Back-to-back apparatus structure and silicon wafer processing apparatus

Abstract

This utility model discloses a back-to-back equipment structure and silicon wafer processing equipment, including a first device and a second device, with their back sidewalls abutting against each other. Multiple motion components are symmetrically arranged vertically along the corresponding back sidewalls of the first and second devices, with components located on opposite sides of each symmetrical motion component. Furthermore, the corresponding motion components on the back sidewalls of both the first and second devices are designed with a hollow structure. Each motion component is equipped with a corresponding drive component, which drives the corresponding motion component to perform lifting and lowering movements. This utility model connects the back sidewalls of the first and second devices, and through the liftable motion components, allows the components on the motion components to be displayed on the other device via the hollow structure for maintenance. This eliminates the need for additional maintenance space, thereby reducing the distance between the first and second devices, decreasing the equipment's footprint, and lowering land costs.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic device technology, and in particular to a back-to-back device structure and silicon wafer processing equipment. Background Technology

[0002] With the continuous development of the solar photovoltaic cell industry, the field of solar cells is currently characterized by a variety of competing approaches, with PERC, TOPCON, HJT, and BC cells each forming their own distinct path. The demand for silicon wafer (cell) processing equipment is also constantly increasing.

[0003] Silicon wafer processing equipment includes multiple sub-equipment, and due to its own structure, some sub-equipment need to be placed close together to reduce the floor space. In addition, due to debugging and maintenance needs, the back of the sub-equipment needs to be opened and closed for debugging and maintenance. Therefore, when the back sidewalls of two sub-equipment are placed opposite each other, the distance between the two sub-equipment is determined by the width of the door panel, and maintenance space passage must be reserved.

[0004] In existing silicon wafer processing equipment, in order to facilitate the maintenance of components behind the sub-equipment, the reserved maintenance space is relatively large, resulting in excessive spacing between the two sub-equipment and an excessive footprint of the sub-equipment on the site, which increases the land cost of the equipment. Utility Model Content

[0005] This utility model provides a back-to-back equipment structure and silicon wafer processing equipment to solve the problems of excessive floor space and high floor space cost of existing equipment.

[0006] The technical solution of this utility model is a back-to-back device structure, including a first device and a second device, with the back sidewalls of the first device and the second device abutting against each other.

[0007] Multiple motion components are symmetrically arranged in the vertical direction on the corresponding back sidewalls of the first and second devices, and components are provided on the opposite side of the symmetrical motion components; and the corresponding motion components on the back sidewalls of the first and second devices are all designed with a hollow structure.

[0008] Each motion component is equipped with a corresponding drive component, which is used to drive the corresponding motion component to perform lifting and lowering movements.

[0009] Furthermore, the drive assembly includes a first drive unit, a second drive unit, and a synchronous shaft;

[0010] A first drive device and a second drive device are arranged horizontally inside the device located above or below the motion component, and a synchronous shaft is horizontally connected between the first drive device and the second drive device.

[0011] The outputs of both the first and second drive units are connected to the motion component.

[0012] Furthermore, the corresponding moving components in the first and second devices are provided with multiple vertically arranged guide rails, and the multiple guide rails are on the same horizontal line;

[0013] The side of the motion component with the components is fitted with a groove that matches the guide rail.

[0014] Furthermore, a boat-pushing assembly is provided on the side of the motion component facing away from the component and extending horizontally thereon. The boat-pushing assembly is used to move the boat placed on the boat-pushing assembly to the next process.

[0015] Furthermore, the boat propulsion assembly includes a paddle structure, a propulsion component, and a propulsion drive device;

[0016] Multiple parallel propeller structures are arranged to extend horizontally along the motion component. A pusher is installed on the propeller structure, and the pusher is also connected to the push end of the push drive device.

[0017] The drive unit drives the pusher to slide the paddle structure, so as to move the boat placed on the paddle structure to the next process.

[0018] Furthermore, a tray assembly is provided horizontally below the motion component to prevent the paddle structure from falling off.

[0019] Furthermore, a cooling assembly is provided below the soup plate assembly in a horizontal direction, which is used to cool the boat on the boat pusher assembly.

[0020] Furthermore, baffles are provided between the vertically arranged moving components to prevent the heat of the boat from spreading to the side of the moving components where the components are located.

[0021] Furthermore, both the first and second devices have maintenance openings on their front sidewalls opposite the back sidewall.

[0022] This utility model also proposes a silicon wafer processing equipment, which includes the back-to-back equipment structure described above.

[0023] Compared with the prior art, the present invention has at least the following beneficial effects:

[0024] This invention directly connects the back walls of the first and second devices to each other, and then uses a liftable motion component to allow the components on the motion component to be displayed on the other side of the device through a hollow structure for maintenance. This eliminates the need to reserve additional maintenance space, thereby reducing the distance between the first and second devices, reducing the footprint of the equipment, and lowering the equipment's footprint cost. Attached Figure Description

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or accompanying drawings of this invention are used to distinguish different objects and not to describe a particular order.

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a right view of the back-to-back device structure proposed in this utility model;

[0028] Figure 2 This is a front view of the back-to-back device structure proposed in this utility model;

[0029] Figure 3 This is a front view of the motion component proposed in this utility model;

[0030] Figure 4 This is a rear view of the motion component proposed in this utility model;

[0031] Figure 5 This is a schematic diagram of the back-to-back device structure proposed in this utility model;

[0032] Figure 6 A front view of the motion component of this utility model in the open state when it moves upward.

[0033] Figure label:

[0034] 10. First equipment;

[0035] 20. Second equipment;

[0036] 30. Motion components; 301. Components; 3011. Optoelectronic components; 3012. Encoders; 302. Guide rails; 303. Slides; 304. Connecting blocks; 305. Bearing seats; 306. Connecting rods;

[0037] 40. Drive assembly; 401. First drive device; 402. Second drive device; 403. Synchronous shaft;

[0038] 50. Boat-pushing assembly; 501. Paddle structure; 502. Propulsion component;

[0039] 60. Soup dish components;

[0040] 70. Cooling components; 701. Heat sink; 702. Piping;

[0041] 80. Baffle;

[0042] 90. Maintenance port. Detailed Implementation

[0043] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model. Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of the present utility model, and does not imply that every embodiment of the present utility model must have the described feature. Furthermore, it should be noted that this specification describes many features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.

[0044] The principle and structure of this utility model will be described in detail below with reference to the accompanying drawings and embodiments.

[0045] In some embodiments, to reduce the footprint of silicon wafer processing equipment and lower its footprint cost, such as... Figure 1 , Figure 2 and Figure 5 As shown, this utility model proposes a back-to-back device structure, including a first device 10 and a second device 20, with the back sidewalls of the first device 10 and the second device 20 abutting against each other.

[0046] Multiple motion components 30 are symmetrically arranged in the vertical direction on the corresponding back sidewalls of the first device 10 and the second device 20. A component 301 is provided in the middle of the side facing each other of the symmetrical motion components 30; and the corresponding motion components 30 on the back sidewalls of the first device 10 and the second device 20 are all designed with a hollow structure.

[0047] Each motion component 30 is provided with a corresponding drive component 40, which is used to drive the corresponding motion component 30 to perform lifting and lowering movements.

[0048] It should be noted that both the first device 10 and the second device 20 are sub-devices within the silicon wafer processing equipment. In this embodiment, the first device 10 and the second device 20 are used to feed or remove the boat into the furnace, and after passing through the first device 10 and the second device 20, the boat is moved to the next process. Furthermore, the opposite side of the symmetrical motion component 30 corresponds to the back side of the motion component 30, and the same applies throughout the text.

[0049] Both the first device 10 and the second device 20 have maintenance ports 90 on their front sidewalls opposite the back sidewall, which facilitate maintenance personnel to enter the first device 10 and the second device 20 for debugging and maintenance. The two ends of the motion component 30 along its axial direction are connected and fixed to the corresponding sidewalls of the first device 10 and the second device 20 through bearing seats 305. The front sidewalls of the first device 10 and the second device 20 with maintenance ports 90 are provided with connecting rods 306 in the vertical direction. The connecting rods 306 are connected to the vertically arranged motion components 30. The side of the connecting rod 306 of the first device 10 or the second device 20 along the axial direction of the motion component 30 is the maintenance port 90, and the other side along the axial direction of the motion component 30 is the boat's inlet and outlet.

[0050] In this design, the back walls of the first device 10 and the second device 20 abut against each other, and the corresponding moving components 30 on the back walls of the first device 10 and the second device 20 are configured with a hollow structure. This allows maintenance personnel to locate the symmetrical moving component 30 to be repaired in the first device 10 from the second device 20 when the back component 30 of the moving component 30 needs repair. Then, the corresponding moving component 30 in the second device 20 is moved upwards via the drive component 40 (e.g., ...). Figure 6 As shown, the components 301 on the back side of the motion component 30 to be repaired in the first device 10 can be displayed in the second device 20 through the hollow structure. This allows maintenance personnel to repair the components 301 of the motion component 30 in the first device 10 within the second device 20, and then reset the motion component 30 after repair. Similarly, when it is necessary to repair the components 301 on the back side of the motion component 30 in the second device 20, maintenance personnel can find the motion component 30 symmetrical to the motion component 30 to be repaired in the second device 20 from the first device 10, and then move the corresponding motion component 30 in the first device 10 upwards via the drive component 40. This allows the components 301 on the back side of the motion component 30 to be repaired in the second device 20 to be displayed in the first device 10 through the hollow structure, allowing maintenance personnel to repair the components 301 of the motion component 30 in the second device 20 within the first device 10, and then reset the motion component 30 after repair.

[0051] By placing the component 301 on the back side of the motion assembly 30, the component 301 can be prevented from directly contacting the excessive heat inside the first device 10 or the second device 20, thus extending the service life of the component 301; and the component 301 includes, but is not limited to, electronic components such as the photoelectric component 3011 and the encoder 3012.

[0052] Therefore, this utility model directly connects the back sidewalls of the first device 10 and the second device 20 to each other, eliminating the need for additional maintenance space channels, thereby reducing the distance between the first device 10 and the second device 20, reducing the footprint of the silicon wafer processing equipment, and lowering the footprint cost of the silicon wafer processing equipment; moreover, the mutual contact of the back sidewalls of the first device 10 and the second device 20 also facilitates maintenance by maintenance personnel, improves maintenance efficiency, and extends the service life of the first device 10 and the second device 20.

[0053] In some embodiments, to facilitate the lifting and lowering movement of the motion component 30 via the drive component 40, such as Figure 3 As shown, the drive assembly 40 includes a first drive device 401, a second drive device 402, and a synchronous shaft 403;

[0054] A first drive device 401 and a second drive device 402 are arranged horizontally inside the device located above or below the motion component 30, and a synchronous shaft 403 is horizontally connected between the first drive device 401 and the second drive device 402.

[0055] The output terminals of both the first drive device 401 and the second drive device 402 are connected to the motion component 30.

[0056] It should be noted that the first driving device 401 and the second driving device 402 proposed in this embodiment are preferably lifting motors, and the output end of the lifting motor is connected to the motion component 30 through a lead screw. In this way, the motion component 30 moves up and down along the lead screw under the action of the first driving device 401 and the second driving device 402.

[0057] To prevent the motion component 30 from deviating under the drive of the first drive device 401 and the second drive device 402, the first drive device 401 and the second drive device 402 are rigidly connected to both ends of the synchronous shaft 403, so that the first drive device 401 and the second drive device 402 can rotate synchronously. That is, the first drive device 401 and the second drive device 402 drive the motion component 30 to move synchronously in the vertical direction through the synchronous shaft 403, thereby improving the stability of the motion component 30 when it moves up and down.

[0058] In a further embodiment, to further improve the stability of the motion component 30 during lifting and lowering movements, such as... Figures 3-4As shown, the first device 10 and the second device 20 have a plurality of vertically arranged guide rails 302 in the corresponding motion components 30, and the plurality of guide rails 302 are on the same horizontal line;

[0059] The motion component 30 has a slide groove 303 installed on one side of the component 301 corresponding to the guide rail 302.

[0060] It is understood that the back sidewalls of the first device 10 and the second device 20 are provided with multiple connecting blocks 304 in the horizontal direction (the horizontal direction is equivalent to the axial direction or length direction of the motion component 30, the same throughout the text). The connecting blocks 304 are provided with guide rails 302 vertically, and the back sidewalls between the connecting blocks 304 are hollow structures.

[0061] It should be noted that the guide rail 302 proposed in this embodiment can be any one or both of circular guide rails and linear guide rails. When the guide rail 302 is a circular guide rail, the motion component 30 will slide more smoothly on the circular guide rail under the drive of the first drive device 401 and the second drive device 402. When the guide rail 302 is a linear guide rail, due to the higher precision and stronger rigidity of the linear guide rail, the sliding of the motion component 30 on the linear guide rail under the drive of the first drive device 401 and the second drive device 402 is more accurate and stable, thus making it suitable for larger-sized equipment.

[0062] In some embodiments, such as Figure 2 As shown, the motion component 30 has a boat-pushing component 50 extending horizontally from the side opposite to the component 301. The boat-pushing component 50 is used to move the boat placed on itself to the next process.

[0063] Specifically, such as Figure 3 As shown, the boat propulsion assembly 50 includes a paddle structure 501, a propulsion member 502, and a propulsion drive device (not shown, the same throughout the text);

[0064] Multiple parallel propeller structures 501 are arranged to extend along the horizontal direction of the motion component 30. A pusher 502 is matched and installed on the propeller structure 501. The pusher 502 is also connected to the push end of the push drive device.

[0065] The drive device drives the pusher 502 to slide the paddle structure 501, so as to move the boat placed on the paddle structure 501 to the next process.

[0066] It is understood that the motion component 30 has multiple parallel propeller structures 501 extending vertically at its top and horizontally. The drive device is preferably a drive motor.

[0067] In this way, the control unit of the silicon wafer processing equipment places the boat on the paddle structure 501 through a robot or other handling structure. Then the control unit activates the push drive device to drive the push member 502 to slide the paddle structure 501, thereby moving the boat on the paddle structure 501 to the next process. Of course, there can be one or more robots, which is not limited here.

[0068] In some embodiments, such as Figure 2 As shown, a soup pan assembly 60 is horizontally provided below the motion component 30, and the soup pan assembly 60 is used to prevent the paddle structure 501 from falling off.

[0069] It should be noted that the soup plate assembly 60 serves as a physical isolation layer between the motion assembly 30 and the lower propeller structure 501. The soup plate assembly 60 plays a role in intercepting falls. When the upper propeller structure 501 accidentally falls off, the bearing surface of the soup plate assembly 60 (usually made of impact-resistant ceramic or anodized aluminum) can absorb kinetic energy and prevent penetrating damage to the lower propeller structure 501. Furthermore, the soup plate assembly 60 and the motion assembly 30 are arranged at a vertical interval.

[0070] In some embodiments, to prevent excessive heat within the first device 10 and the second device 20 from damaging the components 301, such as... Figure 2 As shown, a cooling assembly 70 is provided below the soup pan assembly 60 in a horizontal direction. The cooling assembly 70 is used to cool the boat on the boat pusher assembly 50.

[0071] Specifically, the cooling component 70 is located below the soup pan component 60 and is provided with a water-flowing heat dissipation pipe 701 extending horizontally. The inlet and outlet of the heat dissipation pipe 701 are connected to the outside through pipes 702 to form a water circulation of outflow and inflow, thereby achieving the purpose of water cooling and heat dissipation, avoiding excessive heat in the first device 10 and the second device 20, shortening the cooling time of the boat, and improving the working efficiency of the silicon wafer processing equipment.

[0072] In some embodiments, to further prevent the components 301 of the moving assembly 30 from being damaged due to excessive heat, such as... Figure 2 As shown, a baffle 80 is provided between the vertically arranged motion components 30. The baffle 80 is used to prevent the heat of the boat from spreading to the side of the motion component 30 where the component 301 is located.

[0073] In some embodiments, the present invention also provides a silicon wafer processing apparatus, which includes the back-to-back equipment structure described above.

[0074] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A back-to-back device structure, characterized in that, It includes a first device (10) and a second device (20), the back sidewalls of the first device (10) and the second device (20) abutting against each other; The first device (10) and the second device (20) have multiple motion components (30) symmetrically arranged on the corresponding back sidewalls in the vertical direction. The symmetrical motion components (30) have components (301) on the opposite side. The back sidewalls of the first device (10) and the second device (20) are all designed with a hollow structure corresponding to the motion components (30). Each of the motion components (30) is provided with a corresponding drive component (40), which is used to drive the corresponding motion component (30) to perform lifting and lowering movements.

2. The back-to-back device structure according to claim 1, characterized in that, The drive assembly (40) includes a first drive device (401), a second drive device (402), and a synchronous shaft (403); A first drive device (401) and a second drive device (402) are arranged horizontally in the device located above or below the motion component (30), and a synchronous shaft (403) is horizontally connected between the first drive device (401) and the second drive device (402); The output terminals of the first drive device (401) and the second drive device (402) are both connected to the motion component (30).

3. The back-to-back device structure according to claim 1, characterized in that, The first device (10) and the second device (20) are provided with a plurality of vertically arranged guide rails (302) corresponding to the motion component (30), and the plurality of guide rails (302) are on the same horizontal line; The motion component (30) has a slide groove (303) installed on one side of the component (301) corresponding to the guide rail (302).

4. The back-to-back device structure according to claim 1, characterized in that, The motion component (30) is provided with a boat-pushing component (50) on the side opposite to the component (301) and extending horizontally thereon. The boat-pushing component (50) is used to move the boat placed on the boat-pushing component (50) to the next process.

5. The back-to-back device structure according to claim 4, characterized in that, The boat propulsion assembly (50) includes a paddle structure (501), a propulsion component (502), and a propulsion drive device; Multiple parallel propeller structures (501) are arranged to extend along the horizontal direction of the motion component (30), and a pusher (502) is matched and installed on the propeller structure (501). The pusher (502) is also connected to the push end of the push drive device. The push drive device drives the pusher (502) to slide the paddle structure (501) so as to move the boat placed on the paddle structure (501) to the next process.

6. The back-to-back device structure according to claim 5, characterized in that, A soup tray assembly (60) is horizontally disposed below the motion component (30), and the soup tray assembly (60) is used to prevent the paddle structure (501) from falling off.

7. The back-to-back device structure according to claim 6, characterized in that, A cooling assembly (70) is provided below the soup plate assembly (60) in a horizontal direction, the cooling assembly (70) being used to cool the boat on the boat pusher assembly (50).

8. The back-to-back device structure according to any one of claims 1 to 7, characterized in that, A baffle (80) is provided between the vertically arranged motion components (30), and the baffle (80) is used to prevent the heat of the boat from spreading to the side of the motion component (30) where the component (301) is located.

9. The back-to-back device structure according to any one of claims 1 to 7, characterized in that, Both the first device (10) and the second device (20) have maintenance openings (90) on their front sidewalls opposite to the back sidewall.

10. A silicon wafer processing equipment, characterized in that, The silicon wafer processing equipment includes the back-to-back equipment structure as described in any one of claims 1 to 9.

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