Heat dissipation device and domain controller

Abstract

Disclosed are a heat dissipation device and a domain controller. The heat dissipation device comprises a shell main body, the shell main body is used for accommodating a first heat source, the shell main body has an opening corresponding to the first heat source, and a heat conduction layer is arranged on the side of the first heat source facing the opening; a heat dissipation piece is arranged in the opening, and the heat dissipation piece is in pressure contact with the heat conduction layer; and an elastic connecting piece is in elastic pressure contact with the heat dissipation piece, and at least part of the structure of the elastic connecting piece is connected with the shell main body through the heat dissipation piece. The heat dissipation device and the domain controller provided by the present disclosure can reduce the gap between the heat dissipation device and the heat source, thereby improving the heat conduction efficiency and improving the heat dissipation effect on the heat source.

Description

Technical Field

[0001] This disclosure relates to the field of thermal management technology, and in particular to a heat dissipation device and a domain controller. Background Technology

[0002] With the rapid development of intelligent driving, the computing power requirements for chips in vehicle domain controllers are also increasing. Increased chip computing power leads to increased power consumption, resulting in more heat generation during operation.

[0003] Currently, domain controllers often utilize liquid cooling channels within the upper housing to dissipate heat from the chip. However, due to the large overall coverage area of ​​the upper housing and the significant planar tolerances during manufacturing, coupled with dimensional tolerances in both the heat dissipation bumps and the chip, a substantial gap exists between the heat dissipation bumps and the chip, impacting the chip's heat dissipation efficiency. Utility Model Content

[0004] To address the aforementioned technical problems, this disclosure provides a heat dissipation device and a domain controller to reduce the gap between the heat dissipation device and the heat source, thereby improving heat conduction efficiency and enhancing the heat dissipation effect on the heat source.

[0005] The first aspect of this disclosure provides a heat dissipation device, comprising:

[0006] The shell body is used to accommodate the first heat source. The shell body has an opening corresponding to the first heat source, and a heat-conducting layer is provided on the side of the first heat source facing the opening.

[0007] A heat sink is provided in the opening and pressed onto the heat-conducting layer;

[0008] An elastic connector is elastically pressed against a heat sink, and at least a portion of the structure of the elastic connector passes through the heat sink and is connected to the housing body.

[0009] A second aspect of this disclosure provides a domain controller, comprising:

[0010] Circuit board and heat dissipation device as provided in the first aspect of this disclosure;

[0011] The circuit board includes a substrate, a first heat source, and a second heat source;

[0012] The first heat source and the second heat source are disposed on the substrate, with the second heat source located on the outer periphery of the first heat source;

[0013] The substrate is connected to the housing body of the heat dissipation device;

[0014] A heat-conducting layer is provided on the side of the first heat source facing the opening of the heat dissipation device;

[0015] The heat dissipation components of the heat dissipation device are pressed onto the heat-conducting layer.

[0016] The heat dissipation device and domain controller disclosed herein can accommodate and fix a first heat source using a housing body, while placing a heat sink at an opening corresponding to the first heat source, thereby reducing the heat transfer path between the first heat source and the heat sink. By providing a thermally conductive layer with a thermal resistance lower than air on the surface of the first heat source, the heat conduction efficiency between the first heat source and the heat sink is improved. Furthermore, the elastic connector not only connects the heat sink to the housing body but also continuously applies an elastic force towards the first heat source to the heat sink. This elastic force compresses the heat sink, compensating for flatness errors in the assembly planes between the heat sink, the housing body, and the first heat source, reducing the machining accuracy requirements of the assembly planes. More importantly, the elastic connector's compression of the heat sink by the elastic force also reduces the distance between the heat sink and the first heat source, thereby reducing the thickness of the thermally conductive layer and lowering the thermal resistance between the first heat source and the heat sink, thus improving the heat transfer efficiency between the first heat source and the heat sink and enhancing the heat dissipation effect on the first heat source. Attached Figure Description

[0017] Figure 1 This is an exploded view of a domain controller provided by some examples in this disclosure;

[0018] Figure 2 This is a top view of a domain controller provided by some examples in this disclosure;

[0019] Figure 3 yes Figure 2 A cross-sectional view along the AA direction;

[0020] Figure 4 This is a schematic diagram of the structure of the heat sink and the flexible connector provided in some examples of this disclosure;

[0021] Figure 5 It is along Figure 4 A cross-sectional view along the BB direction in the middle;

[0022] Figure 6 This is a structural schematic diagram of the heat sink provided in some examples of this disclosure from another perspective;

[0023] Figure 7 This disclosure provides structural schematic diagrams of the upper and lower shells, as illustrated in some examples.

[0024] Figure 8 This is a schematic diagram of the structure of the upper shell, the first sealing ring, and the second sealing ring provided in some examples of this disclosure;

[0025] Figure 9This is an exploded view of another domain controller provided by some examples in this disclosure;

[0026] Figure 10 This is a top view of another domain controller provided by some examples in this disclosure;

[0027] Figure 11 yes Figure 10 A cross-sectional view along the CC direction;

[0028] Figure 12 This is a schematic diagram of the structure of a second type of upper shell and heat sink provided in some examples of this disclosure;

[0029] Figure 13 yes Figure 10 A cross-sectional view along the DD direction;

[0030] Figure 14 This is a schematic diagram of another domain controller structure provided by some examples in this disclosure;

[0031] Figure 15 This is a partial structural breakdown diagram of another domain controller provided by some examples in this disclosure;

[0032] Figure 16 Figure 14 A cross-sectional view along the EE direction.

[0033] Figure label:

[0034] 100 - Heat dissipation device; 110 - Shell body; 11a - Opening; 11b - Receiving cavity; 111 - Upper shell; 1111 - Heat-conducting boss; 1112 - First recess; 1113 - Second annular groove; 1114 - Third annular groove; 1115 - Water guide channel; 1116 - Connecting boss; 1117 - Annular boss; 1118 - Heat dissipation fins; 1119 - First boss; 111a - Second heat dissipation cavity; 111b - Second inlet; 111c - Second outlet; 112 - Bottom shell; 1121 - Back clip; 1 122-Second boss; 120-Heat sink; 121-Mounting hole; 1211-Stepped surface; 122-First heat dissipation cavity; 123-First inlet; 124-First outlet; 125-Extending boss; 126-First annular groove; 130-Elastic connector; 131-Connecting part; 1311-Connecting post; 1312-Connecting cap; 132-Elastic part; 140-Elastic seal; 150-Heat dissipation teeth; 160-Insulating sheet; 171-First sealing ring; 172-Second sealing ring; 180-Connecting pipe;

[0035] 200 - Domain controller; 210 - Circuit board; 211 - Substrate; 212 - First heat source; 213 - Second heat source; 220 - Thermal conductive layer. Detailed Implementation

[0036] To explain this disclosure, exemplary embodiments of the disclosure will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the disclosure, and not all of them. It should be understood that the disclosure is not limited to exemplary embodiments.

[0037] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0038] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this disclosure. However, this disclosure may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this disclosure is not limited to the specific embodiments disclosed below.

[0039] In the description of this disclosure, it should be understood that the terms "upper," "lower," "horizontal," "bottom," "inner," and "outer" (if any) indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. In this disclosure, unless otherwise expressly specified and limited, the first feature being "upper" or "lower" than the second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.

[0040] In this disclosure, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities connected are not linked by an intermediate structure, but are simply connected to form a whole. For those skilled in the art, the specific meaning of the above terms in this disclosure can be understood according to the specific circumstances.

[0041] In this disclosure, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0042] An in-vehicle domain controller is a high-performance, high-reliability automotive control system. It contains chips designed for autonomous vehicles. These chips primarily handle tasks such as autonomous driving, environmental perception, voice interaction, and decision control, enabling the management and control of the entire vehicle system. By integrating various sensors (such as cameras, LiDAR, and millimeter-wave radar) and controllers, the domain controller achieves centralized management of the vehicle's electronic control units, thereby enabling vehicle perception and intelligent control management.

[0043] With the rapid development of advanced autonomous driving, the computing power requirements of chips in domain controllers are also increasing. However, the increase in chip computing power will increase the power consumption of the chips, thereby causing the chips to generate more heat during operation.

[0044] Due to the significant temperature variations in the automotive environment, traditional air cooling and passive heat dissipation methods are insufficient to meet the cooling requirements of automotive domain controllers. Currently, domain controllers often utilize liquid cooling channels within the upper housing, with heat dissipation bumps corresponding to the chips on the upper housing for chip cooling. However, the large overall coverage area of ​​the upper housing and the significant planar tolerances during manufacturing, coupled with dimensional tolerances in both the heat dissipation bumps and the chips, result in substantial gaps between the heat dissipation bumps and the chips, impacting the chip's heat dissipation efficiency.

[0045] Figure 1 This is an exploded view of a domain controller provided by some examples in this disclosure. Figure 2 This is a top view of a domain controller provided by some examples in this disclosure. Figure 3 yes Figure 2 A cross-sectional view along the AA direction.

[0046] Reference Figures 1 to 3 As shown, in some examples, the domain controller 200 includes a circuit board 210 and a heat dissipation device 100. The circuit board 210 may include a substrate 211, a first heat source 212 and a second heat source 213, and the heat dissipation device 100 is capable of dissipating heat from the first heat source 212 and the second heat source 213.

[0047] In some examples, the first heat source 212 and the second heat source 213 are disposed on the substrate 211 and fixedly supported by the substrate 211. At the same time, conductive lines can also be disposed on the substrate 211 to realize the circuit conduction of the first heat source 212 and the second heat source 213.

[0048] In some examples, the first heat source 212 may be the main chip on the circuit board 210. In other words, the first heat source 212 may be the main chip in the domain controller 200, which consumes 100W-300W during normal operation and is the main heat source in the domain controller 200.

[0049] In some examples, the second heat source 213 can be other devices on the circuit board 210 that have the ability to generate heat, such as memory chips, power chips, capacitors, and inductors. It is understood that any device on the circuit board 210 that generates heat, except for the AI ​​chip, can serve as the second heat source 213, and no limitation is made in the examples disclosed herein.

[0050] In some examples, the second heat source 213 can be arranged around the first heat source 212. In other words, the second heat source 213 can be located on the outer periphery of the first heat source 212. This facilitates the circuit connection between the first heat source 212 and the second heat source 213, and also allows some of the heat from the second heat source 213 to be carried away when the first heat source 212 is cooled, so as to facilitate the cooling of the second heat source 213.

[0051] It is understood that the circuit board 210 is a circuit integration system in the domain controller 200, and the substrate 211 may also include, but is not limited to, devices such as power supply, network, and peripheral connectors (such as camera connectors, radar connectors, etc.), which are not limited in this disclosure example.

[0052] In some examples, the heat dissipation device 100 includes a housing body 110, a heat sink 120, and a resilient connector 130.

[0053] In some examples, the substrate 211 can be connected to the housing body 110, thereby using the housing body 110 to accommodate the first heat source 212 on the substrate 211. At the same time, the housing body 110 has an opening 11a corresponding to the first heat source 212, and a heat-conducting layer 220 is provided on the side of the first heat source 212 facing the opening 11a.

[0054] In some examples, the housing body 110 has a receiving cavity 11b for receiving the circuit board 210, and the opening 11a communicates with the receiving cavity 11b.

[0055] In some examples, the heat sink 120 is disposed at the opening 11a of the housing body 110 and pressed against the thermally conductive layer 220. In this way, the heat generated by the first heat source 212 can be transferred to the heat sink 120 through the thermally conductive layer 220, so that the heat sink 120 can dissipate heat from the first heat source 212. At the same time, setting the heat sink 120 independently relative to the housing body 110 allows the heat dissipation device 100 of the domain controller 200 to be set independently from the automotive motor cooling system, thereby avoiding the impact of the high-temperature (65℃-75℃) automotive coolant on the heat dissipation effect of the domain controller 200.

[0056] Furthermore, the separate design of the heat sink 120 and the housing body 110 facilitates structural optimization of the heat sink 120, thereby improving heat dissipation. This allows the structure of the housing body 110 to remain unchanged, thus reducing the cost of optimizing the manufacturing of the heat dissipation device 100.

[0057] In some examples, the elastic connector 130 is elastically pressed against the heat sink 120, while at least a portion of the structure of the elastic connector 130 passes through the heat sink 120 and connects to the housing body 110. In this way, while connecting the heat sink 120 to the housing body 110, the elastic connector 130 can continuously apply an elastic force towards the heat conduction layer 220 to the heat sink 120, thereby continuously compressing the heat conduction layer 220. When the thickness of the heat conduction layer 220 between the heat sink 120 and the first heat source 212 is large, the elastic compressive force of the elastic connector 130 can press the heat sink 120 towards the first heat source 212, thereby thinning the thickness of the heat conduction layer 220 and reducing the thermal resistance between the first heat source 212 and the heat sink 120, thus improving the heat transfer efficiency between the first heat source 212 and the heat sink 120 and improving the heat dissipation effect on the first heat source 212.

[0058] Compared to traditional heat dissipation solutions that use heat dissipation protrusions on the housing to cool the chip, in this embodiment, the heat sink 120 is separately disposed from the housing body 110. This allows the heat sink 120 to directly dissipate heat from the chip, thus avoiding the problem of large dimensional tolerances between the heat dissipation protrusions on the housing and the chip. More importantly, the elastic force applied to the heat sink 120 by the elastic connector 130 further reduces the distance between the heat sink 120 and the chip, thereby further improving heat conduction efficiency and enhancing the heat dissipation effect.

[0059] In some examples, the thermal conductive layer 220 can compensate for the tolerance gap between the heat sink 120 and the first heat source 212, thereby reducing the thermal resistance between the heat sink 120 and the first heat source 212 and improving the heat transfer efficiency between the first heat source 212 and the heat sink 120.

[0060] In some examples, the thermally conductive layer 220 includes a thermally conductive structure formed through a thermal interface material. For example, the thermally conductive layer 220 may be formed by curing a thermally conductive gel; or, the thermally conductive layer 220 may be a thermally conductive pad; or, the thermally conductive layer 220 may be a phase change thermally conductive sheet, etc.

[0061] It is understood that the thermal conductive layer 220 can also be any other structure formed of a material with high thermal conductivity that can be filled between the heat sink 120 and the first heat source 212. In this embodiment of the disclosure, the thermal conductive layer 220 is not specifically limited.

[0062] In some examples, conventional housings with liquid cooling channels have a large surface area on the chip-facing side of the housing, resulting in a large flatness tolerance and a gap of 0.5mm to 1mm between the housing and the chip, leading to a thicker thermal conductive layer 220. In contrast, in this embodiment, the surface area of ​​the heat sink 120 facing the first heat source 212 is smaller, and the flatness tolerance is smaller, reducing the gap between the heat sink 120 and the first heat source 212. Furthermore, under the compression of the elastic force of the elastic connector 130, the heat sink 120 deforms towards the first heat source 212, further reducing the gap to 0.05mm to 0.2mm. Compared to housings with conventional liquid cooling devices, the heat sink 120 provided in this embodiment has lower thermal resistance between the heat sink 120 and the first heat source 212, higher thermal conductivity, and better heat dissipation.

[0063] It should be noted that the heat sink 120 can not only dissipate heat from the first heat source 212, but also dissipate heat generated by the second heat source 213 around the first heat source 212, thereby accurately dissipating heat from the high-power devices on the circuit board 210.

[0064] In the heat dissipation device 100 provided in this embodiment, the shell body 110 can be used to accommodate and fix the first heat source 212, while the heat sink 120 is set at the opening 11a corresponding to the first heat source 212, which can reduce the heat transfer path between the first heat source 212 and the heat sink 120. By providing a thermally conductive layer 220 with a thermal resistance lower than that of air on the surface of the first heat source 212, the heat conduction efficiency between the first heat source 212 and the heat sink 120 is improved. In addition, the elastic connector 130 not only enables the connection between the heat sink 120 and the shell body 110, but also continuously applies an elastic force toward the first heat source 212 to the heat sink 120, thereby squeezing the heat sink 120 through the elastic force to compensate for the flatness error of the assembly plane between the heat sink 120, the shell body 110 and the first heat source 212, and reduce the machining accuracy requirements of the assembly plane between the heat sink 120, the shell body 110 and the first heat source 212. More importantly, the elastic connector 130 can reduce the distance between the heat sink 120 and the first heat source 212 by squeezing the heat sink 120 with elastic force, thereby reducing the thickness of the heat-conducting layer 220 and reducing the thermal resistance between the first heat source 212 and the heat sink 120, so as to improve the heat transfer efficiency between the first heat source 212 and the heat sink 120 and improve the heat dissipation effect of the first heat source 212.

[0065] In addition, the elastic force applied by the elastic connector 130 to the heat sink 120 can also compensate for the decrease in connection preload caused by vehicle vibration or impact, thereby avoiding the problem of connection loosening due to vibration or impact, and thus preventing the heat sink 120 from shifting or separating from the heat-conducting layer 220.

[0066] Figure 4 This is a schematic diagram of the structure of heat sinks and flexible connectors provided in some examples of this disclosure.

[0067] Combination Figure 3 and Figure 4As shown, in some examples, the elastic connector 130 includes a connecting portion 131 and an elastic portion 132. The connecting portion 131 includes a connecting post 1311 and a connecting cap 1312. One end of the connecting post 1311 is connected to the connecting cap 1312, and the other end of the connecting post 1311 passes through the heat sink 120 and connects to the housing body 110, thus connecting the heat sink 120 to the housing body 110. Simultaneously, the elastic portion 132 is sleeved on the connecting post 1311 and is located between the connecting cap 1312 and the heat sink 120. In this way, the connecting cap 1312 and the heat sink 120 can limit the elastic portion 132, thereby allowing the elastic portion 132 to be in a compressed state, so that the elastic portion 132 can generate an elastic force on the heat sink 120 towards the first heat source 212. Furthermore, by fitting the elastic part 132 onto the connecting post 1311, the connecting post 1311 can guide and fix the elastic part 132, preventing the elastic part 132 from deforming in other directions after being subjected to force, thus affecting the direction of the elastic force.

[0068] In some examples, the elastic part 132 can be a spring.

[0069] In some examples, the elastic part 132 can be an elastic nut.

[0070] In some examples, the elastic part 132 can also be an elastic gasket.

[0071] In some examples, the elastic part 132 may be a combination of a spring and an elastic washer, or it may be a combination of an elastic nut and an elastic washer, or it may be a combination of a spring, an elastic nut, and an elastic washer. It is understood that the elastic part 132 may also be other structures with elastic deformation capability, and the structure of the elastic part 132 is not limited in the embodiments of this disclosure.

[0072] In some examples, the heat sink 120 includes a portion extending through the thickness direction of the heat sink 120 (e.g., Figure 3 The mounting hole 121 is provided in the z-axis direction, and the mounting hole 121 has a stepped surface 1211 inside. In other words, the mounting hole 121 is a stepped hole.

[0073] In some examples, the connecting part 131 is disposed within the mounting hole 121, and a gap exists between the connecting cap 1312 and the stepped surface 1211. One end of the connecting post 1311, facing away from the connecting cap 1312, passes through the mounting hole 121 and connects to the housing body 110. In this case, the elastic part 132 is located in the gap between the connecting cap 1312 and the stepped surface 1211, thereby enabling bidirectional limiting of the elastic part 132 using the connecting cap 1312 and the stepped surface 1211. Simultaneously, the elastic part 132 is pressed against the stepped surface 1211, meaning that the elastic part 132 can directly apply elastic force to the stepped surface 1211 to compress the heat sink 120.

[0074] Please refer to it again. Figure 1 and Figure 3 In some examples, the heat dissipation device 100 also includes a resilient seal 140 with conductive properties. Along the axial direction of the mounting hole 121 (e.g.) Figure 3 Along the z-axis (in the circuit diagram), an elastic seal 140, a connecting cap 1312, and a connecting post 1311 are sequentially disposed in the mounting hole 121, with the elastic seal 140 sealingly connected to the mounting hole 121. This allows the elastic seal 140 to seal the mounting hole 121, preventing external moisture or dust from entering the housing body 110 through the mounting hole 121 and affecting the normal operation of the electronic components on the circuit board 210. Simultaneously, the conductivity of the elastic seal 140 also enables electromagnetic shielding sealing, preventing potential electromagnetic shielding leakage at the mounting hole 121, thus protecting the circuit board 210.

[0075] Figure 5 It is along Figure 4 A cross-sectional view along the BB direction.

[0076] In some examples, the heat sink 120 includes a first heat dissipation cavity 122. The first heat dissipation cavity 122 is provided corresponding to the opening 11a, and the first heat dissipation cavity 122 allows the cooling medium to circulate. In this way, the heat sink 120 can remove the heat generated by the first heat source 212 through the cooling medium, thereby improving the heat dissipation efficiency of the first heat source 212.

[0077] In some examples, the cooling medium in the first heat dissipation cavity 122 can be a gaseous cooling medium, such as air, nitrogen, helium, and carbon dioxide.

[0078] In some examples, the cooling medium in the first heat dissipation cavity 122 can be a liquid cooling medium, such as water, ethylene glycol solution, mineral oil, and fluorinated liquid.

[0079] In some examples, the cooling medium in the first heat dissipation cavity 122 may also be a two-phase cooling medium. In other words, the cooling medium in the first heat dissipation cavity 122 may include a combination of gaseous and liquid cooling media. In the embodiments of this disclosure, the specific type of cooling medium is not limited.

[0080] In some examples, the heat sink 120 also includes a first inlet 123 and a first outlet 124 communicating with the first heat sink cavity 122. The first inlet 123 is used to allow the cooling medium to enter the first heat sink cavity 122, and the first outlet 124 is used to allow the cooling medium to leave the first heat sink cavity 122, thereby forming a first heat dissipation channel for the cooling medium to flow through using the first inlet 123, the first heat sink cavity 122, and the first outlet 124.

[0081] In some examples, along the length direction of the first heat dissipation cavity 122 (e.g.) Figure 5 The first inlet 123 and the first outlet 124 (in the x-axis direction) are located on both sides of the first heat dissipation cavity 122. This increases the distance between the first inlet 123 and the first outlet 124, thereby increasing the time and contact area of ​​the cooling medium in the first heat dissipation cavity 122 and improving heat dissipation efficiency.

[0082] In some examples, the first heat dissipation cavity 122 is further provided with a plurality of heat dissipation teeth 150, the extension direction of which is the same as the flow direction of the cooling medium. Simultaneously, the plurality of heat dissipation teeth 150 are arranged at intervals to form heat dissipation channels for the cooling medium to flow through at the intervals. In this way, the heat dissipation teeth 150 can be used to increase the contact area with the cooling medium, thereby further improving heat dissipation efficiency.

[0083] like Figure 5 As shown in (a) of the diagram, in some examples, the heat dissipation fins 150 may include die-cast heat dissipation fins 150. The die-cast heat dissipation fins 150 may be made of metals with good thermal conductivity, such as aluminum alloy or magnesium alloy, and may be formed in the first heat dissipation cavity 122 by a die-casting process. Die-cast heat dissipation fins 150 are easy to process and have high forming efficiency.

[0084] like Figure 5 As shown in (b) of the diagram, in some examples, the heat dissipation fins 150 may include folded heat dissipation fins 150. The folded heat dissipation fins 150 may be made of metals with good thermal conductivity, such as high thermal conductivity aluminum or high thermal conductivity copper, and may be brazed to the first heat dissipation cavity 122. The folded heat dissipation fins 150 can effectively increase the density of the heat dissipation fins 150, thereby increasing the heat dissipation area and improving the heat dissipation efficiency of the heat sink 120.

[0085] like Figure 5 As shown in (c) in some examples, the heat dissipation teeth 150 may also include microchannel heat dissipation teeth 150. The microchannel heat dissipation teeth 150 can be made of metals with good thermal conductivity, such as aluminum alloy, copper, and copper alloys. The microchannel heat dissipation teeth 150 can be formed in the first heat dissipation cavity 122 through processes such as 3D printing, welding, and etching. Compared with die-cast heat dissipation teeth 150 and folded heat dissipation teeth 150, microchannel heat dissipation teeth 150 can further increase the contact area with the cooling medium and also increase the fluid turbulence effect to improve heat dissipation efficiency.

[0086] It is understood that the spacing, number, extension length, shape, height, and thickness of the heat dissipation teeth 150 in the first heat dissipation cavity 122 can be adjusted according to actual conditions and are not limited in this embodiment.

[0087] Figure 6 This is a structural schematic diagram of a heat sink provided in some examples of this disclosure from another perspective.

[0088] like Figure 6 As shown, in some examples, in order to facilitate the connection between the heat sink 120 and the heat-conducting layer 220, an extension boss 125 can also be provided on the surface of the heat sink 120 facing the first heat source 212. The extension boss 125 extends and protrudes towards the first heat source 212 and / or the second heat source 213 so as to fit tightly with the heat-conducting layer 220 on the surface of the first heat source 212 and / or the second heat source 213.

[0089] It is worth noting that, compared with the heat dissipation boss structure on the housing in the conventional solution, the extended boss 125 of the heat dissipation component 120 in this embodiment can further reduce the fit tolerance between the extended boss 125 and the first heat source 212 under the elastic force of the elastic connector 130, thereby further improving the heat conduction efficiency and improving the heat dissipation effect.

[0090] Figure 7 These are schematic diagrams of the upper and lower shells provided in some examples of this disclosure. Figure 7 (a) in the diagram is a schematic diagram of the upper shell 111. Figure 7 (b) in the figure is a schematic diagram of the bottom shell 112.

[0091] Please combine Figure 1 , Figure 3 and Figure 7 In some examples, the shell body 110 includes an upper shell 111 and a bottom shell 112, which are sealed together to form a receiving cavity 11b.

[0092] In some examples, the upper shell 111 and the bottom shell 112 can be connected by screws.

[0093] In some examples, a corresponding snap-fit ​​structure can be provided between the upper shell 111 and the bottom shell 112 to achieve a sealed connection.

[0094] In some examples, the surface of the upper shell 111 facing the receiving cavity 11b is provided with a heat-conducting protrusion 1111 that corresponds to and extends toward the second heat source 213. The heat-conducting protrusion 1111 is connected to the heat-conducting layer 220 on the surface of the second heat source 213. In this way, the heat generated by the second heat source 213 can be conducted to the upper shell 111 by means of the heat-conducting protrusion 1111, thereby improving the heat dissipation effect of the second heat source 213.

[0095] It is understood that the specific shape and number of the heat-conducting protrusions 1111 can be set according to the number and shape of the second heat source 213, and are not limited in this embodiment.

[0096] It should be noted that when the second heat source 213 on the circuit board 210 faces the bottom shell 112, the heat-conducting boss 1111 can also be provided on the bottom shell 112 and extend towards the second heat source 213. The specific location of the heat-conducting boss 1111 is not limited in this embodiment.

[0097] Please combine Figure 1 and Figure 7 In some examples, the heat dissipation device 100 also includes an insulating sheet 160, which is disposed between the substrate 211 and the bottom shell 112 of the circuit board 210, thereby enabling an insulating connection between the circuit board 210 and the bottom shell 112.

[0098] In some examples, a back clip 1121 is provided on the side of the bottom shell 112 facing the circuit board 210. The back clip 1121 corresponds to the shape of the insulating sheet 160. The insulating sheet 160 is disposed between the back clip 1121 and the circuit board 210. The back clip 1121 can support the circuit board 210 and prevent the circuit board 210 from deforming.

[0099] Combination Figure 1 and Figure 3 As shown, in some examples, the surface of the upper housing 111 facing away from the receiving cavity 11b may have a first recess 1112. An opening 11a is formed on the bottom surface of the first recess 1112. In this way, the heat sink 120 can be pressed against the bottom surface of the first recess 1112, thereby enabling the surface of the heat sink 120 to be on the same plane as the surface of the upper housing 111, so as to facilitate the miniaturization design of the domain controller 200.

[0100] Figure 8 This is a schematic diagram of the structure of the upper shell, the first sealing ring, and the second sealing ring provided in some examples of this disclosure.

[0101] Combination Figure 3 and Figure 8 As shown, in some examples, the side of the upper shell 111 facing the heat sink 120 is provided with a second annular groove 1113 recessed towards the receiving cavity 11b. In other words, the second annular groove 1113 can be located at the bottom surface of the first recess 1112, and the second annular groove 1113 can be located on the outer periphery of the opening 11a. The heat dissipation device 100 also includes a first sealing ring 171, which is embedded in the second annular groove 1113. The first sealing ring 171 is elastic. When the heat sink 120 is pressed against the first sealing ring 171, it can compress the first sealing ring 171 to generate deformation, thereby achieving a sealed connection between the heat sink 120 and the upper shell 111, thus preventing external moisture and dust from entering the receiving cavity 11b from the opening 11a of the upper shell 111.

[0102] In some examples, the upper shell 111 has a third annular groove 1114 recessed towards the receiving cavity 11b on one side facing the heat sink 120. In other words, the third annular groove 1114 can be located at the bottom surface of the first recess 1112, and the third annular groove 1114 can be located on the outer periphery of the opening 11a. The heat dissipation device 100 also includes a second sealing ring 172, which is embedded in the third annular groove 1114, and the heat sink 120 is pressed against the second sealing ring 172 to achieve a sealed connection between the heat sink 120 and the upper shell 111.

[0103] In some examples, the material of the second sealing ring 172 is different from that of the first sealing ring 171. For example, the first sealing ring 171 is made of rubber or silicone waterproof sealing ring, thus achieving a waterproof seal. The second sealing ring 172 can be made of conductive rubber ring, thus achieving an electromagnetic shielding seal and preventing electromagnetic shielding leakage at the opening 11a.

[0104] In some examples, the second annular groove 1113 may be located on the outer periphery of the third annular groove 1114, which can prevent external moisture from affecting the electromagnetic sealing performance of the second sealing ring 172.

[0105] In this embodiment of the disclosure, by providing a first sealing ring 171 and a second sealing ring 172 between the upper shell 111 and the heat sink 120, both waterproof sealing and conductive shielding sealing can be achieved, which can effectively improve the waterproof performance of the domain controller 200.

[0106] Please refer to it again. Figure 8 A water guide groove 1115 is also provided on the surface of the upper shell 111 that is away from the receiving cavity 11b. In this way, the water guide groove 1115 can be used to drain the moisture from the surface of the upper shell 111, thereby preventing water from accumulating around the outer periphery of the first sealing ring 171 and affecting the service life of the first sealing ring 171.

[0107] Combination Figure 3 As shown, in some examples, the heat sink 120 can be connected to the base case 112 via a flexible connector 130. That is, the end of the connecting post 1311 facing away from the connecting cap 1312 passes through the mounting hole 121 and is connected to the base case 112. This simplifies the assembly process of the domain controller 200.

[0108] In some examples, the domain controller 200 can be assembled using the following steps:

[0109] A heat-conducting layer 220 is attached to the surface of the heat-conducting protrusion 1111 of the upper shell 111, and insulating paper is installed on the back clip 1121 of the bottom shell 112. The circuit board 210 and the bottom shell 112 are then fixed to the upper shell 111 with screws. Next, the first sealing ring 171 and the second sealing ring 172 are installed in the corresponding annular grooves of the upper shell 111. A heat-conducting layer 220 is attached to the surface of the extension protrusion 125 of the heat sink 120, and the heat sink 120 is connected to the bottom shell 112 using an elastic connector 130, so that the heat-conducting layer 220 is in contact with the first heat source 212. Finally, the elastic sealing member 140 is sealed in the mounting hole 121 to achieve a sealed connection.

[0110] It should be noted that the above assembly process is only an example and is not limited in the embodiments disclosed herein.

[0111] Figure 9 This is an exploded view of another domain controller provided by some examples in this disclosure. Figure 10 This is a top view of another domain controller provided by some examples in this disclosure. Figure 11 yes Figure 10 A cross-sectional view along the CC direction.

[0112] Combination Figure 9 , Figure 10 and Figure 11 As shown, in some examples, the heat sink 120 can be connected to the upper housing 111 via the elastic connector 130. That is, the end of the connecting post 1311 facing away from the connecting cap 1312 passes through the mounting hole 121 and is connected to the upper housing 111.

[0113] Figure 12 This is a schematic diagram of the structure of a second type of upper shell and heat sink provided in some examples of this disclosure. Among them, Figure 12 (a) in the diagram is a schematic diagram of the heat sink 120. Figure 12 (b) is a schematic diagram of the upper shell 111.

[0114] Combination Figure 9 , Figure 11 and Figure 12 As shown, in some examples, the groove depth of the upper shell 111 can be relatively deep, and connecting bosses 1116 can be provided on the opposite sides of the groove. The connecting hole between the upper shell 111 and the elastic connector 130 can be set at the position of the connecting boss 1116, so that the connecting boss 1116 can be used to ensure the connection strength between the elastic connector 130 and the upper shell 111.

[0115] Figure 13 yes Figure 10 A cross-sectional view along the DD direction.

[0116] Combination Figure 12 and Figure 13As shown, in some examples, the side of the upper shell 111 facing the heat sink 120 is provided with an annular boss 1117 protruding towards the heat sink 120, and the annular boss 1117 is located on the outer periphery of the opening 11a. The side of the heat sink 120 facing the upper shell 111 is provided with a first annular groove 126 corresponding to the annular boss 1117. The first annular groove 126 is sealed to the annular boss 1117. In this way, the mating connection between the annular boss 1117 and the first annular groove 126 achieves a sealed connection between the heat sink 120 and the upper shell 111, thereby preventing external moisture and dust from entering the cavity 11b through the opening 11a. Furthermore, when both the upper shell 111 and the heat sink 120 are made of metal, the metal and the annular boss 1117 can also achieve electromagnetic shielding, thereby preventing electromagnetic leakage at the opening 11a and protecting the circuit board 210.

[0117] In some examples, in order to improve heat dissipation efficiency, the side of the upper shell 111 away from the receiving cavity 11b can be provided with heat dissipation fins 1118. The heat dissipation fins 1118 can be distributed on the entire surface of the upper shell 111 to absorb the heat generated by the second heat source 213 distributed in various positions in the receiving cavity 11b. In this way, the heat dissipation fins 1118 can be used to increase the heat exchange area with the outside air and improve the heat dissipation effect on the second heat source 213.

[0118] In some examples, the upper shell 111 has a first protrusion 1119 on the side facing the receiving cavity 11b. The first protrusion 1119 is located on the outer periphery of the opening 11a and surrounds the outer periphery of the first heat source 212. The bottom shell 112 has a second protrusion 1122 on the side facing the receiving cavity 11b, corresponding to the first protrusion 1119. The first protrusion 1119 and the second protrusion 1122 clamp the circuit board 210, thereby providing double-sided support for the circuit board 210 around the first heat source 212 to prevent deformation of the circuit board 210 and affect the normal function of the first heat source 212.

[0119] Figure 14 This is a schematic diagram of another domain controller structure provided by some examples in this disclosure. Figure 15 This is a partial structural breakdown diagram of another domain controller provided by some examples in this disclosure. Figure 16 Figure 14 A cross-sectional view along the EE direction.

[0120] Combination Figures 14 to 16 As shown, in some examples, the upper shell 111 is provided with a second heat dissipation cavity 111a around the opening 11a for the cooling medium to flow through. In this way, the upper shell 111 can further improve the heat dissipation efficiency of the upper shell 111 by utilizing the second heat dissipation cavity 111a, thereby improving the heat dissipation effect on the second heat source 213.

[0121] In some examples, the heat dissipation device 100 also includes a connecting pipe 180, which connects the first heat dissipation cavity 122 and the second heat dissipation cavity 111a. In this way, the first heat dissipation cavity 122 and the second heat dissipation cavity 111a can be connected by the connecting pipe 180, which facilitates the flow of the cooling medium and simplifies the design of the source of the cooling medium.

[0122] In some examples, the cooling medium in the second heat dissipation cavity 111a is the same as the cooling medium in the first heat dissipation cavity 122. For the specific type, please refer to the description of the first heat dissipation cavity 122, which will not be repeated here.

[0123] In some examples, the upper shell 111 also includes a second inlet 111b and a second outlet 111c communicating with the second heat dissipation cavity 111a. The second inlet 111b is used to allow the cooling medium to enter the second heat dissipation cavity 111a, and the second outlet 111c is used to allow the cooling medium to leave the second heat dissipation cavity 111a, thereby forming a second heat dissipation channel for the cooling medium to flow using the second inlet 111b, the second heat dissipation cavity 111a, and the second outlet 111c.

[0124] In some examples, along the length direction of the second heat dissipation cavity 111a (e.g.) Figure 14 (In the x-axis direction) The second inlet 111b and the second outlet 111c are located on both sides of the second heat dissipation cavity 111a. This increases the distance between the second inlet 111b and the second outlet 111c, thereby increasing the time and contact area of ​​the cooling medium in the second heat dissipation cavity 111a, and thus improving the heat dissipation efficiency.

[0125] In some examples, the connecting pipe 180 is connected to the first outlet 124 and the second inlet 111b, so that the first heat dissipation cavity 122 and the second heat dissipation cavity 111a can be connected in series, which facilitates the flow of cooling medium.

[0126] In some examples, the connecting pipe 180 can be connected to the first outlet 124 and the second outlet 111c, and also to the cooling medium recovery end, thus enabling the first heat dissipation cavity 122 and the second heat dissipation cavity 111a to be connected in parallel.

[0127] In some examples, the second heat dissipation cavity 111a is further provided with multiple heat dissipation teeth 150, the extension direction of which is the same as the flow direction of the cooling medium. Simultaneously, the multiple heat dissipation teeth 150 are arranged at intervals to form heat dissipation channels for the cooling medium to flow through at the intervals. In this way, the heat dissipation teeth 150 can be used to increase the contact area with the cooling medium, thereby further improving heat dissipation efficiency.

[0128] In some examples, the heat dissipation teeth 150 in the second heat dissipation cavity 111a may include die-cast heat dissipation teeth 150, folded heat dissipation teeth 150, and microchannel heat dissipation teeth 150, etc. For details, please refer to the description of the first heat dissipation cavity 122, which will not be repeated here.

[0129] The basic principles of this disclosure have been described above with reference to specific embodiments. However, the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0130] Various modifications and variations can be made to this disclosure without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.

Claims

1. A heat dissipation device, characterized in that, include: The shell body is used to accommodate a first heat source. The shell body has an opening corresponding to the first heat source, and a heat-conducting layer is provided on the side of the first heat source facing the opening. A heat sink is disposed at the opening and pressed onto the thermally conductive layer; An elastic connector is elastically pressed against the heat sink, and at least a portion of the structure of the elastic connector passes through the heat sink and is connected to the housing body.

2. The heat dissipation device according to claim 1, characterized in that, The elastic connector includes a connecting part and an elastic part; The connecting part includes a connecting post and a connecting cap; One end of the connecting post is connected to the connecting cap, and the other end of the connecting post passes through the heat sink and is connected to the shell body; The elastic part is sleeved on the connecting post, the elastic part is located between the connecting cap and the heat sink, and the elastic part is in a compressed state.

3. The heat dissipation device according to claim 2, characterized in that, The elastic part includes at least one of a spring, an elastic nut, and an elastic washer.

4. The heat dissipation device according to claim 2, characterized in that, The heat sink includes a mounting hole extending through the thickness direction of the heat sink, and the mounting hole has a stepped surface. The connecting part is disposed in the mounting hole; There is a gap between the connecting cap and the stepped surface; The elastic part is located in the gap between the connecting cap and the stepped surface, and the elastic part is pressed against the stepped surface.

5. The heat dissipation device according to claim 4, characterized in that, Also includes: Elastic seals with conductive properties; Along the axial direction of the mounting hole, the elastic seal, the connecting cap, and the connecting post are arranged sequentially; The elastic seal is sealed to the mounting hole.

6. The heat dissipation device according to any one of claims 1-5, characterized in that, The shell body has a receiving cavity for accommodating a circuit board; The circuit board includes a first heat source and a second heat source, wherein the second heat source is located on the outer periphery of the first heat source; The shell body is provided with a heat-conducting protrusion that corresponds to the second heat source and extends toward the second heat source; The heat-conducting boss is connected to the heat-conducting layer on the surface of the second heat source.

7. The heat dissipation device according to claim 6, characterized in that, The shell body includes an upper shell and a bottom shell, and the upper shell and the bottom shell are sealed and fastened together to form the receiving cavity; The heat dissipation component is connected to the upper shell or the bottom shell via the elastic connector; The upper shell has heat dissipation fins on the side facing away from the receiving cavity.

8. The heat dissipation device according to claim 7, characterized in that, The heat sink is provided with a first heat dissipation cavity for the flow of cooling medium corresponding to the opening; The upper shell is provided with a second heat dissipation cavity around the opening for the cooling medium to circulate; The heat dissipation device also includes a connecting pipe; The connecting pipe connects the first heat dissipation cavity and the second heat dissipation cavity.

9. The heat dissipation device according to claim 8, characterized in that, The first heat dissipation cavity and / or the second heat dissipation cavity are provided with a plurality of heat dissipation teeth extending along the flow direction of the cooling medium. The plurality of heat dissipation teeth are arranged at intervals to form a heat dissipation channel for the cooling medium to flow. The heat dissipation teeth include at least one of die-cast heat dissipation teeth, folded heat dissipation teeth, and microchannel heat dissipation teeth.

10. The heat dissipation device according to claim 7, characterized in that, The upper shell has an annular boss protruding towards the heat sink on one side facing the heat sink, and the annular boss is located on the outer periphery of the opening; The heat sink has a first annular groove on the side facing the upper shell, corresponding to the annular boss. The first annular groove is sealed to the annular boss.

11. The heat dissipation device according to claim 7, characterized in that, The upper shell has a second annular groove recessed towards the receiving cavity on one side facing the heat sink, and the second annular groove is located on the outer periphery of the opening; the heat dissipation device also includes a first sealing ring; the first sealing ring is embedded in the second annular groove, and the heat sink is pressed against the first sealing ring; And / or, The upper shell has a third annular groove recessed towards the receiving cavity on one side facing the heat sink, and the third annular groove is located on the outer periphery of the opening; the heat dissipation device also includes a second sealing ring; the second sealing ring is embedded in the third annular groove, and the heat sink is pressed against the second sealing ring; The second sealing ring is made of a different material than the first sealing ring.

12. The heat dissipation device according to claim 7, characterized in that, A first protrusion is provided on one side of the upper shell facing the receiving cavity; The first protrusion is disposed on the outer periphery of the opening and surrounds the outer periphery of the first heat source; A second protrusion is provided on one side of the bottom shell facing the receiving cavity, corresponding to the first protrusion. The first boss and the second boss clamp the circuit board.

13. A domain controller, characterized in that, include: Circuit board and heat dissipation device as described in any one of claims 1-12; The circuit board includes a substrate, a first heat source, and a second heat source; The first heat source and the second heat source are disposed on the substrate, and the second heat source is located on the outer periphery of the first heat source; The substrate is connected to the housing body of the heat dissipation device; A heat-conducting layer is provided on the side of the first heat source facing the opening of the heat dissipation device; The heat dissipation component of the heat dissipation device is pressed onto the heat-conducting layer.

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