Circular welding strip tinning device
By employing mold adjustment and high-frequency vibration devices in the production of photovoltaic solder ribbons, the problem of poor concentricity of the solder ribbons was solved, resulting in uniform coating of molten solder and improved surface finish of the solder ribbons, thus improving product quality.
Patent Information
- Application Number
- CN202520856088.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2026-06-12
- Estimated Expiration
- 2035-04-30
AI Technical Summary
In the hot-dip galvanizing process of photovoltaic ribbons, the existing technology has poor control over the concentricity of the ribbons, resulting in uneven coating thickness and product surface quality problems, which affect subsequent welding work.
A circular solder strip tin plating device is used, which combines a mold adjustment device and a high-frequency vibration device. The surface tension of the molten tin on the copper wire is changed by high-frequency vibration, so that the molten tin is evenly distributed on the surface of the copper wire. The amount of molten tin is controlled by a tin control mold, and the device is combined with an air cooling device for shaping to form a uniform tin alloy coating.
It improves the concentricity and surface finish of the solder strip, prevents mold clogging, ensures uniform coating of molten solder, and enhances product quality.