler or a miniature cooling fan is disposed on the upper circuit board and / or the lower circuit board.

[0017] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0018] This application employs a two-layer stacked design, with inter-board connectors enabling electrical connections between the upper and lower circuit boards for signal transmission and power supply. The upper circuit board houses large components such as transformers, while the lower circuit board houses control devices. By placing large components and control devices on different circuit boards, functional partitioning is achieved, reducing mutual interference and improving circuit stability. The inter-board connector design ensures stable signal and power transmission, and both the upper and lower circuit boards can be replaced independently, facilitating quick component replacement during maintenance and reducing maintenance costs. The two-layer stacked design also improves space utilization, effectively reducing the size requirements of the circuit boards. The overall size is optimized from 97*270mm to 80*120mm, which is beneficial for miniaturizing the driver board design. It can be widely used in industrial testing for product leak detection on production lines, in scientific research for high-precision gas leak detection in laboratories, in medical equipment for micro-gas leak detection, and in environmental monitoring for gas leak detection. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0020] Figure 1 This is a structural diagram of the upper circuit board provided in an embodiment of this application;

[0021] Figure 2 This is a structural diagram of the lower-layer circuit board provided in an embodiment of this application. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the embodiments and accompanying drawings in an optional embodiment. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model.

[0023] Please see Figure 1 and Figure 2 As shown, Figure 1 This is a structural diagram of the upper circuit board provided in an embodiment of this application. Figure 2 This is a structural diagram of the lower circuit board provided in an embodiment of this application. The ion source drive board structure of the gas leak detector includes: an upper circuit board and a lower circuit board with a stacked design, the upper circuit board and the lower circuit board are connected by an inter-board connector to realize electrical connection and signal connection; large components are disposed on the upper circuit board; and control components are disposed on the lower circuit board.

[0024] Compared with existing technologies, the stacked board design of this application enables miniaturization of the ion source drive board, improves space utilization and portability, and reduces maintenance costs and improves maintenance convenience while ensuring the stability and reliability of the circuit.

[0025] In one optional embodiment, the lower circuit board is provided with: an ion source anode and cathode interface 1, an inhibitor interface 2, a motherboard power supply interface 3, a control signal interface 4, an inter-board connector 5, a molecular pump interface 6, and a main power supply interface 7.

[0026] In one alternative embodiment, the upper circuit board is provided with: an inter-board connector 5, a high-voltage module 8, and a transformer 9.

[0027] In one alternative embodiment, two inter-board connectors are provided on both the upper and lower circuit boards.

[0028] Furthermore, the two inter-board connectors are symmetrically arranged. For example... Figures 1-2 It features a symmetrical design, connecting the upper and lower circuit boards via two symmetrically designed inter-board connectors on the lower circuit board and two symmetrically designed inter-board connectors on the upper circuit board.

[0029] It should be noted that the two inter-board connectors can also be configured to be symmetrical vertically or diagonally, depending on the actual situation.

[0030] In one optional embodiment, the ion source drive board structure of the gas leak detector further includes: a metal shell, an upper circuit board and a lower circuit board with a stacked design fixed inside the metal shell, and a heat dissipation structure provided outside the metal shell.

[0031] Furthermore, the metal casing is made of aluminum alloy.

[0032] Furthermore, the heat dissipation structure employs a heat sink.

[0033] Specifically, a metal casing with high thermal conductivity (such as aluminum alloy) is used, and heat dissipation efficiency is improved through heat dissipation structures (such as heat sinks). The aluminum alloy casing has excellent thermal conductivity, enabling it to quickly conduct heat generated by the circuit board to the casing surface. The external heat sinks further accelerate heat dissipation by increasing the heat dissipation area, effectively reducing the operating temperature of the circuit board and ensuring the stability and reliability of the equipment under high load. Simultaneously, the aluminum alloy casing also possesses good electromagnetic shielding properties, effectively blocking external electromagnetic interference, ensuring the normal operation of internal circuits, and reducing false alarms or missed alarms. Furthermore, the high strength and corrosion resistance of the aluminum alloy casing provide physical protection for the internal circuit board, making it adaptable to various working environments.

[0034] In one optional embodiment, the upper circuit board and the lower circuit board are provided with window structures on their edges, so that the ground plane of the upper and lower circuit boards is connected to the metal casing. The window structures are used to conduct heat from the upper and lower circuit boards to the metal casing for heat dissipation.

[0035] Specifically, a window structure is an opening or hole made in the insulating layer of a circuit board to expose the ground plane (usually a large area of ​​copper cladding). The window structure in this application is located at the edge of the circuit board in contact with the metal casing to ensure that heat can be quickly conducted to the metal casing and dissipated through the large surface area of ​​the metal casing.

[0036] In one alternative embodiment, a semiconductor cooler or a miniature cooling fan is disposed on the upper and / or lower circuit boards.

[0037] Specifically, in a confined environment, the combined action of a thermoelectric cooler / micro-fan and a metal heat sink effectively reduces the circuit board temperature, extends equipment lifespan, and improves system stability. The micro-fan works in conjunction with the internal airflow channels of the metal casing to rapidly dissipate heat. The thermoelectric cooler absorbs and releases heat through a phase change process, achieving efficient heat transfer. This allows for efficient heat management in confined environments while simultaneously meeting dustproof and reliability requirements.

[0038] Understandably, this application employs a two-layer stacked design, using inter-board connectors to achieve electrical connections between the upper and lower circuit boards, enabling signal transmission and power supply. The upper circuit board houses large components such as transformers, while the lower circuit board houses control devices. By placing large components and control devices on different circuit boards, functional partitioning is achieved, reducing mutual interference and improving circuit stability. The inter-board connector design ensures stable signal and power transmission, and the upper and lower circuit boards can be replaced independently, facilitating quick component replacement during maintenance and reducing maintenance costs. The two-layer stacked design improves space utilization and effectively reduces the size requirements of the circuit boards, optimizing the overall size from 97*270mm to 80*120mm, which is beneficial for miniaturizing the driver board design. It can be widely used in industrial testing for product leak detection on production lines, in scientific research for high-precision gas leak detection in laboratories, in medical equipment for micro-gas leak detection, and in environmental monitoring for gas leak detection.

[0039] Furthermore, this application can also optimize device layout and heat output. Specifically, with the optimization objectives of minimizing heat output and minimizing device size, simulation and experimental verification are performed using the multiphysics simulation tool (FloTHERM) to optimize device layout and heat dissipation path design, calculate the optimal device layout, and reduce thermal resistance during heat transfer.

[0040] In addition, vias and thermal conductive materials can be arranged reasonably on the circuit board to conduct heat to the metal casing more quickly.

[0041] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A structure for an ion source driving board of a gas leak detector, characterized in that, include: The upper and lower circuit boards are stacked together and connected by an inter-board connector to achieve electrical and signal connections. Large components are mounted on the upper circuit board; The lower circuit board is equipped with control devices.

2. The ion source driving board structure for a gas leak detector according to claim 1, characterized in that, The lower circuit board is equipped with: ion source anode and cathode interface (1), inhibitor interface (2), motherboard power supply interface (3), control signal interface (4), board connector (5), molecular pump interface (6), and main power supply interface (7).

3. The ion source driving board structure for a gas leak detector according to claim 1, characterized in that, The upper circuit board is equipped with: an inter-board connector (5), a high-voltage module (8), and a transformer (9).

4. The ion source driving board structure for a gas leak detector according to claim 1, characterized in that, Two inter-board connectors are provided on both the upper and lower circuit boards.

5. The ion source driving board structure for a gas leak detector according to claim 4, characterized in that, The two inter-board connectors are arranged symmetrically.

6. The ion source driving board structure for a gas leak detector according to claim 1, characterized in that, The structure of the ion source drive board of the gas leak detector also includes: a metal shell, an upper circuit board and a lower circuit board with a stacked design inside the metal shell, and a heat dissipation structure outside the metal shell.

7. The ion source driving board structure for a gas leak detector according to claim 6, characterized in that, The metal casing is made of aluminum alloy.

8. The structure of the ion source driving board for a gas leak detector according to claim 6, characterized in that, The heat dissipation structure uses heat sinks.

9. The ion source driving board structure for a gas leak detector according to claim 6, characterized in that, The upper and lower circuit boards are provided with window structures on their edges, so that the ground plane of the upper and lower circuit boards is connected to the metal casing. The window structures are used to conduct heat from the upper and lower circuit boards to the metal casing for heat dissipation.

10. The structure of the ion source driving board for a gas leak detector according to claim 6, characterized in that, A semiconductor cooler or a miniature cooling fan is provided on the upper circuit board and / or the lower circuit board.

Images