A control monitoring system of a medical temperature controller

Abstract

This application provides a control and monitoring system for a medical temperature controller, including an H-bridge driven semiconductor cooler control circuit, a system status monitoring circuit, a controller, a semiconductor cooler, and a water pump circulation system. The H-bridge driven semiconductor cooler control circuit, system status monitoring circuit, and water pump circulation system are all connected to the controller. The H-bridge driven semiconductor cooler control circuit is also connected to the semiconductor cooler and the system status monitoring circuit. By introducing the system status monitoring circuit, the original medical temperature controller is upgraded from single-state monitoring trigger protection to multi-state trigger protection, improving system operational safety.

Description

Technical Field

[0001] This application relates to the field of medical electronic equipment technology, and in particular to a control and monitoring system for a medical temperature controller. Background Technology

[0002] A medical temperature controller is a medical device used to treat patients with high or low body temperature. It works by controlling the temperature of a circulating liquid within the device to physically regulate the body's external temperature. During use, the temperature controller is attached to the treatment area, and then the device is activated. Water is injected into the temperature controller, circulating to the treatment area to provide both cold and heat therapy, thus alleviating the condition. The main component of the medical temperature controller is a semiconductor cooler. Its working principle utilizes the Peltier effect of the semiconductor cooler, switching electrodes via relays to change the direction of the current, thereby achieving cooling or heating of the water.

[0003] In the existing technology, the drive circuit only controls the switching action of the key electrical components. The circuit only uses the switching signal to control the drive circuit, which cannot adjust the speed. It is relatively simple, inconvenient to use, and not intelligent. The relay is prone to jitter and the response speed is relatively slow. Utility Model Content

[0004] In view of this, the purpose of this application is to provide at least one control and monitoring system for a medical temperature controller, which upgrades the original medical temperature controller from single-state monitoring and trigger protection to multi-state trigger protection by introducing a system status monitoring circuit, thereby improving the system's operational safety.

[0005] This application mainly includes the following aspects:

[0006] In a first aspect, embodiments of this application provide a control and monitoring system for a medical temperature controller, including a semiconductor cooler control circuit based on H-bridge driving, a system status monitoring circuit, a controller, a semiconductor cooler, and a water pump circulation system, wherein the semiconductor cooler control circuit based on H-bridge driving, the system status monitoring circuit, and the water pump circulation system are respectively connected to the controller; the semiconductor cooler control circuit based on H-bridge driving is also respectively connected to the semiconductor cooler and the system status monitoring circuit.

[0007] In one possible implementation, the semiconductor cooler control circuit includes a first half-bridge drive circuit and a second half-bridge drive circuit. The input terminals of the first and second half-bridge drive circuits are respectively connected to a controller. The enable terminals of the first and second half-bridge drive circuits are respectively connected to a system status monitoring circuit. The output terminal of the first half-bridge drive circuit is connected to the cold end of the semiconductor cooler, and the output terminal of the second half-bridge drive circuit is connected to the hot end of the semiconductor cooler. The controller is also connected to the enable terminals of the first and second half-bridge drive circuits.

[0008] In one possible implementation, the first half-bridge driver circuit includes a first half-bridge driver chip, a first anti-reverse filter unit, a first bootstrap capacitor, a first power driver chip and its corresponding first gate driver unit, a second power driver chip and its corresponding second gate driver unit, a first capacitor, and a second capacitor. The logic input pins of the first half-bridge driver chip are connected to a controller, the enable control pins of the first half-bridge driver chip are connected to a system status monitoring circuit, the low-side return pin of the first half-bridge driver chip is grounded, the low-side gate driver output pin of the first half-bridge driver chip is connected to the input of the second gate driver unit, the high-side floating power input pins of the first half-bridge driver chip are respectively connected to one end of the first anti-reverse filter unit and one end of the first bootstrap capacitor, the other end of the first anti-reverse filter unit is grounded, and the other end of the first bootstrap capacitor is respectively connected to the high-side floating power input pins of the first half-bridge driver chip. The source return pin and the cold end of the semiconductor cooler are connected. The high-side gate drive output pin of the first half-bridge driver chip is connected to the input of the first gate drive unit. The low-side floating and reference power input pin of the first half-bridge driver chip is connected to the first power supply. The first output of the first gate drive unit is connected to the gate of the first power drive chip. The second output of the first gate drive unit is connected to the source of the first power drive chip and the drain of the second power drive chip. The drain of the first power drive chip is connected to the second power supply and one end of the first capacitor. The other end of the first capacitor is connected to the cold end of the semiconductor cooler and one end of the second capacitor. The first output of the second gate drive unit is connected to the gate of the second power drive chip. The second output of the second gate drive unit is connected to the source of the second power drive chip, the other end of the second capacitor, and the second half-bridge drive circuit.

[0009] In one possible implementation, the second half-bridge driver circuit includes a second half-bridge driver chip, a second anti-reverse filter unit, a second bootstrap capacitor, a third power driver chip and its corresponding third gate driver unit, a fourth power driver chip and its corresponding fourth gate driver unit, a third capacitor, and a fourth capacitor. The logic input pins of the second half-bridge driver chip are connected to a controller, the enable control pins of the second half-bridge driver chip are connected to a system status monitoring circuit, the low-side return pin of the second half-bridge driver chip is grounded, the low-side gate driver output pin of the second half-bridge driver chip is connected to the input of the fourth gate driver unit, the high-side floating power input pins of the second half-bridge driver chip are respectively connected to one end of the second anti-reverse filter unit and one end of the second bootstrap capacitor, the other end of the second anti-reverse filter unit is grounded, and the other end of the second bootstrap capacitor is respectively connected to the high-side floating power return of the second half-bridge driver chip. The high-side gate drive output pin of the second half-bridge driver chip is connected to the input of the third gate drive unit, and the low-side floating and reference power input pin of the second half-bridge driver chip is connected to the first power supply. The first output of the third gate drive unit is connected to the gate of the third power drive chip, and the second output of the third gate drive unit is connected to the source of the third power drive chip and the drain of the fourth power drive chip. The drain of the third power drive chip is connected to the second power supply and one end of the third capacitor. The other end of the third capacitor is connected to the hot end of the semiconductor cooler and one end of the fourth capacitor. The first output of the fourth gate drive unit is connected to the gate of the fourth power drive chip, and the second output of the fourth gate drive unit is connected to the source of the fourth power drive chip, the other end of the fourth capacitor, and the other end of the second capacitor in the first half-bridge drive circuit.

[0010] In one possible implementation, the system status monitoring circuit includes a temperature sensor, a current signal acquisition circuit corresponding to the semiconductor cooler, and an over-temperature protection circuit corresponding to the semiconductor cooler. The temperature sensor is installed inside the pipe containing the liquid after it has been heated or cooled by the semiconductor cooler, or on a temperature control component, and is connected to the controller. The input terminal of the current signal acquisition circuit is connected to the cold and hot ends of the semiconductor cooler, and the output terminal of the current signal acquisition circuit is connected to the controller. The input terminals of the over-temperature protection circuit are respectively connected to the cold and hot ends of the semiconductor cooler, and the output terminals of the over-temperature protection circuit are respectively connected to the enable terminals of the first half-bridge drive circuit and the second half-bridge drive circuit. The water pump data terminal in the water pump circulation system is connected to the controller.

[0011] In one possible implementation, the temperature sensor includes a first temperature sensor and a second temperature sensor, which are respectively connected to the controller. The first temperature sensor is disposed in the pipe containing the liquid after it has been heated or cooled by the semiconductor cooler, or on the temperature control accessory. The second temperature sensor is disposed in the pipe containing the liquid after it has been heated or cooled by the semiconductor cooler, or on the temperature control accessory.

[0012] In one possible implementation, the current signal acquisition circuit includes a sampling resistor, a first voltage divider resistor, a second voltage divider resistor, a first filter capacitor, a first operational amplifier, a first amplification resistor, a second amplification resistor, a non-inverting input resistor, a second operational amplifier, a third amplification resistor, a fourth amplification resistor, a second filter capacitor, and an output voltage divider resistor. One end of the sampling resistor is connected to the cold end and hot end of the semiconductor cooler, and one end of the first voltage divider resistor. The other end of the sampling resistor is grounded. The other end of the first voltage divider resistor is connected to the inverting input terminal of the first operational amplifier, connected to a third power supply through the second voltage divider resistor, and grounded through the first filter capacitor. The non-inverting input of an operational amplifier is grounded through a first amplifying resistor and connected to the output of the first operational amplifier through a second amplifying resistor. The output of the first operational amplifier is also connected to the non-inverting input of a second operational amplifier through a non-inverting input resistor. The inverting input of the second operational amplifier is grounded through a third amplifying resistor and connected to the output of the second operational amplifier through a fourth amplifying resistor. The output of the second operational amplifier is also connected to the controller through an output voltage divider resistor and grounded through an output voltage divider resistor and a second filter capacitor. The positive input of the second operational amplifier is connected to a third power supply, and the negative input of the second operational amplifier is grounded.

[0013] In one possible implementation, the over-temperature protection circuit includes a first temperature control switch and its corresponding first series resistor, a second temperature control switch and its corresponding second series resistor, a logic AND gate chip, and a third filter capacitor. The input terminal of the first temperature control switch is connected to the cold end of the semiconductor cooler, and the output terminal of the first temperature control switch is connected to the first AND gate input pin of the logic AND gate chip through the first series resistor. The power supply terminals of the first and second temperature control switches are connected to a fourth power supply. The input terminal of the second temperature control switch is connected to the hot end of the semiconductor cooler, and the output terminal of the second temperature control switch is connected to the second AND gate input pin of the logic AND gate chip through the second series resistor. The ground pin of the logic AND gate chip is grounded. The power supply pins of the logic AND gate chip are connected to the fourth power supply and grounded through the third filter capacitor. The AND gate output pins of the logic AND gate chip are connected to the enable terminals of the first half-bridge drive circuit, the second half-bridge drive circuit, and the controller.

[0014] In one possible implementation, the control and monitoring system of the medical temperature controller also includes an alarm circuit connected to the controller.

[0015] In one possible implementation, the gate drive unit includes a gate resistor, a turn-off diode, and a coupling capacitor. One end of the gate resistor is connected to the cathode of the turn-off diode to form the input terminal of the gate drive unit. The other end of the gate resistor serves as the first output terminal of the gate drive unit and is connected to the anode of the turn-off diode and one end of the coupling capacitor, respectively. The other end of the coupling capacitor is used as the second output terminal of the gate drive unit.

[0016] This application provides a control and monitoring system for a medical temperature controller, comprising an H-bridge driven semiconductor cooler control circuit, a system status monitoring circuit, a controller, a semiconductor cooler, and a water pump circulation system. The H-bridge driven semiconductor cooler control circuit, system status monitoring circuit, and water pump circulation system are all connected to the controller. The H-bridge driven semiconductor cooler control circuit is also connected to the semiconductor cooler and the system status monitoring circuit. By introducing the system status monitoring circuit, the original medical temperature controller is upgraded from single-state monitoring trigger protection to multi-state trigger protection, improving system operational safety.

[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This illustration shows one of the structural schematic diagrams of a control and monitoring system for a medical temperature controller provided in an embodiment of this application;

[0020] Figure 2 This is a second schematic diagram of the structure of a control and monitoring system for a medical temperature controller provided in an embodiment of this application;

[0021] Figure 3 This paper shows a schematic diagram of the structure of a semiconductor cooler control circuit provided in an embodiment of this application;

[0022] Figure 4 This paper shows a schematic diagram of a current signal acquisition circuit provided in an embodiment of this application;

[0023] Figure 5 A schematic diagram of an over-temperature protection circuit provided in an embodiment of this application is shown. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It should be understood that the drawings in this application are for illustrative and descriptive purposes only and are not intended to limit the scope of protection of this application. Furthermore, it should be understood that the schematic drawings are not drawn to scale. The flowcharts used in this application illustrate operations implemented according to some embodiments of this application. It should be understood that the operations in the flowcharts may not be implemented in sequence, and steps without logical contextual relationships may be reversed or implemented simultaneously. In addition, those skilled in the art, guided by the content of this application, may add one or more other operations to the flowcharts, or remove one or more operations from the flowcharts.

[0025] Furthermore, the described embodiments are merely some, not all, of the embodiments of this application. The components of the embodiments of this application described and illustrated herein can typically be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] A medical temperature controller is a medical device used to treat patients with high or low temperatures. The medical temperature controller is equipped with a water pump circulation system, a semiconductor cooler, and temperature control accessories. The water pump circulation system includes at least a water pump and a liquid pipeline. Liquid flows in the liquid pipeline, the semiconductor cooler controls the temperature of the circulating liquid in the liquid pipeline, and the water pump realizes the circulation of the liquid in the liquid pipeline.

[0027] During use, the temperature control accessories (including but not limited to blankets and caps) are attached to the treatment area on the body. Then, the medical temperature controller is activated. The water pump circulates the liquid, which has been temperature-controlled by a semiconductor cooler, from the liquid pipe to the temperature control accessories. The temperature control accessories, which are in contact with the body, provide external physical heating / cooling to the treatment area, thus helping to regulate the temperature of the treatment area. The medical temperature controller can effectively reduce pain, swelling, exudation, and inhibit inflammatory complications. It can also promote local blood circulation and metabolism, facilitate wound healing, relieve muscle spasms, and promote swelling reduction.

[0028] The main component for temperature control in medical temperature controllers is a semiconductor cooler. A semiconductor cooler typically consists of multiple alternating n-type and p-type semiconductor elements. These semiconductor elements are connected together by a metal conductor (such as copper) to form thermocouple pairs. One end of each thermocouple pair is the "cold junction" and the other end is the "hot junction." The "cold junction" is used to cool the target object, while the "hot junction" requires effective heat dissipation measures (such as heat sinks, fans, etc.) to remove the generated heat. Similarly, by changing the direction of the current flowing through the semiconductor cooler (usually by controlling a relay to switch electrodes), the "cold junction" and "hot junction" are switched, switching the semiconductor cooler to heating mode to heat the target object, thereby achieving temperature control of the target object.

[0029] Existing medical temperature controllers have at least the following drawbacks:

[0030] (1) In the prior art, the driving circuit for the semiconductor cooler achieves a single switching action of the semiconductor cooler by controlling the relay. That is, it can only control the start and stop of the semiconductor cooler and cannot adjust the power of the semiconductor cooler, which makes the medical temperature controller extremely inconvenient to use. Moreover, the semiconductor cooler is easily jittered by only using the relay to switch it on and off, and the relay response speed is relatively slow, resulting in a slow response speed of the semiconductor cooler.

[0031] (2) The medical temperature controller in the prior art has an automatic stop function when the temperature exceeds the limit, but when different types of key components such as the internal temperature sensor, circulating water pump, and semiconductor device fail, they cannot be detected or effectively alerted, resulting in certain safety hazards in the medical temperature controller.

[0032] Based on this, this application provides a control and monitoring system for a medical temperature controller. By introducing a system status monitoring circuit, the original medical temperature controller is upgraded from single-state monitoring and trigger protection to multi-state trigger protection, thereby improving system operational safety. The specific details are as follows:

[0033] Please see Figure 1 , Figure 1 This illustration shows one of the structural schematic diagrams of a control and monitoring system for a medical temperature controller provided in an embodiment of this application. For example... Figure 1 As shown, the control and monitoring system provided in this application embodiment includes a semiconductor cooler control circuit 1 based on H-bridge drive, a system status monitoring circuit 2, a controller 3, a semiconductor cooler 4, and a water pump circulation system 5. The semiconductor cooler control circuit 1 based on H-bridge drive, the system status monitoring circuit 2, and the water pump circulation system 5 are respectively connected to the controller. The semiconductor cooler control circuit 1 based on H-bridge drive is also respectively connected to the semiconductor cooler 4 and the system status monitoring circuit 2.

[0034] Controller 3 is a single-chip microcomputer controller.

[0035] In a preferred embodiment, please refer to Figure 2 , Figure 2 This is a second schematic diagram of the control and monitoring system of a medical temperature controller provided in an embodiment of this application. For example... Figure 2 As shown, the system status monitoring circuit 2 includes a temperature sensor 21, a current signal acquisition circuit 22 corresponding to the semiconductor cooler 4, and an over-temperature protection circuit 23 corresponding to the semiconductor cooler 4.

[0036] Preferably, the temperature sensor 21 is installed in the pipe containing the liquid after it has been heated or cooled by the semiconductor cooler 4, or on the temperature control accessory. The temperature sensor 21 is connected to the controller 3. The temperature sensor 21 is used to monitor the temperature of the liquid in the temperature control accessory (temperature control blanket or temperature control cap) sent into the medical temperature controller and send the temperature to the controller 3.

[0037] The input terminal of the current signal acquisition circuit 22 is connected to the cold end and the hot end of the semiconductor cooler 4, and the output terminal of the current signal acquisition circuit 22 is connected to the controller 3.

[0038] The input terminals of the over-temperature protection circuit 23 are connected to the cold end and the hot end of the semiconductor cooler 4, respectively, and the output terminal of the over-temperature protection circuit 23 is connected to the semiconductor cooler control circuit 1.

[0039] In a preferred embodiment, please refer to Figure 3 , Figure 3 A schematic diagram of a semiconductor cooler control circuit according to an embodiment of this application is shown. Figure 3 As shown, the semiconductor cooler control circuit 1 includes a first half-bridge drive circuit 11 and a second half-bridge drive circuit 12. The input terminals of the first half-bridge drive circuit 11 and the second half-bridge drive circuit 12 are respectively connected to the controller 3. Specifically, the input terminal of the first half-bridge drive circuit 11 is connected to the first pulse width modulation signal PWM1A output by the controller 3, and the input terminal of the second half-bridge drive circuit 12 is connected to the second pulse width modulation signal PWM1B output by the controller 3.

[0040] In one specific embodiment, the semiconductor cooler control circuit 1 controls the H-bridge composed of the first half-bridge drive circuit 11 and the second half-bridge drive circuit 12 through the first pulse width modulation signal PWM1A and the second pulse width modulation signal PWM1B output by the controller 3, thereby realizing the control of the polarity of the semiconductor cooler 4 by the pulse width modulation signal. Thus, the semiconductor cooler control circuit 1 can not only control the polarity of the semiconductor cooler 4, but also control the voltage and power output to the semiconductor cooler 4.

[0041] The enable terminals of the first half-bridge drive circuit 11 and the second half-bridge drive circuit 12 are respectively connected to the output terminal of the over-temperature protection circuit 23 to receive the output signal SD1 of the over-temperature protection circuit 23. The output terminal of the first half-bridge drive circuit 11 is connected to the cold end A+ of the semiconductor cooler 4, and the output terminal of the second half-bridge drive circuit 12 is connected to the hot end A- of the semiconductor cooler 4.

[0042] In one specific embodiment, when SD1 is high, the semiconductor cooler control circuit can output effectively, and when SD1 is low, the semiconductor cooler control circuit does not output.

[0043] In a preferred embodiment, such as Figure 3 As shown, the first half-bridge drive circuit 11 includes a first half-bridge drive chip U1, a first anti-reverse filter unit 110, a first bootstrap capacitor E1, a first power drive chip Q1 and its corresponding first gate drive unit 111, a second power drive chip Q2 and its corresponding second gate drive unit 112, a first capacitor C1 and a second capacitor C2.

[0044] Preferably, the logic input pin IN of the first half-bridge driver chip U1 is connected to the controller 3, specifically to the first pulse width modulation signal PWM1A output by the controller 3, and the enable control pin of the first half-bridge driver chip U1. Connect to the output terminal of the over-temperature protection circuit 23 to receive the output signal SD1 of the over-temperature protection circuit 23. The low-side return current pin COM of the first half-bridge driver chip U1 is grounded to GND. The low-side gate drive output pin LO of the first half-bridge driver chip U1 is connected to the input terminal of the second gate drive unit 112.

[0045] The high-side floating power input pin VB of the first half-bridge driver chip U1 is connected to one end of the first anti-reverse filter unit 110 and one end of the first bootstrap capacitor E1, respectively. The other end of the first anti-reverse filter unit 110 is grounded to GND. The other end of the first bootstrap capacitor E1 is connected to the high-side floating power return pin VS of the first half-bridge driver chip U1 and the cold terminal A+ of the semiconductor cooler 4, respectively. The high-side gate drive output pin HO of the first half-bridge driver chip U1 is connected to the input terminal of the first gate drive unit 111. The low-side floating and reference power input pin VCC of the first half-bridge driver chip U1 is connected to the first power supply VCC1, which is 12V.

[0046] The first output terminal of the first gate drive unit 111 is connected to the gate of the first power drive chip Q1. The second output terminal of the first gate drive unit 111 is connected to the source of the first power drive chip Q1 and the drain of the second power drive chip Q2. The drain of the first power drive chip Q1 is connected to the second power supply VCC2 and one end of the first capacitor C1. The other end of the first capacitor C1 is connected to the cold terminal A+ of the semiconductor cooler 4 and one end of the second capacitor C2. The second power supply VCC2 is 24V.

[0047] The first output terminal of the second gate drive unit 112 is connected to the gate of the second power drive chip Q2, and the second output terminal of the second gate drive unit 112 is connected to the source of the second power drive chip Q2, the other end of the second capacitor C2, and the second half-bridge drive circuit 12, respectively.

[0048] In one specific embodiment, the first power driver chip Q1 and the second power driver chip Q2 are NMOS (N-channel metal-oxide-semiconductor field-effect transistors), the first power driver chip Q1 and the second power driver chip Q2 are of model IRBB7534PBF, the first half-bridge driver chip U1 is of model IR2184SIRPBF, the first bootstrap capacitor E1 is of model 10μF / 50V, and the first capacitor C1 and the second capacitor C2 are of model 1nF.

[0049] In a preferred embodiment, the first gate drive unit 111 includes a first gate resistor R. N1 The first turn-off diode DE1 and the first coupling capacitor C m1 First gate resistor R N1 One end is connected to the cathode of the first turn-off diode DE1, and then connected to the high-side gate drive output pin HO of the first half-bridge driver chip U1, with the first gate resistor R... N1 The other end is connected to the anode of the first turn-off diode DE1 and the first coupling capacitor C, respectively. m1 One end, the first coupling capacitor C m1 The other end is connected to the source of the first power driver chip Q1 and the drain of the second power driver chip Q2, respectively.

[0050] In one specific embodiment, the first gate resistor R N1 A 10R diode is selected, the first turn-off diode DE1 is model SS14, and the first coupling capacitor C... m1 Choose 1 nF, first gate resistor R N1 By reducing the gate-source oscillation of the first power drive chip Q1 through series damping, the first turn-off diode DE1 accelerates the turn-off speed of the first power drive chip Q1.

[0051] In another preferred embodiment, the second gate drive unit 112 includes a second gate resistor R. N2 The second turn-off diode DE2 and the second coupling capacitor C m2 The second gate resistor R N2 One end is connected to the cathode of the second turn-off diode DE2, and then connected to the low-side gate drive output pin LO of the first half-bridge driver chip U1. The second gate resistor R N2 The other end is connected to the anode of the second turn-off diode DE2 and the second coupling capacitor C, respectively. m2 One end, the second coupling capacitor C m2 The other end is connected to the source of the second power drive chip Q2, the other end of the second capacitor C2, and the second half-bridge drive circuit 12, respectively.

[0052] In one specific embodiment, the second gate resistor R N2 A 10R diode is selected, the second turn-off diode DE1 is model SS14, and the second coupling capacitor C... m2 Select 1 nF, second gate resistor R N2 The gate-source oscillation of the second power drive chip Q2 is weakened by series damping, and the second turn-off diode DE2 accelerates the turn-off speed of the second power drive chip Q2.

[0053] In one specific embodiment, the first anti-reverse filtering unit 110 includes a fourth filter capacitor C. p4 And the first anti-reverse diode DM1, specifically, the fourth filter capacitor C p4 One end is grounded, and the fourth filter capacitor C p4 The other end is connected to the anode of the first anti-reverse diode DM1 and the first power supply VCC1 (12V), respectively. The cathode of the first anti-reverse diode DM1 is connected to one end of the first bootstrap capacitor E1 and the high-side floating power input pin VB of the first half-bridge driver chip U1, respectively.

[0054] In a preferred embodiment, the second half-bridge drive circuit 12 includes a second half-bridge drive chip U2, a second anti-reverse filter unit 120, a second bootstrap capacitor E2, a third power drive chip Q3 and its corresponding third gate drive unit 121, a fourth power drive chip Q4 and its corresponding fourth gate drive unit 122, a third capacitor C3 and a fourth capacitor C4.

[0055] Preferably, the logic input pin IN of the second half-bridge driver chip U2 is connected to the controller 3, specifically to the second pulse width modulation signal PWM1B output by the controller 3, and the enable control pin of the second half-bridge driver chip U2. Connect to the output terminal of the over-temperature protection circuit 23 to receive the output signal SD1 of the over-temperature protection circuit 23. The low-side return current pin COM of the second half-bridge driver chip U2 is grounded to GND. The low-side gate drive output pin LO of the second half-bridge driver chip U2 is connected to the input terminal of the fourth gate drive unit 122.

[0056] The high-side floating power input pin VB of the second half-bridge driver chip U2 is connected to one end of the second anti-reverse filter unit 120 and one end of the second bootstrap capacitor E2, respectively. The other end of the second anti-reverse filter unit 120 is grounded. The other end of the second bootstrap capacitor E2 is connected to the high-side floating power return pin VS of the second half-bridge driver chip U2 and the hot end A- of the semiconductor cooler 4, respectively. The high-side gate drive output pin HO of the second half-bridge driver chip U2 is connected to the input end of the third gate drive unit 121. The low-side floating and reference power input pin VCC of the second half-bridge driver chip U2 is connected to the first power supply VCC1 (12V).

[0057] The first output terminal of the third gate drive unit 121 is connected to the gate of the third power drive chip Q3. The second output terminal of the third gate drive unit 121 is connected to the source of the third power drive chip Q3 and the drain of the fourth power drive chip Q4. The drain of the third power drive chip Q3 is connected to the second power supply VCC2 (24V) and one end of the third capacitor C3. The other end of the third capacitor C3 is connected to the hot end A- of the semiconductor cooler 4 and one end of the fourth capacitor C4.

[0058] The first output terminal of the fourth gate drive unit 122 is connected to the gate of the fourth power drive chip Q4, and the second output terminal of the fourth gate drive unit 122 is connected to the source of the fourth power drive chip Q4, the other end of the fourth capacitor C4, and the other end of the second capacitor C2, respectively.

[0059] In one specific embodiment, the third power driver chip Q3 and the fourth power driver chip Q4 are NMOS (N-channel metal-oxide-semiconductor field-effect transistors), the model of the third power driver chip Q3 and the fourth power driver chip Q4 is IRFB7534PBF, the second half-bridge driver chip U2 is a semiconductor driver chip of model IR2184SIRPBF, the second bootstrap capacitor E2 is 10μF / 50V, and the third capacitor C3 and the fourth capacitor C4 are 1nF.

[0060] In a preferred embodiment, the third gate drive unit 121 includes a third gate resistor R. N3 The third turn-off diode DE3 and the third coupling capacitor C m3 The third gate resistor R N3One end is connected to the cathode of the third turn-off diode DE3, and then connected to the high-side gate drive output pin HO of the second half-bridge driver chip U2. The third gate resistor R N3 The other end is connected to the anode of the third turn-off diode DE3 and the third coupling capacitor C, respectively. m3 One end, the third coupling capacitor C m3 The other end is connected to the source of the third power driver chip Q3 and the drain of the fourth power driver chip Q4, respectively.

[0061] In one specific embodiment, the third gate resistor R N3 A 10R diode is selected, the third turn-off diode DE3 is model SS14, and the third coupling capacitor C... m3 Select 1 nF, third gate resistor R N3 The gate-source oscillation of the third power drive chip Q3 is weakened by series damping, and the third turn-off diode DE3 accelerates the turn-off speed of the third power drive chip Q3.

[0062] In another preferred embodiment, the fourth gate drive unit 122 includes a fourth gate resistor R. N4 The fourth turn-off diode DE4 and the fourth coupling capacitor C m4 The fourth gate resistor R N4 One end is connected to the cathode of the fourth turn-off diode DE4, and then connected to the low-side gate drive output pin LO of the second half-bridge driver chip U2. The fourth gate resistor R N4 The other end is connected to the anode of the fourth turn-off diode DE4 and the fourth coupling capacitor C, respectively. m4 One end, the fourth coupling capacitor C m4 The other end is connected to the source of the fourth power driver chip Q4, the other end of the fourth capacitor C4, and the other end of the second capacitor C2, respectively.

[0063] In one specific embodiment, the fourth gate resistor R N4 A 10R diode is selected; the fourth turn-off diode DE4 is model SS14; and the fourth coupling capacitor C... m4 Select 1 nF, fourth gate resistor R N4 The gate-source oscillation of the fourth power driver chip Q4 is reduced by series damping, and the fourth turn-off diode DE4 accelerates the turn-off speed of the fourth power driver chip Q4.

[0064] In one specific embodiment, the second anti-reverse filtering unit 120 includes a fifth filter capacitor C. p5 The second anti-reverse diode DM2, specifically, one end of the filter capacitor is grounded, and the fifth filter capacitor C p5The other end is connected to the anode of the second anti-reverse diode DM2 and the first power supply VCC1 (12V), respectively. The cathode of the second anti-reverse diode DM2 is connected to one end of the second bootstrap capacitor E2 and the high-side floating power input pin VB of the second half-bridge driver chip U2, respectively.

[0065] Preferably, the first reverse protection diode DM1 and the second reverse protection diode DM2 prevent reverse current from burning out relevant parts of the controller 3, and the fourth filter capacitor C p4 and the fifth filter capacitor C p5 All are 100nF.

[0066] The first anti-reverse diode DM1 and the second anti-reverse diode DM2 are selected from IN4007G.

[0067] In one specific embodiment, such as Figure 3 As shown, the semiconductor cooler control circuit 1 provided in this application is an H-bridge circuit composed of two half-bridge driver chips and four NMOS transistors. The enable control terminal of the half-bridge driver chip is active high. The controller outputs the first pulse width modulation signal PWM1A and the second pulse width modulation signal PWM1B to realize the change of the output voltage and polarity of the H-bridge circuit, thereby controlling the semiconductor cooler to achieve the heating and cooling of the liquid in the pipe under the corresponding output power control.

[0068] In a preferred embodiment, when SD1 is high and the first pulse width modulation signal PWM1A is high, the high-side gate drive output pin HO of the first half-bridge driver chip U1 outputs a high level, and the low-side gate drive output pin LO of the first half-bridge driver chip U1 outputs a low level. When the first pulse width modulation signal PWM1B is low, the high-side gate drive output pin HO of the second half-bridge driver chip U2 outputs a low level, and the low-side gate drive output pin LO of the second half-bridge driver chip U2 outputs a high level. At this time, the first power drive chip Q1 and the fourth power drive chip Q4 are turned on, and the second power drive chip Q2 and the third power drive chip Q3 are turned off. Current flows from the cold end A+ of the semiconductor cooler to the hot end A- of the semiconductor cooler, and the semiconductor cooler 4 cools down.

[0069] In another preferred embodiment, when SD1 is high and the first pulse width modulation signal PWM1A is low, the high-side gate drive output pin HO of the first half-bridge driver chip U1 outputs a low level, and the low-side gate drive output pin LO of the first half-bridge driver chip U1 outputs a high level. When the second pulse width modulation signal PWM1B is high, the high-side gate drive output pin HO of the second half-bridge driver chip U2 outputs a high level, and the low-side gate drive output pin LO of the second half-bridge driver chip U2 outputs a low level. At this time, the first power driver chip Q1 and the fourth power driver chip Q4 are turned off, and the second power driver chip Q2 and the third power driver chip Q3 are turned on. Current flows from the hot end A- of the semiconductor cooler to the cold end A+ of the semiconductor cooler, and the semiconductor cooler 4 heats up.

[0070] In a preferred embodiment, return Figure 2 The temperature sensor includes a first temperature sensor and a second temperature sensor, which are respectively connected to the controller 3. The first temperature sensor is installed in the pipe containing the liquid after it has been heated or cooled by the semiconductor cooler or on the temperature control accessory. The second temperature sensor is installed in the pipe containing the liquid after it has been heated or cooled by the semiconductor cooler or on the temperature control accessory.

[0071] Specifically, the purpose of setting the temperature sensor in this application is to monitor the liquid temperature of the temperature control blanket or temperature control cap delivered to the medical temperature controller. After the controller obtains the temperature transmitted by the temperature sensor, it determines the temperature status of the temperature control blanket or temperature control cap. Specifically, the controller compares the liquid temperature of the temperature control blanket or temperature control cap collected by the temperature sensor with the preset over-temperature threshold and the preset low-temperature threshold. When the liquid temperature is greater than the preset over-temperature threshold or less than the preset low-temperature threshold, the controller 3 determines that the temperature of the temperature control blanket or temperature control cap is abnormal. Then the controller 3 triggers the protection action of the semiconductor cooler control circuit and the water pump circulation system. The protection action is to cut off the output of the semiconductor cooler control circuit and stop the operation of the water pump in the water pump circulation system.

[0072] Specifically, the introduction of temperature sensors ensures that the temperature of the temperature control blanket or temperature control cap applied to the human body by the medical temperature controller does not exceed the preset over-temperature threshold or fall below the preset low-temperature threshold. This better ensures the safety of patients. Once the temperature sensor detects that the liquid temperature exceeds the preset over-temperature threshold or falls below the preset low-temperature threshold, it immediately determines that the temperature control blanket or temperature control cap is in an abnormal temperature state and triggers the protection action of controller 3.

[0073] In a preferred embodiment, two temperature sensors are provided, one of which is a main temperature sensor and the other is an auxiliary temperature sensor. When the main temperature sensor is not faulty, the liquid temperature collected by the main temperature sensor is used as the monitoring standard of the controller. When the main temperature sensor fails, the liquid temperature collected by the auxiliary temperature sensor is used for status judgment. The two sensors work redundantly to prevent the failure of a single sensor from affecting the circuit safety.

[0074] In a preferred embodiment, please refer to Figure 4 , Figure 4 A schematic diagram of a current signal acquisition circuit provided in an embodiment of this application is shown. Figure 4 As shown, the current signal acquisition circuit 22 includes a sampling resistor R. G First voltage divider resistor R m1 Second voltage divider resistor R m2 First filter capacitor C p1 First operational amplifier LM1, first amplification resistor R s1 Second amplifying resistor R s2 Non-inverting input resistor R E1 Second operational amplifier LM2, third amplification resistor R s3 Fourth amplifying resistor R s4 Second filter capacitor C p2 and output voltage divider resistor R m3 .

[0075] Wherein, sampling resistor R G One end is connected to the cold end A+, the hot end A- of the semiconductor cooler 4, and the first voltage divider resistor R, respectively. m1 One end, sampling resistor R G The other end is grounded to GND, and the first voltage divider resistor R m1 The other end is connected to the inverting input of the first operational amplifier LM1 and through the second voltage divider resistor R. m2 Connected to the third power supply VCC3 (+5V) and through the first filter capacitor C p1 Grounded to GND, the non-inverting input of the first operational amplifier LM1 is connected to the first amplification resistor R. s1 Ground GND and through the second amplification resistor R s2 Connect to the output of the first operational amplifier LM1.

[0076] The output of the first operational amplifier LM1 is also connected to a non-inverting input resistor R. E1 The non-inverting input of the second operational amplifier LM2 is connected to the inverting input of the second operational amplifier LM1, which is connected to the third amplification resistor R. s3 Ground GND and through the fourth amplification resistor Rs4 Connected to the output of the second operational amplifier LM2, the output of the second operational amplifier LM2 is also connected to the output voltage divider resistor R. m3 Connected to controller 3 and via output voltage divider resistor R m3 Second filter capacitor C p2 The positive input terminal of the second operational amplifier LM2 is connected to the third power supply VCC3 (+5V), and the negative input terminal of the second operational amplifier LM2 is connected to the ground GND.

[0077] In one specific embodiment, the sampling resistor R G Select a 0.05Ω first voltage divider resistor R. m1 Select 2K, second voltage divider resistor R m2 Select a 100K first filter capacitor C p1 The first operational amplifier LM1 is selected as LM358DT, and the first amplification resistor R is 100nF / 50V. s1 Choose 3K3, second amplification resistor R s2 Select 5K1, non-inverting input resistor R E1 The 2K8 is selected, the second operational amplifier LM2 is model LM358DT, and the third amplification resistor R... s3 Select 3K3, fourth amplification resistor R s4 Select 7K5, second filter capacitor C p2 Select 100nF / 50V, output voltage divider resistor R m3 Select 2K.

[0078] In this application, for the current signal acquisition circuit 22, the current flowing through the semiconductor cooler passes through the sampling resistor R. G The voltage is amplified by a certain factor by an operational amplifier and finally input to controller 3 to calculate the voltage value. By monitoring this voltage value, the current state of the semiconductor cooler is determined.

[0079] For the current signal acquisition circuit 22 provided in this application, taking the above-mentioned device selection as an example, the amplification factor β = (5.1 / 3.3+1) × (7.5 / 3.3+1) = 8.22, for example, the current flowing through the sampling resistor R G If the current I = 5A is given by a current of 0.05Ω, then the sampling resistor R... G Voltage U at both ends G1 =I×R G =5A ×0.05=0.25V, which is amplified 8.22 times by a subsequent operational amplifier to obtain the amplified voltage U=β×U G1 =8.22×0.25=2.055V.

[0080] Controller 3 monitors the sampling resistor R GThe voltage U at both ends is amplified and compared with a preset voltage threshold. Once U exceeds the preset voltage threshold, it is determined that the current flowing through the semiconductor cooler 4 is in an abnormal state, and protection action is immediately executed.

[0081] In a preferred embodiment, please refer to Figure 5 , Figure 5 A schematic diagram of an over-temperature protection circuit provided in an embodiment of this application is shown. Figure 5 As shown, the over-temperature protection circuit 23 includes a first temperature control switch P1 and its corresponding first series resistor R. T1 The second temperature control switch P2 and its corresponding second series resistor R T2 AND gate chip U3 and third filter capacitor C p3 .

[0082] The input terminal of the first temperature control switch P1 is connected to the cold end A+ of the semiconductor cooler 4, and the output terminal of the first temperature control switch P1 is connected to the first series resistor R. T1 The first AND gate input pin 1A of the logic AND gate chip U3 is connected to the power supply terminals of the first temperature control switch P1 and the second temperature control switch P2, which are connected to the fourth power supply VCC4 (3V3). One end of the second temperature control switch P2 is connected to the hot end A- of the semiconductor cooler 4, and the other end of the second temperature control switch P2 is connected to the second series resistor R. T2 The second AND gate input pin 1B of the logic AND gate chip U3 is connected, the ground pin GND of the logic AND gate chip U3 is connected to GND, and the third AND gate input pin 2A, the fourth AND gate input pin 2B, and the AND gate output pin 2Y of the logic AND gate chip U3 are all left floating.

[0083] The power supply pin VCC of the AND gate chip U3 is connected to the fourth power supply VCC4 (3V3) and through the third filter capacitor C. p3 Grounded to GND, the AND gate output pin 1Y of the logic AND gate chip U3 outputs signal SD1 and is connected to the enable terminal of the first half-bridge driver circuit 11, the enable terminal of the second half-bridge driver circuit 12, and the controller 3, respectively.

[0084] In one specific embodiment, the first temperature control switch P1 and the second temperature control switch P2 are selected as KSD9700, the first temperature control switch P1 and the second temperature control switch P2 are normally closed switches at 70°C, and the logic AND gate chip U3 is SN74LVC2G08DCUR.

[0085] Specifically, the first temperature control switch P1 disconnects when it detects that the cold end temperature of the semiconductor cooler exceeds 70°C, and the second temperature control switch P2 disconnects when it detects that the hot end temperature of the semiconductor cooler exceeds 70°C. In this application, for the over-temperature protection circuit, if either of the two temperature control switches detects that the temperature exceeds 70°C and disconnects, then the output signal SD1 of the AND gate chip U3 is low.

[0086] When the output signal SD1 of the AND gate chip U3 is low, the enable inputs of the first half-bridge driver circuit 11 and the second half-bridge driver circuit 12 are low. Since the enable inputs of the first half-bridge driver circuit 11 and the second half-bridge driver circuit 12 are enabled by a high level, when the output signal SD1 of the AND gate chip U3 is low, the first half-bridge driver circuit 11 and the second half-bridge driver circuit 12 stop outputting.

[0087] In one specific embodiment, on the one hand, the output signal SD1 of the over-temperature protection circuit 23 is directly connected to the enable terminal of the first half-bridge drive circuit 11 and the enable terminal of the second half-bridge drive circuit 12. That is, once the output signal SD1 is low, it indicates that either of the two water cooling heads of the semiconductor cooler 4 is abnormal in temperature. At this time, the first half-bridge drive circuit 11 and the second half-bridge drive circuit 12 automatically stop working, so that the semiconductor cooler 4 stops working.

[0088] On the other hand, the output signal SD1 of the over-temperature protection circuit 23 is also input to the controller 3. Once the controller 3 detects that SD1 is low, it triggers the protection action, shuts down the pulse width modulation signal output to the first half-bridge drive circuit 11 and the second half-bridge drive circuit 12, and stops the water pump of the water pump circulation system.

[0089] In a preferred embodiment, the data interface and start / stop control interface corresponding to the water pump in the water pump circulation system 5 are also connected to the controller 3. The controller 3 determines the water pump operating status based on the water pump operating data transmitted by the data interface corresponding to the water pump. Specifically, the water pump operating data includes at least the number of feedback pulses and the water pump speed within the counting cycle.

[0090] For controller 3, when the number of feedback pulses of the water pump in the counting cycle is less than the preset number or the water pump speed exceeds the error range of the target speed of the medical temperature controller, it is determined that the water pump is in an abnormal operating state.

[0091] When it is determined that the water pump is in an abnormal operating state, the controller triggers a protection action.

[0092] In this application, the protective actions performed by the controller 3 include stopping the output of the pulse width modulation signal to the semiconductor cooler control circuit and setting the enable signal to a low level, and inputting a stop signal to the start / stop control signal corresponding to the water pump to stop the water pump from working.

[0093] In a preferred embodiment, the controller 3 determines the current state of the semiconductor cooler through the current signal acquisition circuit corresponding to the semiconductor cooler, determines the water pump operating state through the data interface and start / stop control interface corresponding to the water pump, determines the temperature state corresponding to the temperature control accessory through the temperature sensor, and determines the temperature state corresponding to the cold and hot ends of the semiconductor cooler through the over-temperature protection circuit. If the controller 3 detects that at least one of the above states is abnormal, it triggers a protection action.

[0094] In a preferred embodiment, such as Figure 2 As shown, the control and monitoring system of the medical temperature controller also includes an alarm circuit 6, which is connected to the controller 3.

[0095] In a preferred embodiment, the alarm circuit can be a buzzer operating circuit or a voice broadcast operating circuit, and no specific limitation is made here.

[0096] The advantages of this application are:

[0097] 1. By introducing an H-bridge-based semiconductor cooler control circuit, the semiconductor cooler is transformed from relay switch control to pulse width modulation signal control via H-bridge drive, avoiding the jitter problem caused by relays, reducing response time, improving response speed, and adding power adjustment functionality to the semiconductor cooler.

[0098] 2. Compared with related technologies that only rely on temperature sensors to perform protection actions, this application also introduces a current signal acquisition circuit and an over-temperature protection circuit corresponding to the semiconductor cooler to determine different states of the medical temperature controller. By combining different states to protect the medical temperature controller, it can avoid the failure to perform protection actions in a timely manner when the core components of the medical temperature controller fail, and ensure the stable and safe operation of the medical temperature controller.

[0099] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A control and monitoring system for a medical temperature controller, characterized in that, This includes an H-bridge driven semiconductor cooler control circuit, a system status monitoring circuit, a controller, a semiconductor cooler, and a water pump circulation system. Among them, the semiconductor cooler control circuit based on H-bridge drive, the system status monitoring circuit and the water pump circulation system are respectively connected to the controller; The H-bridge driven semiconductor cooler control circuit is also connected to the semiconductor cooler and the system status monitoring circuit, respectively.

2. The control and monitoring system according to claim 1, characterized in that, The semiconductor cooler control circuit includes a first half-bridge drive circuit and a second half-bridge drive circuit. The input terminals of the first half-bridge drive circuit and the second half-bridge drive circuit are respectively connected to the controller; the enable terminals of the first half-bridge drive circuit and the second half-bridge drive circuit are respectively connected to the system status monitoring circuit; the output terminal of the first half-bridge drive circuit is connected to the cold end of the semiconductor cooler; and the output terminal of the second half-bridge drive circuit is connected to the hot end of the semiconductor cooler. The controller is also connected to the enable terminal of the first half-bridge drive circuit and the enable terminal of the second half-bridge drive circuit, respectively.

3. The control and monitoring system according to claim 2, characterized in that, The first half-bridge drive circuit includes a first half-bridge drive chip, a first anti-reverse filter unit, a first bootstrap capacitor, a first power drive chip and its corresponding first gate drive unit, a second power drive chip and its corresponding second gate drive unit, a first capacitor, and a second capacitor. The logic input pins of the first half-bridge driver chip are connected to the controller, the enable control pin of the first half-bridge driver chip is connected to the system status monitoring circuit, the low-side return pin of the first half-bridge driver chip is grounded, and the low-side gate drive output pin of the first half-bridge driver chip is connected to the input of the second gate drive unit. The high-side floating power input pin of the first half-bridge driver chip is connected to one end of the first anti-reverse filter unit and one end of the first bootstrap capacitor, respectively. The other end of the first anti-reverse filter unit is grounded. The other end of the first bootstrap capacitor is connected to the high-side floating power return pin of the first half-bridge driver chip and the cold end of the semiconductor cooler, respectively. The high-side gate drive output pin of the first half-bridge driver chip is connected to the input end of the first gate drive unit. The low-side floating and reference power input pin of the first half-bridge driver chip is connected to the first power supply. The first output terminal of the first gate drive unit is connected to the gate of the first power drive chip, the second output terminal of the first gate drive unit is connected to the source of the first power drive chip and the drain of the second power drive chip respectively, the drain of the first power drive chip is connected to the second power supply and one end of the first capacitor respectively, and the other end of the first capacitor is connected to the cold end of the semiconductor cooler and one end of the second capacitor respectively. The first output terminal of the second gate drive unit is connected to the gate of the second power drive chip, and the second output terminal of the second gate drive unit is connected to the source of the second power drive chip, the other end of the second capacitor, and the second half-bridge drive circuit, respectively.

4. The control and monitoring system according to claim 2, characterized in that, The second half-bridge drive circuit includes a second half-bridge drive chip, a second anti-reverse filter unit, a second bootstrap capacitor, a third power drive chip and its corresponding third gate drive unit, a fourth power drive chip and its corresponding fourth gate drive unit, a third capacitor, and a fourth capacitor. The logic input pins of the second half-bridge driver chip are connected to the controller, the enable control pin of the second half-bridge driver chip is connected to the system status monitoring circuit, the low-side return pin of the second half-bridge driver chip is grounded, and the low-side gate drive output pin of the second half-bridge driver chip is connected to the input of the fourth gate drive unit. The high-side floating power input pin of the second half-bridge driver chip is connected to one end of the second anti-reverse filter unit and one end of the second bootstrap capacitor, respectively. The other end of the second anti-reverse filter unit is grounded. The other end of the second bootstrap capacitor is connected to the high-side floating power return pin of the second half-bridge driver chip and the hot end of the semiconductor cooler, respectively. The high-side gate drive output pin of the second half-bridge driver chip is connected to the input of the third gate drive unit. The low-side floating and reference power input pin of the second half-bridge driver chip is connected to the first power supply. The first output terminal of the third gate drive unit is connected to the gate of the third power drive chip. The second output terminal of the third gate drive unit is connected to the source of the third power drive chip and the drain of the fourth power drive chip. The drain of the third power drive chip is connected to the second power supply and one end of the third capacitor. The other end of the third capacitor is connected to the hot end of the semiconductor cooler and one end of the fourth capacitor. The first output terminal of the fourth gate drive unit is connected to the gate of the fourth power drive chip, and the second output terminal of the fourth gate drive unit is connected to the source of the fourth power drive chip, the other end of the fourth capacitor, and the other end of the second capacitor in the first half-bridge drive circuit.

5. The control and monitoring system according to claim 2, characterized in that, The system status monitoring circuit includes a temperature sensor, a current signal acquisition circuit corresponding to the semiconductor cooler, and an over-temperature protection circuit corresponding to the semiconductor cooler. The temperature sensor is installed inside the pipe containing the liquid after it has been heated or cooled by the semiconductor cooler, or on the temperature control accessory, and the temperature sensor is connected to the controller. The input terminal of the current signal acquisition circuit is connected to the cold end and the hot end of the semiconductor cooler, and the output terminal of the current signal acquisition circuit is connected to the controller. The input terminal of the over-temperature protection circuit is connected to the cold end and the hot end of the semiconductor cooler, respectively, and the output terminal of the over-temperature protection circuit is connected to the enable terminal of the first half-bridge drive circuit and the enable terminal of the second half-bridge drive circuit, respectively. The water pump data terminal in the water pump circulation system is connected to the controller.

6. The control and monitoring system according to claim 5, characterized in that, The temperature sensor includes a first temperature sensor and a second temperature sensor, which are respectively connected to the controller. The first temperature sensor is installed in the pipe containing the liquid after it has been heated or cooled by the semiconductor cooler, or on the temperature control component. The second temperature sensor is installed inside the pipe containing the liquid after it has been heated or cooled by the semiconductor cooler, or on the temperature control component.

7. The control and monitoring system according to claim 5, characterized in that, The current signal acquisition circuit includes a sampling resistor, a first voltage divider resistor, a second voltage divider resistor, a first filter capacitor, a first operational amplifier, a first amplification resistor, a second amplification resistor, a non-inverting input resistor, a second operational amplifier, a third amplification resistor, a fourth amplification resistor, a second filter capacitor, and an output voltage divider resistor. One end of the sampling resistor is connected to the cold end and hot end of the semiconductor cooler and one end of the first voltage divider resistor, respectively. The other end of the sampling resistor is grounded. The other end of the first voltage divider resistor is connected to the inverting input terminal of the first operational amplifier, connected to the third power supply through the second voltage divider resistor, and grounded through the first filter capacitor. The non-inverting input terminal of the first operational amplifier is grounded through the first amplification resistor and connected to the output terminal of the first operational amplifier through the second amplification resistor. The output of the first operational amplifier is also connected to the non-inverting input of the second operational amplifier through a non-inverting input resistor. The inverting input of the second operational amplifier is grounded through a third amplifying resistor and connected to the output of the second operational amplifier through a fourth amplifying resistor. The output of the second operational amplifier is also connected to the controller through an output voltage divider resistor and grounded through an output voltage divider resistor and a second filter capacitor. The positive input of the second operational amplifier is connected to a third power supply, and the negative input of the second operational amplifier is grounded.

8. The control and monitoring system according to claim 5, characterized in that, The over-temperature protection circuit includes a first temperature control switch and its corresponding first series resistor, a second temperature control switch and its corresponding second series resistor, an AND gate chip, and a third filter capacitor. The input terminal of the first temperature control switch is connected to the cold end of the semiconductor cooler, the output terminal of the first temperature control switch is connected to the first AND gate input pin of the logic AND gate chip through the first series resistor, the power supply terminals of the first and second temperature control switches are connected to the fourth power supply, the input terminal of the second temperature control switch is connected to the hot end of the semiconductor cooler, the output terminal of the second temperature control switch is connected to the second AND gate input pin of the logic AND gate chip through the second series resistor, and the ground pin of the logic AND gate chip is grounded. The power supply pins of the AND gate chip are connected to the fourth power supply and grounded through the third filter capacitor, respectively. The AND gate output pins of the AND gate chip are connected to the enable terminal of the first half-bridge driver circuit, the enable terminal of the second half-bridge driver circuit, and the controller, respectively.

9. The control and monitoring system according to claim 1, characterized in that, The control and monitoring system of the medical temperature controller also includes an alarm circuit. The alarm circuit is connected to the controller.

10. The control and monitoring system according to claim 3, characterized in that, The gate drive unit includes a gate resistor, a turn-off diode, and a coupling capacitor. One end of the gate resistor is connected to the cathode of the turn-off diode to form the input terminal of the gate driving unit. The other end of the gate resistor serves as the first output terminal of the gate driving unit and is connected to the anode of the turn-off diode and one end of the coupling capacitor, respectively. The other end of the coupling capacitor is used as the second output terminal of the gate driving unit.

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