Onboard charger, powertrain, and electric vehicle

Abstract

The application discloses a vehicle-mounted charger, a power assembly and an electric vehicle, relates to the technical field of electric vehicles, and is used for charging and discharging a power battery of an electric vehicle, and comprises a circuit board and a heat dissipation plate. The circuit board is used for bearing a power module and a first magnetic device of the vehicle-mounted charger. The height of the power module is less than the height of the first magnetic device along the thickness direction of the circuit board. The power module and the first magnetic device are located on the same side of the thickness direction of the circuit board. The circuit board, the power module and the heat dissipation plate are sequentially stacked along the thickness direction of the circuit board. The first magnetic device and the heat dissipation plate are arranged along the direction perpendicular to the thickness of the circuit board. By changing the layout among the circuit board, the power module, the first magnetic device and the heat dissipation plate in the vehicle-mounted charger, the utilization rate of the heat dissipation area of the heat dissipation plate can be improved, the heat dissipation efficiency of the heat dissipation plate is improved, and the power density of the vehicle-mounted charger is improved.

Description

Technical Field

[0001] This application relates to the field of electric vehicle technology, and in particular to an on-board charger, powertrain, and electric vehicle. Background Technology

[0002] On-board chargers are an important component of the vehicle's electrical system. As electric vehicles place increasingly higher demands on the power density of on-board chargers, the requirements for heat dissipation performance within the chargers are also increasing.

[0003] Current heat dissipation solutions for vehicle chargers include three-dimensional water channels, with power modules distributed and attached to the sides of the three-dimensional water channels for heat dissipation. This heat dissipation layout requires the three-dimensional water channels to occupy a large amount of space inside the vehicle charger housing, resulting in a large vehicle charger volume, low power density, and limited utilization of the heat dissipation area of ​​the three-dimensional water channels, which is not conducive to the full heat dissipation of the vehicle charger. Utility Model Content

[0004] This application provides an on-board charger, a powertrain, and an electric vehicle. By changing the layout of the circuit board, power module, first magnetic device, and heat sink in the on-board charger, the utilization rate of the heat dissipation area of ​​the heat sink can be improved, the heat dissipation efficiency of the heat sink can be improved, and the power density of the on-board charger can be increased.

[0005] In a first aspect, this application provides a multi-directional heat dissipation vehicle charger for charging and discharging the power battery of an electric vehicle, comprising a circuit board and a heat sink. The circuit board is used to carry the power module and a first magnetic device of the vehicle charger. The height of the power module along the thickness direction of the circuit board is less than the height of the first magnetic device, wherein:

[0006] The power module and the first magnetic device are located on the same side of the thickness direction of the circuit board. The circuit board, the power module and the heat sink are stacked sequentially along the thickness direction of the circuit board. The first magnetic device and the heat sink are arranged in a direction perpendicular to the thickness of the circuit board.

[0007] This application provides a multi-directional heat dissipation vehicle charger. The vehicle charger includes a heat sink, with a power module located between the heat sink and a circuit board. The heat sink dissipates heat from the power module. A first magnetic component is located on the side of the heat sink, which also dissipates heat from the first magnetic component. The power module generates more heat than the first magnetic component. The surface of the heat sink facing the circuit board has a larger heat dissipation area than the side of the heat sink. Utilizing the larger surface area to dissipate heat from the power module improves the heat dissipation effect. Utilizing the smaller side surface to dissipate heat from the first magnetic component satisfies its heat dissipation requirements while avoiding waste of the heat sink's heat dissipation resources. The heat sink is arranged according to the heat generation and dissipation requirements of the power module and the first magnetic component, optimizing the allocation of heat dissipation resources and fully utilizing the heat sink's resources to improve its heat dissipation efficiency. At the same power level, the vehicle charger provided by this application is smaller, has higher heat dissipation efficiency, and better heat dissipation effect. Within the same volume, the vehicle charger provided by this application can accommodate more power modules, increasing the power density of the vehicle charger.

[0008] In one embodiment, the number of the first magnetic devices is at least two, and along the arrangement direction of the two first magnetic devices, the length of the heat sink is less than or equal to the distance between the two first magnetic devices, and the heat sink is located between the two first magnetic devices.

[0009] In this embodiment, the length of the heat sink along the arrangement direction of the two first magnetic components is less than or equal to the distance between the two first magnetic components. This ensures that when the heat sink is located between the two first magnetic components, there is no interference between the heat sink and the first magnetic components on either side of the heat sink along the arrangement direction. Simultaneously, the two first magnetic components are located on opposite sides of the heat sink along the arrangement direction, allowing the heat sink to dissipate heat from both sides of the heat sink along the arrangement direction. This improves the utilization rate of the heat dissipation area of ​​the heat sink and increases its heat dissipation efficiency.

[0010] In one embodiment, along the direction of the heat sink toward either of the two first magnetic devices, the distance between the heat sink and the first magnetic device is less than or equal to the distance between the power module and the first magnetic device.

[0011] In this embodiment, along the direction of the heat sink towards either of the two first magnetic devices, the distance between the heat sink and the first magnetic device is less than or equal to the distance between the power module and the first magnetic device. As a result, the length of the heat sink is greater than or equal to the length of the power module along the direction of the heat sink towards the first magnetic device, and the heat sink can cover the power module along the direction of the heat sink towards the first magnetic device, ensuring that the power module can receive heat dissipation from the heat sink and improving the heat dissipation effect of the heat sink on the power module.

[0012] In one embodiment, the first magnetic device includes a magnetic component for a DC filter and a magnetic component for an AC filter. The DC filter is used to receive and filter DC power, and the AC filter is used to receive and filter AC power, thereby suppressing electromagnetic interference, ensuring stable output of electrical signals, and ensuring that the on-board charger can charge and discharge the power battery.

[0013] In one embodiment, the length of the power module is less than or equal to the length of the heat sink along a direction perpendicular to the arrangement of the power module and the first magnetic device.

[0014] In this embodiment, the power module and the heat sink are stacked along the thickness direction of the circuit board. The length of the power module is less than or equal to the length of the heat sink in the direction perpendicular to the arrangement of the power module and the first magnetic device. The heat sink can cover the power module installed on the circuit board in the direction perpendicular to the arrangement of the power module and the first magnetic device, ensuring that the power module can be cooled by the heat sink and improving the heat dissipation effect of the heat sink on the power module.

[0015] In one embodiment, the vehicle charger includes a thermally conductive layer, and the power module, the thermally conductive layer, and the heat sink are arranged sequentially along the thickness direction of the circuit board.

[0016] In this embodiment, the heat from the power module is transferred to the heat sink through a thermally conductive layer. The thermally conductive layer has high thermal conductivity, which can improve the heat transfer efficiency between the power module and the heat sink and enhance the heat dissipation effect of the heat sink on the power module.

[0017] In one embodiment, the vehicle charger includes a second magnetic device, and the power module, the heat sink, and the second magnetic device are arranged sequentially along the thickness direction of the circuit board.

[0018] In this embodiment, the heat sink provides heat dissipation for the first magnetic device on the side along the arrangement direction of the power module and the first magnetic device, and provides heat dissipation for the power module and the second magnetic device on the surface along the thickness direction of the circuit board. Both the surface along the arrangement direction of the power module and the first magnetic device and the surface along the thickness direction of the circuit board can be utilized. The arrangement of the heat sink, the power module, the first magnetic device and the second magnetic device can make full use of the heat dissipation area of ​​the heat sink, reduce the waste of heat dissipation resources of the heat sink, and thus improve the heat dissipation efficiency of the heat sink.

[0019] In one embodiment, the projections of the first magnetic device and the second magnetic device along a direction perpendicular to the thickness of the circuit board at least partially overlap.

[0020] In this embodiment, the second magnetic device and the first magnetic device are arranged along a direction perpendicular to the thickness of the circuit board. When arranging the second magnetic device, it is positioned on the side of the first magnetic device along the direction perpendicular to the thickness of the circuit board, based on the height of the first magnetic device. The space occupied by the first magnetic device in the circuit board thickness direction is utilized for arranging the second magnetic device. The projections of the first and second magnetic devices along the direction perpendicular to the thickness of the circuit board at least partially overlap, ensuring that the space occupied by the second magnetic device in the circuit board thickness direction at least partially overlaps with the space occupied by the first magnetic device. This avoids wasted space due to height differences between the first and second magnetic devices during arrangement and helps reduce the height of the vehicle charger in the circuit board thickness direction.

[0021] In one embodiment, the heat sink includes a channel, the inner wall of the channel including an opening, the opening being located on the side of the channel away from the circuit board along the thickness direction of the circuit board, and on the side of the second magnetic device along the direction perpendicular to the power module and the arrangement of the second magnetic device, for penetrating the inner wall of the channel along the thickness direction of the circuit board and for the flow of coolant.

[0022] In this embodiment, an opening is located on the side of a channel away from the circuit board along its thickness direction, thus avoiding installation interference with the power module and the first magnetic device. Coolant enters the channel through the opening, allowing heat from the power module to be transferred through the surface of the heat sink to the coolant within the channel. The coolant then carries away the heat from the power module, thus dissipating heat.

[0023] The second magnetic device is located on the side of the heat sink away from the circuit board along the thickness direction of the circuit board. An opening is located on the side of the second magnetic device along the direction perpendicular to the arrangement of the power module and the first magnetic device. The second magnetic device will not interfere with the opening.

[0024] In one embodiment, the vehicle charger includes another thermally conductive layer, and the heat sink, the other thermally conductive layer, and the second magnetic device are arranged sequentially along the thickness direction of the circuit board.

[0025] In this embodiment, the heat of the second magnetic device is transferred to the heat sink through another thermally conductive layer. This other thermally conductive layer has high thermal conductivity, which can improve the thermal conduction efficiency between the second magnetic device and the heat sink, thereby enhancing the heat dissipation effect of the heat sink.

[0026] In one embodiment, along the arrangement direction of the power module and the first magnetic device, the first magnetic device and the heat sink are arranged at intervals, and the second magnetic device includes an electrical connector for passing through the gap between the first magnetic device and the heat sink and for electrically connecting the circuit board.

[0027] In this embodiment, the second magnetic device is located on the side of the heat sink away from the circuit board. Along the thickness direction of the circuit board, the second magnetic device and the circuit board are spaced apart by the heat sink. The gap between the first magnetic device and the heat sink facilitates the electrical connection between the second magnetic device and the circuit board, avoiding interference from the heat sink located between the circuit board and the second magnetic device. This facilitates the circuit board to connect to the second magnetic device through electrical connectors and supply power to the second magnetic device, ensuring that the second magnetic device can work normally.

[0028] In one embodiment, the housing of the vehicle charger includes a receiving groove for accommodating the heat sink. The bottom wall of the receiving groove includes another channel, and the inner wall of the other channel includes another opening. The other opening is located on the side of the other channel facing the heat sink along the thickness direction of the circuit board. The other opening is used to penetrate the inner wall of the other channel along the thickness direction of the circuit board and to communicate with the first opening.

[0029] In this embodiment, the coolant enters another channel through another opening. The heat from the components inside the vehicle charger can be transferred through the bottom wall of one receiving tank to the coolant in the other channel. The coolant carries away the heat, thus dissipating heat from the components inside the vehicle charger.

[0030] Another channel and an opening can be connected through the other opening. The opening and the other opening are positioned along the thickness direction of the circuit board. Coolant in one channel flows out of one opening and then flows towards the other opening along the direction of gravity, which helps reduce power loss. It also shortens the distance between the two openings, saving the coolant flow path.

[0031] A channel, an opening, another opening, and another channel are connected in sequence, allowing the coolant to flow sequentially along one channel, one opening, another opening, and another channel, or sequentially along another channel, another opening, one opening, and one channel. The coolant can circulate within the channels, effectively dissipating heat from components located in different positions within the onboard charger.

[0032] In one embodiment, the bottom wall of the receiving slot includes another receiving slot, the other channel and the other receiving slot are arranged sequentially along the arrangement direction of the power module and the first magnetic device, and the circuit board, the first magnetic device and the bottom wall of the other receiving slot are arranged sequentially along the thickness direction of the circuit board, the other receiving slot being used to receive the first magnetic device.

[0033] In this embodiment, another channel and another receiving slot are arranged sequentially along the arrangement direction of the power module and the first magnetic device. The first magnetic device is partially located within the other receiving slot. The first magnetic device and the other channel are also arranged along the arrangement direction of the power module and the first magnetic device. The distance between the other channel and the first magnetic device is small, allowing coolant to flow through the other channel. The coolant can directly absorb the heat generated by the first magnetic device, thus dissipating heat for the first magnetic device. On one side along the thickness direction of the circuit board, the first magnetic device is arranged with one channel of the heat sink along the arrangement direction of the power module and the first magnetic device. On the other side along the thickness direction of the circuit board, the first magnetic device is arranged with another channel of a receiving slot along the arrangement direction of the power module and the first magnetic device. The coolant in both channels can simultaneously dissipate heat for the first magnetic device, improving the heat dissipation effect. Simultaneously, the other receiving slot provides clearance space to prevent interference between the first magnetic device and the bottom wall of the receiving slot when it is installed there, thus avoiding damage to the first magnetic device.

[0034] In one embodiment, the housing includes two grooves, which are arranged opposite each other in a direction perpendicular to the arrangement of the power module and the first magnetic device. The length of the heat sink in the direction in which the two grooves are arranged opposite each other is equal to the distance between the two grooves. The length of the heat sink in the direction in which the two grooves are arranged opposite each other is less than or equal to the distance between the inner walls of the two grooves. The two grooves are used to accommodate a portion of the heat sink.

[0035] In this embodiment, the heat sink is respectively housed in the two grooves on both sides of the direction in which the two grooves are arranged opposite each other. The two grooves can provide a space for the heat sink. The heat sink can extend out of a receiving groove of the housing through the two grooves. The two grooves increase the size of the heat sink along the direction in which the two grooves are arranged opposite each other. Compared with the heat sink being completely located in a receiving groove of the housing, the length of the heat sink along the direction in which the two grooves are arranged opposite each other is increased, the heat dissipation area of ​​the heat sink is increased, and the heat dissipation efficiency and heat dissipation effect of the heat sink can be improved.

[0036] Secondly, this application provides a powertrain including a housing and an on-board charger as described in any of the embodiments of the first aspect above, wherein the electrical control slot of the housing is used to accommodate the on-board charger. The on-board charger provided in this application has high heat dissipation efficiency, which helps to reduce the heat generated during charging and discharging, reduce energy loss due to overheating, improve power conversion efficiency, and improve the performance of the powertrain.

[0037] Thirdly, this application provides an electric vehicle, which includes a power battery and the powertrain described in the second aspect above, wherein the on-board charger is used to charge and discharge the power battery. The on-board charger provided in this application has high power density, which helps to reduce the size of the powertrain and optimize the overall vehicle layout. The on-board charger also has high heat dissipation efficiency, which helps to reduce the heat generated during charging and discharging, reduce energy loss due to overheating, improve energy conversion efficiency, and enhance overall vehicle performance. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of an electric vehicle provided in an embodiment of this application;

[0039] Figure 2 This is another schematic diagram of the electric vehicle provided in the embodiments of this application;

[0040] Figure 3 This is a schematic diagram of the powertrain provided in an embodiment of this application;

[0041] Figure 4 This is a schematic diagram of the vehicle charger provided in an embodiment of this application;

[0042] Figure 5 This is an exploded view of the vehicle charger provided in the embodiments of this application;

[0043] Figure 6 This is a schematic diagram showing the relationship between the circuit board, power module, first magnetic device, and heat sink provided in an embodiment of this application;

[0044] Figure 7 This is a schematic diagram showing the relationship between the circuit board, heat sink, power module, and first magnetic device provided in the embodiments of this application;

[0045] Figure 8 This is a schematic diagram showing the relationship between the circuit board, the first magnetic device, and the heat sink provided in an embodiment of this application;

[0046] Figure 9 This is a schematic diagram showing the relationship between the circuit board, power module, and first magnetic device provided in an embodiment of this application;

[0047] Figure 10 This is a schematic diagram of an on-board charger provided in an embodiment of this application, including a heat-conducting layer;

[0048] Figure 11 This is a schematic diagram showing the relationship between the heat sink and the second magnetic device provided in the embodiments of this application;

[0049] Figure 12 This is a schematic diagram showing the relationship between the first magnetic device, the heat sink, and the second magnetic device provided in the embodiments of this application;

[0050] Figure 13 This is a schematic diagram showing the relationship between the heat sink, power module, first magnetic device, and second magnetic device provided in the embodiments of this application;

[0051] Figure 14 This is a schematic diagram of the heat sink provided in an embodiment of this application;

[0052] Figure 15 This is a schematic diagram of the vehicle charger provided in this application embodiment including another heat-conducting layer;

[0053] Figure 16 This is a schematic diagram of the housing of the vehicle charger provided in the embodiments of this application;

[0054] Figure 17 This is a schematic diagram showing the connection between one channel and another channel provided in an embodiment of this application;

[0055] Figure 18 This is a cross-sectional view of the vehicle charger provided in the embodiments of this application;

[0056] Figure 19 This is a schematic diagram showing the relationship between the housing and the heat sink provided in an embodiment of this application;

[0057] Figure 20 This is a top view of the housing and heat sink provided in the embodiments of this application. Detailed Implementation

[0058] The embodiments of this application are described below with reference to the accompanying drawings.

[0059] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0060] It should be understood that the terms "first," "second," etc., used in this application are for distinguishing purposes only and should not be construed as indicating or implying relative importance or order.

[0061] On-board chargers are an important component of the vehicle's electrical system. As the electrical systems of electric vehicles continue to develop towards miniaturization and high integration, electric vehicles are placing increasingly higher demands on the power density of on-board chargers, as well as on their heat dissipation performance.

[0062] Current heat dissipation solutions for vehicle chargers include three-dimensional water channels, with power modules distributed and attached to the sides of the three-dimensional water channels for heat dissipation. This heat dissipation layout requires the three-dimensional water channels to occupy a large amount of space inside the vehicle charger housing, resulting in a large vehicle charger volume, low power density, and limited utilization of the heat dissipation area of ​​the three-dimensional water channels, which is not conducive to the full heat dissipation of the vehicle charger.

[0063] To address the aforementioned problems, this application provides a multi-directional heat dissipation vehicle charger for charging and discharging the power battery of an electric vehicle. The charger includes a circuit board and a heat sink. The circuit board is electrically connected to the power module and a first magnetic device of the vehicle charger, respectively. The height of the power module along the thickness direction of the circuit board is less than the height of the first magnetic device.

[0064] The power module and the first magnetic device are located on the same side of the circuit board along its thickness direction. The circuit board, the power module, and the heat sink are stacked sequentially along the thickness direction of the circuit board, with the first magnetic device and the heat sink arranged perpendicular to the thickness of the circuit board. The vehicle charger provided in this application, by changing the layout of the circuit board, power module, first magnetic device, and heat sink within the vehicle charger, can improve the utilization rate of the heat dissipation area of ​​the heat sink, increase the heat dissipation efficiency of the heat sink, and enhance the power density of the vehicle charger.

[0065] This application provides an embodiment of an electric vehicle, see reference. Figure 1 As shown, Figure 1This is a schematic diagram of an electric vehicle provided in an embodiment of this application. In this embodiment, the electric vehicle 1 includes a two-wheeled, three-wheeled, or four-wheeled vehicle. In this embodiment, the electric vehicle 1 includes a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), and a range-extended electric vehicle (REEV). The electric vehicle 1 includes a powertrain 10 and a power battery 20. The powertrain 10 is used to receive power from the power battery 20.

[0066] In one embodiment, the electric vehicle 1 includes wheels 30, and the powertrain 10 is used to receive power from the power battery 20 and to drive the wheels 30 to rotate.

[0067] In one embodiment, the electric vehicle 1 includes a frame 40, a powertrain 10 and a power battery 20 fixed on the frame 40, and the frame 40 provides protection and support for the powertrain 10 and the power battery 20.

[0068] See Figure 2 As shown, Figure 2 This is another schematic diagram of an electric vehicle provided in this application embodiment. The powertrain 10 of the electric vehicle 1 includes an on-board charger 100, which is electrically connected to the power battery 20 and used to charge and discharge the power battery 20. In one embodiment, the on-board charger 100 can receive power from an external power source and convert it into DC power to charge the power battery 20. The external power source includes AC and DC power; exemplarily, the external power source includes an AC power grid, an AC charging pile, or a DC charging pile, etc.

[0069] In one embodiment, the on-board charger 100 can convert high-voltage direct current into low-voltage direct current to power on-board electrical equipment. The on-board electrical equipment includes at least one of a low-voltage battery, headlights, windshield wipers, air conditioning, display instruments, or multimedia equipment.

[0070] In one embodiment, the powertrain 10 includes a motor controller 200, which is electrically connected to an on-board charger 100. The on-board charger 100 is electrically connected to a power battery 20 to charge the power battery 20. The power battery 20 is electrically connected to the motor controller 200, which receives DC power from the power battery 20.

[0071] In one embodiment, the powertrain 10 includes a drive motor 300, a motor controller 200 electrically connected to the drive motor 300, and the motor controller 200 supplying power to the drive motor 300. The motor controller 200 receives high-voltage direct current (DC) from the power battery 20 and converts the DC into high-voltage alternating current (AC) to supply power to the drive motor 300, thereby causing the drive motor 300 to rotate.

[0072] In one embodiment, the powertrain 10 includes a reducer 400. A drive motor 300 is used to drive the reducer 400. When the drive motor 300 rotates, it drives the reducer 400 to rotate, and the reducer 400 transmits the power of the drive motor 300 to the wheels 30, driving the wheels 30 to rotate.

[0073] See Figure 3 As shown, Figure 3 This is a schematic diagram of the powertrain provided in the embodiments of this application. The powertrain 10 includes a housing 101. The electrical control slot 102 of the housing 101 is used to accommodate the on-board charger 100. The on-board charger 100 is integrated into the powertrain 10, and the housing 101 provides support for the on-board charger 100.

[0074] In one embodiment, the electrical control slot 102 is also used to accommodate the motor controller 200, the power distribution device, and the vehicle controller, etc. The on-board charger 100 is applied in the multi-functional powertrain that integrates the motor controller 200, the power distribution device, and the vehicle controller, etc. The on-board charger 100 is electrically connected to the motor controller 200. The on-board charger 100 can receive power from an external power source and convert it into DC power. Part of it is electrically connected to the motor controller 200 to power the motor controller 200, and the other part powers the power battery 20.

[0075] See Figure 4 , Figure 5 and Figure 6 As shown, Figure 4 This is a schematic diagram of the vehicle charger provided in an embodiment of this application. Figure 5 This is an exploded view of the vehicle charger provided in the embodiments of this application. Figure 6 This is a schematic diagram showing the relationship between the circuit board, power module, first magnetic device, and heat sink provided in an embodiment of this application. The vehicle charger 100 includes a circuit board 110 and a heat sink 120. The circuit board 110 is fixedly connected to the power module 130 and the first magnetic device 140, respectively, and serves to support the power module 130 and the first magnetic device 140. The circuit board 110 is electrically connected to both the power module 130 and the first magnetic device 140 of the vehicle charger 100, enabling the circuit board 110 to supply power to both the power module 130 and the first magnetic device 140, ensuring their normal operation.

[0076] The power module 130 is used to implement power conversion, which, exemplarily, includes conversion between alternating current and direct current or between high-voltage direct current and low-voltage direct current.

[0077] In one embodiment, the power module 130 includes a power switch. The power switch is used to implement power conversion. Optionally, in this embodiment, the power switch includes at least one of an insulated gate bipolar transistor (IGBT), a silicon carbide power transistor, a silicon transistor, and a metal-oxide-semiconductor field-effect transistor (MOS).

[0078] The first magnetic device 140 can use the principle of electromagnetic induction to regulate, transform, or filter electrical signals. In one embodiment, the first magnetic device 140 includes at least one of a capacitor and an inductor.

[0079] Continue reading Figure 4 , Figure 6 and Figure 7 As shown, Figure 7 This is a schematic diagram showing the relationship between the circuit board, heat sink, power module, and first magnetic device provided in an embodiment of this application. The height of the power module 130 along the thickness direction of the circuit board 110 is less than the height of the first magnetic device 140. In this embodiment, the thickness direction of the circuit board 110 is the Z-direction, and the same applies below. The height of the power module 130 in the Z-direction is less than the height of the first magnetic device 140 in the Z-direction, and there is a height difference between the power module 130 and the first magnetic device 140.

[0080] The power module 130 and the first magnetic device 140 are located on the same side of the circuit board 110 in the thickness direction. In this embodiment, the surface of the circuit board 110 in the positive Z direction is the first surface of the circuit board 110, and the surface of the circuit board 110 in the negative Z direction is the second surface 111 of the circuit board 110, and so on below. The power module 130 and the first magnetic device 140 are both located on one side of the circuit board 110 in the Z direction and are connected to the second surface 111 of the circuit board 110. Since the power module 130 and the first magnetic device 140 are located on the same surface of the circuit board 110, the power module 130 and the first magnetic device 140 only need to be assembled on one surface of the circuit board 110, which can reduce the assembly time of the power module 130 and the first magnetic device 140, and also facilitates the arrangement of other structures within the vehicle charger 100 by utilizing the height difference between the power module 130 and the first magnetic device 140.

[0081] The circuit board 110, power module 130, and heat sink 120 are stacked sequentially along the thickness direction of the circuit board 110. Both the power module 130 and heat sink 120 are located on the opposite side of the Z-axis of the circuit board 110. The circuit board 110, power module 130, and heat sink 120 are arranged parallel to each other in pairs along the Z-axis. The power module 130 is laid flat on the second surface 111 of the circuit board 110 and sandwiched between the second surface 111 of the circuit board 110 and the third surface 121 of the heat sink 120. The third surface 121 of the heat sink 120 is the surface of the heat sink 120 in the positive Z-axis. The power module 130 and heat sink 120 are stacked along the Z-axis, and the projection of the heat sink 120 and the projection of the power module 130 coincide along the Z-axis. This facilitates the third surface 121 of the heat sink 120 covering the power module 130 mounted on the circuit board 110, allowing the heat sink 120 to cool the power module 130.

[0082] When the power module 130 is in the power conversion operation state, it frequently switches between the on and off states, resulting in significant heat generation. The third surface 121 of the heat sink 120 has a large heat dissipation area. Utilizing the third surface 121 of the heat sink 120 to dissipate heat from the power module 130 improves its heat dissipation effect. Furthermore, the sequential stacking of the circuit board 110, power module 130, and heat sink 120 along the thickness direction of the circuit board 110 reduces the space occupied by the power module 130 and heat sink 120 in the Z-direction, which helps to reduce the height of the on-board charger 100 in the Z-direction.

[0083] The first magnetic device 140 and the heat sink 120 are arranged along a direction perpendicular to the thickness of the circuit board 110. In this embodiment, the direction perpendicular to the thickness of the circuit board 110 is the X direction. The first magnetic device 140 and the heat sink 120 are arranged along the X direction. The first magnetic device 140 is located on at least one side of the heat sink 120 in the X direction. The side of the heat sink 120 in the X direction can dissipate heat for the first magnetic device 140.

[0084] The first magnetic device 140 and the power module 130 are arranged in a direction perpendicular to the thickness of the circuit board 110. The first magnetic device 140 is located on at least one side of the power module 130 in the X direction. Both the first magnetic device 140 and the power module 130 are located on the side of the circuit board 110 in the opposite Z direction. The projection of the first magnetic device 140 in the Z direction and the projection of the power module 130 in the Z direction do not coincide. The first magnetic device 140 and the power module 130 are arranged in separate areas on the circuit board 110 along the X direction. The arrangement of the first magnetic device 140 and the power module 130 on the circuit board 110 is more regular, which facilitates the installation and maintenance of the power module 130 and the first magnetic device 140 on the circuit board 110.

[0085] Along the thickness direction of circuit board 110, the height of power module 130 is less than the height of first magnetic device 140. Power module 130 and first magnetic device 140 are connected to the second surface 111 of circuit board 110 on one side of the positive Z direction. The height of power module 130 in the Z direction is less than the height of first magnetic device 140 in the Z direction, and there is a height difference between power module 130 and first magnetic device 140. Power module 130 and heat sink 120 are both located on the opposite Z direction side of circuit board 110. Power module 130 and heat sink 120 are arranged along the Z direction, and the distance between circuit board 110 and heat sink 120 along the Z direction is less than the height of first magnetic device 140. The power module 130 and the heat sink 120 are both arranged along the X direction with the first magnetic device 140. The arrangement of the power module 130, the heat sink 120 and the first magnetic device 140 is designed using the height difference between the first magnetic device 140 and the power module 130, which can improve the space utilization rate inside the vehicle charger 100, ensure a more reasonable arrangement of the power module 130, the heat sink 120 and the first magnetic device 140, and reduce the size of the vehicle charger 100.

[0086] This application provides a multi-directional heat dissipation vehicle charger 100, which includes a heat sink 120 and a power module 130 located between the heat sink 120 and a circuit board 110. The third surface 121 of the heat sink 120 can dissipate heat for the power module 130. A first magnetic device 140 is located on the side of the heat sink 120, and the side of the heat sink 120 can dissipate heat for the first magnetic device 140. The power module 130 has a higher heat generation than the first magnetic device 140. The third surface 121 of the heat sink 120 has a larger heat dissipation area than the side of the heat sink 120. Using the third surface 121 with a larger heat dissipation area to dissipate heat for the power module 130 with higher heat generation can improve the heat dissipation effect of the power module 130. Using the side with a smaller heat dissipation area to dissipate heat for the first magnetic device 140 can meet the heat dissipation requirements of the first magnetic device 140 while avoiding waste of the heat dissipation resources of the heat sink 120.

[0087] The heat sink 120 is laid out according to the heat generation and heat dissipation requirements of the power module 130 and the first magnetic device 140 of the vehicle charger 100. This optimizes the allocation of heat dissipation resources, fully utilizes the heat dissipation resources of the heat sink 120, and improves the heat dissipation efficiency of the heat sink 120. Under the same power, the vehicle charger 100 provided in this application has a smaller size, higher heat dissipation efficiency, and better heat dissipation effect. Under the same volume, the vehicle charger 100 provided in this application can accommodate more power modules, increasing the power density of the vehicle charger 100.

[0088] In one embodiment, the heat sink 120 and the circuit board 110 are fixedly connected. For example, the second surface 111 of the circuit board 110 along the Z direction is fixedly connected to the third surface 121 of the heat sink 120 by bolts.

[0089] In one embodiment, the heat sink 120 is a brazed sheet metal heat sink, which has good heat dissipation performance.

[0090] In one embodiment, the distance between the side of the heat sink 120 away from the circuit board 110 and the circuit board 110 is less than or equal to the height of the first magnetic device 140, and the space occupied by the heat sink 120 in the Z direction is completely located within the space occupied by the first magnetic device 140 in the Z direction, and the heat sink 120 does not occupy additional space in the Z direction.

[0091] In one embodiment, see Figure 6 As shown, the number of first magnetic devices 140 is at least two, for example, two, three, or four, etc. Along the arrangement direction of the two first magnetic devices 140, the length of the heat sink 120 is less than or equal to the distance between the two first magnetic devices 140, and the heat sink 120 is located between the two first magnetic devices 140. In this embodiment, the two first magnetic devices 140 are arranged at intervals along the X direction. It can be understood that when the number of first magnetic devices 140 is two, the heat sink 120 along the X direction is located between the two first magnetic devices 140; when the number of first magnetic devices 140 is greater than two, the heat sink 120 along the X direction is located between any two first magnetic devices 140.

[0092] This application uses an example where the number of the first magnetic device 140 is two. See [reference needed]. Figure 8 As shown, Figure 8 This is a schematic diagram showing the relationship between the circuit board, the first magnetic device, and the heat sink provided in an embodiment of this application. The length of the heat sink 120 in the X direction is D1, and the distance between the two first magnetic devices 140 in the X direction is L1, where D1 can be less than or equal to L1. The heat sink 120 is located between the two first magnetic devices 140 along the X direction. The length D1 of the heat sink 120 in the X direction is less than or equal to the distance L1 between the two first magnetic devices 140, ensuring that the heat sink 120 does not interfere with the first magnetic devices 140 on either side in the X direction when it is located between them. Simultaneously, the two first magnetic devices 140 are located on opposite sides of the heat sink 120 in the X direction, allowing the heat sink 120 to dissipate heat from both sides in the X direction, thereby improving the utilization rate of the heat dissipation area of ​​the heat sink 120 and increasing its heat dissipation efficiency.

[0093] It is understandable that when the spacing between the two first magnetic devices 140 along the X direction is not uniform, the spacing between the two first magnetic devices 140 along the X direction is the minimum spacing; the length D1 of the heat sink 120 in the X direction is the maximum length of the heat sink 120, and the same applies below.

[0094] In one embodiment, see Figure 8 and Figure 9 As shown, Figure 9 This is a schematic diagram illustrating the relationship between the circuit board, power module, and first magnetic device provided in this embodiment. Taking two first magnetic devices 140 as an example, the two first magnetic devices 140 are located on opposite sides of the power module 130 in the X direction, with the power module 130 positioned between the two magnetic devices 140 along the X direction. When the number of first magnetic devices 140 is greater than two, the heat sink 120 is positioned between any two first magnetic devices 140 along the X direction. The power module 130 is located between the two first magnetic devices 140, and the short signal transmission distance between the power module 130 and the first magnetic devices 140 ensures smooth transmission of power and electrical signals between them.

[0095] Two first magnetic devices 140 are respectively located on both sides of the heat sink 120 in the X direction. Along the direction from the heat sink 120 toward either of the two first magnetic devices 140, the distance between the heat sink 120 and the first magnetic device 140 is less than or equal to the distance between the power module 130 and the first magnetic device 140. In this embodiment, the direction from the heat sink 120 toward either of the two first magnetic devices 140 includes the positive X direction and the negative X direction.

[0096] In one embodiment, the distance between the heat sink 120 and the first magnetic device 140 along the positive X direction is L2, and the distance between the power module 130 and the first magnetic device 140 is L3, where L2 is less than or equal to L3. The heat sink 120 and the power module 130 are arranged along the Z direction, and the heat sink 120 is located between the two first magnetic devices 140 along the X direction, and the power module 130 is located between the two first magnetic devices 140 along the X direction. The distance L2 between the heat sink 120 and the first magnetic device 140 in the positive X direction is less than or equal to the distance L3 between the power module 130 and the first magnetic device 140. The heat sink 120 is closer to the first magnetic device 140 than the power module 130 in the positive X direction, or the distance between the heat sink 120 and the power module 130 and the first magnetic device 140 in the positive X direction is equal.

[0097] In one embodiment, the distance between the heat sink 120 and the first magnetic device 140 in the X-direction is L4, and the distance between the power module 130 and the first magnetic device 140 is L5, where L4 is less than or equal to L5. The heat sink 120 and the power module 130 are arranged along the Z-direction. In the X-direction, the heat sink 120 is located between the two first magnetic devices 140, and the power module 130 is located between the two first magnetic devices 140. In the X-direction, the distance L4 between the heat sink 120 and the first magnetic device 140 is less than or equal to the distance L5 between the power module 130 and the first magnetic device 140. In the X-direction, the heat sink 120 is closer to the first magnetic device 140 than the power module 130, or the distances between the heat sink 120 and the power module 130 and the first magnetic device 140 in the X-direction are equal.

[0098] The distance L2 between the heat sink 120 and the first magnetic device 140 along the positive X direction is less than or equal to the distance L3 between the power module 130 and the first magnetic device 140. Similarly, the distance L4 between the heat sink 120 and the first magnetic device 140 along the negative X direction is less than or equal to the distance L5 between the power module 130 and the first magnetic device 140. Regardless of whether it's along the positive or negative X direction, the distance between the heat sink 120 and the first magnetic device 140 is less than or equal to the distance between the power module 130 and the first magnetic device 140. Therefore, the length of the heat sink 120 in the X direction is greater than or equal to the length of the power module 130 in the X direction. This allows the heat sink 120 to cover the power module 130 in the X direction, ensuring that the portion of the power module 130 in the X direction receives heat dissipation from the heat sink 120, thus improving the heat dissipation effect of the heat sink 120 on the power module 130.

[0099] In one embodiment, the first magnetic device 140 includes a magnetic device for a DC filter and a magnetic device for an AC filter. The DC filter is used to receive and filter DC power, and the AC filter is used to receive and filter AC power, thereby suppressing electromagnetic interference, ensuring stable output of electrical signals, and ensuring that the on-board charger 100 charges and discharges the power battery 20.

[0100] In one embodiment, see Figure 8 and Figure 9As shown, along the direction perpendicular to the arrangement of the power module 130 and the first magnetic device 140, the length of the power module 130 is less than or equal to the length of the heat sink 120. In this embodiment, the power module 130 and the first magnetic device 140 are arranged along the X direction, and the direction perpendicular to the arrangement of the power module 130 and the first magnetic device 140 is the Y direction, and the same applies below. The length of the heat sink 120 along the Y direction is D2, and the length of the power module 130 is D3. The power module 130 and the heat sink 120 are stacked along the Z direction, and the length D3 of the power module 130 along the Y direction is less than or equal to the length D2 of the heat sink 120. The heat sink 120 can cover the power module 130 mounted on the circuit board 110 in the Y direction, ensuring that the portion of the power module 130 in the Y direction can be cooled by the heat sink 120, thereby improving the heat dissipation effect of the heat sink 120 on the power module 130.

[0101] It is understandable that the length D2 of the heat sink 120 along the Y direction is the maximum length of the heat sink 120, and the length D3 of the power module 130 along the Y direction is the maximum length of the power module 130.

[0102] In one embodiment, see Figure 10 As shown, Figure 10 This is a schematic diagram of a vehicle charger including a thermally conductive layer according to an embodiment of this application. The vehicle charger 100 includes a thermally conductive layer 150, and a power module 130, a thermally conductive layer 150, and a heat sink 120 are arranged sequentially along the thickness direction of the circuit board 110. The surface of the power module 130 and the surface of the thermally conductive layer 150 are in contact and bonded along the Z direction. The surface of the thermally conductive layer 150 facing away from the power module 130 is in contact and bonded to the third surface 121 of the heat sink 120. The heat from the power module 130 is transferred to the heat sink 120 through the thermally conductive layer 150. The thermally conductive layer 150 has high thermal conductivity, which can improve the heat conduction efficiency between the power module 130 and the heat sink 120, and enhance the heat dissipation effect of the heat sink 120 on the power module 130.

[0103] In one embodiment, a thermally conductive layer 150 includes at least one of thermally conductive grease, thermally conductive silicone pad, and thermally conductive gel.

[0104] It is understood that in this embodiment, a thermally conductive layer 150 may have an irregular structure to accommodate the shapes of the power module 130 and the heat sink 120, as well as the shape of the gap between them. Specifically, a thermally conductive layer 150 can fill the gap between the power module 130 and the heat sink 120, ensuring that heat conduction can occur between them through the thermally conductive layer 150.

[0105] In one embodiment, see Figure 5 and Figure 11 As shown, Figure 11 This is a schematic diagram illustrating the relationship between the heat sink and the second magnetic device provided in this embodiment. The vehicle charger 100 includes a second magnetic device 160, and a power module 130, a heat sink 120, and a second magnetic device 160 are arranged sequentially along the thickness direction of the circuit board 110. The power module 130 is located on the side of the heat sink 120 facing the circuit board 110 along the Z direction, and the second magnetic device 160 is located on the side of the heat sink 120 away from the circuit board 110 along the Z direction. The power module 130 and the second magnetic device 160 are respectively located on opposite sides of the heat sink 120 in the Z direction. The heat sink 120 dissipates heat from the power module 130 through a third surface 121, and dissipates heat from the second magnetic device 160 through a fourth surface 124. In this embodiment, the fourth surface 124 is the surface of the heat sink 120 in the opposite Z direction. The heat sink 120 provides heat dissipation for the first magnetic device 140 on its side in the X direction, and for the power module 130 and the second magnetic device 160 on its surface in the Z direction. Both the X-direction and Z-direction surfaces of the heat sink 120 can be utilized. The arrangement of the heat sink 120, the power module 130, the first magnetic device 140 and the second magnetic device 160 can fully utilize the heat dissipation area of ​​the heat sink 120, reduce the waste of heat dissipation resources of the heat sink 120, and thus improve the heat dissipation efficiency of the heat sink 120.

[0106] In one embodiment, the second magnetic device 160 includes at least one of a transformer and an inductor. Exemplarily, the second magnetic device 160 includes an LLC transformer, a direct current to direct current (DCDC) transformer, and a power factor correction (PFC) inductor.

[0107] In one embodiment, see Figure 7 and Figure 12 As shown, Figure 12This is a schematic diagram illustrating the relationship between the first magnetic device, the heat sink, and the second magnetic device provided in this application embodiment. The projections of the first magnetic device 140 and the second magnetic device 160 along a direction perpendicular to the thickness of the circuit board 110 at least partially overlap. The projections of the first magnetic device 140 along the X direction and the second magnetic device 160 along the X direction may partially or completely overlap. In this application embodiment, the second magnetic device 160 and the first magnetic device 140 are arranged along the X direction, and both the first magnetic device 140 and the second magnetic device 160 are located on the side of the circuit board 110 in the opposite Z direction. The distance between the second magnetic device 160 and the circuit board 110 along the Z direction is L6, and the height of the first magnetic device 140 is H. The distance L6 between the second magnetic device 160 and the circuit board 110 along the Z direction is less than the height H of the first magnetic device 140, and the projections of the first magnetic device 140 and the second magnetic device 160 along the X direction partially overlap.

[0108] The projections of the first magnetic device 140 and the second magnetic device 160 along the Z-direction do not coincide. The second magnetic device 160 and the first magnetic device 140 are arranged along the X-direction. When arranging the second magnetic device 160, it is placed on one side of the first magnetic device 140 in the X-direction according to the height of the first magnetic device 140, utilizing the space occupied by the first magnetic device 140 in the Z-direction. The projections of the first magnetic device 140 and the second magnetic device 160 along the X-direction at least partially coincide, so that the space occupied by the second magnetic device 160 in the Z-direction at least partially overlaps with the space occupied by the first magnetic device 140 in the Z-direction. This avoids space waste caused by the height difference between the first magnetic device 140 and the second magnetic device 160 during arrangement, and helps to reduce the height of the vehicle charger 100 in the Z-direction.

[0109] In one embodiment, the distance between the side of the second magnetic device 160 away from the circuit board 110 and the circuit board 110 is less than or equal to the height of the first magnetic device 140, and the space occupied by the second magnetic device 160 in the Z direction is completely located within the space occupied by the first magnetic device 140 in the Z direction, and the second magnetic device 160 does not occupy additional space in the Z direction.

[0110] Understandably, when the height of the first magnetic device 140 along the Z direction is not uniform, the height H of the first magnetic device 140 along the Z direction is the maximum height of the first magnetic device 140. The distance L6 between the second magnetic device 160 and the circuit board 110 along the Z direction is the maximum distance between the second magnetic device 160 and the circuit board 110.

[0111] In one embodiment, see Figure 13 As shown, Figure 13This is a schematic diagram showing the relationship between the heat sink, power module, first magnetic device, and second magnetic device provided in this embodiment. The power module 130 is located on one side of the heat sink 120 in the positive Z direction, the second magnetic device 160 is located on the side of the heat sink 120 in the negative Z direction, and the first magnetic device 140 is located on both sides of the heat sink 120 in the X direction. The heat sink 120 is also provided on both sides in the Y direction. Every surface of the heat sink 120 can be utilized, avoiding waste of heat dissipation resources and improving the heat dissipation efficiency of the heat sink 120.

[0112] In one embodiment, see Figure 6 and Figure 14 As shown, Figure 14 This is a schematic diagram of a heat sink provided in an embodiment of this application. The heat sink 120 includes a channel 122, and the inner wall of the channel 122 includes an opening 1221. The opening 1221 is located on the side of the channel 122 opposite to the circuit board 110 along the thickness direction of the circuit board 110, and on the side of the channel 122 in the opposite Z direction. The opening 1221 being located on the side of the channel 122 in the opposite Z direction can avoid installation interference with the power module 130 located on the heat sink 120 in the positive Z direction, and with the first magnetic device 140 located on the heat sink 120 in the X direction.

[0113] The second magnetic device 160 is located on the side of the heat sink 120 away from the circuit board 110 along the Z direction. An opening 1221 is located on the side of the second magnetic device 160 along the direction perpendicular to the arrangement of the power module 130 and the first magnetic device 140. The opening 1221 and the second magnetic device 160 are arranged along the Y direction. The second magnetic device 160 will not interfere with the opening 1221.

[0114] An opening 1221 is provided to penetrate the inner wall of a channel 122 along the thickness direction of the circuit board 110 and to allow coolant to flow through. Coolant can be introduced into the channel 122 through the opening 1221, and coolant can also flow out of the channel 122 through the opening 1221. As coolant enters the channel 122 through the opening 1221, heat from the power module 130 can be transferred through the third surface 121 of the heat sink 120 to the coolant in the channel 122 of the heat sink 120, thus dissipating heat from the power module 130.

[0115] In one embodiment, there are two openings 1221, one for coolant inflow and the other for coolant outflow.

[0116] Understandably, an opening 1221 can be a hole that penetrates the inner wall of a channel 122 along the Z direction, or it can be a pipe that extends out of the outer wall of a channel 122.

[0117] In one embodiment, see Figure 14 As shown, the heat sink 120 includes heat dissipation fins 123, which are located within a channel 122 of the heat sink 120. The channel 122 is used to contain coolant and the heat dissipation fins 123, which can be immersed in the coolant. The heat dissipation fins 123 increase the heat dissipation area of ​​the heat sink 120. When coolant flows through the channel 122, the heat dissipation fins 123 enable the coolant to carry away the heat from the power module 130 more quickly, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat sink 120.

[0118] In one embodiment, see Figure 15 As shown, Figure 15 This is a schematic diagram of an on-board charger provided in an embodiment of this application, including another thermally conductive layer. The on-board charger 100 includes another thermally conductive layer 170, and a heat sink 120, another thermally conductive layer 170, and a second magnetic device 160 are arranged sequentially along the thickness direction of the circuit board 110.

[0119] Along the Z-direction, the surface of the heat sink 120 facing away from the circuit board 110 contacts and adheres to the surface of another thermally conductive layer 170. The surface of the other thermally conductive layer 170 facing away from the heat sink 120 contacts and adheres to the surface of the second magnetic device 160. The heat of the second magnetic device 160 is transferred to the heat sink 120 through the other thermally conductive layer 170. The other thermally conductive layer 170 has high thermal conductivity, which can improve the thermal conduction efficiency between the second magnetic device 160 and the heat sink 120, and enhance the heat dissipation effect of the heat sink 120.

[0120] In one embodiment, another thermally conductive layer 170 includes at least one of thermally conductive grease, thermally conductive silicone pad, and thermally conductive gel.

[0121] It is understood that the other thermally conductive layer 170 in this embodiment may have an irregular structure to adapt to the shapes of the second magnetic device 160 and the heat sink 120, as well as the shape of the gap between the second magnetic device 160 and the heat sink 120. Specifically, the other thermally conductive layer 170 can fill the gap between the second magnetic device 160 and the heat sink 120, ensuring that heat conduction can occur between the second magnetic device 160 and the heat sink 120 through the other thermally conductive layer 170.

[0122] In one embodiment, see Figure 12As shown, along the arrangement direction of the power module 130 and the first magnetic device 140, the first magnetic device 140 and the heat sink 120 are arranged at intervals. In this embodiment, the arrangement direction of the power module 130 and the first magnetic device 140 is the X direction, and the same applies below. The first magnetic device 140 and the heat sink 120 are arranged at intervals along the X direction, and there is a gap between the first magnetic device 140 and the heat sink 120 in the X direction. The second magnetic device 160 includes an electrical connector 161, which is used to pass through the gap between the first magnetic device 140 and the heat sink 120 and to electrically connect to the circuit board 110. The second magnetic device 160 is located on the side of the heat sink 120 away from the circuit board 110. The heat sink 120 is spaced between the second magnetic device 160 and the circuit board 110 along the Z direction. The gap between the first magnetic device 140 and the heat sink 120 facilitates the electrical connection between the second magnetic device 160 and the circuit board 110, and avoids the heat sink 120 located between the circuit board 110 and the second magnetic device 160 from interfering with the electrical connection between the circuit board 110 and the second magnetic device 160. This facilitates the circuit board 110 to be electrically connected to the second magnetic device 160 through the electrical connector 161 and to supply power to the second magnetic device 160, ensuring that the second magnetic device 160 can work normally.

[0123] In one embodiment, the electrical connector 161 includes pins or inserts, etc.

[0124] In one embodiment, see Figure 12 As shown, the electrical connector 161 is located on at least one side of the second magnetic device 160 in the X direction, which facilitates the electrical connector 161 to directly pass through the gap in the X direction between the heat sink 120 and the first magnetic device 140 and connect to the circuit board 110, thereby reducing the electrical signal transmission path between the circuit board 110 and the second magnetic device 160 and improving the electrical signal transmission efficiency.

[0125] In one embodiment, see Figure 5 and Figure 16 As shown, Figure 16 This is a schematic diagram of the housing of an on-board charger provided in an embodiment of this application. The housing 180 of the on-board charger 100 includes a receiving groove 181 for accommodating a heat sink 120, and also for accommodating a circuit board 110, a power module 130, and a first magnetic device 140. The housing 180 provides support and protection for the circuit board 110, the heat sink 120, the power module 130, and the first magnetic device 140.

[0126] The opening of a receiving slot 181 faces the positive Z direction, and the bottom wall of a receiving slot 181 is a wall opposite to the opening of the receiving slot 181. In this embodiment, the bottom wall of a receiving slot 181 is a wall in the opposite Z direction. The circuit board 110, power module 130, heat sink 120, and the bottom wall of the receiving slot 181 are arranged sequentially along the thickness direction of the circuit board 110. The bottom walls of the circuit board 110, power module 130, heat sink 120, and receiving slot 181 are parallel to each other in the thickness direction of the circuit board 110, which makes the height of the vehicle charger 100 in the Z direction smaller, which is beneficial to the miniaturization of the vehicle charger 100 and saves the space occupied by the vehicle charger 100 in the electric vehicle 1.

[0127] Continue reading Figure 17 As shown, Figure 17 This is a schematic diagram showing the connection between one channel and another channel according to an embodiment of this application. The bottom wall of a receiving groove 181 includes another channel 1811, and the inner wall of the other channel 1811 includes another opening 1812. Along the thickness direction of the circuit board 110, the other opening 1812 is located on the side of the other channel 1811 facing the heat sink 120, and on the side of the other channel 1811 in the positive Z direction. Along the Z direction, the other opening 1812 is located between one channel 122 and the other channel 1811. The other opening 1812 is used to penetrate the inner wall of the other channel 1811 along the thickness direction of the circuit board 110. The other opening 1812 can introduce coolant into the other channel 1811, and the coolant in the other channel 1811 can also flow out through the other opening 1812. The coolant enters another channel 1811 through another opening 1812. The heat of the components in the vehicle charger 100 can be transferred through the bottom wall of a receiving tank 181 to the coolant in the other channel 1811. The coolant carries away the heat and dissipates heat from the components in the vehicle charger 100.

[0128] An opening 1221 and another opening 1812 are located between a channel 122 and another channel 1811 along the Z-direction. The other opening 1812 connects to the opening 1221, and the other channel 1811 and the opening 1221 can be connected through the other opening 1812. With the openings 1221 and 1812 positioned along the Z-direction, the coolant in the channel 122 flows out from one opening 1221 and then flows towards the other opening 1812 along the direction of gravity, which helps reduce power loss. Simultaneously, the Z-direction arrangement of the openings 1221 and 1812 shortens the distance between them, reducing the coolant flow path.

[0129] A channel 122, an opening 1221, another opening 1812, and another channel 1811 are sequentially connected, allowing coolant to flow sequentially along one channel 122, one opening 1221, another opening 1812, and another channel 1811, or sequentially along another channel 1811, another opening 1812, one opening 1221, and one channel 122. The coolant can circulate within one channel 122 and another channel 1811, enabling heat dissipation for components located in different positions within the on-board charger 100.

[0130] In one embodiment, see Figure 17 As shown, the outer diameter of one opening 1221 is smaller than the inner diameter of the other opening 1812, so that one opening 1221 can be inserted into the other opening 1812 to communicate with the other opening 1812.

[0131] In one embodiment, one opening 1221 is sealed to another opening 1812 to prevent coolant leakage that could damage the on-board charger 100 when flowing between the two openings, thus making the on-board charger 100 safer. Exemplarily, one opening 1221 and another opening 1812 are sealed together by a sealing ring.

[0132] In one embodiment, there are two additional openings 1812, one for coolant inflow and the other for coolant outflow.

[0133] Understandably, the other opening 1812 could be a hole penetrating the inner wall of another channel 1811 along the Z direction, or it could be a pipe extending out of the outer wall of another channel 1811.

[0134] In one embodiment, a channel 122 in the heat sink 120 and another channel 1811 in a receiving groove 181 of the housing 180 are connected and operate in series or in parallel.

[0135] In one embodiment, see Figure 16 and Figure 17As shown, the outer wall of the housing 180 includes a third opening 182, which connects to another channel 1811 and an external flow channel. The third opening 182 is located on the outer wall of the housing 180, facilitating its arrangement with the external flow channel. The on-board charger 100 is located inside the electric vehicle 1. Coolant from the vehicle's cooling system flows sequentially through the external flow channel, the third opening 182, another channel 1811, another opening 1812, an opening 1221, and a channel 122. The coolant enters the channel 122 and exchanges heat with the power module 130 and the first magnetic device 140, carrying away the heat generated by the power module 130 and the first magnetic device 140. The heated coolant then flows sequentially through the channel 122, an opening 1221, another opening 1812, another channel 1811, the third opening 182, and the external flow channel before exiting the housing 180.

[0136] In one embodiment, the external flow channel is a flow channel within the housing 101 of the powertrain 10, and the flow channel within the housing 101 is connected to the third opening 182.

[0137] In one embodiment, there are two third openings 182, one for coolant inflow and the other for coolant outflow.

[0138] In one embodiment, see Figure 5 and Figure 17 As shown, a receiving groove 181 is also used to accommodate a second magnetic device 160. The heat sink 120, the second magnetic device 160, and the bottom wall of the receiving groove 181 are arranged sequentially along the thickness direction of the circuit board 110. The heat sink 120 and the bottom wall of the receiving groove 181 are respectively provided on both sides of the second magnetic device 160 along the Z direction. The second magnetic device 160 is sandwiched between the heat sink 120 and the bottom wall of the receiving groove 181. The coolant in one channel 122 of the heat sink 120 and the coolant in another channel 1811 of the bottom wall of the receiving groove 181 respectively dissipate heat on both sides of the second magnetic device 160 in the Z direction. The cooperation of one channel 122 and the other channel 1811 can improve the heat dissipation efficiency of the second magnetic device 160 and enhance the heat dissipation effect of the second magnetic device 160.

[0139] In one embodiment, the circuit board 110 can serve as a cover for the vehicle charger 100, and the circuit board 110 and the housing 180 enclose the power module 130, the first magnetic device 140, and the heat sink 120. The surface of the circuit board 110 in the positive Z direction is located on the outside of the housing 180.

[0140] In one embodiment, the circuit board 110 is detachably connected to the housing 180. When the internal components of the vehicle charger 100 need repair or replacement, the detachable connection helps reduce operational difficulty and cost. For example, the detachable connection is a screw connection.

[0141] In one embodiment, the housing 180 of the vehicle charger 100 is integrally formed, which improves the structural stability of the vehicle charger 100.

[0142] In one embodiment, the housing 180 of the vehicle charger 100 is made of plastic, which is lightweight and low in cost.

[0143] In one embodiment, see Figure 16 , Figure 17 and Figure 18 As shown, Figure 18 This is a cross-sectional view of the vehicle charger provided in an embodiment of this application. The bottom wall of one receiving slot 181 includes another receiving slot 183. The opening of the other receiving slot 183 faces the positive Z-direction, and the bottom wall of the other receiving slot 183 is the wall of the other receiving slot 183 in the opposite Z-direction. The bottom wall of the other receiving slot 183 is located on the opposite Z-direction side of the bottom wall of one receiving slot 181. The distance between the bottom wall of the other receiving slot 183 and the circuit board 110 along the Z-direction is greater than the distance between the bottom wall of one receiving slot 181 and the circuit board 110.

[0144] Along the arrangement direction of the power module 130 and the first magnetic device 140, another channel 1811 and another receiving groove 183 are arranged sequentially. The other channel 1811 and the other receiving groove 183 are arranged along the X direction. Along the thickness direction of the circuit board 110, the bottom wall of the circuit board 110, the first magnetic device 140, and the other receiving groove 183 are arranged sequentially. The other receiving groove 183 is used to accommodate the first magnetic device 140. The projection of the first magnetic device 140 along the Z direction coincides with the projection of the other receiving groove 183 along the Z direction. The first magnetic device 140 can be accommodated in the other receiving groove 183 on the side opposite to the Z direction.

[0145] Another channel 1811 and another receiving tank 183 are arranged along the X direction. The first magnetic device 140 is partially located in the other receiving tank 183. The first magnetic device 140 and the other channel 1811 are also arranged along the X direction. The distance between the other channel 1811 and the first magnetic device 140 is small, and coolant can flow in the other channel 1811. The coolant can directly absorb the heat generated by the first magnetic device 140, thus dissipating heat for the first magnetic device 140. The first magnetic device 140 is arranged along the X direction with one channel 122 of the heat sink 120 on one side of the positive Z direction, and along the X direction with another channel 1811 of the receiving tank 181 on the other side of the negative Z direction. The coolant in one channel 122 and the other channel 1811 can simultaneously dissipate heat for the first magnetic device 140, improving the heat dissipation effect of the first magnetic device 140.

[0146] Meanwhile, another receiving slot 183 can provide clearance space to prevent the first magnetic device 140 from interfering with the bottom wall of the receiving slot 181 when it is installed in the receiving slot 181, thus avoiding damage to the first magnetic device 140.

[0147] In one embodiment, see Figure 18 As shown, there are two first magnetic devices 140, located on both sides of the heat sink 120 along the X direction. The heat sink 120 can dissipate heat from both sides of the first magnetic devices 140 in the X direction. There are also two other receiving slots 183, located on both sides of another channel 1811 along the X direction. The two other receiving slots 183 are used to accommodate the two first magnetic devices 140 respectively. The other channel 1811 can dissipate heat from both sides of the first magnetic devices 140 in the X direction, thus improving the heat dissipation effect of the first magnetic devices 140.

[0148] In one embodiment, see Figure 16 , Figure 19 and Figure 20 As shown, Figure 19 This is a schematic diagram showing the relationship between the housing and the heat sink provided in an embodiment of this application. Figure 20This is a top view of the housing and heat sink provided in an embodiment of this application. The housing 180 includes two recesses 184, which are arranged opposite each other along a direction perpendicular to the arrangement of the power module 130 and the first magnetic device 140. The length of the heat sink 120 along the direction in which the two recesses 184 are arranged opposite each other is greater than or equal to the distance between the inner walls of the two recesses 184 and less than or equal to the distance between the outer walls of the two recesses 184. The two recesses 184 are used to accommodate a portion of the heat sink 120. In this embodiment, the two recesses 184 are arranged opposite each other along the Y direction. The length of the heat sink 120 along the Y direction is D2, the distance between the inner walls of the two recesses 184 along the Y direction is A1, and the distance between the outer walls of the two recesses 184 is A2. D2 is greater than or equal to A1 and less than or equal to A2, thereby ensuring that the two sides of the heat sink 120 in the Y direction can be respectively located within the two recesses 184, so that the two recesses 184 can accommodate and support the heat sink 120. The heat sink 120 is accommodated in two grooves 184 on both sides in the Y direction. The two grooves 184 can provide space for the heat sink 120. The heat sink 120 can extend out of a receiving groove 181 of the housing 180 through the two grooves 184. The length of the heat sink 120 in the Y direction is increased by the length of the two grooves 184. Compared with the heat sink 120 being completely located in a receiving groove 181 of the housing 180, the length of the heat sink 120 in the Y direction is increased, the heat dissipation area of ​​the heat sink 120 is increased, and the heat dissipation efficiency and heat dissipation effect of the heat sink 120 can be improved.

[0149] In one embodiment, the length of the heat sink 120 along the direction perpendicular to the two grooves 184 is less than or equal to the distance between the inner walls of the two grooves 184. In this embodiment, the direction perpendicular to the two grooves 184 is the X direction, the length of the heat sink 120 along the X direction is D1, and the distance between the inner walls of the two grooves 184 along the X direction is A3. D1 is less than or equal to A3, thereby ensuring that the heat sink 120 is smoothly installed into the grooves 184 without interfering with the grooves 184.

[0150] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A vehicle charger for charging and discharging the power battery of an electric vehicle, characterized in that, The device includes a circuit board and a heat sink. The circuit board supports the power module and a first magnetic component of the vehicle charger. The height of the power module is less than the height of the first magnetic component along the thickness direction of the circuit board. The power module and the first magnetic device are located on the same side of the thickness direction of the circuit board. The circuit board, the power module and the heat sink are stacked sequentially along the thickness direction of the circuit board. The first magnetic device and the heat sink are arranged in a direction perpendicular to the thickness of the circuit board.

2. The vehicle charger according to claim 1, characterized in that, The number of the first magnetic devices is at least two. Along the arrangement direction of the two first magnetic devices, the length of the heat sink is less than or equal to the distance between the two first magnetic devices, and the heat sink is located between the two first magnetic devices.

3. The vehicle charger according to claim 2, characterized in that, Along the direction of the heat sink toward either of the two first magnetic devices, the distance between the heat sink and the first magnetic device is less than or equal to the distance between the power module and the first magnetic device.

4. The vehicle charger according to claim 2 or 3, characterized in that, The first magnetic device includes magnetic components for a DC filter and magnetic components for an AC filter.

5. The vehicle charger according to any one of claims 1-4, characterized in that, Along a direction perpendicular to the arrangement of the power module and the first magnetic device, the length of the power module is less than or equal to the length of the heat sink.

6. The vehicle charger according to any one of claims 1-5, characterized in that, The vehicle charger includes a thermally conductive layer, and the power module, the thermally conductive layer, and the heat sink are arranged sequentially along the thickness direction of the circuit board.

7. The vehicle charger according to any one of claims 1-6, characterized in that, The vehicle charger includes a second magnetic device, and the power module, the heat sink, and the second magnetic device are arranged sequentially along the thickness direction of the circuit board.

8. The vehicle charger according to claim 7, characterized in that, The projections of the first magnetic device and the second magnetic device along a direction perpendicular to the thickness of the circuit board at least partially overlap.

9. The vehicle charger according to claim 7 or 8, characterized in that, The heat sink includes a channel, and the inner wall of the channel includes an opening. The opening is located on the side of the channel away from the circuit board along the thickness direction of the circuit board, and on the side of the second magnetic device along the direction perpendicular to the power module and the arrangement direction of the second magnetic device. The opening is used to penetrate the inner wall of the channel along the thickness direction of the circuit board and to allow coolant to flow through.

10. The vehicle charger according to any one of claims 7-9, characterized in that, The vehicle charger includes another thermally conductive layer, and the heat sink, the other thermally conductive layer, and the second magnetic device are arranged sequentially along the thickness direction of the circuit board.

11. The vehicle charger according to claim 9, characterized in that, The housing of the vehicle charger includes a receiving slot for accommodating the heat sink. The bottom wall of the receiving slot includes another channel, and the inner wall of the other channel includes another opening. The other opening is located on the side of the other channel facing the heat sink along the thickness direction of the circuit board. The other opening is used to penetrate the inner wall of the other channel along the thickness direction of the circuit board and to communicate with the first opening.

12. The vehicle charger according to claim 11, characterized in that, The bottom wall of one receiving slot includes another receiving slot. The other channel and the other receiving slot are arranged sequentially along the arrangement direction of the power module and the first magnetic device. The circuit board, the first magnetic device and the bottom wall of the other receiving slot are arranged sequentially along the thickness direction of the circuit board. The other receiving slot is used to accommodate the first magnetic device.

13. The vehicle charger according to claim 11 or 12, characterized in that, The housing includes two grooves, which are arranged opposite each other in a direction perpendicular to the arrangement of the power module and the first magnetic device. The length of the heat sink is greater than or equal to the distance between the inner walls of the two grooves and less than or equal to the distance between the outer walls of the two grooves in the direction in which the two grooves are arranged opposite each other. The two grooves are used to accommodate part of the heat sink.

14. A powertrain, characterized in that, The device includes a housing and an on-board charger as described in any one of claims 1-13, wherein the electrical control slot of the housing is used to accommodate the on-board charger.

15. An electric vehicle, characterized in that, The electric vehicle includes a power battery and the powertrain as described in claim 14, and the on-board charger is used to charge and discharge the power battery.

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