Integrally formed high-strength heat-insulating aluminum profile
By incorporating a buffer structure consisting of support rods, springs, and buffer plates into the aluminum profile, dynamic adjustment of the insulation board is achieved. This solves the problems of deformation and insufficient insulation performance of the insulation aluminum profile under external impact, thereby improving its impact resistance and insulation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOSHAN GONGDING METAL PROD CO LTD
- Filing Date
- 2025-05-10
- Publication Date
- 2026-06-12
AI Technical Summary
Existing thermal insulation aluminum profiles lack an effective buffer structure when subjected to external impact, making them prone to deformation or damage, and their thermal insulation performance cannot be automatically adjusted according to external pressure.
A one-piece molded high-strength thermal insulation aluminum profile was designed. By setting a buffer structure consisting of support rods, springs and buffer plates between the material body and the protective frame, the thermal insulation plate can be dynamically adjusted by using a mechanical transmission structure, thereby enhancing the impact resistance and thermal insulation effect.
It effectively absorbs external impact, reduces profile deformation, improves impact resistance, and dynamically adjusts the thermal insulation effect when external pressure changes, making it suitable for dealing with sudden external forces or high-temperature environments.
Smart Images

Figure CN224352758U_ABST