Power domain control structure and automobile

Abstract

The utility model belongs to electric drive controller technical field, propose a kind of power domain control structure and car, wherein a kind of power domain control structure, including cover and shell, the cover and shell composition is used to place the box of circuit component and electrical component, the electrical component is located the lower surface of circuit component, and circuit component and electrical component are electrically connected;The circuit component includes main control panel, shielding plate and drive power board installed in shell from top to bottom in proper order;The wall of shell is provided with heat dissipation water channel, and the heat dissipation water channel is located below electrical component;The utility model's power domain control structure is heat dissipated to the device of main control chip of main control panel and high voltage acquisition control area by setting shielding plate, by being provided with heat dissipation water channel on shell, and then realize the water cooling heat dissipation to electrical component, improve the heat dissipation efficiency, prevent circuit device from appearing over-temperature damage under extreme condition.

Description

Technical Field

[0001] This utility model belongs to the field of electric drive controller technology, and specifically relates to a power domain control structure and automobile. Background Technology

[0002] The vehicle E / E architecture, or vehicle electronic and electrical architecture, is the top-level design of the electronic and electrical systems in a car. It plans the composition, connection methods, and information interaction logic of the in-vehicle electronic and electrical systems, playing a crucial role in the vehicle's performance, functionality, and intelligence. The vehicle E / E architecture is evolving from distributed to centralized, and ultimately towards centralized computing. The functions of traditional ECUs (Electronic Control Units) are being redistributed, with 3-5 domain controllers leading the vehicle's functions (such as BMS (Battery Management System), MCU (Motor Control Unit), TMC (Traffic Message Channel), VCU (Vehicle Control Unit), etc., which will gradually be replaced by a unified controller).

[0003] However, the development of high-power electric drive products in the 200kW to 300kW range (corresponding to B to C-class vehicles) has not yet reached a significant scale, with only a few companies conducting research and design. One of the main reasons is that the application environment requirements of high-power power domain control bring the following challenges to structural design.

[0004] 1. The integration of the power domain control unit will bring about heat dissipation problems for the whole machine. The heat is mainly generated from two aspects: first, the heat generated by the main control chip and high-voltage acquisition and control area devices on the domain control motherboard; second, the heat generated by the high-voltage inverter electrical components, which include high-power devices such as silicon carbide, thin film capacitors and filters. Traditional electric drive controllers mainly consider the heat generated by the high-voltage inverter electrical components, but do not specifically cool the control board. This may lead to overheating and damage to circuit components under extreme operating conditions.

[0005] 2. Currently, there are two mainstream approaches to assembly structure design. One is a common board structure with high-voltage components laid horizontally, which can effectively reduce the volume in the Z direction, but increases the overall space occupied in the X and Y directions. The common board design also increases circuit design costs, heat dissipation difficulties, and the risk of EMC (Electromagnetic Compatibility) failure. The other is a separate board structure with high-voltage components arranged vertically. Although this can effectively reduce the volume in the X and Y directions, it increases the overall space occupied in the Z direction, making it inconvenient to arrange.

[0006] 3. The integration of the all-in-one power domain control unit will bring EMC problems to the whole machine, such as signal shielding between the domain control motherboard and the driver board, and shielding and isolation of the silicon carbide module by the high voltage filter.

[0007] To address the aforementioned issues, a power domain control structure that is small in size, has good heat dissipation, and provides good signal shielding is needed. Utility Model Content

[0008] To address the aforementioned problems, this utility model proposes a power domain control structure, including a cover plate and a housing. The cover plate and housing form a box for housing circuit components and electrical components. The electrical components are located on the lower surface of the circuit components, and the circuit components and electrical components are electrically connected. The circuit components include a main control board, a shielding plate, and a drive power board, which are installed sequentially from top to bottom in the housing. A heat dissipation channel is provided in the wall of the housing, and the heat dissipation channel is located below the electrical components.

[0009] Furthermore, the main control board is equipped with an MCU, a high-voltage sampling area, and a BMS control circuit area.

[0010] Furthermore, three first silicone pads are provided between the main control board and the shielding board, and the three first silicone pads are respectively installed on the lower surface of the MCU, the high voltage sampling area and the BMS control circuit area.

[0011] Furthermore, the main control board and the drive power board are electrically connected via a connecting cable.

[0012] Furthermore, the circuit assembly also includes a connecting harness, one end of which is electrically connected to the main control board, and the other end of which passes through a cavity on the shielding plate and is electrically connected to the drive power board.

[0013] Furthermore, the electrical components include a filter, a capacitor, a silicon carbide module, and a three-phase mounting bracket, which are horizontally mounted in sequence in the housing, with the filter located above the heat dissipation channel; the filter, capacitor, silicon carbide module, and three-phase mounting bracket are all electrically connected to the drive power board.

[0014] Furthermore, an aluminum plate is provided on the lower surface of the filter, and the aluminum plate is in contact with the inner surface of the housing through a second silicone pad.

[0015] Furthermore, a shielding cavity is provided in the housing, and the filter is installed in the shielding cavity.

[0016] Furthermore, an aluminum plate is provided on the lower surface of the capacitor, and the aluminum plate is in contact with the inner surface of the housing through a second silicone pad.

[0017] An automobile includes a body and the aforementioned power domain control structure, the power domain control structure being installed in the body.

[0018] The beneficial effects of this utility model are:

[0019] 1. The power domain control structure of this utility model dissipates heat from the main control chip and high-voltage acquisition and control area devices on the main control board by setting a shielding plate. By setting a heat dissipation water channel on the shell, water cooling is achieved for electrical components, which improves heat dissipation efficiency and prevents circuit devices from being damaged by overheating under extreme conditions.

[0020] 2. The circuit components of the power domain control structure of this utility model include a main control board, a shielding board, and a drive power board installed sequentially from top to bottom in the housing. The main control board is arranged parallel above the drive power board. This method will save about 50% of the space compared to integrating the main control board and the drive power board in the XY direction (integrating the main control board and the drive power board will introduce complex isolation circuits, thereby increasing the layout area), and reduce the space occupied by the power domain control unit in the XY direction of the whole vehicle.

[0021] 3. The electrical components of the power domain control structure of this utility model include a filter, a capacitor, a silicon carbide module and a three-phase mounting base installed sequentially in the housing, thereby achieving compression in the Z direction, reducing the height of the power domain control structure and reducing the space occupied by the power domain control unit in the Z direction of the whole vehicle.

[0022] 4. In the XY direction, the power domain control structure of this utility model uses a two-stage filter at the input end to filter the DC signal first, and a shielding cavity is designed on the housing to separate the filter from the capacitor and silicon carbide module to reduce interference between high and low voltage signals; in the Z direction, a shielding plate is added between the main control board and the drive power board to reduce the interference of the lower electrical components to the upper main control board.

[0023] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the structures pointed out in the description and the accompanying drawings. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 An exploded view of the power domain control structure at a first angle in an embodiment of this utility model is shown.

[0026] Figure 2 An exploded view of the power domain control structure from a second angle is shown in an embodiment of this utility model.

[0027] Figure 3 A schematic diagram of the structural position of the power domain control structure in an embodiment of this utility model is shown.

[0028] Figure 4 A schematic diagram of the circuit components of the power domain control structure in an embodiment of this utility model is shown.

[0029] Figure 5 An exploded view of the circuit components of the power domain control structure in an embodiment of this utility model is shown.

[0030] Figure 6 A schematic diagram of the main control board of the power domain control structure in an embodiment of this utility model is shown.

[0031] Figure 7 A schematic diagram of the shielding plate of the power domain control structure in an embodiment of this utility model is shown.

[0032] Figure 8 A schematic diagram showing the installation positions of the electrical components of the power domain control structure in an embodiment of this utility model is provided.

[0033] Figure 9 A schematic diagram of the housing of the power domain control structure in an embodiment of this utility model is shown.

[0034] Figure 10 The diagram shows a first cross-sectional view of the power domain control structure in an embodiment of this utility model.

[0035] Figure 11 The diagram shows a second cross-sectional view of the power domain control structure in an embodiment of this utility model.

[0036] Figure 12 A schematic diagram of the overall structural layout of the power domain control structure in an embodiment of this utility model is shown.

[0037] In the diagram, 10 is the cover plate;

[0038] 20. Circuit assembly; 21. Main control board; 22. First silicone pad; 23. Shielding plate; 231. Cavity; 24. Drive power board; 25. Connecting harness; 26. Connecting ribbon cable;

[0039] 30. Electrical components; 31. Silicon carbide module; 32. Aluminum plate; 33. Second silicone pad; 36. Capacitor; 37. Filter; 38. Three-phase mounting bracket;

[0040] 40. Housing; 41. Shielding cavity; 42. Heat dissipation channel. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0042] Example 1,

[0043] refer to Figure 1 A power domain control structure includes a cover plate 10 and a housing 40. The cover plate 10 and the housing 40 form a box for housing a circuit assembly 20 and an electrical assembly 30. The electrical assembly 30 is located on the lower surface of the circuit assembly 20, and the circuit assembly 20 and the electrical assembly 30 are electrically connected. The circuit assembly 20 includes a main control board 21, a shielding plate 23, and a drive power board 24 (see reference) which are installed sequentially from top to bottom in the housing 40. Figure 4 A heat dissipation channel 42 is provided in the wall of the housing 40, and the heat dissipation channel 42 is located below the electrical component 30.

[0044] Specifically, this utility model integrates the circuit component 20 and the electrical component 30 together and places them in the housing 40, achieving small-volume integration, thereby increasing the space for battery cell installation and the interior space for driving and riding, and improving the driving experience.

[0045] refer to Figure 2 This utility model mainly consists of four main components: a cover plate 10, a circuit assembly 20, an electrical assembly 30, and a housing 40. The circuit assembly 20 mainly consists of a main control board 21, a shielding plate 23, and a drive power board 24, which are arranged in a vertical and parallel manner. To ensure reliable communication between the main control board 21 and the drive power board 24 after arrangement, the upper and lower boards are connected by high-voltage signal connector harnesses (i.e., connecting harnesses 25) and low-voltage signal connecting cables (i.e., connecting cables 26) on both sides respectively.

[0046] Furthermore, by setting up a shielding plate 23 to dissipate heat from the main control chip and the high-voltage acquisition and control area of ​​the main control board 21, and by setting up a heat dissipation channel 42 on the housing 40, heat dissipation of the electrical components 30 is achieved, thereby improving heat dissipation efficiency; specifically, in order to cool the main control board 21, a shielding plate 23 is designed to conduct heat to the main heat-generating component areas (such as MCU (Motor Control Unit), high-voltage sampling area and BMS (Battery Management System) area) on the main control board 21; thus solving the heat dissipation problem of the main control board 21 caused by the integration of the assembly.

[0047] refer to Figure 6 The main control board 21 is equipped with an MCU, a high-voltage sampling area, and a BMS control circuit area. Specifically, in order to cool the main control board 21, a first silicone pad 22 is designed to conduct heat to the main heat-generating component areas (such as the MCU (Motor Control Unit), the high-voltage sampling area, and the BMS (Battery Management System) area) on the main control board 21.

[0048] refer to Figure 5 Three first silicone pads 22 are disposed between the main control board 21 and the shielding board 23. The three first silicone pads 22 are respectively mounted on the lower surface of the MCU, the high-voltage sampling area, and the BMS control circuit area. Specifically, refer to Figure 3 The main heat-generating areas in the main control board 21 are the MCU, the high-voltage sampling area, and the BMS control circuit area. For these three areas, mounting bosses corresponding to the first silicone pad 22 are designed on the shielding plate 23. The first silicone pad 22 is installed on the mounting boss, so that the heat-generating devices in the corresponding areas can transfer heat to the housing 40 through the shielding plate 23.

[0049] refer to Figure 4 The main control board 21 and the drive power board 24 are electrically connected via a connecting cable 26. Specifically, to ensure normal signal interaction between the main control board 21 and the drive power board 24 after they are separated into boards, the upper and lower boards are connected by connecting harnesses 25 and connecting cables 26 on both sides. In the Z-axis direction, to compensate for the increased space caused by the separate board arrangement, the lower electrical components 30 are arranged horizontally to further reduce the Z-axis occupancy, making the overall size concentrated and uniform. Specifically, the connecting harness 25 is a high-voltage signal connector harness, and the connecting cable 26 is a low-voltage signal connecting cable.

[0050] refer to Figure 7The circuit assembly 20 also includes a connecting harness 25. A cavity 231 is provided on the shielding plate 23. One end of the connecting harness 25 is electrically connected to the main control board 21, and the other end passes through the cavity 231 and is electrically connected to the drive power board 24. Specifically, the shielding plate 23 creates a cavity (cavity 231) in the connection area of ​​the connecting harness 25 between the two boards, which ensures both signal shielding and reliable harness connection.

[0051] refer to Figure 8 The electrical component 30 includes a filter 37, a capacitor 36, a silicon carbide module 31, and a three-phase mounting base 38, which are horizontally mounted sequentially within the housing 40. The filter 37 is located above the heat dissipation channel 42. The filter 37, capacitor 36, silicon carbide module 31, and three-phase mounting base 38 are all electrically connected to the drive power board 24. Specifically, the electrical component 30 mainly consists of the filter 37, capacitor 36, silicon carbide module 31, and three-phase mounting base 38, which are arranged horizontally. This solves the challenge of structural heat dissipation design in high-power applications of the power domain controller, namely, both the circuit component 20 and the electrical component 30 require a reasonable structural arrangement for heat conduction to ensure the reliable operation of the entire unit in high-power applications.

[0052] Furthermore, to reduce the space occupied by the power domain control unit in the vehicle's overall space, the shared integrated circuit board is designed as a separate board in the XY direction, consisting of a main control board 21 and a drive power board 24, with the main control board 21 arranged parallel above the drive power board 24. This approach saves approximately 50% of the space compared to integrating the main control board 21 and the drive power board 24 in the XY direction (integrating the main control board 21 and the drive power board 24 would introduce complex isolation circuits, thus increasing the layout area).

[0053] Furthermore, in the XY direction, a two-stage filter 37 is used at the input to first filter the DC signal, and a shielding cavity 41 is designed on the housing 40 (see reference). Figure 9 The filter 37 is isolated from the capacitor 36 and the silicon carbide module 31, and the electrical components 30 are isolated from the motor resolver low-voltage wiring harness to reduce interference between high and low voltage signals. In the Z-direction direction, a shielding plate 23 is added between the main control board 21 and the drive power board 24 to reduce the interference of the lower electrical components 30 to the upper main control board 21.

[0054] refer to Figure 11 The housing 40 contains a shielding cavity 41, and a filter 37 is installed in the shielding cavity 41. Specifically, this solves the overall EMC (Electromagnetic Compatibility) problem caused by the integration of chip-level power domain control, ensuring that the signal interference between the main control board 21 and the electrical components 30 is within the normal required level, and realizing the integration of multiple control functions.

[0055] Specifically, the connecting harness 25 directly contacts the parallel cooling water channel 42 for heat dissipation. For the capacitor 36 and the filter 37, heat is indirectly conducted to the housing 40 by means of an aluminum plate 32 and a second silicone pad 33, respectively. The housing 40 is a water-cooled housing.

[0056] refer to Figure 10 An aluminum plate 32 is disposed on the lower surface of capacitor 36, and the aluminum plate 32 contacts the inner surface of housing 40 through a second silicone pad 33. (Reference) Figure 7 An aluminum plate 32 is provided on the lower surface of the filter 37, and the aluminum plate 32 contacts the inner surface of the housing 40 through the second silicone pad 33.

[0057] Specifically, the connecting harness 25 directly contacts the parallel cooling water channel 42 for heat dissipation. For the capacitor 36 and filter 37, heat is indirectly conducted to the housing 40 by using an aluminum plate 32 with a second silicone pad 33.

[0058] Furthermore, the silicon carbide module 31 directly contacts the parallel heat dissipation channel 42 for heat dissipation. For the capacitor 36 and filter 37, heat is indirectly conducted to the housing 40 using an aluminum plate 32 and a second silicone pad 33, respectively (the capacitor 36 dissipates heat through its bottom aluminum plate 32 and copper busbar heat dissipation pad in contact with the corresponding second silicone pad 33 on the housing 40; the filter 37 dissipates heat through its own copper busbar heat dissipation pad in contact with the corresponding second silicone pad 33 on the housing 40 at its input end).

[0059] In the above embodiments, another optional implementation is that, in order to reduce the space occupied by the circuit components 20 in the vehicle space and to leverage the advantages of domain control integration, the power domain control needs to uniformly reserve sufficient cell storage space and passenger storage space for the battery pack in the X, Y, and Z directions. This utility model provides an integrated structural design scheme for the power domain control unit, offering a new approach to the overall thermal design and EMC shielding design. Due to its deep integration of functions such as BMS (Battery Management System), MCU (Motor Control Unit), TMC (Traffic Message Channel), and VCU (Vehicle Control Unit), it can achieve integrated power domain control of the entire vehicle chassis. Simultaneously, the domain control unit equipped with an 800V silicon carbide power module can significantly improve system efficiency, and combined with a high-performance oil-cooled motor, it can also meet the drive requirements of rear-wheel-drive pure electric vehicles of Class B and above.

[0060] refer to Figure 12In the XY direction, the input end uses a two-stage filter 37 to filter the DC signal first. A metal shielding cavity 41 is designed on the main housing to isolate the filter 37 from the capacitor 36 and the silicon carbide module 31, and at the same time to isolate the electrical components 30 from the motor resolver low-voltage wiring harness (connecting wiring harness 25 and connecting ribbon cable 26), reducing interference between high and low voltage signals. In the Z direction, a shielding plate 23 is added between the main control board 21 and the drive power board 24 to reduce the interference of the lower electrical components 30 to the upper main control board 21. Specifically, the connection area of ​​the shielding plate 23 between the two boards is made open, which ensures both signal shielding and reliable installation of the wiring harness connection.

[0061] Example 2,

[0062] An automobile includes a body and a power domain control structure of embodiment 1, the power domain control structure being installed in the body.

[0063] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A dynamic domain control structure, characterized in that, The device includes a cover plate (10) and a housing (40), which together form a box for housing a circuit assembly (20) and an electrical assembly (30). The electrical assembly (30) is located on the lower surface of the circuit assembly (20), and the circuit assembly (20) and the electrical assembly (30) are electrically connected. The circuit assembly (20) includes a main control board (21), a shielding plate (23), and a drive power board (24) installed in the housing (40) from top to bottom. A heat dissipation channel (42) is provided in the wall of the housing (40), and the heat dissipation channel (42) is located below the electrical assembly (30).

2. The dynamic domain control structure according to claim 1, characterized in that, The main control board (21) is equipped with an MCU, a high-voltage sampling area and a BMS control circuit area.

3. The dynamic domain control structure according to claim 2, characterized in that, Three first silicone pads (22) are provided between the main control board (21) and the shielding plate (23). The three first silicone pads (22) are respectively installed on the lower surface of the MCU, the high voltage sampling area and the BMS control circuit area.

4. The dynamic domain control structure according to claim 1, characterized in that, The main control board (21) and the drive power board (24) are electrically connected via a connecting cable (26).

5. The dynamic domain control structure according to claim 1, characterized in that, The circuit assembly (20) also includes a connecting harness (25), one end of which is electrically connected to the main control board (21), and the other end passes through the cavity (231) on the shielding plate (23) and is electrically connected to the drive power board (24).

6. The dynamic domain control structure according to claim 1, characterized in that, The electrical components (30) include a filter (37), a capacitor (36), a silicon carbide module (31) and a three-phase mounting bracket (38) that are horizontally mounted in the housing (40) in sequence, and the filter (37) is located above the heat dissipation channel (42); the filter (37), capacitor (36), silicon carbide module (31) and three-phase mounting bracket (38) are all electrically connected to the drive power board (24).

7. A dynamic domain control structure according to claim 6, characterized in that, An aluminum plate (32) is provided on the lower surface of the filter (37), and the aluminum plate (32) contacts the inner surface of the housing (40) through a second silicone pad (33).

8. A dynamic domain control structure according to claim 6 or 7, characterized in that, The housing (40) is provided with a shielding cavity (41), and the filter (37) is installed in the shielding cavity (41).

9. A dynamic domain control structure according to claim 6, characterized in that, An aluminum plate (32) is provided on the lower surface of the capacitor (36), and the aluminum plate (32) is in contact with the inner surface of the housing (40) through a second silicone pad (33).

10. A car, characterized in that, The vehicle includes a vehicle body and the power domain control structure according to any one of claims 1-9, wherein the power domain control structure is installed in the vehicle body.

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