Backlight panel and display device

Abstract

This utility model relates to the field of backlight display technology, and particularly to a backlight panel. The backlight panel includes a support, which comprises a substrate and an optical structure layer with a cup-shaped groove. The backlight panel includes LED chips disposed within the cup-shaped groove and connected to the substrate. The backlight panel also includes an encapsulation module, which includes encapsulating adhesive covering the side of the substrate where the LED chips are disposed, and a reflective layer disposed on the surface of the encapsulating adhesive away from the substrate. A gap exists between the reflective layer and the optical structure layer at their ends away from the substrate in a direction parallel to the substrate. By providing the cup-shaped groove, the reflective layer, and the gap between them, the oblique light emitted by the LED chips is reflected together and emitted through the gap, isolating the light emitted by each LED chip in a separate area, reducing the halo effect of the backlight panel, and enhancing the uniformity of light emission within a single emitting area. This utility model also provides a display device, which includes the aforementioned backlight panel and a support structure for mounting the backlight panel.

Description

[Technical Field]

[0001] This utility model relates to the field of backlight display technology, and in particular to a backlight panel and display device. [Background Technology]

[0002] With the development of LED technology, in order to adapt to LED use in different scenarios, people have designed LED backlight panels of different sizes and pitches according to usage requirements. Generally speaking, when it is necessary to reduce costs or adapt to long-distance viewing scenarios, display screens made with backlight panels with larger pitches will have a better visual effect.

[0003] However, the large backlight panels of existing PITCHs are prone to uneven light emission within the luminous area of ​​individual LED beads, resulting in bright and dark areas within the luminous area, which affects the visual effect when viewing. [Utility Model Content]

[0004] To address the problem of uneven light output in the luminous area of ​​a single LED in existing large-pitch backlight panels, which affects visual effects, this invention provides a backlight panel and a display device.

[0005] The present invention provides a backlight panel and a display device to solve the technical problem. The backlight panel includes a support, the support includes a substrate and an optical structure layer disposed on one side of the substrate; the optical structure layer has a cup groove.

[0006] An LED chip is disposed within the cup groove and connected to the substrate;

[0007] The encapsulation module includes an encapsulating adhesive covering the side of the substrate on which the LED chip is disposed, and a reflective layer disposed on the surface of the encapsulating adhesive away from the substrate; the reflective layer and the end of the optical structure layer away from the substrate are separated by a gap in a direction parallel to the substrate.

[0008] Preferably, the optical structure layer is integrally molded onto the substrate.

[0009] Preferably, the projection center of the reflective layer on the substrate coincides with the projection center of the LED chip on the substrate, and the reflective layer is parallel to the substrate;

[0010] Of the light emitted from the LED chip into the reflective layer, part passes through the reflective layer and is emitted out, while the other part is reflected by the reflective layer.

[0011] Preferably, the inner surface of the cup groove is a plane or an arc surface.

[0012] Preferably, the plane containing the side of the encapsulating adhesive away from the substrate is parallel to the substrate, and the maximum height of the encapsulating adhesive is higher than the maximum height of the optical structure layer.

[0013] Preferably, the height of the cup groove is between 0.4 mm and 1.0 mm.

[0014] Preferably, the thickness of the reflective layer is between 0.03 mm and 0.5 mm.

[0015] Preferably, the optical structure layer leaves a certain gap between the end of the cup groove near the LED chip and the LED chip, and forms a die-bonding site around the LED chip.

[0016] Preferably, the optical structure layer further includes a filling layer disposed corresponding to the die-bonding site.

[0017] The display device includes the backlight panel and a support structure for mounting the backlight panel.

[0018] Compared with the prior art, the backlight panel and display device of this utility model have the following advantages:

[0019] 1. The backlight panel of this utility model includes a bracket, which includes a substrate and an optical structure layer disposed on one side of the substrate; the optical structure layer has a cup-shaped groove; the backlight panel includes LED chips, which are disposed in the cup-shaped groove and connected to the substrate; the backlight panel also includes an encapsulation module, which includes an encapsulating adhesive covering the side of the substrate where the LED chips are disposed, and a reflective layer disposed on the surface of the encapsulating adhesive away from the substrate; there is a gap between the reflective layer and the optical structure layer at the end away from the substrate in the direction parallel to the substrate. By providing a cup-shaped groove around the LED chips, the oblique light emitted by the LED chips with excessive emission angles is reflected by the cup-shaped groove, thereby isolating the light emitted by each LED chip in the backlight module into a separate light-emitting area, reducing the halo that may be generated by the backlight panel; and the dispersed part of the light is emitted through the gap between the reflective layer and the optical structure layer, making the light emission in this area relatively uniform, thereby enhancing the light emission effect in the light-emitting area of ​​a single LED and greatly improving the visual effect of the backlight panel.

[0020] 2. The optical structure layer of this utility model is integrally molded onto the substrate. By integrally molding the optical structure layer onto the substrate, the time and process required to assemble multiple reflection structures on the substrate are reduced, the structural design of the substrate is optimized, the production efficiency of the backlight panel is greatly improved, and the production cost of the substrate is reduced.

[0021] 3. In this invention, the projection center of the reflective layer on the substrate coincides with the projection center of the LED chip on the substrate, and the reflective layer is parallel to the substrate. Part of the light emitted from the LED chip through the reflective layer is emitted, while the other part is reflected. On one hand, by setting a reflective layer directly above the LED chip, the light emitted from directly above the LED chip is partially dispersed onto the optical structure layers on both sides of the LED chip, preventing a large brightness difference between the light emitted from directly above and from both sides of the LED chip, which would cause bright and dark bands to appear on the backlight panel. On the other hand, by setting a reflective layer parallel to the substrate, the light emitted from the reflective layer is evenly dispersed onto the optical structure layers surrounding the LED chip, avoiding large brightness differences at different edges of a single LED light-emitting area.

[0022] 4. The inner surface of the cup groove of this utility model is either a flat or curved surface. By changing the state of the inclined surface to a flat or curved surface, the optical structure layer can more effectively control the direction of light reflection inside the cup groove, reduce light scattering or loss, and greatly improve the utilization rate of light.

[0023] 5. In this invention, the plane on the side of the encapsulating adhesive furthest from the substrate is parallel to the substrate, and the maximum height of the encapsulating adhesive is higher than the maximum height of the optical structure layer. By designing the encapsulating adhesive to be higher than the optical structure layer and to lie in the same plane, on the one hand, it facilitates one-time molding of the encapsulation process, improving the standardization and simplicity of backlight panel production; on the other hand, it promotes light transmission in the top area of ​​the optical structure layer, avoiding dark bands at the top of the optical structure layer that would affect the overall visual effect of the backlight panel.

[0024] 6. The height range of the cup groove in this utility model is between 0.4mm and 1.0mm. By adjusting the height range of the cup groove, it is beneficial for the cup groove to better collect and reflect the light emitted by the LED chip, reduce light loss, and improve the light reflection effect of the cup groove, thereby further improving the visual comfort of the backlight panel.

[0025] 7. The thickness of the reflective layer of this utility model ranges from 0.03mm to 0.5mm. By controlling the thickness range of the reflective layer, the propagation path and light path distribution of light passing through the reflective layer can be controlled more precisely, greatly improving the display light efficiency and light emission uniformity of the backlight panel.

[0026] 8. In this invention, the optical structure layer has a certain gap between the end of the cup groove near the LED chip and the LED chip, forming a die-bonding position surrounding the LED chip. During the fabrication of the backlight board, by setting a die-bonding position with a large opening near the LED chip, even if the substrate expands or contracts, causing the die-bonding position opening to shift from the position of the LED chip's pad, the LED chip can still contact the pad located within the die-bonding position, reducing the substrate's manufacturing difficulty and cost.

[0027] 9. The optical structure layer of this utility model also includes a filling layer corresponding to the die-bonding position. After die bonding, a filling layer is set around the LED chip to further protect the substrate and prevent damage to the substrate exposed at the die-bonding position.

[0028] 10. This utility model also provides a display device, including a backlight panel and a support structure for mounting the backlight panel, which has the same beneficial effects as the backlight panel described above, and will not be described in detail here. [Attached Image Description]

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a cross-sectional schematic diagram of the backlight panel provided in the first embodiment of this utility model.

[0031] Figure 2 This is an example optical path diagram of the backlight panel provided in the first embodiment of this utility model.

[0032] Figure 3 This is a top view of the backlight panel provided in the first embodiment of this utility model.

[0033] Figure 4 This is a cross-sectional schematic diagram of the backlight panel provided in the second embodiment of this utility model.

[0034] Figure 5 This is an example optical path diagram of the backlight panel provided in the second embodiment of this utility model.

[0035] Figure 6 This is a top view of the backlight panel provided in the second embodiment of this utility model.

[0036] Figure 7 This is a block diagram of the display device provided in the third embodiment of this utility model.

[0037] Explanation of reference numerals in the attached diagram:

[0038] 1. Backlight panel; 2. Bracket; 3. LED chip; 4. Packaging module; 5. Display device;

[0039] 21. Substrate; 22. Optical structure layer; 41. Encapsulating adhesive; 42. Reflective layer; 43. Gap; 51. Support structure;

[0040] 100. Backlight panel; 221. Cup groove; 222. Die-bonding position; 223. Filler layer.

Detailed Implementation Methods

[0041] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the scope of the present utility model.

[0042] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0043] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0044] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0045] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0046] Please see Figures 1-3 The first embodiment of this utility model provides a backlight panel 1, including a bracket 2, the bracket 2 including a substrate 21 and an optical structure layer 22 disposed on one side of the substrate 21; the optical structure layer 22 has a cup groove 221; an LED chip 3 is disposed in the cup groove 221 and connected to the substrate 21; an encapsulation module 4, the encapsulation module 4 including an encapsulating adhesive 41 covering the side of the substrate 21 where the LED chip 3 is disposed, and a reflective layer 42 disposed on the surface of the encapsulating adhesive 41 away from the substrate 21; a gap 43 exists between the reflective layer 42 and the end of the optical structure layer 22 away from the substrate 21 in the direction parallel to the substrate 21.

[0047] Specifically, in this embodiment, the encapsulating adhesive 41 is molded silicone.

[0048] Understandably, when the oblique light emitted from the LED chip 3 shines on the inner wall of the cup groove 221, it is reflected by the inner wall of the cup groove 221 before being emitted again. This avoids the oblique light with an excessively large emission angle from entering the light-emitting area of ​​the adjacent LED chip 3. In other words, the emission area of ​​the light emitted by a single LED chip 3 is limited to the cup groove 221 corresponding to that LED chip 3, which greatly reduces the halo effect that the backlight panel 1 may produce.

[0049] Understandably, part of the light reflected by the cup groove 221 exits through the gap 43, while the other part enters the reflective layer 42 and is repeatedly reflected within the space formed by the reflective layer 42 and the cup groove 221, and finally exits through the gap 43. This means that all the light reflected by the cup groove 221 is ultimately limited to exiting through the gap 43 set along the edge contour of the light-emitting area, thereby further enhancing the uniformity of light emission in the area and greatly improving the visual effect of the backlight panel 1.

[0050] More specifically, the optical structure layer integrally covers the substrate, which not only reflects light but also replaces the solder mask on the substrate, greatly reducing the process complexity and production cost of the bracket 2.

[0051] Furthermore, the optical structure layer 22 is integrally molded on the substrate 21.

[0052] Understandably, the one-piece molding process reduces the process and time required to assemble the optical structure layer 22 onto the substrate 21 with multiple reflective structures, optimizes the structure of the substrate 21, greatly improves the production efficiency of the backlight panel 1, and reduces the production cost of the substrate 21.

[0053] Furthermore, the projection center of the reflective layer 42 on the substrate 21 coincides with the projection center of the LED chip 3 on the substrate 21, and the reflective layer 42 is parallel to the substrate 21; part of the light emitted by the LED chip 3 into the reflective layer 42 passes through the reflective layer 42 and is emitted out, while the other part is reflected by the reflective layer 42.

[0054] Specifically, in this embodiment, the reflective layer 42 is prepared using CSP white oil, which is beneficial to improving the light reflection efficiency of the reflective layer 42.

[0055] Understandably, when the LED chip 3 emits light directly upwards, the reflective layer 42 located directly above the LED chip 3 disperses some of the light onto the inner wall of the cup groove 221 on the side of the LED chip 3. Through the joint reflection of the cup groove 221 and the reflective layer 42, this part of the light is emitted from the gap 43, thereby preventing the light emitted directly above the LED chip 3 from being too bright, which would result in a large brightness difference between the top of the LED chip 3 and the side of the light-emitting area, causing the backlight panel 1 to have bright and dark bands.

[0056] Understandably, the reflective layer 42, which is parallel to the substrate 21, helps to uniformly disperse the light emitted from the LED chip 3 onto the optical structure layer 22 surrounding the LED chip 3, thereby reducing the brightness difference between the light emitted from different edges of the light-emitting area and further enhancing the uniformity of light emission in a single light-emitting area of ​​the backlight panel 1.

[0057] Furthermore, the inner surface of the cup groove 221 is either a plane or an arc surface.

[0058] More specifically, the groove of the cup groove 221 is square or circular; in this embodiment, the inner surface of the cup groove 221 is flat and the groove is square, that is, the shape of the cup groove 221 is an inverted frustum.

[0059] Understandably, the cup groove 221 reflects the light propagating inside the cup groove 221 through the inclined surface of its inner surface. Adjusting the inclined surface to be a flat or curved surface helps the cup groove 221 control the direction of light reflection, thereby reducing light scattering or loss and greatly improving the utilization rate of the light emitted by the LED chip 3 by the backlight panel 1.

[0060] Furthermore, the plane on the side of the encapsulant 41 away from the substrate 21 is parallel to the substrate 21, and the maximum height of the encapsulant 41 is higher than the maximum height of the optical structure layer 22.

[0061] Understandably, the design that the encapsulating adhesive 41 is higher than the optical structure layer 22 ensures that the encapsulating adhesive 41 can completely cover the optical structure layer 22, avoids unevenness on the surface of the encapsulating adhesive 41, and facilitates one-time molding when the backlight board 1 is encapsulated.

[0062] Understandably, the arrangement of the plane on the side of the encapsulant 41 away from the substrate 21 parallel to the substrate 21 makes it easier to control the flow and distribution of the encapsulant 41, reduce errors caused by the flowability of the encapsulant 41 in the encapsulation process, and further improve the encapsulation accuracy and reliability of the encapsulant 41.

[0063] Understandably, since the height of the encapsulating adhesive 41 is greater than that of the optical structure layer 22, a certain thickness of light-transmitting encapsulating adhesive 41 is provided at the top of the optical structure layer 22. This allows a certain amount of light to pass through the top of the optical structure layer 22 when it is far away from the LED chip 3, preventing dark bands from appearing at the intervals between the light-emitting areas of different LED chips 3, which would affect the overall display effect of the backlight panel 1.

[0064] Furthermore, the slope and height of the cup groove 221 are matched with the shape and thickness of the LED chip 3 through optical simulation; the shape and thickness of the reflective layer 42 are matched with the shape and thickness of the LED chip 3 through optical simulation.

[0065] Specifically, since the slope and height of the cup groove 221 are matched with the shape and thickness of the LED chip 3, the slope and height of the cup groove 221 can also be matched with the shape and thickness of the LED chip 3 through optical simulation.

[0066] Furthermore, the height of the cup groove 221 ranges from 0.4 mm to 1.0 mm.

[0067] Understandably, the height of the cup groove 221 changes with the height of the LED chip 3. When the height of the cup groove 221 is preferably between 0.4 mm and 1.0 mm, the optical structure layer 22 has a high light reflectivity to the LED chip 3, which is beneficial for the cup groove 221 to better collect and reflect the light emitted by the LED chip 3, reduce light loss and increase the uniformity of light output, and greatly improve the visual comfort of the backlight panel 1.

[0068] Furthermore, the thickness of the reflective layer 42 ranges from 0.03 mm to 0.5 mm.

[0069] Understandably, the thickness of the reflective layer 42 varies with the PIT CH of the LED chip 3, that is, the spacing between two adjacent LED chips 3. When the thickness of the reflective layer 42 is preferably between 0.03mm and 0.5mm, the reflective layer 42 can more accurately control the propagation path and light path distribution of the light passing through the reflective layer 42, which greatly improves the display light efficiency and light emission uniformity of the backlight panel 1.

[0070] Furthermore, the optical structure layer 22 leaves a certain gap between the end of the cup groove 221 near the LED chip 3 and the LED chip 3, and forms a die-bonding site 222 around the LED chip 3.

[0071] Specifically, the substrate 21 is provided with pads for placing LED chips 3; in this embodiment, the opening diameter of the die bonding position 222 is much larger than the diameter of the pads.

[0072] Understandably, during the fabrication of the backlight board 1, the LED chip 3 needs to be placed on the pads before the die bonding operation is performed. Setting a larger opening for the die bonding position 222 is beneficial for the substrate 21 to expand and contract during actual production. When the pads shift position, the pads are still located within the die bonding position 222, and the LED chip 3 can be properly installed on the pads, which greatly reduces the manufacturing difficulty and cost of the substrate 21.

[0073] Furthermore, the optical structure layer 22 also includes a filling layer 223 disposed corresponding to the die-bonding site 222.

[0074] Specifically, the filling layer 223 is filled around the LED chip 3 by dispensing or brushing. In this embodiment, the filling layer 223 is made of a high reflective material, which is beneficial to reflect the light that enters the die-bonding site 222 after being reflected by the optical structure layer 22 and the reflective layer 42, thereby reducing light loss and further improving the light utilization rate of the backlight panel 1.

[0075] Understandably, the filler layer 223 protects the exposed part of the circuitry on the substrate 21 at the die bonding site 222, preventing damage to the circuitry around the LED chip 3 and reducing the defect rate during the production of the backlight board 1.

[0076] Please see Figures 4-6 The second embodiment of this utility model provides a backlight panel 100. The backlight panel 100 differs from the backlight panel 1 provided in the first embodiment only in that the opening of the cup groove 221 is circular, and the inclined surface of the inner surface of the cup groove 221 is arc-shaped, that is, the shape of the cup groove 221 is hemispherical. As an optional implementation, the hemispherical cup groove 221 design is more suitable for the light source shape of the LED chip 3, improving the light utilization rate of the LED chip 3.

[0077] Please see Figure 7 The third embodiment of this utility model provides a display device 5, including a backlight panel 1 and a support structure 51 for mounting the backlight panel 1.

[0078] Compared with the prior art, the backlight panel and display device of this utility model have the following advantages:

[0079] 1. The backlight panel of this utility model includes a bracket, which includes a substrate and an optical structure layer disposed on one side of the substrate; the optical structure layer has a cup-shaped groove; the backlight panel includes LED chips, which are disposed in the cup-shaped groove and connected to the substrate; the backlight panel also includes an encapsulation module, which includes an encapsulating adhesive covering the side of the substrate where the LED chips are disposed, and a reflective layer disposed on the surface of the encapsulating adhesive away from the substrate; there is a gap between the reflective layer and the optical structure layer at the end away from the substrate in the direction parallel to the substrate. By providing a cup-shaped groove around the LED chips, the oblique light emitted by the LED chips with excessive emission angles is reflected by the cup-shaped groove, thereby isolating the light emitted by each LED chip in the backlight module into a separate light-emitting area, reducing the halo that may be generated by the backlight panel; and the dispersed part of the light is emitted through the gap between the reflective layer and the optical structure layer, making the light emission in this area relatively uniform, thereby enhancing the light emission effect in the light-emitting area of ​​a single LED and greatly improving the visual effect of the backlight panel.

[0080] 2. The optical structure layer of this utility model is integrally molded onto the substrate. By integrally molding the optical structure layer onto the substrate, the time and process required to assemble multiple reflection structures on the substrate are reduced, the structural design of the substrate is optimized, the production efficiency of the backlight panel is greatly improved, and the production cost of the substrate is reduced.

[0081] 3. In this invention, the projection center of the reflective layer on the substrate coincides with the projection center of the LED chip on the substrate, and the reflective layer is parallel to the substrate. Part of the light emitted from the LED chip through the reflective layer is emitted, while the other part is reflected. On one hand, by setting a reflective layer directly above the LED chip, the light emitted from directly above the LED chip is partially dispersed onto the optical structure layers on both sides of the LED chip, preventing a large brightness difference between the light emitted from directly above and from both sides of the LED chip, which would cause bright and dark bands to appear on the backlight panel. On the other hand, by setting a reflective layer parallel to the substrate, the light emitted from the reflective layer is evenly dispersed onto the optical structure layers surrounding the LED chip, avoiding large brightness differences at different edges of a single LED light-emitting area.

[0082] 4. The inner surface of the cup groove of this utility model is either a flat or curved surface. By changing the state of the inclined surface to a flat or curved surface, the optical structure layer can more effectively control the direction of light reflection inside the cup groove, reduce light scattering or loss, and greatly improve the utilization rate of light.

[0083] 5. In this invention, the plane on the side of the encapsulating adhesive furthest from the substrate is parallel to the substrate, and the maximum height of the encapsulating adhesive is higher than the maximum height of the optical structure layer. By designing the encapsulating adhesive to be higher than the optical structure layer and to lie in the same plane, on the one hand, it facilitates one-time molding of the encapsulation process, improving the standardization and simplicity of backlight panel production; on the other hand, it promotes light transmission in the top area of ​​the optical structure layer, avoiding dark bands at the top of the optical structure layer that would affect the overall visual effect of the backlight panel.

[0084] 6. The height range of the cup groove in this utility model is between 0.4mm and 1.0mm. By adjusting the height range of the cup groove, it is beneficial for the cup groove to better collect and reflect the light emitted by the LED chip, reduce light loss, and improve the light reflection effect of the cup groove, thereby further improving the visual comfort of the backlight panel.

[0085] 7. The thickness of the reflective layer of this utility model ranges from 0.03mm to 0.5mm. By controlling the thickness range of the reflective layer, the propagation path and light path distribution of light passing through the reflective layer can be controlled more precisely, greatly improving the display light efficiency and light emission uniformity of the backlight panel.

[0086] 8. In this invention, the optical structure layer has a certain gap between the end of the cup groove near the LED chip and the LED chip, forming a die-bonding position surrounding the LED chip. During the fabrication of the backlight board, by setting a die-bonding position with a large opening near the LED chip, even if the substrate expands or contracts, causing the die-bonding position opening to shift from the position of the LED chip's pad, the LED chip can still contact the pad located within the die-bonding position, reducing the substrate's manufacturing difficulty and cost.

[0087] 9. The optical structure layer of this utility model also includes a filling layer corresponding to the die-bonding position. After die bonding, a filling layer is set around the LED chip to further protect the substrate and prevent damage to the substrate exposed at the die-bonding position.

[0088] 10. This utility model also provides a display device, including a backlight panel and a support structure for mounting the backlight panel, which has the same beneficial effects as the backlight panel described above, and will not be described in detail here.

[0089] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A backlight panel, characterized in that, include: The support includes a substrate and an optical structure layer disposed on one side of the substrate; The optical structure layer has a cup-shaped groove; An LED chip is disposed within the cup groove and connected to the substrate; The encapsulation module includes an encapsulating adhesive covering the side of the substrate on which the LED chip is disposed, and a reflective layer disposed on the surface of the encapsulating adhesive away from the substrate; the reflective layer and the end of the optical structure layer away from the substrate are separated by a gap in a direction parallel to the substrate.

2. The backlight panel as described in claim 1, characterized in that: The optical structure layer is integrally molded onto the substrate.

3. The backlight panel as described in claim 1, characterized in that: The projection center of the reflective layer on the substrate coincides with the projection center of the LED chip on the substrate, and the reflective layer is parallel to the substrate. Of the light emitted from the LED chip into the reflective layer, part passes through the reflective layer and is emitted out, while the other part is reflected by the reflective layer.

4. The backlight panel as described in claim 1, characterized in that: The inner surface of the cup groove is either a plane or an arc surface.

5. The backlight panel as described in claim 1, characterized in that: The plane containing the side of the encapsulating adhesive away from the substrate is parallel to the substrate, and the maximum height of the encapsulating adhesive is higher than the maximum height of the optical structure layer.

6. The backlight panel as described in claim 4, characterized in that: The height of the cup groove ranges from 0.4 mm to 1.0 mm.

7. The backlight panel as described in claim 4, characterized in that: The thickness of the reflective layer ranges from 0.03 mm to 0.5 mm.

8. The backlight panel as described in claim 1, characterized in that: The optical structure layer leaves a certain gap between the end of the cup groove near the LED chip and the LED chip, and forms a die-bonding site around the LED chip.

9. The backlight panel as described in claim 8, characterized in that: The optical structure layer also includes a filling layer corresponding to the die-bonding site.

10. A display device, characterized in that: The display device includes a backlight panel as described in any one of claims 1-9 and a support structure for mounting the backlight panel.

Images