Heat dissipation structure of vehicle-mounted device, vehicle-mounted device and vehicle

Abstract

This application relates to a heat dissipation structure for vehicle-mounted equipment, vehicle-mounted equipment, and vehicles, belonging to the field of vehicle technology, to solve the technical problem of poor stability in the connection between the circuit board and the heat dissipation structure of vehicle-mounted electronic devices in related technologies. The heat dissipation structure provided by this application includes a circuit board, a base, a heat-conducting component, and an air-cooling assembly. The circuit board includes a heat source portion, and the heat-conducting component and the heat source portion of the circuit board assembly are thermally connected. The air-cooling assembly and the circuit board are respectively disposed on opposite sides of the heat-conducting component along a first direction, and are thermally connected. The air intake direction of the air-cooling assembly is consistent with the first direction. The side of the heat-conducting component away from the air-cooling assembly is between the base and the base. The base and the heat-conducting component form a receiving cavity, and the circuit board is housed within the receiving cavity.

Description

Technical Field

[0001] This application relates to the field of vehicle technology, specifically to the heat dissipation structure of vehicle-mounted equipment, vehicle-mounted equipment, and vehicles. Background Technology

[0002] In the era of rapid iteration of intelligent technology, electronic devices, with their powerful functions and high integration, are widely used in various terminal devices, especially in the vehicle field.

[0003] For example, the rapid development of autonomous driving technology has led to the integration of a large number of intelligent devices and systems into vehicles, such as sensors, controllers, and computing units. These devices generate a lot of heat during operation.

[0004] However, current heat dissipation designs for electronic devices have limitations, neglecting the stability of the connection between the circuit board and the heat dissipation structure. Utility Model Content

[0005] The purpose of this utility model is to provide a heat dissipation structure for vehicle-mounted equipment, vehicle-mounted equipment, and vehicle, so as to solve the technical problem of poor stability of the connection between the circuit board and the heat dissipation structure of vehicle-mounted electronic equipment in related technologies.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] According to the first aspect of this application, this application provides a heat dissipation structure for an in-vehicle device. The heat dissipation structure includes a circuit board, a base, a heat conductor, and an air-cooling assembly. The circuit board includes a heat source portion. The heat conductor is thermally connected to the heat source portion of the circuit board assembly. The air-cooling assembly and the circuit board are respectively disposed on opposite sides of the heat conductor along a first direction. The air-cooling assembly is thermally connected to the heat conductor. The air intake direction of the air-cooling assembly is consistent with the first direction. The side of the heat conductor away from the air-cooling assembly is connected to the base. The base and the heat conductor form a receiving cavity, and the circuit board is housed within the receiving cavity.

[0008] According to the above technical means, the heat dissipation structure involved in this application is thermally connected to the heat source part of the circuit board through the heat-conducting component, which can quickly conduct the heat generated by the heat source part of the circuit board to the heat-conducting component, thereby achieving efficient heat dissipation. The air-cooling component and the circuit board are respectively arranged on opposite sides of the heat-conducting component along the first direction and are thermally connected to the heat-conducting component, forming a heat dissipation layout with cold and heat separation, so that heat can be directionally transferred to the air-cooling component through the heat-conducting component.

[0009] Meanwhile, the air intake direction of the air-cooled component is consistent with the first direction, allowing the airflow to directly act on the air-cooled component along the heat conduction direction of the heat-conducting component. This optimizes the airflow path, enhances the heat dissipation effect on the heat-conducting component, and thus meets the requirements of efficient heat dissipation for electronic devices. Furthermore, air cooling reduces the overall cost of the vehicle-mounted equipment, and this application further ensures the stability of the circuit board mounting through the base.

[0010] In one possible implementation, the heat dissipation structure further includes a support frame, which is disposed on the bottom surface of the base and is correspondingly connected to the heat source part, and the support frame is used to support the heat source part.

[0011] According to the above technical means, the support is set on the bottom surface of the base and connected to the heat source part. The rigid support can reduce the deformation of the heat source part caused by gravity or vibration, ensure the stable contact between the heat source part and the first contact part of the heat transfer component, enhance the stability of the connection between the two, and avoid the increase of thermal resistance caused by loose contact.

[0012] In one possible implementation, the support frame includes a support platform and a connecting bracket. The support platform is connected to the base, the heat source portion is placed on the support platform, and the connecting bracket is connected between the support platform and the heat-conducting component, surrounding the periphery of the heat source portion.

[0013] According to the above technical means, the support platform of the support frame connects to the base and carries the heat source part, which can provide stable horizontal support for the heat source part, avoid displacement due to gravity or vibration, and prevent failure of contact with the heat transfer component, thus ensuring the continuity of the heat conduction path.

[0014] The connecting bracket connects the support platform and the heat-conducting component and surrounds the heat source part. The rigid connection enhances the overall structural strength of the support frame and forms a perimeter limit on the heat source part, preventing it from lateral shaking under vehicle vibration environment. It ensures uniform vertical pressure between the heat source part and the first contact part of the heat transfer component, reduces contact thermal resistance, and forms physical protection for the heat source part with the surrounding structure.

[0015] In one possible implementation, the circuit board includes a substrate and a chip electrically connected to the substrate. The chip is disposed between the substrate and a heat-conducting element, with the side of the chip facing the heat-conducting element forming a heat source portion. The circuit board also includes a support frame connected to the substrate, which supports the chip.

[0016] According to the above-mentioned technical means, the chip is electrically connected to the substrate and located between the substrate and the heat-conducting component. The side of the chip facing the heat-conducting component forms a heat source, allowing the heat generated by the chip to be directly conducted to the heat-conducting component through a short path. The direct proximity of the chip and the heat-conducting component increases the contact area between them, further reducing the chip temperature in a compact space and ensuring its stable operating performance. The support frame also provides support for the chip to ensure its stability.

[0017] In one possible implementation, the heat-conducting component includes a first surface and a second surface opposite to each other. The first surface is thermally connected to the heat source portion of the circuit board by thermal conduction, and the second surface is thermally connected to the air-cooling component by thermal convection. The heat dissipation structure also includes a heat transfer component, which is thermally connected between the heat-conducting component and the circuit board. The heat transfer component includes a first bonding portion disposed towards the circuit board, which is used to bond with the surface of the heat source portion facing the heat-conducting component.

[0018] According to the above technical means, the first surface of the heat-conducting component is thermally connected to the heat source part of the circuit board through thermal conduction. The high thermal conductivity of the heat-conducting component can be used to quickly absorb and conduct the heat generated by the heat source part of the circuit board, realizing the efficient transfer of heat from the circuit board to the heat-conducting component. The second surface is thermally connected to the air-cooling component through thermal convection. With the help of the airflow of the air-cooling component, the heat on the surface of the heat-conducting component can be carried away. The heat dissipation effect is enhanced by thermal convection, ensuring that the heat of the heat source part of the circuit board is dissipated in time, meeting the heat dissipation requirements of electronic devices.

[0019] The heat transfer element is thermally connected between the heat conductor and the circuit board. Its first contact part is set towards the circuit board and directly contacts the surface of the heat source part. The contact thermal resistance between the two can be reduced by increasing the contact area and reducing the air gap, so that the heat of the heat source part can be more efficiently conducted to the heat conductor through the heat transfer element.

[0020] In one possible implementation, the heat transfer element further includes a heat sink and a heat pipe. The heat sink is disposed on the side of the heat source portion facing the heat transfer element, and a first contact portion is formed on the surface of the heat sink facing the heat source portion. Along the radial direction of the heat pipe, the heat pipe is connected between the heat sink and the heat transfer element.

[0021] According to the above technical means, the heat sink is directly attached to the surface of the heat source part through the first bonding part. The planar structure of the heat sink can increase the contact area with the heat source part, reduce the contact thermal resistance, and collect heat evenly. The heat pipe connects the heat sink and the heat conductor in a radial direction. The high thermal conductivity of the heat pipe can quickly transfer the heat collected by the heat sink to the heat conductor, thereby improving the heat transfer efficiency from the circuit board to the heat conductor.

[0022] In one possible implementation, the first surface is provided with a recess for accommodating a heat pipe, and the wall of the recess is in contact with the heat pipe.

[0023] According to the above technical means, the recessed portion on the first surface of the heat-conducting component is used to accommodate the heat pipe and the wall surface is in contact with the heat pipe. Through the geometric adaptation of the recessed portion, the heat pipe and the heat-conducting component can form a tight contact interface, reduce the contact thermal resistance, and ensure that the heat in the heat pipe is quickly conducted to the heat-conducting component. The setting of the recessed portion allows the heat pipe to be embedded in the surface of the heat-conducting component, avoiding the external heat pipe occupying extra space, adapting to the compact internal layout of the vehicle equipment, and at the same time, the in contact wall surface provides mechanical support for the heat pipe, reducing the risk of contact failure caused by vibration.

[0024] In one possible implementation, the heat pipe includes a heat dissipation section disposed opposite to the heat sink and a condensation section connected to the heat dissipation section. Along the direction from the heat dissipation section to the circuit board, the condensation section is offset from the heat source section.

[0025] Based on the above technical means, the heat dissipation section of the heat pipe is set opposite to the heat sink, which can directly receive the heat collected by the heat sink from the heat source and quickly transfer it to the condensation section along the axial direction through the superconducting thermal properties of the heat pipe; the condensation section is set off from the heat source section along the direction of the heat dissipation section pointing to the circuit board, so as to avoid the condensation section and the high-temperature heat source section from affecting each other.

[0026] A second aspect of this application relates to a vehicle-mounted device, which includes the heat dissipation structure of any of the aforementioned vehicle-mounted devices.

[0027] Based on the aforementioned technical means, the vehicle-mounted equipment in this application can achieve a highly efficient cooling effect by optimizing the internal air-cooling flow channels.

[0028] A third aspect of this application involves providing a vehicle that includes the aforementioned on-board equipment and functional components, wherein the on-board equipment and functional components are electrically connected.

[0029] Based on the above-mentioned technical means, the heat dissipation structure of the vehicle-mounted equipment in this application can meet the heat dissipation requirements of the vehicle-mounted equipment when transmitting signals with functional components.

[0030] It should be noted that the technical effects of the second and third implementation methods can be found in the technical effects of the corresponding implementation methods in the first aspect, and will not be repeated here.

[0031] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application, and do not constitute an undue limitation of this application.

[0033] Figure 1An exploded view of a heat dissipation structure for a vehicle-mounted device provided in an embodiment of this application;

[0034] Figure 2 for Figure 1 A partial structural diagram of the heat dissipation structure;

[0035] Figure 3 for Figure 1 Another structural diagram of the heat dissipation structure in the middle;

[0036] Figure 4 A schematic diagram showing the connection between the heat-conducting component and the support frame of the heat dissipation structure provided in the embodiments of this application;

[0037] Figure 5 A schematic diagram of the connection structure between the heat dissipation component and the heat transfer component provided in an embodiment of this application;

[0038] Figure 6 This is a schematic diagram of the structure of the heat transfer element provided in the embodiments of this application;

[0039] Figure 7 A schematic diagram of the cooling principle of a heat pipe provided in an embodiment of this application;

[0040] Figure 8 Simulation experimental diagram of the air-cooled component provided in the embodiments of this application;

[0041] Figure 9 This is a cross-sectional view of a heat dissipation structure for a vehicle-mounted device provided in an embodiment of this application.

[0042] Figure label:

[0043] 100 - Circuit board; 101 - Substrate; 102 - Chip; 103 - Shielding cover;

[0044] 200 - Thermal conductive element; 201 - First surface; 2011 - Recess; 202 - Second surface; 2021 - First part; 2022 - Second part;

[0045] 300 - Air-cooled assembly; 301 - Cover; 3011 - Cover plate; 3011a - Air inlet; 3011b - Annular rib; 3011c - Longitudinal rib; 3012 - Side plate; 302 - Fan;

[0046] 400 - Heat transfer component; 401 - Heat sink; 402 - Heat pipe; 4021 - Condensation section; 4022 - Heat dissipation section;

[0047] 500-base;

[0048] 600 - Support frame; 601 - Support platform; 602 - Connecting bracket;

[0049] 700 - First antenna assembly;

[0050] 800-Second day antenna component;

[0051] 900 - Signal conversion component. Detailed Implementation

[0052] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0053] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "some embodiments," "example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0054] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0055] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0056] In some embodiments, this application provides a vehicle, wherein the specific type of vehicle is not specifically limited in the embodiments of this application. For example, the vehicle provided in the embodiments of this application may be an electric vehicle, a hybrid electric vehicle, a fuel vehicle, or a solar vehicle, etc.

[0057] Of course, the vehicle provided in this application embodiment can also be a vehicle of different types. For example, the vehicle provided in this application embodiment can be a sedan, a sport utility vehicle (SUV), or a multi-purpose vehicle (MPV), etc.

[0058] In some embodiments, the vehicle in this application includes an in-vehicle device and functional components. The in-vehicle device is electrically connected to the functional components. The in-vehicle device can control the functional components to interact with the driver and passengers, and can also control the functional components to cooperate with other modules inside the vehicle to process their corresponding computing tasks.

[0059] For example, the functional component may be an in-vehicle screen. As another example, the functional component may also be a dashboard. This application does not limit the scope of the application.

[0060] Based on this, the in-vehicle equipment in this application can meet the needs of drivers and passengers for in-vehicle entertainment, intelligent interactive experience, and other aspects.

[0061] In some embodiments, the vehicle-mounted device in this application further includes a heat dissipation structure that can meet the heat dissipation requirements of the vehicle-mounted device to ensure that the vehicle-mounted device can work normally.

[0062] In some embodiments, see Figure 1 and combined Figure 2 The heat dissipation structure in this application includes a circuit board 100, a heat-conducting component 200, and an air-cooling component 300. The circuit board 100 includes a heat source portion. The heat-conducting component 200 is thermally connected to the heat source portion of the circuit board 100 assembly. The air-cooling component 300 and the circuit board 100 are respectively disposed on opposite sides of the heat-conducting component 200 along a first direction. The air-cooling component 300 is thermally connected to the heat-conducting component 200. The air intake direction of the air-cooling component 300 is consistent with the first direction.

[0063] Among them, the circuit board 100 is the basic carrier for carrying electronic components, and the heat source part is the area on the circuit board 100 with the highest heat generation power and the most concentrated temperature, specifically the chip 102.

[0064] It should be noted that this application does not limit the specific structure of the circuit board 100 and the chip 102. For example, the chip 102 in this application is the MT8678 chip 102. Of course, the chip 102 in this application can also integrate other chips 102, such as high-power chips 102 such as SOC, DDR, UFS, PMIC, etc. This application does not limit the integration of these chips.

[0065] For example, the size of chip 102 can be 64mm × 64mm.

[0066] Based on this, the heat dissipation structure involved in this application is thermally connected to the heat source part of the circuit board 100 through the heat-conducting component 200, which can quickly conduct the heat generated by the heat source part of the circuit board 100 to the heat-conducting component 200, thereby achieving efficient heat dissipation. The air-cooling component 300 and the circuit board 100 are respectively disposed on opposite sides of the heat-conducting component 200 along the first direction and are thermally connected to the heat-conducting component 200, forming a heat dissipation layout with cold and heat separation, so that heat can be directionally transferred to the air-cooling component 300 through the heat-conducting component 200.

[0067] Meanwhile, the air intake direction of the air-cooled component 300 is consistent with the first direction, allowing the airflow to directly act on the air-cooled component 300 along the heat conduction direction of the heat conductor 200. This optimizes the airflow path, enhances the heat dissipation effect on the heat conductor 200, and thus meets the requirements of efficient heat dissipation for electronic devices. In addition, air cooling also reduces the cost of the entire vehicle-mounted equipment.

[0068] In some embodiments, see Figures 2-5 The heat-conducting component 200 includes a first surface 201 and a second surface 202 opposite to each other. The first surface 201 is thermally connected to the heat source part of the circuit board 100 by thermal conduction, and the second surface 202 is thermally connected to the air-cooling component 300 by thermal convection.

[0069] It is understood that in this application, the first surface 201 is bonded to the chip 102, and the air-cooling component 300 air-cools the second surface 202.

[0070] Based on this, the first surface 201 of the heat-conducting component 200 is thermally connected to the heat source part of the circuit board 100 through thermal conduction. The high thermal conductivity of the heat-conducting component 200 can be used to quickly absorb and conduct the heat generated by the heat source part of the circuit board 100, thereby achieving efficient heat transfer from the circuit board 100 to the heat-conducting component 200.

[0071] In addition, the second surface 202 is thermally connected to the air-cooling component 300 through thermal convection. The airflow of the air-cooling component 300 can carry away the heat from the surface of the heat-conducting component 200, thereby enhancing the heat dissipation effect through thermal convection and ensuring that the heat source of the circuit board 100 is dissipated in a timely manner to meet the heat dissipation requirements of electronic devices.

[0072] In some embodiments, see Figure 1 and combined Figure 2 The air-cooled assembly 300 includes a cover 301 and a fan 302. The cover 301 covers a portion of the second surface 202, and the cover 301 and the portion of the second surface 202 form an air-cooled cavity. The cover 301 has an air inlet and an air outlet. The fan 302 is housed in the air-cooled cavity and is used to transport the gas in the air-cooled cavity from the air inlet to the air outlet.

[0073] It should be noted that this application does not limit the size of the fan 302, and the size of the fan 302 can vary depending on the vehicle model and specific application scenario. For example, the overall length of the fan 302 is 80mm, the overall width of the fan 302 is 80mm, the corresponding height of the fan 302 is 15mm, and the corresponding maximum airflow of the fan 302 is 24CFM.

[0074] Based on this, the cover 301 is placed on part of the second surface 202 of the heat-conducting component 200 and forms a cooling cavity, creating a closed airflow channel to reduce heat loss and airflow turbulence.

[0075] The fan 302 is housed in the air-cooling cavity. By transporting the gas in the cavity from the air inlet to the air outlet, it forces the airflow to flow, so that the airflow evenly washes the second surface 202 of the heat-conducting component 200 and efficiently removes heat through thermal convection.

[0076] Based on this, the air inlet and outlet of this application clearly define the airflow direction, ensuring the heat dissipation effect of the air-cooled component 300 on the second surface 202 of the heat-conducting component 200, and meeting the needs of electronic equipment for rapid heat dissipation.

[0077] In some embodiments, see Figure 1 and combined Figure 2 In this application, the fan 302 is used to provide air cooling for the circuit board 100. Exemplarily, the fan 302 also includes a sleeve for the fan 302, which is fitted over the outer casing of the fan 302 to prevent the fan 302 from making rigid contact with other components of the vehicle equipment.

[0078] In some embodiments, see Figure 1 and combined Figure 2 The cover 301 is a plastic cover, the heat-conducting component 200 is a metal heat sink, and the heat dissipation structure also includes a first antenna assembly 700 electrically connected to the circuit board 100. The first antenna assembly 700 includes a first ground terminal, which is connected to the side surface of the heat-conducting component 200 facing the air-cooling assembly 300. The first antenna assembly 700 is housed in the air-cooling cavity.

[0079] Based on this, the cover 301 uses a plastic cover, which can protect the internal structure of the air-cooled cavity while avoiding electrical conductivity, ensuring the electrical safety of the system, and reducing production costs. In addition, the plastic itself has a low coefficient of friction, and the airflow experiences relatively low resistance, which can reduce wind resistance and make it easier for air to enter.

[0080] The heat-conducting component 200 is a metal heat sink, and its side surface facing the air-cooling component 300 is connected to the first ground terminal of the first antenna component 700. Thus, this application utilizes the large-area conductive characteristics of the metal heat sink to provide a good ground plane for the antenna and improve the stability of antenna signal transmission.

[0081] Meanwhile, the first antenna assembly 700 is housed in the air-cooling cavity, and the integrated design is achieved by utilizing the spatial layout of the air-cooling cavity, reducing the occupation of additional structures and improving the space utilization of the vehicle equipment.

[0082] It should be noted that this application does not limit the specific materials of the cover 301 and the heat sink.

[0083] In some embodiments, see Figure 1 and combined Figure 2 The heat dissipation structure also includes a second antenna assembly 800 electrically connected to the circuit board 100. The second antenna assembly 800 includes a second ground terminal connected to the side surface of the heat conductor 200 facing the air-cooled assembly 300, and the second antenna assembly 800 is spaced apart from the cover 301.

[0084] Based on this, the second grounding terminal of the second antenna assembly 800 is connected to the surface of the heat-conducting component 200 facing the air-cooling component 300. This application can form a grounding plane by means of the metallic conductivity of the heat-conducting component 200, providing a low-impedance grounding path for the second antenna assembly 800, thereby ensuring the signal radiation and reception performance of the second antenna assembly 800.

[0085] For example, the first antenna assembly 700 is a 5G antenna to meet the communication and positioning needs of the driver and passengers.

[0086] As another example, the second antenna component 800 is a BT / WIFI antenna to meet the internet usage needs of drivers and passengers.

[0087] In some embodiments, see Figure 1 and combined Figure 2 The volume of the second antenna component 800 is larger than that of the first antenna component 700.

[0088] Based on this, this application utilizes the heat-conducting component 200 to form differentiated installation positions to meet the grounding plane requirements and spatial layout requirements of antennas of different volumes, thereby achieving compatibility with antenna components of different specifications and enabling the heat dissipation structure to flexibly adapt to the diverse antenna components in vehicle-mounted equipment.

[0089] In some embodiments, see Figure 1 and combined Figure 2 The heat dissipation structure also includes a signal conversion component 900 electrically connected to the circuit board 100, which is located in the air-cooling cavity, and the first antenna component 700 and the signal conversion component 900 are spaced apart.

[0090] Based on this, the signal conversion component 900 is electrically connected to the circuit board 100 and is located inside the air-cooled cavity. The forced airflow of the air-cooling component 300 dissipates heat from the signal conversion component 900, ensuring that the heat generated during efficient signal processing is dissipated in a timely manner and maintaining a stable operating temperature. Simultaneously, the first antenna component 700 and the signal conversion component 900 are spaced apart, reducing electromagnetic interference between them and ensuring that the high-frequency signal processing of the signal conversion component 900 does not affect the signal reception and transmission performance of the first antenna component 700.

[0091] Therefore, this application further optimizes the spatial layout of the air-cooling cavity and improves the space utilization rate of the vehicle-mounted equipment.

[0092] In some embodiments, see Figure 2 and combined Figure 3 The second surface 202 covered by the cover 301 includes a first part 2021 and a second part 2022 connected to each other. The first part 2021 is provided with a plurality of heat dissipation fins, and the second part 2022 is a mounting plane. The signal conversion component 900 is disposed on the mounting plane.

[0093] Based on this, the second surface 202 covered by the cover 301 is divided into a first part 2021 with heat dissipation fins and a second part 2022 as a mounting plane. The heat dissipation fins can enhance the heat convection with the airflow in the air-cooled cavity by increasing the surface area, thereby improving the heat dissipation efficiency of the second surface 202 of the heat conductor 200.

[0094] The mounting surface provides a flat and stable mounting platform for the signal conversion component 900, ensuring its operational stability.

[0095] In some embodiments, the plurality of heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin, wherein the first heat dissipation fin is disposed below the first antenna assembly 700 and the height of the first heat dissipation fin is lower than that of the second heat dissipation fin.

[0096] Based on this, the first heat dissipation fin is located below the first antenna assembly 700 and is lower in height than the second heat dissipation fin. Since the heat dissipation fins are mostly made of metal, the lower height reduces their electromagnetic shielding and reflection on the first antenna assembly 700, avoiding the formation of a strong electromagnetic coupling area in the metal structure, thereby reducing magnetic interference to the antenna signal radiation and reception of the first antenna assembly 700. At the same time, the first heat dissipation fin can still participate in the heat convection within the air-cooling cavity, ensuring the stability of the electromagnetic performance of the antenna assembly while also meeting the basic heat dissipation needs of this area.

[0097] In some embodiments, the structure of the heat dissipation fins is heat dissipation fins.

[0098] In other embodiments, the heat dissipation fins are structured as columnar fins.

[0099] Building upon this, the heat dissipation fins are densely arranged to create a continuous heat dissipation surface within a limited space, ensuring the efficiency of air cooling. Simultaneously, the three-dimensional shape of the columnar fins allows airflow to move evenly between the fins, avoiding localized heat dissipation blind spots, and the multi-sided contact with air increases the heat dissipation area and enhances the cooling effect.

[0100] In some embodiments, the heat dissipation fins are columnar fins, and the peripheral wall of the columnar fins is provided with at least one edge.

[0101] Based on this, the edges in this application can disrupt the laminar boundary layer on the surface of the columnar fins, causing turbulence when air flows through them, reducing airflow adhesion resistance, and enabling air to pass through the gaps between adjacent columnar fins at a higher flow rate.

[0102] In this application, the spacing and structure of the columnar fins are more conducive to airflow penetration, which is especially suitable for the application scenario of the low-pressure fan 302 in the vehicle-mounted equipment of this application.

[0103] In some embodiments, see Figure 2 and combined Figure 3 The first part 2021 is at least partially facing the air inlet, and the end of the first part 2021 extends toward the air outlet.

[0104] Based on this, at least part of the first portion 2021 of the second surface 202 of the heat-conducting component 200 faces the air inlet, allowing the low-temperature airflow drawn in by the air-cooling assembly 300 to directly scour the heat dissipation fins of the first portion 2021, ensuring the initial contact efficiency between the high-velocity airflow and the heat dissipation fins; at the same time, the end of the first portion 2021 extends toward the air outlet, forming a guide structure along the airflow direction (from the air inlet to the air outlet), guiding the airflow evenly through the gaps between the heat dissipation fins, reducing turbulence loss at the turning point, and making the airflow path smoother.

[0105] In some embodiments, see Figure 2 and combined Figure 3 The cover 301 includes a cover plate 3011 and a side plate 3012 surrounding the cover plate 3011. The cover plate 3011 has an air inlet 3011a forming an air inlet, and the side plate 3012 has an air outlet forming an air outlet. The air inlet end of the fan 302 is opposite to the air inlet 3011a, and the air outlet end of the fan 302 is opposite to the air outlet.

[0106] This application does not limit the shape of the air outlet; for example, the air outlet can be a square opening.

[0107] For details on the air-cooling path, please refer to [link / reference]. Figure 8 , Figure 8 This is a simulation experiment diagram corresponding to the air-cooled component 300 in this application.

[0108] Based on this, the cover plate 3011 of the cover 301 is provided with an air inlet 3011a as the air inlet and the side plate 3012 is provided with an air outlet as the air outlet. The air inlet end of the fan 302 is opposite to the air inlet 3011a and the air outlet end is opposite to the air outlet, so that the outside air enters the fan 302 directly through the air inlet 3011a, is pressurized by the fan 302 and discharged directionally along the air outlet, thereby accelerating the cooling of the airflow.

[0109] In some embodiments, see Figure 2 and combined Figure 3 as well as Figure 9 Along the direction of the cover plate 3011 pointing towards the heat sink, the fan 302 is spaced apart from the cover plate 3011. For example, the distance L1 between the two is 10mm to ensure that the airflow enters the air-cooling cavity at a suitable speed.

[0110] In some embodiments, see Figure 2 and combined Figure 3 as well as Figure 9 Along the direction of the cover plate 3011 pointing towards the heat sink, the fan 302 is spaced apart from the heat sink. For example, the distance L2 between the two is 14.5mm to ensure that the cooling airflow can be fully mixed in the cooling chamber.

[0111] In some embodiments, see Figure 2 and combined Figure 3 There are multiple air outlets 3012a, which are spaced apart along the circumferential direction of the side plate 3012.

[0112] Based on this, the number of air outlets 3012a is multiple and they are spaced apart along the circumferential direction of the side plate 3012, which can make the airflow discharged by the fan 302 evenly discharged from multiple directions, avoiding local airflow congestion and pressure unevenness caused by a single air outlet 3012a, and improving the balance of airflow distribution in the air-cooled cavity.

[0113] In some embodiments, see Figure 2 and combined Figure 3 The multiple air outlets 3012a include a first air outlet and a second air outlet, which are arranged opposite to each other.

[0114] Based on this, the first and second air outlets of multiple air outlets 3012a are arranged opposite each other. The symmetrical layout can guide the airflow discharged by the fan 302 to be evenly discharged from the opposite sides, forming a balanced airflow field in the air-cooling cavity. This avoids the local airflow pressure concentration and uneven flow velocity caused by the air outlet 3012a in one direction. The oppositely arranged air outlets 3012a make the airflow flow symmetrically along both sides of the second surface 202 of the heat conductor 200, ensuring that each area of ​​the heat dissipation fins can be evenly flushed by the reverse airflow, reducing the heat dissipation blind spots caused by airflow bias.

[0115] In some embodiments, see Figure 2 and combined Figure 3 The cover plate 3011 has multiple through holes, which form an air inlet 3011a.

[0116] Based on this, the cover plate 3011 forms an air inlet 3011a through multiple through holes. The dispersed layout of the through holes allows external air to flow evenly into the air-cooled cavity from different positions, avoiding the problem of concentrated or deflected airflow caused by a single air inlet 3011a, and improving the uniformity of air intake.

[0117] In some embodiments, see Figure 2 and combined Figure 3 The cover plate 3011 has a circular hole. The cover plate 3011 includes a plurality of annular ribs 3011b arranged radially at intervals along the circular hole and longitudinal ribs 3011c connected between the plurality of annular ribs 3011b. One end of the longitudinal rib 3011c is connected to the inner annular rib 3011b, and the other end of the longitudinal rib 3011c is connected to the wall of the circular hole. The plurality of annular ribs 3011b are arranged concentrically, and the gap between the longitudinal rib 3011c and the annular ribs 3011b forms a through hole.

[0118] Based on this, concentric annular ribs 3011b and longitudinal ribs 3011c are provided at the circular hole of the cover plate 3011. The annular ribs 3011b are distributed radially at intervals and connected to the wall of the circular hole through the longitudinal ribs 3011c, and the gap formed constitutes a through hole.

[0119] The annular rib 3011b can enhance the structural rigidity of the cover plate 3011 in the circular hole area, reduce deformation caused by fan 302 vibration or external impact, and improve the overall strength of the cover 301.

[0120] The grid-like layout of the longitudinal ribs 3011c and the annular ribs 3011b ensures that the through holes are evenly distributed around the round holes, ensuring that the airflow in the air inlet flows into the air-cooling cavity in a balanced manner from multiple directions, and avoiding concentrated airflow loss from a single through hole.

[0121] The annular ribs 3011b and longitudinal ribs 3011c form a stable grid-like support system, effectively dispersing external pressure and vibration, and improving the deformation resistance of the enclosure. The ventilation holes formed by the intervals between the annular ribs 3011b and longitudinal ribs 3011c can rectify the incoming air, making the airflow flow more orderly towards the air inlet 3011a, reducing turbulence and eddies, lowering wind resistance, and improving air intake efficiency in conjunction with the fan 302.

[0122] In some embodiments, see Figure 2 and combined Figure 3 The heat dissipation structure also includes a heat transfer element 400, which is thermally connected between the heat transfer element 200 and the circuit board 100. The heat transfer element 400 includes a first bonding portion disposed facing the circuit board 100. The first bonding portion is used to bond with the surface of the heat source portion facing the heat transfer element 200.

[0123] Based on this, the heat transfer element 400 is thermally connected between the heat transfer element 200 and the circuit board 100. Its first contact part is set towards the circuit board 100 and directly contacts the surface of the heat source part. The contact thermal resistance between the two can be reduced by increasing the contact area and reducing the air gap, so that the heat of the heat source part can be more efficiently conducted to the heat transfer element 200 through the heat transfer element 400.

[0124] In some embodiments, see Figure 2 and combined Figure 4 as well as Figure 5 The heat transfer element 400 also includes a heat sink 401 and a heat pipe 402. The heat sink 401 is located on the side of the heat source portion facing the heat transfer element 200. A first contact portion is formed on the surface of the heat sink 401 facing the heat source portion. The heat pipe 402 is connected between the heat sink 401 and the heat transfer element 200 along the radial direction of the heat pipe 402.

[0125] For example, heat pipe 402 is a heat dissipation copper pipe, and a cooling medium is provided inside the heat dissipation copper pipe.

[0126] Based on this, the heat sink 401 is directly attached to the surface of the heat source part through the first bonding part. The planar structure of the heat sink 401 can increase the contact area with the heat source part, reduce the contact thermal resistance, and collect heat evenly. The heat pipe 402 connects the heat sink 401 and the heat conductor 200 in a radial direction. The high thermal conductivity of the heat pipe 402 is used to quickly transfer the heat collected by the heat sink 401 to the heat conductor 200, thereby improving the heat conduction efficiency of the heat transfer component 400 from the circuit board 100 to the heat conductor 200.

[0127] In some embodiments, see Figure 4 and combined Figure 5 The first surface 201 is provided with a recess 2011, which is used to accommodate the heat pipe 402. The wall of the recess 2011 is in contact with the heat pipe 402.

[0128] Based on this, the recess 2011 of the first surface 201 of the heat-conducting component 200 is used to accommodate the heat pipe 402 and the wall surface is in contact with the heat pipe 402. Through the geometric adaptation of the recess 2011, the heat pipe 402 and the heat-conducting component 200 form a tight contact interface, reducing contact thermal resistance and ensuring that the heat in the heat pipe 402 is quickly conducted to the heat-conducting component 200. The setting of the recess 2011 allows the heat pipe 402 to be embedded in the surface of the heat-conducting component 200, avoiding the external heat pipe 402 occupying extra space and adapting to the compact internal layout of the vehicle equipment. At the same time, the in contact wall provides mechanical support for the heat pipe 402, reducing the risk of contact failure caused by vibration.

[0129] In some embodiments, see Figure 6 and combined Figure 7 The heat pipe 402 includes a heat dissipation section 4022 disposed opposite to the heat sink 401 and a condensation section 4021 connected to the heat dissipation section 4022. Along the direction from the heat dissipation section 4022 to the circuit board 100, the condensation section 4021 is offset from the heat source section.

[0130] For example, when the heat dissipation section 4022 is heated, the working fluid of the heat pipe 402 absorbs heat and begins to evaporate, becoming high-temperature, high-pressure steam. Under the influence of the pressure difference within the heat pipe 402, it rapidly flows towards the condensation section 4021 of the heat pipe 402. Since the interior of the heat pipe 402 is typically under vacuum or extremely low pressure, the flow resistance of the steam is very small, enabling it to quickly transfer heat to the far end. After reaching the condensation section 4021, the steam encounters the cooler wall of the heat pipe 402, releasing heat and condensing into liquid. The released heat is transferred through the wall of the heat pipe 402 to the external heat dissipation medium (such as air, water, etc.), achieving heat dissipation. The condensed liquid, under the influence of gravity, capillary force, or other external forces, flows back to the heat dissipation section 4022, participating in the evaporation and heat absorption process again, forming a cycle.

[0131] Based on this, the heat dissipation section 4022 of the heat pipe 402 is arranged opposite to the heat sink 401, and can directly receive the heat collected by the heat sink 401 from the heat source part. Through the superconducting thermal characteristics of the heat pipe 402, the heat is quickly transferred along the axial direction to the condensation section 4021. The condensation section 4021 is staggered from the heat source part along the direction of the heat dissipation section 4022 pointing to the circuit board 100, so as to avoid the condensation section 4021 and the high-temperature heat source part from affecting each other.

[0132] For example, the heat sink 401 is a heat sink 401 formed by die casting.

[0133] In another example, the heat sink 401 and the heat pipe 402 are connected by adhesive, wherein the two can be connected by AB component epoxy resin to ensure the bonding strength of the two.

[0134] In some embodiments, see Figure 2 and combined Figure 3 The heat dissipation structure also includes a base 500, which is disposed opposite to the cover 301. The heat-conducting component 200 is connected between the cover 301 and the base 500. That is, the side of the heat-conducting component 200 away from the air-cooling component 300 is connected to the base 500. The base 500 and the heat-conducting component 200 form a receiving cavity, and the circuit board 100 is housed in the receiving cavity.

[0135] Based on this, the base 500 and the cover 301 are positioned opposite each other and connected by a heat-conducting element 200. Together with the heat-conducting element 200, they form a cavity to house the circuit board 100. At the same time, the cavity is defined by the heat-conducting element 200 and the base 500, thus enclosing the circuit board 100 inside the structure. The metal shell properties of the heat-conducting element 200 form electromagnetic shielding and physical protection, reducing external interference and the intrusion of dust and liquids.

[0136] In some embodiments, see Figure 2 and combined Figure 4 The heat dissipation structure also includes a support frame 600, which is located on the bottom surface of the base 500 and is connected to the heat source part. The support frame 600 is used to support the heat source part.

[0137] Of course, the support frame 600 can also be directly mounted on the circuit board 100.

[0138] Based on this, the support frame 600 is located on the bottom surface of the base 500 and is connected to the heat source part. The rigid support can reduce the deformation of the heat source part caused by gravity or vibration, ensure the stable contact between the heat source part and the first contact part of the heat transfer element 400, and avoid the increase of thermal resistance caused by loose contact.

[0139] In some embodiments, see Figure 2 and combined Figure 4 The support frame 600 includes a support platform 601 and a connecting bracket 602. The support platform 601 is connected to the base 500, and the heat source is placed on the support platform 601. The connecting bracket 602 is connected between the support platform 601 and the heat-conducting component 200, and the connecting bracket 602 surrounds the periphery of the heat source.

[0140] Based on this, the support platform 601 of the support frame 600 is connected to the base 500 and carries the heat source part, which can provide stable horizontal support for the heat source part, prevent it from displacing due to gravity or vibration and causing failure to fit with the heat transfer element 400, and ensure the continuity of the heat conduction path.

[0141] The connecting bracket 602 connects the support platform 601 and the heat-conducting component 200 and surrounds the heat source part. It can enhance the overall structural strength of the support frame 600 through rigid connection, and at the same time form a limit on the heat source part around the perimeter to prevent it from lateral shaking under vehicle vibration environment. It ensures that the vertical pressure between the heat source part and the first contact part of the heat transfer component 400 is uniform, reduces contact thermal resistance, and forms physical protection for the heat source part with the surrounding structure.

[0142] For example, the connecting bracket 602 can be a support rib that extends from the support platform 601 to connect with the heat conductor 200.

[0143] As another example, the support rib is connected to the heat-conducting component 200 by spring screws to avoid stress concentration caused by uneven screw fastening force.

[0144] In some embodiments, see Figure 2 and combined Figure 3 The circuit board 100 includes a substrate 101 and a chip 102 electrically connected to the substrate 101. The chip 102 is disposed between the substrate 101 and the heat-conducting component 200, and the side of the chip 102 facing the heat-conducting component 200 forms a heat source portion.

[0145] In another example, the support frame 600 is connected to the substrate 101 and is used to support the chip 102.

[0146] For example, chip 102 is reflow soldered to substrate 101 using BGA pads.

[0147] Based on this, chip 102 is electrically connected to substrate 101 and located between substrate 101 and heat conductor 200. The side of chip 102 facing heat conductor 200 forms a heat source portion, allowing the heat generated by chip 102 to be directly conducted to heat conductor 200 through a short path. The direct proximity of chip 102 and heat conductor 200 increases the contact area between them, further reducing the temperature of chip 102 in a compact space and ensuring its stable operating performance.

[0148] In some embodiments, see Figure 2 and combined Figure 3 The chip 102 includes a body and a shield 103 connected to the body. The body is connected to the substrate 101, and the shield 103 is located on the side of the body facing the heat conduction element 200.

[0149] Based on this, the shielding cover 103 of the chip 102 is located on the side of the body facing the heat conduction component 200. The metal shielding cover 103 can form electromagnetic shielding for the body, reducing the interference of external high-frequency signals to the circuit of the chip 102. The adjacent layout of the shielding cover 103 and the heat conduction component 200 can enhance the shielding effectiveness with the help of the metal shell of the heat conduction component 200, forming a double electromagnetic shielding structure.

[0150] Meanwhile, the shield 103 serves as a protective shell for the main body and can withstand the contact pressure during the installation of the heat-conducting component 200, preventing the solder joints from cracking or the chip 102 from being damaged due to mechanical stress.

[0151] In some embodiments, see Figure 2 and combined Figure 3 The circuit board 100 also includes an elastic seal, which is connected between the chip 102 and the first bonding portion. The elastic seal has a relief opening so that the first bonding portion can be bonded to the chip 102.

[0152] Based on this, the elastic seal is connected between the chip 102 and the first bonding part and is provided with a clearance opening. The deformation of the elastic material can compensate for the flatness error during installation, ensuring that the first bonding part and the surface of the chip 102 always maintain uniform contact pressure. The clearance opening allows the first bonding part to directly bond with the heat source part of the chip 102, avoiding the elastic seal from completely blocking the heat conduction path. While achieving sealing around the chip 102, the heat conduction channel is preserved.

[0153] In some embodiments, the resilient seal is conductive foam.

[0154] Based on this, the elastic seal uses conductive foam, whose elastic properties can adaptively compensate for the installation tolerance between the chip 102 and the first mating part, maintaining uniform contact pressure through deformation. The conductive properties of the conductive foam can form an electromagnetic shielding layer around the chip 102, effectively attenuating high-frequency electromagnetic radiation.

[0155] In some embodiments, see Figure 2 and combined Figure 3 The circuit board 100 also includes a seal connected between the resilient seal and the substrate 101; and / or, the seal is connected between the chip 102 and the substrate 101.

[0156] Based on this, when the seal is connected between the elastic seal and the substrate 101, it prevents dust and moisture from entering the chip 102 through the gap between the bottom of the elastic seal and the substrate 101. At the same time, when the seal is connected between the chip 102 and the substrate 101, it can fill the installation gap between the chip 102 and the substrate 101, thereby protecting the chip 102 and improving the reliability of the connection between the chip 102 and the substrate 101.

[0157] In some embodiments, the sealant is a sealant.

[0158] Based on this, the sealing element uses a sealant whose liquid flowability can adaptively fill irregular gaps between the elastic sealant and the substrate 101, or between the chip 102 and the substrate 101. After curing, it forms a continuous sealing layer, effectively preventing dust and moisture from contacting the chip 102.

[0159] For example, the sealant may be a filler adhesive, which fills the gaps between the various components to absorb stress deformation.

[0160] In some embodiments, see Figure 2 and combined Figure 3 The heat dissipation structure includes a controller, which is electrically connected to circuit board 100 and fan 302. The controller is configured to:

[0161] Adjust the fan speed of fan 302 according to the working status of circuit board 100.

[0162] Based on this, the controller is electrically connected to the circuit board 100 and the fan 302 and adjusts the fan speed of the fan 302 according to the working status of the circuit board 100. It can dynamically match the heat dissipation requirements by monitoring the load of the circuit board 100 in real time (such as the temperature and current power consumption of the chip 102): reduce the fan speed of the fan 302 when the load is low to reduce energy consumption and noise.

[0163] Under high load, the fan speed is increased to full speed to enhance air cooling intensity and avoid energy waste caused by constant high speed operation or insufficient heat dissipation during low speed operation. This achieves intelligent control of heat dissipation on demand, ensuring stable operation of circuit board 100 under high temperature conditions and extending the life of fan 302 through adaptive fan speed.

[0164] For example, the temperature range adjusted by the controller is 110°C to 115°C.

[0165] As another example, when the temperature of the entire circuit board 100 assembly exceeds 117°C, the controller controls the circuit board 100 assembly to restart.

[0166] In some embodiments, see Figure 2 and combined Figure 3 This application can reduce noise during the operation of vehicle-mounted equipment in the following ways.

[0167] For example: change the size of fan 302; put a silicone sleeve on the outside of fan 302; adjust the wind speed of fan 302 through the controller; adjust the gap between fan 302 and surrounding components.

[0168] Furthermore, the resistance of the heat sink fins to airflow can further reduce noise.

[0169] Although this application has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of this application. Accordingly, this specification and drawings are merely illustrative descriptions of the application as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from the spirit and scope of this application. Thus, if such modifications and modifications fall within the scope of the claims and their equivalents, this application also intends to include such modifications and modifications. Any changes or substitutions within the scope of the technology disclosed in this application should be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A heat dissipation structure of a vehicle-mounted device, characterized by comprising: include: Circuit board (100), including a heat source section; The heat-conducting component (200) is thermally connected to the heat source portion of the circuit board (100); An air-cooled assembly (300) is thermally connected to one side of the heat-conducting component (200); The base, the heat-conducting element (200) is connected to the base (500) on the side opposite to the air-cooling assembly (300), the base (500) and the heat-conducting element (200) form a receiving cavity, and the circuit board (100) is housed in the receiving cavity.

2. The heat dissipating structure according to claim 1, wherein Also includes: A support frame (600) is disposed on the base (500), and the support frame (600) is correspondingly connected to the heat source part. The support frame (600) is used to support the heat source part.

3. The heat dissipating structure according to claim 1, wherein Also includes: A support platform (601) is connected to the base (500), and the heat source portion is placed on the support platform (601); A connecting bracket (602) is connected between the support platform (601) and the heat-conducting component (200), and the connecting bracket (602) surrounds the periphery of the heat source portion.

4. The heat dissipating structure according to claim 1, wherein The circuit board (100) includes: substrate(101); A chip (102) electrically connected to the substrate (101) is disposed between the substrate (101) and the heat-conducting element (200), and the heat source portion is formed on the side of the chip (102) facing the heat-conducting element (200); A support frame (600) is connected to the substrate (101) and the support frame (600) is used to support the chip (102).

5. The heat dissipating structure according to claim 1, wherein The heat-conducting component (200) includes a first surface (201) and a second surface (202) opposite to each other. The first surface (201) is thermally connected to the heat source portion of the circuit board (100) by thermal conduction, and the second surface (202) is thermally connected to the air-cooling assembly (300) by thermal convection. The heat dissipation structure also includes: A heat transfer element (400) is thermally connected between the first surface (201) and the circuit board (100). The heat transfer element (400) includes a first bonding portion disposed toward the circuit board (100) for bonding with the surface of the heat source portion toward the heat transfer element (200).

6. The heat dissipating structure according to claim 5, wherein The heat transfer element (400) also includes: A heat sink (401) is provided on the side of the heat source portion facing the heat conductor (200), and the first contact portion is formed on the surface of the heat sink (401) facing the heat source portion; A heat pipe (402) is connected between the heat sink (401) and the heat conductor (200) along the radial direction of the heat pipe (402).

7. The heat dissipating structure according to claim 6, wherein The first surface (201) is provided with a recess (2011) for accommodating the heat pipe (402), and the wall of the recess (2011) is in contact with the heat pipe (402).

8. The heat dissipating structure according to claim 6, wherein The heat pipe (402) includes a heat dissipation section (4022) disposed opposite to the heat sink (401) and a condensation section (4021) connected to the heat dissipation section (4022). Along the direction of the heat dissipation section (4022) pointing to the circuit board (100), the condensation section (4021) is offset from the heat source portion.

9. An in-vehicle device characterized by comprising: include: The heat dissipation structure of the vehicle-mounted equipment according to any one of claims 1-8.

10. A vehicle, characterized in that, include: The vehicle-mounted device as described in claim 9; Functional components, wherein the vehicle-mounted equipment is electrically connected to the functional components.

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