A round solder strip tinning device

Abstract

The utility model belongs to photovoltaic solder strip tin plating technical field relates to a kind of round solder strip tin plating device.The device includes rack, and mould adjusting device and high-frequency vibration device are arranged on the rack, and high-frequency vibration device includes vibration terminal, and vibration terminal is located below tin control mould, and vibration terminal is in contact with round copper wire, and vibration terminal is vibrated to round copper wire, and round copper wire is successively coated and shaped by the line pressing wheel, vibration terminal, tin control mould, air cooling device, and forms round solder strip.High-frequency vibration device is used, and high-frequency vibration changes the surface tension of copper line surface tin liquid, accelerates the flow of tin liquid in the circumferential direction of copper line, so that it is more evenly distributed on the surface of copper line before solidification, and the concentricity of cooled round solder strip is better, and the surface is more smooth.

Description

Technical Field

[0001] This utility model belongs to the field of photovoltaic solder ribbon tin plating technology, and relates to a circular solder ribbon tin plating device. Background Technology

[0002] In the photovoltaic industry, there are two main production methods for photovoltaic solder ribbons: electroplating and hot-dip plating. Electroplating is more expensive and has a smaller market share in the photovoltaic industry, while the mainstream hot-dip plating method is cheaper and simpler, giving it a significant advantage in the photovoltaic industry. In the hot-dip plating process, tin plating is the core process; the tin plating process affects important indicators such as coating thickness, concentricity, and surface quality of the photovoltaic solder ribbon product. Currently, in the production of hot-dip coated circular photovoltaic solder ribbons, the industry commonly uses the annular air knife method, which creates a uniform airflow around the entire circumference of the round copper wire, using gas to wipe and form a photovoltaic solder ribbon with a consistent coating.

[0003] like Figure 5 As shown, the definition For the finished wire diameter of round solder strip, For the diameter of the copper substrate, d max d min The maximum and minimum coating thicknesses are defined. Based on the finished wire diameter D, the tin alloy layer d... max d min It must be controlled within a reasonable range. The industry uses concentricity as the control standard, that is... Ideal state such as Figure 7 As shown, however, in actual production using circular molds, they mostly appear as follows. Figure 6 As shown, the eccentricity is quite serious, with a high percentage of sections having a concentricity of less than 50%, which is detrimental to subsequent welding work. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and to propose a circular solder strip tin plating device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A circular solder strip tinning device includes a frame, on which a mold adjustment device and a high-frequency vibration device are mounted. A tin furnace is located below the frame, and a wire pressing wheel connecting plate is mounted on the frame. A wire pressing wheel is located below the wire pressing wheel connecting plate. A tin control mold floats on the surface of the molten tin in the tin furnace. An air cooling device is mounted on the frame. The high-frequency vibration device includes a vibration terminal located below the tin control mold. The vibration terminal contacts a circular copper wire and vibrates the circular copper wire. The circular copper wire passes sequentially through the wire pressing wheel, the vibration terminal, the tin control mold, and the air cooling device for coating and shaping to form a circular solder strip.

[0007] Furthermore, the mold adjustment device includes a support plate, on which several baffles are provided, and the solder control mold is located below the baffles.

[0008] Furthermore, the support plate is provided with a number of mounting holes from top to bottom, and the baffle and the support plate are connected through the mounting holes.

[0009] Furthermore, the vibration device includes a voice coil motor, and the vibration terminal is connected to the voice coil motor via a connecting rod.

[0010] Furthermore, the vibration terminal includes a semi-circular component, and a semi-tube component is connected above the semi-circular component.

[0011] Furthermore, if we define the diameter of the solder control mold as E and the amplitude of the high-frequency vibration device as F, then F < E / 2.

[0012] Furthermore, the vibration frequency of the high-frequency vibration device is 100Hz to 300Hz.

[0013] Furthermore, the frame is provided with a drive guide wheel, point A is defined as the point of tangency between the drive guide wheel and the circular solder strip in the vertical direction, point B is defined as the center point of the solder control mold, and point C is defined as the vertical point of tangency on the inner surface of the vibration terminal. Points A, B, and C are located on the same straight line.

[0014] Furthermore, the concentricity of the circular solder strip is greater than 50%.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. This utility model provides a circular solder strip tin plating device, which adopts a high-frequency vibration device. The high-frequency vibration changes the surface tension of the molten tin on the surface of the copper wire, accelerates the flow of the molten tin in the circumferential direction of the copper wire, and makes it more evenly distributed on the surface of the copper wire before solidification. The circular solder strip after cooling has better concentricity and a smoother surface. In addition, the high-frequency vibration can clean the fine flux residues remaining in the mold hole in time, preventing the mold from clogging.

[0017] 2. The sizing die floats on the surface of the molten tin in the furnace, with its upper surface higher than the molten tin surface. The molten tin is carried upward from the central die hole by the copper wire through the inlet on the lower surface of the floating die. Impurities such as tin ash floating on the surface of the molten tin in the furnace are separated and will not enter the sizing die outlet.

[0018] 3. The solder control mold limits the amount of solder on the surface of the copper wire. The total amount of solder that passes through is equal to the total amount required for the coating of the solder ribbon product. During the upward pulling process, the molten solder that leaves the mold forms a miniature cone in the vertical direction. Attached Figure Description

[0019] The accompanying drawings are incorporated in and form part of this specification, and together with the description, serve to explain the principles of this invention.

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of the circular solder strip tin plating device of this utility model;

[0022] Figure 2 This is a schematic diagram of part I of the present invention;

[0023] Figure 3 This is a schematic diagram of the vibration device of this utility model;

[0024] Figure 4 This is a three-dimensional schematic diagram of the circular solder strip tin plating device of this utility model;

[0025] Figure 5 This is a schematic diagram showing the maximum and minimum coating thickness of circular solder strips in the prior art;

[0026] Figure 6 This is a schematic diagram of coating a copper substrate with a tin alloy in the prior art;

[0027] Figure 7 This is a schematic diagram of coating a copper substrate with a tin alloy under ideal conditions.

[0028] Wherein: 1 is the mold adjustment device; 1-1 is the support plate; 1-2 is the baffle; 2 is the high-frequency vibration device; 2-1 is the vibration terminal; 2-2 is the connecting rod; 2-3 is the voice coil motor; 3 is the solder pot; 4 is the wire pressing wheel connecting plate; 5 is the wire pressing wheel; 6 is the solder control mold; 7 is the drive guide wheel. Detailed Implementation

[0029] Exemplary embodiments will be described in detail below. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this invention. Rather, they are merely examples consistent with some aspects of this invention as detailed in the appended claims.

[0030] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0031] Example

[0032] like Figure 1-4As shown, a circular solder strip tinning device includes a frame, on which a mold adjustment device 1 and a high-frequency vibration device 2 are mounted. A tin furnace 3 is located below the frame, and a wire pressing wheel connecting plate 4 is mounted on the frame. A wire pressing wheel 5 is located below the wire pressing wheel connecting plate 4. A tin control mold 6 floats on the surface of the molten tin in the tin furnace 3. An air cooling device is mounted on the frame. The high-frequency vibration device 2 includes a vibration terminal 2-1, which is located below the tin control mold 6. The vibration terminal 2-1 contacts the circular copper wire and vibrates the circular copper wire. The circular copper wire passes sequentially through the wire pressing wheel 5, the vibration terminal 2-1, the tin control mold 6, and the air cooling device 8 for coating and shaping to form a circular solder strip.

[0033] In this embodiment: along the direction of copper wire movement, the pressure roller 5, high-frequency vibration device 2, air-cooling device 8, and drive guide roller 7 are all in fixed positions. During the tin plating operation, the copper wire pre-coated with flux passes around the pressure roller 5 and is vertically pulled upwards by the molten tin alloy liquid. The tin control mold 6 controls the total amount of tin on the surface of the copper wire, and the molten tin liquid that breaks through the central hole of the tin control mold 6 continues to move upwards with the copper wire. At this time, the copper wire between the pressure roller 5 and the tin control mold 6 is in close contact with the ceramic part of the vibration terminal 2-1. The high-frequency vibration of the voice coil motor 2-3 is transmitted to the copper wire through the fixed fixture, and the vibration is continuously transmitted upwards on the upwardly pulled copper wire to the photovoltaic solder ribbon that has detached from the tin control mold 6. The high-frequency vibration changes the surface tension of the molten tin on the surface of the copper wire, accelerates the flow of the molten tin in the circumferential direction of the copper wire, and makes it more evenly distributed on the surface of the copper wire before solidification. After the molten tin alloy liquid cools, it forms a uniform tin alloy coating; the tin control mold 6 is made of stainless steel. When in a fixed position, the mold adjustment device needs to be adjusted to keep it aligned with the AC connection line; if in a floating state, no excessive intervention is required during normal operation. The solder control mold 6 is existing technology, and its function is to remove excess solder. The structure and shape of the solder control mold 6 can be adjusted according to requirements.

[0034] Furthermore, the mold adjustment device 1 includes a support plate 1-1, on which a plurality of baffles 1-2 are provided, and through holes are provided on the baffles 1-2. The solder control mold 6 is located below the baffles 1-2.

[0035] In this embodiment: the baffle 1-2 can prevent the tin control mold 6 from being stuck by impurities and moving upward with the circular copper wire when impurities are carried to the circular copper wire in the tin alloy liquid; the through hole on the baffle 1-2 can be a U-shaped hole, and the maximum diameter of the through hole is smaller than the diameter of the tin control mold 6.

[0036] Furthermore, the support plate 1-1 is provided with a plurality of mounting holes from top to bottom, and the baffle 1-2 is connected to the support plate 1-1 through the mounting holes.

[0037] In this embodiment, the position of the baffle 1-2 can be changed through mounting holes of different heights. When the tin alloy liquid level rises or falls, the baffle 1-2 can change its position according to the height of the tin alloy liquid level.

[0038] Furthermore, such as Figure 3 As shown, the vibration device includes a voice coil motor 2-3, and the vibration terminal 2-1 is connected to the voice coil motor 2-3 via a connecting rod 2-2.

[0039] Furthermore, the vibration terminal 2-1 includes a semi-circular component, and a semi-tube component is connected above the semi-circular component.

[0040] In this embodiment, the cross-sections of the semicircular part 2-1 and the semi-tube part 2-2 are both arc-shaped, which allows for better contact with the circular copper wire.

[0041] Furthermore, let E be the diameter of the solder control mold 6 and F be the amplitude of the high-frequency vibration device 2, then F < E / 2.

[0042] Furthermore, the vibration frequency of the high-frequency vibration device 2 is 100Hz to 300Hz.

[0043] In this embodiment: the voice coil motor provides high-frequency vibration, can move left and right and set an initial point, the vibration frequency is 100-300Hz, the amplitude is less than E / 2, and the vibration end is a semi-circular ceramic part, which is fixed to the voice coil motor 2-3 by connecting rod 2-2. The adjustment seat below the voice coil motor 2-3 is driven by the motor to move back and forth. During initial installation, the parameters can be adjusted to determine the initial position of point C, and the position is marked as the zero point after it is determined.

[0044] Furthermore, such as Figure 1-2 As shown, the frame is equipped with a drive guide wheel 7. Point A is defined as the point of tangency between the drive guide wheel 7 and the circular solder strip in the vertical direction. Point B is defined as the center point of the solder control mold 6. Point C is defined as the vertical point of tangency on the inner surface of the vibration terminal 2-1. Points A, B, and C are located on the same straight line.

[0045] In this embodiment: During installation, first ensure that points A and C (the zero point of the vibration device) are on the same vertical line. Then adjust the mold adjustment device 1 to ensure that the mold center is on line AC. At this time, A, B, and C are on the same vertical line. Define the position of the wire outlet of the pressure plate as point D. The offset distance of point D from the extension line of line ABC is L, then 0.5mm < L < 1mm.

[0046] The copper wire enters the solder bath from the left, is pressed into a certain depth by the pressure rollers, and then pulled vertically upwards. The total amount of solder applied is controlled by a solder control mold, and a high-frequency vibration device evenly coats the surface of the copper wire with molten solder in a circumferential direction. After air cooling / natural cooling, it is conveyed backwards.

[0047] Point A: The point of vertical tangency between the drive guide wheel and the welding strip;

[0048] Point B: Center point of the solder control mold;

[0049] Point C: Vertical tangent point at the end of the high-frequency vibration fixture;

[0050] Point D: The wire exit point of the pressure plate;

[0051] E: Diameter of the solder control mold;

[0052] Points A, B, and C are on a straight line. Points A and C (zero point) are fixed. Point B is ensured to be on the line AC by adjusting the mold. Point D is offset from the straight line AC.

[0053] Furthermore, the concentricity of the circular solder strip is greater than 50%.

[0054] The above description is merely a specific embodiment of this utility model, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this utility model.

[0055] It should be understood that this utility model is not limited to the content already described above, and various modifications and changes can be made without departing from its scope. The scope of this utility model is limited only by the appended claims.

Claims

1. A circular solder strip tin plating apparatus, comprising a frame, characterized in that, The frame is equipped with a mold adjustment device (1) and a high-frequency vibration device (2). A tin furnace (3) is located below the frame. A wire pressing wheel connecting plate (4) is located on the frame. A wire pressing wheel (5) is located below the wire pressing wheel connecting plate (4). A tin control mold (6) floats on the surface of the tin alloy liquid in the tin furnace (3). An air cooling device (8) is located on the frame. The high-frequency vibration device (2) includes a vibration terminal (2-1). The vibration terminal (2-1) is located below the tin control mold (6). The vibration terminal (2-1) is in contact with the round copper wire and vibrates the round copper wire through the vibration terminal (2-1). The round copper wire is coated and shaped by passing through the wire pressing wheel (5), the vibration terminal (2-1), the tin control mold (6), and the air cooling device (8) in sequence to form a round solder strip.

2. The circular solder strip tin plating device according to claim 1, characterized in that, The mold adjustment device (1) includes a support plate (1-1), on which a plurality of baffles (1-2) are provided, and through holes are provided on the baffles (1-2). The solder control mold (6) is located below the baffles (1-2).

3. The circular solder strip tin plating device according to claim 2, characterized in that, The support plate (1-1) has a number of mounting holes arranged from top to bottom, and the baffle (1-2) is connected to the support plate (1-1) through the mounting holes.

4. The circular solder strip tin plating device according to claim 1, characterized in that, The high-frequency vibration device (2) includes a voice coil motor (2-3), and the vibration terminal (2-1) is connected to the voice coil motor (2-3) via a connecting rod (2-2).

5. The circular solder strip tin plating device according to claim 1, characterized in that, The vibration terminal (2-1) includes a semi-circular part, and a semi-tube part is connected above the semi-circular part.

6. The circular solder strip tin plating device according to claim 1, characterized in that, Let E be the diameter of the solder control mold (6) and F be the amplitude of the high-frequency vibration device (2). Then F < E / 2.

7. The circular solder strip tin plating device according to claim 1, characterized in that, The vibration frequency of the high-frequency vibration device (2) is 100HZ to 300HZ.

8. The circular solder strip tin plating device according to claim 1, characterized in that, The frame is provided with a drive guide wheel (7). Point A is defined as the point of tangency between the drive guide wheel (7) and the circular solder strip in the vertical direction. Point B is defined as the center point of the solder control mold (6). Point C is defined as the vertical point of tangency on the inner surface of the vibration terminal (2-1). Points A, B, and C are located on the same straight line.

9. The circular solder strip tin plating device according to claim 1, characterized in that, The concentricity of the circular welding strip is greater than 50%.

Images