Heat plate and electronic device

Abstract

This utility model relates to the field of electronic equipment technology, providing a heat spreader and an electronic device. The heat spreader includes: a shell, a flow guiding structure, a capillary structure, and a working medium; a receiving cavity is formed within the shell; the flow guiding structure is disposed in the receiving cavity, forming an evaporation zone and multiple fluid channels communicating with the evaporation zone within the area defined by the flow guiding structure; the capillary structure and the working medium are respectively disposed in the receiving cavity, with at least a portion of the capillary structure located within the area defined by the flow guiding structure; a condensation zone is formed on the side of each fluid channel away from the evaporation zone. In the heat dissipation operation of the heat spreader, this utility model can transport the gaseous working medium generated in the evaporation zone along different fluid channels, achieving heat dissipation along multiple heat dissipation paths, thereby effectively improving the heat dissipation efficiency of the heat spreader.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and in particular to a heat spreader and electronic equipment. Background Technology

[0002] In the field of electronic equipment, with the continuous increase in the integration of electronic components and the gradual increase in operating power, heat dissipation has become one of the key factors restricting the improvement of equipment performance and reliability. Traditional heat dissipation methods, such as air cooling and heat conduction, are often insufficient to meet the heat dissipation requirements of heat-generating components such as high heat flux density chips.

[0003] As a highly efficient heat dissipation device, vapor chambers are increasingly widely used in electronic device cooling systems due to their excellent thermal conductivity and temperature uniformity. However, in practical applications, it has been found that existing vapor chambers have a single heat dissipation path, such as mostly using unidirectional heat transfer, which makes it difficult to effectively improve heat dissipation efficiency and thus cannot meet the ever-evolving heat dissipation requirements of electronic devices. Utility Model Content

[0004] This invention provides a heat spreader and an electronic device to at least solve or improve the problem that heat spreaders in the prior art have a single heat dissipation path and are difficult to effectively improve heat dissipation efficiency.

[0005] In a first aspect, the present invention provides a heat spreader plate, comprising:

[0006] A housing having a receiving cavity formed within it;

[0007] A flow guiding structure is provided in the receiving cavity, and an evaporation zone and multiple fluid channels communicating with the evaporation zone are formed within the area defined by the flow guiding structure.

[0008] The capillary structure and the working medium are respectively disposed in the receiving cavity, and at least a portion of the capillary structure is located within the area defined by the flow guiding structure;

[0009] The heat spreader has a condensation zone on the side of each fluid channel away from the evaporation zone.

[0010] According to the present invention, a heat spreader plate is provided in which at least two of the fluid channels have different flow directions.

[0011] According to the heat spreader provided by this utility model, the fluid channel includes:

[0012] A first channel, wherein a first end of the first channel is connected to the evaporation zone, and a second end of the first channel extends along a first direction;

[0013] The second channel has a first end connected to the evaporation zone and a second end extending along a second direction.

[0014] Wherein, the first direction and the second direction are perpendicular.

[0015] According to the present invention, a heat spreader plate is provided, the shell comprising: a first cover plate and a second cover plate, the first cover plate and the second cover plate being stacked and arranged to form the receiving cavity between the first cover plate and the second cover plate;

[0016] The heat spreader further includes: a plurality of first support columns, which are located within the area defined by the flow guiding structure and supported between the first cover plate and the second cover plate;

[0017] The first support column is provided with a flow guide groove, which is used to guide the working medium from the evaporation zone to each of the fluid channels.

[0018] According to the present invention, a heat spreader plate further includes:

[0019] A plurality of second support columns are located outside the area defined by the flow guiding structure and are supported between the first cover plate and the second cover plate.

[0020] According to the present invention, a heat spreader plate is provided, wherein the flow guiding structure, the first support column and the second support column are respectively disposed on one side of the first cover plate facing the second cover plate, and the capillary structure is disposed on one side of the second cover plate facing the first cover plate.

[0021] In a second aspect, the present invention also provides an electronic device, comprising: a housing, a heating element, and a heat spreader as described above;

[0022] The heating element and the heat spreader are respectively disposed inside the outer casing, and the heating element is connected to the heat spreader at a position corresponding to the evaporation zone.

[0023] According to the heat spreader provided by this utility model, it further includes:

[0024] A heat-conducting sheet having multiple overlapping portions, wherein the multiple overlapping portions are connected one-to-one with the positions of the heat spreader corresponding to multiple condensation zones;

[0025] The outer casing has a heat-conducting back plate, and the heat-conducting sheet is connected to the heat-conducting back plate.

[0026] According to the present invention, a heat spreader is provided, wherein the heat spreader and the heat-conducting back plate are connected.

[0027] According to the present invention, a heat spreader plate is provided, wherein the heat-conducting sheet is a graphite sheet.

[0028] The heat spreader and electronic device provided by this utility model can define multiple fluid channels for connecting the same evaporation zone and different condensation zones by setting a flow guiding structure inside the heat spreader housing. During the heat dissipation operation of the heat spreader, the gaseous working medium generated in the evaporation zone can be transported along different fluid channels to achieve the purpose of heat dissipation along multiple heat dissipation paths, thereby effectively improving the heat dissipation efficiency of the heat spreader. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 This is an exploded view of the heat spreader provided by this utility model.

[0031] Figure 2 This is a schematic diagram of the flow guiding structure provided by this utility model installed inside the heat spreader.

[0032] Figure 3 This is a schematic diagram showing the arrangement of the first support column relative to the flow guiding structure provided by this utility model.

[0033] Figure 4 This is one of the schematic diagrams of the electronic device provided by this utility model.

[0034] Figure 5 This is the second schematic diagram of the electronic device provided by this utility model.

[0035] Figure label:

[0036] 1. Heat spreader; 101. Evaporation zone; 102. Fluid channel; 103. Condensation zone; 11. Shell; 111. First cover plate; 112. Second cover plate; 12. Flow guiding structure; 13. First support column; 131. Flow guiding groove; 14. Second support column; 2. Heating element; 3. Heat-conducting plate; 31. Overlapping part; 4. Outer shell; 41. Heat-conducting back plate. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0038] The following is combined Figures 1-5 The heat spreader and electronic device provided in the utility model embodiments will be described in detail through specific implementation examples and application scenarios.

[0039] In the first aspect, such as Figure 1 and Figure 2 As shown, this embodiment of the utility model provides a heat spreader 1, comprising: a shell 11, a flow guiding structure 12, a capillary structure, and a working medium; wherein, the capillary structure and the working medium are in... Figure 1 It is not specifically shown in the text;

[0040] A receiving cavity is formed inside the shell 11, and a flow guiding structure 12 is disposed in the receiving cavity. An evaporation zone 101 and a plurality of fluid channels 102 communicating with the evaporation zone 101 are formed in the area defined by the flow guiding structure 12.

[0041] The capillary structure and the working medium are respectively located in the receiving cavity, and at least part of the capillary structure is located within the area defined by the flow guiding structure 12;

[0042] In this process, a condensation zone 103 is formed on the side of each fluid channel 102 away from the evaporation zone 101.

[0043] It is understandable that the heat spreader 1 is a heat dissipation device that uses the phase change cycle of the working medium to dissipate heat from the heat source inside the electronic device (such as the main chip and other heat-generating components). Its working process mainly includes four stages: evaporation, convection, condensation and reflux.

[0044] During the evaporation stage, the liquid working medium absorbs heat in the evaporation zone 101 and transforms into a gaseous working medium. During the convection stage, the gaseous working medium flows from the evaporation zone 101 to the condensation zone 103 along the fluid channels 102. During the condensation stage, the gaseous working medium rapidly condenses into a liquid working medium upon contact with the capillary structure of the condensation zone 103 and releases heat. During the reflux stage, the liquid working medium returns from the condensation zone 103 to the evaporation zone 101 along the capillary structure using capillary suction, thus completing a complete phase change cycle of the working medium.

[0045] In practical applications, the capillary structure is usually set in the receiving cavity of the shell 11 in the form of a sheet structure. At least one end of the capillary structure should be located in the evaporation zone 101 and the other end should be located in the condensation zone 103. The capillary structure can be made of copper mesh or copper powder sintered body with a certain porosity, and there is no specific limitation. The working medium can be water, acetone, ethanol, etc., and there is no specific limitation.

[0046] Additionally, the flow guiding structure 12 can employ ribs to enclose the evaporation zone 101 and multiple fluid channels 102 communicating with the evaporation zone 101 within the receiving cavity. The flow guiding direction of each fluid channel 102 can be set to be the same or different, without specific limitation.

[0047] As can be seen from the above, the heat spreader 1 shown in this utility model, by setting a flow guiding structure 12 in the shell 11, can define multiple fluid channels 102 in the shell 11 for connecting the same evaporation zone 101 and different condensation zones 103. During the heat dissipation operation of the heat spreader 1, the gaseous working medium generated in the evaporation zone 101 can be transported along different fluid channels 102 respectively, so as to achieve the purpose of heat dissipation along multiple heat dissipation paths, thereby effectively improving the heat dissipation efficiency of the heat spreader 1.

[0048] In some embodiments, at least two fluid channels 102 have different flow directions.

[0049] It is understandable that the number of fluid channels 102 is greater than two. In practical applications, according to the heat dissipation requirements of the heat spreader 1, at least two of the fluid channels 102 can be configured to have different flow directions, while the other fluid channels 102 can have the same flow direction.

[0050] Of course, it is also possible to set all fluid channels 102 to have different flow directions, for example, each fluid channel 102 is radially distributed relative to the evaporation zone 101.

[0051] In some embodiments, such as Figure 2 As shown, in order to simplify the internal structure of the heat spreader 1 and reduce the difficulty of laying out the flow guiding structure 12, the number of fluid channels 102 can be set to two while meeting the actual heat dissipation requirements. For example, the fluid channel 102 includes: a first channel and a second channel, the first end of the first channel is connected to the evaporation zone 101, and the second end of the first channel extends along a first direction;

[0052] The first end of the second channel is connected to the evaporation zone 101, and the second end of the second channel extends along the second direction; wherein the first direction and the second direction are perpendicular.

[0053] It should be noted that in the fluid channel 102 configured as a first channel and a second channel, the flow guiding structure 12 includes a first rib and a second rib, the first rib and the second rib enclose an evaporation zone 101, the first end of the first rib and the first end of the second rib are close to each other to define the first channel, and the second end of the first rib and the second end of the second rib are close to each other to define the second channel.

[0054] In some embodiments, such as Figure 1 As shown, the housing 11 includes a first cover plate 111 and a second cover plate 112, which are stacked together and form a receiving cavity between them.

[0055] For example, both the first cover plate 111 and the second cover plate 112 can be metal copper plates. The structures of the first cover plate 111 and the second cover plate 112 are roughly the same, and both can be configured as caps. The cover edge of the first cover plate 111 and the cover edge of the second cover plate 112 can be connected by welding or bonding to form a receiving cavity between the first cover plate 111 and the second cover plate 112.

[0056] At the same time, such as Figure 3 As shown, the heat spreader 1 further includes: a plurality of first support columns 13, which are located within the area defined by the flow guiding structure 12 and supported between the first cover plate 111 and the second cover plate 112; wherein, the first support columns 13 are provided with flow guiding grooves 131, which are used to guide the working medium from the evaporation zone 101 to each fluid channel 102. Figure 3 Arrows are used to indicate the flow direction of the gaseous working medium in its respective fluid channel 102 under the auxiliary guidance of the guide groove 131.

[0057] It is understood that the first support column 13 can be a metal pillar, such as a copper pillar. Multiple first support columns 13 are located in the receiving cavity of the heat spreader 1, spaced apart from each other within the area defined by the flow guiding structure 12, and can be arranged in an array.

[0058] In practical applications, since multiple first support columns 13 are provided within the area defined by the flow guiding structure 12, and each first support column 13 is provided with a flow guiding groove 131, while the gaseous working medium is guided by the fluid channel 102, the flow guiding characteristics of the flow guiding groove 131 on each first support column 13 are also used to further correct the flow direction of the gaseous working medium, and further accelerate the diffusion of the entire fluid in the heat spreader 1 according to the design direction.

[0059] At the same time, since each first support column 13 is provided with a guide groove 131, the contact area between the working medium and the first support column 13 can be increased, the heat conduction area can be expanded, and the heat dissipation effect of the heat spreader 1 can be enhanced.

[0060] In some embodiments, such as Figure 1 As shown, the heat spreader 1 also includes a plurality of second support columns 14, which are located outside the area defined by the flow guiding structure 12 and are supported between the first cover plate 111 and the second cover plate 112.

[0061] Understandably, in order to ensure the performance of the heat spreader 1, the heat spreader 1 is also equipped with a plurality of second support columns 14, which are located in the receiving cavity of the heat spreader 1 and provide support for the area between the first cover plate 111 and the second cover plate 112 outside the area defined by the flow guiding structure 12.

[0062] The second support column 14 can be a metal column, such as a copper column. Figure 1 The diagram illustrates multiple second support columns 14 arranged in an array on the exit side of the first channel.

[0063] In some embodiments, the flow guiding structure 12, the first support column 13 and the second support column 14 are respectively disposed on one side of the first cover plate 111 facing the second cover plate 112, and the capillary structure is disposed on one side of the second cover plate 112 facing the first cover plate 111.

[0064] It is understood that the flow guiding structure 12, the first support column 13 and the second support column 14 can be constructed on the side of the first cover plate 111 facing the second cover plate 112 by means of stamping, welding and sintering; correspondingly, the capillary structure can be constructed on the side of the second cover plate 112 facing the first cover plate 111 by means of etching or photolithography.

[0065] Thus, in practical applications, the assembly of the heat spreader 1 can be completed simply by welding or bonding the first cover plate 111 and the second cover plate 112 together. The operation is simple and convenient.

[0066] It should be noted that since the capillary structure is located on the side of the second cover plate 112 facing the first cover plate 111, after the assembly of the heat spreader 1 is completed, the flow guiding structure 12, the first support column 13 and the second support column 14 are respectively supported on the side of the capillary structure away from the second cover plate 112.

[0067] In the second aspect, such as Figure 4 and Figure 5 As shown, this utility model embodiment also provides an electronic device, including: a housing 4, a heating element 2, and a heat spreader 1 as described above;

[0068] The heating element 2 and the heat spreader 1 are respectively disposed inside the outer casing 4, and the heating element 2 and the heat spreader 1 are connected to the position corresponding to the evaporation zone 101.

[0069] Understandably, for electronic devices equipped with a display screen, the outer casing 4 is typically the rear casing of the electronic device, with the display screen mounted at the open end of the rear casing. A receiving space is formed between the display screen and the rear casing, and the heating element 2 and the heat spreader 1 are respectively disposed within the receiving space. The heating element 2 can be a heat source such as a chip or power supply within the electronic device.

[0070] Electronic devices can be mobile terminals, such as smartphones, learning machines, tablet personal computers, laptop computers, personal digital assistants (PDAs), mobile internet devices (MIDs), or wearable devices, or other electronic devices such as digital cameras, e-readers, and navigators, without specific limitations.

[0071] Since the electronic device includes a heat spreader 1, and the specific structure of the heat spreader 1 is as described in the above embodiments, the electronic device of this embodiment includes all the technical solutions of the above embodiments. Therefore, it has at least all the beneficial effects achieved by all the technical solutions of the above embodiments, which will not be described in detail here.

[0072] In some embodiments, such as Figure 4 and Figure 5 As shown, the electronic device also includes: a heat-conducting sheet 3, which has multiple overlapping portions 31, and the multiple overlapping portions 31 are connected one-to-one with the positions of the heat spreader 1 corresponding to the multiple condensation zones 103; wherein, the outer shell 4 has a heat-conducting back plate 41, and the heat-conducting sheet 3 and the heat-conducting back plate 41 are connected.

[0073] It is understood that the various condensation zones 103 of the heat spreader 1 can be arranged side by side on the same side of the heat spreader 1. Correspondingly, the various overlapping portions 31 of the heat conduction sheet 3 are arranged side by side and are respectively connected to the positions of the heat spreader 1 corresponding to the multiple condensation zones 103.

[0074] Meanwhile, the outer casing 4 can be made of metal so that a heat-conducting backplate 41 is formed on the back of the outer casing 4.

[0075] In practical applications, the heat generated by the heating element 2 is transferred to each condensation zone 103 of the heat spreader 1 via the heat spreader 1, and then transferred to the heat-conducting back plate 41 via the heat-conducting sheet 3. The heat-conducting back plate 41 is used for large-area heat dissipation, thereby achieving the purpose of rapid heat dissipation of the heating element 2.

[0076] Meanwhile, in order to enhance the heat dissipation effect on the heat-generating element 2, the heat spreader 1 and the heat-conducting backplate 41 can also be connected.

[0077] In some embodiments, the heat-conducting sheet 3 may be made of a material with a high thermal conductivity, such as a copper sheet, a copper-aluminum alloy sheet, a thermally conductive silicone sheet, a graphite sheet, etc., without specific limitations.

[0078] Considering that graphite is composed of carbon atoms, has a unique grain orientation and lamellar structure, conducts heat uniformly in two directions, and has a thermal conductivity of 150-1800W / m・K, it can quickly reduce the temperature of the location of the heat-generating element 2 in electronic devices, allowing heat to diffuse evenly. At the same time, it can also provide thermal insulation in the thickness direction to prevent excessive heat transfer to other components. Therefore, the heat-conducting sheet 3 is selected as a graphite sheet.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A heat spreader, characterized in that, include: A housing having a receiving cavity formed within it; A flow guiding structure is provided in the receiving cavity, and an evaporation zone and multiple fluid channels communicating with the evaporation zone are formed within the area defined by the flow guiding structure. The capillary structure and the working medium are respectively disposed in the receiving cavity, and at least a portion of the capillary structure is located within the area defined by the flow guiding structure; The heat spreader has a condensation zone on the side of each fluid channel away from the evaporation zone.

2. The heat spreader according to claim 1, characterized in that, At least two of the fluid channels have different flow directions.

3. The heat spreader according to claim 2, characterized in that, The fluid channel includes: A first channel, wherein a first end of the first channel is connected to the evaporation zone, and a second end of the first channel extends along a first direction; The second channel has a first end connected to the evaporation zone and a second end extending along a second direction. Wherein, the first direction and the second direction are perpendicular.

4. The heat spreader according to any one of claims 1 to 3, characterized in that, The housing includes: a first cover plate and a second cover plate, the first cover plate and the second cover plate being stacked and arranged to form the receiving cavity; The heat spreader further includes: a plurality of first support columns, which are located within the area defined by the flow guiding structure and supported between the first cover plate and the second cover plate; The first support column is provided with a flow guide groove, which is used to guide the working medium from the evaporation zone to each of the fluid channels.

5. The heat spreader according to claim 4, characterized in that, The heat spreader also includes: A plurality of second support columns are located outside the area defined by the flow guiding structure and are supported between the first cover plate and the second cover plate.

6. The heat spreader according to claim 5, characterized in that, The flow guiding structure, the first support column, and the second support column are respectively disposed on one side of the first cover plate facing the second cover plate, and the capillary structure is disposed on one side of the second cover plate facing the first cover plate.

7. An electronic device, characterized in that, include: The housing, the heating element, and the heat spreader as described in any one of claims 1 to 6; The heating element and the heat spreader are respectively disposed inside the outer casing, and the heating element is connected to the heat spreader at a position corresponding to the evaporation zone.

8. The electronic device according to claim 7, characterized in that, Also includes: A heat-conducting sheet having multiple overlapping portions, wherein the multiple overlapping portions are connected one-to-one with the positions of the heat spreader corresponding to multiple condensation zones; The outer casing has a heat-conducting back plate, and the heat-conducting sheet is connected to the heat-conducting back plate.

9. The electronic device according to claim 8, characterized in that, The heat spreader and the heat-conducting backplate are connected.

10. The electronic device according to claim 8, characterized in that, The heat-conducting sheet is a graphite sheet.

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