PCB SMT anti-tinning steel screen
By designing a detachable and installable PCB board SMT anti-soldering stencil, the problems of solder sticking and high production costs during stencil soldering are solved, achieving efficient soldering and low-cost production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU WUTONG INTELLIGENT ELECTRONICS CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-06-09
AI Technical Summary
Solder adhesion is prone to occur during the PCB board soldering process using stencils, which affects the overall yield. Furthermore, different components require different stencil apertures, increasing production costs.
Design a PCB board SMT anti-soldering stencil, which can be detachably installed on the frame by a pin. The frame is positioned on the PCB board by suction cups or positioning pins around its perimeter. The stencil is suspended in the mounting groove of the frame. A circular limiting groove and a rotating connecting plate are set inside the frame to allow adjustment of the soldering positioning holes to accommodate different components.
It effectively avoids tinning of the stencil, reduces production costs, improves welding accuracy and efficiency, and lowers production costs.
Smart Images

Figure CN224343483U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of anti-soldering stencils, and particularly relates to an anti-soldering stencil for PCB board SMT. Background Technology
[0002] In PCB soldering, the stencil is a crucial tool in surface mount technology (SMT) for precisely applying solder paste to the PCB pads. Stencil fabrication is typically based on the solder paste layer in the PCB design file, with its openings corresponding one-to-one with the pads. The stencil's material, thickness, opening design, and manufacturing process directly affect the quality and efficiency of the soldering.
[0003] The main function of the stencil is to precisely print solder paste onto the PCB pads, ensuring that each pad is evenly coated with solder paste. This provides the accurate amount of solder paste for subsequent component placement and reflow soldering, thereby guaranteeing the reliability and quality of the soldering process.
[0004] However, during the current PCB board soldering process using stencils, the solder paste remaining in the gaps of the stencil steps can contaminate the PCB board, affecting the overall yield. Furthermore, the required soldering holes in the stencil vary depending on the component being soldered, necessitating the replacement of the stencil with a new one, which significantly increases production costs. Utility Model Content
[0005] The purpose of this utility model is to solve the problem of solder sticking that easily occurs during the soldering process of PCB boards using stencils. This problem has a high defect rate, which affects the overall yield. Furthermore, the soldering holes of the stencil required for different components vary, requiring the replacement of the stencil with a new one, which greatly increases production costs. Therefore, this utility model proposes a PCB board SMT anti-solder sticking stencil.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: a PCB board SMT anti-soldering stencil, comprising a frame on which a stencil is disposed, positioning holes or suction cups are provided around the frame, and a plurality of welding positioning holes are provided on the stencil, and the stencil is suspended and mounted on the frame.
[0007] As a further description of the above technical solution:
[0008] The frame is provided with an installation groove, and the installation groove is provided with a fixing hole. The steel mesh is installed in the fixing hole by means of a pin.
[0009] As a further description of the above technical solution:
[0010] The steel mesh can also be configured in a circular shape, with several welding areas on it, and each of the welding areas has several welding positioning holes of different shapes.
[0011] As a further description of the above technical solution:
[0012] A circular limiting groove is provided inside the frame, and a rotating connecting plate is provided around the steel mesh. The rotating connecting plate is rotatably connected to the circular limiting groove.
[0013] As a further description of the above technical solution:
[0014] A rotating handle is provided at the center of the steel mesh.
[0015] As a further description of the above technical solution:
[0016] A baffle may also be provided between several of the welding positioning holes.
[0017] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:
[0018] 1. In this utility model, the steel mesh is detachably installed on the frame by means of a pin. The frame is positioned around the perimeter by suction cups or positioning pins passing through the positioning holes on the PCB board. The steel mesh is installed in the mounting groove of the frame and is designed to be suspended. There is a certain gap between it and the PCB board, but the distance is not large. This makes the inside of the welding positioning hole form an airflow channel, ensuring that the solder material drips naturally onto the components during the soldering process, avoiding the steel mesh from being stuck with solder and affecting the next soldering.
[0019] 2. In this utility model, by setting a circular limiting groove in the frame, and the circular limiting groove cooperating with the rotating connecting plate on the periphery of the steel mesh, when different components need to be welded, it is only necessary to rotate the handle to adjust the welding positioning hole of the corresponding welding area to be directly above the welding device, without the need to replace the steel mesh, thus reducing production costs. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 A three-dimensional embodiment of a PCB SMT anti-soldering stencil Figure 1 .
[0022] Figure 2 A three-dimensional embodiment of a PCB SMT anti-soldering stencil Figure 2 .
[0023] Figure 3 This is a cross-sectional view of an embodiment of a PCB SMT anti-soldering stencil.
[0024] Figure 4 An analysis of a second embodiment of a PCB SMT anti-soldering stencil. Figure 1 .
[0025] Figure 5 An analysis of a second embodiment of a PCB SMT anti-soldering stencil. Figure 2 .
[0026] Legend:
[0027] 1-Frame; 2-Steel mesh; 3-Positioning hole; 4-Welding positioning hole; 5-Mounting groove; 6-Pin; 7-Welding area; 8-Circular limit groove; 9-Rotating connecting plate; 10-Rotating handle. Detailed Implementation
[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0032] In the description of the embodiments of this utility model, it should be noted that the terms "upper" and "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0033] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0034] Example 1
[0035] Please see Figure 1-3 This utility model provides a technical solution: a PCB board SMT anti-soldering stencil, including a frame 1, on which a stencil 2 is provided. The frame 1 is provided with positioning holes 3 or suction cups around its perimeter. The stencil 2 is provided with a plurality of welding positioning holes 4. The stencil 2 is suspended and installed on the frame 1.
[0036] The frame 1 is provided with an installation groove 5, and the installation groove 5 is provided with a fixing hole. The steel mesh 2 is installed in the fixing hole by a pin 6.
[0037] Example 2
[0038] Please see Figure 4-5 The steel mesh 2 can also be configured as a circle, with a number of welding areas 7 on it, and each of the welding areas 7 is provided with a number of welding positioning holes 4 of different shapes.
[0039] A circular limiting groove 8 is provided inside the frame 1, and a rotating connecting plate 9 is provided on the periphery of the steel mesh 2. The rotating connecting plate 9 is rotatably connected to the circular limiting groove 8.
[0040] A rotating handle 10 is provided at the center of the steel mesh 2. Rotating the steel mesh adjusts the shape of the welding holes above the component, improving welding accuracy.
[0041] A baffle plate may also be provided between several of the welding positioning holes 4 to prevent solder from flowing onto other components during the soldering process.
[0042] Working principle: The stencil is detachably installed on the frame using pins. The frame is positioned by suction cups or positioning pins passing through positioning holes on the PCB board. The stencil is installed in the mounting groove of the frame and is suspended in the air with a certain gap from the PCB board. However, the distance is not large, so that the inside of the solder positioning hole forms an airflow channel. This ensures that during the soldering process, the solder material drips naturally onto the components, preventing the stencil from sticking to the solder and affecting the next soldering.
[0043] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A PCB SMT anti-soldering stencil, characterized in that, The device includes a frame on which a steel mesh is mounted. The frame has positioning holes or suction cups around its perimeter, and the steel mesh has several welding positioning holes. The steel mesh is suspended and mounted on the frame.
2. The PCB SMT anti-soldering stencil according to claim 1, characterized in that, The frame is provided with an installation groove, and the installation groove is provided with a fixing hole. The steel mesh is installed in the fixing hole by means of a pin.
3. The PCB SMT anti-soldering stencil according to claim 1, characterized in that, The steel mesh can also be configured in a circular shape, with several welding areas on it, and each of the welding areas has several welding positioning holes of different shapes.
4. The PCB SMT anti-soldering stencil according to claim 3, characterized in that, A circular limiting groove is provided inside the frame, and a rotating connecting plate is provided around the steel mesh. The rotating connecting plate is rotatably connected to the circular limiting groove.
5. The PCB SMT anti-soldering stencil according to claim 4, characterized in that, A rotating handle is provided at the center of the steel mesh.
6. The PCB SMT anti-soldering stencil according to claim 1, characterized in that, A baffle may also be provided between several of the welding positioning holes.