A heat dissipation module and equipment cabinet

Abstract

The present disclosure provides a heat dissipation module and equipment cabinet, the heat dissipation module comprises a fan assembly; a heat conduction assembly is tightly connected with the fan assembly along a first direction; a rotating support is connected with the fan assembly along the first direction and can rotate around an axis relative to the fan assembly, the rotating support is matched with the heat conduction fins of the heat conduction assembly through a folded edge structure and is tightly connected with the heat conduction fins along a second direction to press the folded edge structure; wherein the first direction and the second direction satisfy the perpendicular condition. The heat dissipation module and equipment cabinet of the present disclosure connect the fan assembly and the heat conduction assembly together by setting the rotating support, the rotating support is rotationally connected with the fan assembly and is tightly connected with the heat conduction fins of the heat conduction assembly along the second direction, the torsion generated in the process of tightening drives the rotating support to rotate upward relative to the fan assembly to press the folded edge structure and ensure that the corresponding part of the heat conduction fins is always in the best position of the air inlet of the fan assembly.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology for electronic products, and in particular to a heat dissipation module and equipment chassis. Background Technology

[0002] In desktop computer cases, traditional tower coolers lack structural stability and are prone to damaging the Central Processing Unit (CPU) core during impacts or drops. Therefore, cooling modules are typically assembled onto the case using side-mounted screws. However, side-mounted screws require specialized tools, and automatic screwdrivers cannot be used due to space constraints, resulting in low assembly efficiency. Furthermore, manufacturing errors or assembly deformation of the cooling module can easily lead to tilting, causing poor CPU cooling and failing to meet high-power cooling requirements. Utility Model Content

[0003] This disclosure provides a heat dissipation module and equipment chassis to at least solve the above-mentioned technical problems existing in the prior art.

[0004] A first aspect of this disclosure provides a heat dissipation module, comprising:

[0005] Fan assembly;

[0006] The heat-conducting component is fastened to the fan assembly along a first direction; and

[0007] A rotating bracket is connected to the fan assembly along the first direction and is capable of rotating relative to the fan assembly about an axis. The rotating bracket is engaged with the heat-conducting fins of the heat-conducting assembly through a folded edge structure and is fastened to the heat-conducting fins along the second direction to press the folded edge structure.

[0008] Wherein, the first direction and the second direction satisfy the perpendicular condition.

[0009] In one embodiment, the heat-conducting fins include interconnected heat-conducting portions and connecting portions, the connecting portions being securely connected to the rotating bracket, and the heat-conducting portions being positioned at the air outlet of the fan assembly.

[0010] In one embodiment, the rotating bracket includes a support portion, which is connected to the connecting portion by a first fastener.

[0011] In one embodiment, the connecting part has a first through hole, the bearing part has a locking hole, and the first fastener passes through the first through hole and locks and fixes itself to the locking hole; wherein, the first through hole is an elliptical through hole.

[0012] In one embodiment, the folded edge structure includes a first folded edge and a second folded edge, the first folded edge being formed on the rotating bracket and the second folded edge being formed on the heat-conducting fin, the first folded edge and the second folded edge abutting each other.

[0013] In one embodiment, the first folded edge is connected to the supporting portion and is inclined relative to the second direction toward the side away from the supporting portion. The first folded edge is formed on the connecting portion, and the inclination of the first folded edge is adapted to the inclination of the second folded edge.

[0014] In one embodiment, the rotating bracket is provided with a rotating shaft, and the rotating bracket is rotatably connected to the fan assembly through the rotating shaft, with the axis of the rotating shaft located in the first direction.

[0015] In one embodiment, the heat-conducting component and the fan component are connected in the first direction by a second fastener. The heat-conducting component has a second through hole, and the second fastener passes through the second through hole and is connected to the fan component. The second through hole is an elliptical through hole.

[0016] A second aspect of this disclosure provides a device chassis, including a housing with a ventilation window, and a heat dissipation module as described in any of the above embodiments, wherein a fan assembly is mounted at the ventilation window, and one end of the heat-conducting component away from the fan assembly is fixedly connected to a motherboard.

[0017] In one embodiment, the heat-conducting component is fixed to the motherboard by spring screws.

[0018] In this disclosure, the heat dissipation module and equipment chassis connect the fan assembly and the heat conduction assembly together via a rotating bracket. The rotating bracket is rotatably connected to the fan assembly and is also securely fastened to the heat conduction fins of the heat conduction assembly along a second direction. The torque generated during the fastening process drives the rotating bracket to rotate upward relative to the fan assembly, thereby pressing the folded edge structure and adjusting the heat conduction fins. This ensures that the corresponding parts of the heat conduction fins are always in the optimal position at the fan assembly's air outlet, maximizing heat exchange efficiency. Therefore, this structure can effectively absorb the unbalanced forces caused by manufacturing errors or assembly deformation in the heat dissipation module, thus eliminating the problem of poor heat dissipation of electronic components, improving heat dissipation effect, and ensuring that the overall power consumption meets design requirements. Furthermore, by fastening the heat conduction fins and the rotating bracket along the second direction, an electric screwdriver only needs to be tightened along the second direction to fix the heat conduction assembly and the fan assembly together, reducing installation difficulty, facilitating user self-installation and maintenance, and improving the operability of the equipment.

[0019] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0020] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which:

[0021] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0022] Figure 1 A schematic diagram of the overall structure of a heat dissipation module according to an exemplary embodiment of the present disclosure is shown;

[0023] Figure 2 A schematic diagram of the structure of a rotating bracket for a heat dissipation module, an exemplary embodiment of the present disclosure, is shown.

[0024] Figure 3 A schematic diagram of the structure of the heat-conducting fins of a heat dissipation module according to an exemplary embodiment of the present disclosure is shown;

[0025] Figure 4 This illustration shows a schematic diagram of the connection structure between the rotating bracket and the heat-conducting fins of a heat dissipation module in an exemplary embodiment of this disclosure;

[0026] Figure 5 A schematic diagram of the connection structure between the rotating bracket and the fan assembly of a heat dissipation module in an exemplary embodiment of this disclosure is shown.

[0027] Figure 6 This illustration shows a schematic diagram of the connection structure between the fan assembly and the heat-conducting assembly of a heat dissipation module according to an exemplary embodiment of the present disclosure;

[0028] Figure 7 Another schematic diagram shows the connection structure between the fan assembly and the heat-conducting assembly of a heat dissipation module according to an exemplary embodiment of the present disclosure;

[0029] Figure 8 This illustration shows another schematic diagram of the connection structure between the fan assembly and the heat-conducting assembly of a heat dissipation module according to an exemplary embodiment of the present disclosure;

[0030] Figure 9 This illustration shows yet another schematic diagram of the connection structure between the fan assembly and the heat-conducting assembly of a heat dissipation module according to an exemplary embodiment of the present disclosure;

[0031] Figure 10 A schematic diagram of the overall structure of a device chassis according to an exemplary embodiment of the present disclosure is shown;

[0032] Figure 11 A partially enlarged view of a device chassis according to an exemplary embodiment of the present disclosure is shown.

[0033] The following are the labels in the diagram: 1. Fan assembly; 2. Heat conduction assembly; 3. Rotating bracket; 4. Folded edge structure; 5. First fastener; 6. Second fastener; 7. Housing; 8. Main board; 9. Spring screw; 10. Electric screwdriver; 21. Heat conduction fins; 22. Second through hole; 23. Heat sink; 24. Heat pipe; 31. Supporting part; 32. Shaft; 41. First folded edge; 42. Second folded edge; 211. Heat conduction part; 212. Connecting part; 311. Locking hole; 2121. First through hole. Detailed Implementation

[0034] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0035] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0036] Reference Figures 1-3 As shown, this disclosure discloses a heat dissipation module in an exemplary embodiment, including a fan assembly 1, a heat-conducting assembly 2, and a rotating bracket 3. The heat-conducting assembly 2 is fastened to the fan assembly 1 along a first direction. The rotating bracket 3 is connected to the fan assembly 1 along the first direction and is capable of rotating relative to the fan assembly 1 about an axis. The rotating bracket 3 engages with the heat-conducting fins 21 of the heat-conducting assembly 2 through a folded edge structure 4 and is fastened to the heat-conducting fins 21 along a second direction to press the folded edge structure 4. The first direction and the second direction satisfy a perpendicular condition.

[0037] In this embodiment, the fan assembly 1 serves as the power source for the heat dissipation module, responsible for generating airflow to rapidly dissipate heat. The fan assembly 1 can employ various types of fans, such as axial fans or centrifugal fans, allowing for adaptive selection based on different application scenarios and heat dissipation requirements. The fan assembly 1 typically includes a fan motor, fan blades, and a fan frame. The fan motor drives the fan blades to rotate, generating directional airflow, which will not be elaborated upon here. The heat-conducting component 2 is securely connected to the frame in the fan assembly 1 along a first direction, primarily used to transfer and dissipate the heat generated by the electronic components. The first direction in this disclosure refers to the thickness direction of the fan assembly 1, i.e., the direction of the fan's rotation axis. The heat-conducting component 2 includes a heat sink 23 and heat-conducting fins 21. The heat-conducting fins 21 are generally made of highly thermally conductive metal materials, such as copper or aluminum, and have a large surface area, increasing the contact area with air and improving heat dissipation efficiency. The heat-conducting component 2 is tightly bonded to the heat-generating electronic components using materials such as thermal paste. Heat is rapidly transferred to the heat dissipation tower 23 via the heat pipe 24, and finally dissipated by convection with the air through the heat-conducting fins 21. The rotating bracket 3 is used to adjust the relative position and contact degree between the heat-conducting component 2 and the fan component 1. Specifically, the rotating bracket 3 is connected to the fan component 1 along a first direction and can rotate relative to the fan component 1 around an axis, making the subsequent process of locking the rotating bracket 3 and the heat-conducting fins 21 along a second direction more flexible. The rotating bracket 3 and the heat-conducting fins 21 are engaged by a folded edge structure 4. During the locking process of the rotating bracket 3 and the heat-conducting fins 21, the locking torque will cause the folded edge structure 4 to press tightly, so as to absorb the unbalanced force caused by manufacturing errors or assembly deformation of the heat dissipation module, and press the heat-conducting fins 21 towards the fan component 1, thereby eliminating the problem of poor heat dissipation contact of electronic components, improving the heat dissipation effect of electronic components, and ensuring that the power consumption of the whole machine meets the design requirements.

[0038] In summary, the heat dissipation module of this disclosure connects the fan assembly 1 and the heat-conducting assembly 2 together by setting a rotating bracket 3. The rotating bracket 3 is rotatably connected to the fan assembly 1 and is fastened to the heat-conducting fins 21 of the heat-conducting assembly 2 along a second direction. The torque generated during the fastening process drives the rotating bracket 3 to rotate upward relative to the fan assembly 1, and is pressed by the folded edge structure 4, thereby adjusting the heat-conducting fins 21 and ensuring that the corresponding part of the heat-conducting fins 21 is always in the optimal position at the air outlet of the fan assembly 1, maximizing the heat exchange efficiency. Therefore, this structure can effectively absorb the unbalanced force caused by manufacturing errors or assembly deformation of the heat dissipation module, thereby eliminating the problem of poor heat dissipation of electronic components, improving the heat dissipation effect, and ensuring that the power consumption of the whole machine meets the design requirements. In addition, by fastening the heat-conducting fins 21 and the rotating bracket 3 along the second direction, the electric screwdriver 10 only needs to be tightened along the second direction to fix the heat-conducting assembly 2 and the fan assembly 1 together, reducing the installation difficulty, making it convenient for users to install and maintain themselves, and improving the operability of the equipment.

[0039] In one embodiment, the heat-conducting fin 21 includes a heat-conducting part 211 and a connecting part 212 connected to each other. The connecting part 212 is fastened to the rotating bracket 3, and the heat-conducting part 211 is placed at the air outlet of the fan assembly 1.

[0040] In this embodiment, the heat conduction part 211 is positioned at the air outlet of the fan assembly 1, maximizing contact with the airflow blown by the fan and rapidly transferring the absorbed heat to the flowing air, achieving efficient heat exchange. The heat conduction part 211 can be sheet-like, columnar, or other shapes that increase the heat dissipation area and promote heat exchange. The connecting part 212 is securely connected to the rotating bracket 3, ensuring the stability of the heat-conducting fins 21 in the entire heat dissipation module. The connecting part 212 matches the structure of the rotating bracket 3 and can be tightly connected to the rotating bracket 3 with screws. The connecting part 212 can be made of the same metal material as the heat conduction part 211 and processed into a specific shape through stamping, forging, or other processes to meet the connection requirements of the rotating bracket 3. When the heat dissipation module is working, the heat generated by the electronic components is conducted to the heat conduction part 211 of the heat-conducting fins 21. After the fan assembly 1 is started, the generated airflow blows towards the heat conduction part 211, and the heat conduction part 211 transfers heat to the airflow, thereby achieving heat dissipation. During this process, if the relative position of the heat-conducting fins 21 and the fan assembly 1 changes due to various reasons, such as equipment vibration or manufacturing errors, affecting the heat dissipation effect, it can be adjusted by rotating the bracket 3. When adjusting the rotating bracket 3, by further tightening the connecting part 212 of the heat-conducting fins 21 to the rotating bracket 3, the rotating bracket 3 is driven to move upward under the action of torque. The rotating bracket 3 squeezes the connecting part 212 of the heat-conducting fins 21, thereby causing the heat conduction part 211 of the heat-conducting fins 21 to tighten towards the fan assembly 1, so that the heat conduction part 211 can better contact the airflow, optimize the heat exchange process, and ensure that the heat dissipation module always maintains efficient heat dissipation performance.

[0041] Reference Figure 4 As shown, in one embodiment, the rotating bracket 3 includes a support portion 31, which is connected to the connecting portion 212 via a first fastener 5.

[0042] In this embodiment, the shape and size of the support portion 31 are designed according to the connection requirements of the heat-conducting fins 21. The support portion 31 has strength and rigidity, and can withstand the force generated during the adjustment process, ensuring a stable connection with the heat-conducting fins 21. The first fastener 5 is used to securely connect the support portion 31 to the connection portion 212 of the heat-conducting fins 21. The first fastener 5 can be a screw, bolt, or rivet, etc., and can be adapted to the structure and usage requirements of the heat dissipation module. During the installation and use of the heat dissipation module, if it is necessary to adjust the position and angle of the heat-conducting fins 21 to optimize the heat dissipation effect, this can be achieved by adjusting the first fastener 5. That is, by further tightening the first fastener 5, in the second direction, under the action of the torque of the first fastener 5, the rotating bracket 3 is driven to move upward. The rotating bracket 3 presses the connection portion 212 of the heat-conducting fins 21, and the heat-conducting fins 21 will move accordingly, thereby adjusting the position and angle of the heat conduction portion 211 at the air outlet of the fan assembly 1, and improving the heat exchange efficiency. Because the rotating bracket 3 can rotate relative to the fan assembly 1 around an axis, with the adjustment of the first fastener 5, the rotating bracket 3 can adaptively rotate relative to the fan assembly 1 around the axis, thereby driving the heat-conducting fins 21 to adjust their position and angle. This adjustment flexibility not only enhances the heat dissipation effect but also allows the heat dissipation module to better adapt to different application scenarios and heat dissipation requirements, improving the versatility and practicality of the heat dissipation module.

[0043] Reference Figures 5-7 As shown, in one embodiment, the connecting part 212 has a first through hole 2121, and the supporting part 31 has a locking hole 311. The first fastener 5 passes through the first through hole 2121 and is locked and fixed in the locking hole 311. The first through hole 2121 is an elliptical through hole.

[0044] In this embodiment, a first through hole 2121 is provided on the connecting portion 212 of the heat-conducting fin 21. This first through hole 2121 is an elliptical through hole, which provides a certain adjustment space for the connection between the connecting portion 212 and the supporting portion 31. This can compensate for position deviations and installation errors caused by manufacturing tolerances, equipment vibrations, and other factors, allowing the heat-conducting fin 21 to be adjusted more flexibly during installation and use, and to better cooperate with other components in the heat dissipation module. A locking hole 311 is provided on the supporting portion 31 of the rotating bracket 3. The position of the locking hole 311 corresponds to the first through hole 2121 on the connecting portion 212, and is used to cooperate with the first fastener 5 to achieve connection. The first fastener 5 locks the connecting portion 212 and the supporting portion 31 together by screwing into the locking hole 311.

[0045] In one embodiment, the folded edge structure 4 includes a first folded edge 41 and a second folded edge 42. The first folded edge 41 is formed on the rotating bracket 3, and the second folded edge 42 is formed on the heat-conducting fin 21. The first folded edge 41 and the second folded edge 42 abut against each other.

[0046] In this embodiment, a first folded edge 41 is formed on the rotating bracket 3. Its shape and size are designed according to the structure of the rotating bracket 3 and the matching requirements with the heat-conducting fins 21. The first folded edge 41 increases the contact area and connection strength between the rotating bracket 3 and the heat-conducting fins 21. A second folded edge 42 is formed on the heat-conducting fins 21, corresponding to the first folded edge 41. The shape and size of the second folded edge 42 match the first folded edge 41 to ensure that the two can fit tightly together. The abutment of the first folded edge 41 and the second folded edge 42 forms a tight connection between the rotating bracket 3 and the heat-conducting fins 21. Under the torque of the first fastener 5, the rotating bracket 3 rotates relative to the fan assembly 1 around its axis and applies upward pressure to the heat-conducting fins 21. The contact between the first folded edge 41 and the second folded edge 42 effectively transfers the pressure to the heat-conducting fins 21, thereby pressing the folded edge structure 4. This not only enhances the connection stability between the rotating bracket 3 and the heat-conducting fins 21, but also allows the heat conduction part 211 to better contact the airflow, optimizing the heat exchange process and ensuring that the heat dissipation module always maintains high-efficiency heat dissipation performance. Therefore, the contact between the first folded edge 41 and the second folded edge 42 greatly increases the connection strength and stability between the rotating bracket 3 and the heat-conducting fins 21. During the operation of the heat dissipation module, even if affected by factors such as vibration and impact, the relative displacement between the rotating bracket 3 and the heat-conducting fins 21 is not easily caused, ensuring the stability of heat transfer and improving the overall performance of the heat dissipation module.

[0047] In one embodiment, the first folded edge 41 is connected to the support portion 31 and is inclined relative to the second direction toward the side away from the support portion 31. The first folded edge 41 is formed on the connecting portion 212, and the inclination of the first folded edge 41 is adapted to the inclination of the second folded edge 42.

[0048] In this embodiment, the first folded edge 41 is connected to the support portion 31 and is inclined relative to the second direction away from the support portion 31, so that when the rotating bracket 3 is rotated for adjustment, the force generated by rotation can be more effectively converted into a pressing force on the heat-conducting fins 21. The first folded edge 41 is formed on the connecting portion 212, and its inclination is adapted to the inclination of the second folded edge 42. The second folded edge 42 is formed on the heat-conducting fins 21 and cooperates with the first folded edge 41. Since the inclinations of the first folded edge 41 and the second folded edge 42 are adapted, they can achieve a tight fit when they come into contact, ensuring that the pressure is evenly transmitted to the heat-conducting fins 21 during the adjustment of the rotating bracket 3, thus enhancing the stability of the connection. Preferably, there is a 2° tilt difference between the first folded edge 41 and the second folded edge 42. For example, the first folded edge 41 is tilted at 48° and the second folded edge 42 is tilted at 50°. This tilt difference design causes the first folded edge 41 to gradually tighten relative to the second folded edge 42 during adjustment of the rotating bracket 3. The cooperation principle of the first folded edge 41 and the second folded edge 42 is that during the rotation of the rotating bracket 3, as the first folded edge 41 moves relative to the second folded edge 42, due to the tilt difference, the first folded edge 41 will gradually fit more tightly against the second folded edge 42, thereby driving the heat-conducting fins 21 to adjust their position. This fit not only enhances the connection stability between the rotating bracket 3 and the heat-conducting fins 21, but also allows for a certain degree of fine adjustment of the position of the heat-conducting fins 21, so that the relative position of the heat conduction part 211 and the air outlet of the fan assembly 1 reaches the optimal level, thereby improving the heat exchange efficiency.

[0049] Reference Figure 5 As shown, in one embodiment, a rotating bracket 3 is provided with a rotating shaft 32, and the rotating bracket 3 is rotatably connected to the fan assembly 1 through the rotating shaft 32. The axis of the rotating shaft 32 is located in the first direction.

[0050] In this embodiment, by providing a rotating shaft 32 on the rotating bracket 3, the rotating bracket 3 can rotate around the rotating shaft 32. The rotating bracket 3 is rotatably connected to the fan assembly 1 through the rotating shaft 32, providing the rotating bracket 3 with a degree of freedom of rotation.

[0051] Reference Figure 8 and Figure 9 As shown, in one possible embodiment, the heat-conducting component 2 and the fan component 1 are connected in a first direction by a second fastener 6. The heat-conducting component 2 has a second through hole 22, and the second fastener 6 passes through the second through hole 22 to connect with the fan component 1. The second through hole 22 is an elliptical through hole.

[0052] In this embodiment, the second fastener 6 can be a common fastener such as a screw or bolt, used to securely connect the heat-conducting component 2 and the fan component 1 together. The second through hole 22 is an elliptical through hole, providing a certain adjustment space for the connection. During installation, when the heat dissipation module has manufacturing tolerances or needs to be fine-tuned according to the installation space, the elliptical through hole allows the heat-conducting component 2 to be adjusted relative to the fan component 1 within a certain range without precisely aligning each mounting hole, greatly reducing the installation difficulty. When installing the heat dissipation module, first pass the second fastener 6 through the elliptical second through hole 22 on the heat-conducting component 2, and then connect it to the corresponding screw hole or connecting structure on the fan component 1. During equipment operation, even if affected by factors such as vibration and temperature changes, the elliptical through hole can buffer stress to a certain extent, preventing loosening at the position of the second through hole 22 and ensuring the stable operation of the heat dissipation module.

[0053] Reference Figure 10 and Figure 11 As shown, this disclosure also provides a device chassis, including a housing 7, on which a ventilation window is provided, and a heat dissipation module as described in any of the above embodiments, a fan assembly 1 is mounted at the ventilation window, and the end of the heat conduction component 2 away from the fan assembly 1 is fixedly connected to the motherboard 8.

[0054] Specifically, in one embodiment, the heat-conducting component 2 is fixed to the motherboard 8 by a spring screw 9.

[0055] In this embodiment, the equipment chassis can be, but is not limited to, an industrial control cabinet, a game console, or a server chassis. The housing 7 serves as the main structure of the equipment chassis, protecting internal electronic components and supporting other parts. Ventilation windows are provided on the housing 7 to facilitate airflow between the inside and outside of the chassis, creating conditions for heat dissipation. The fan assembly 1 is mounted at the ventilation windows, drawing in cool air from outside the chassis and expelling hot air from inside, forming effective air convection. The end of the heat-conducting assembly 2 furthest from the fan assembly 1 is fixedly connected to the motherboard 8, ensuring timely absorption of heat from heat-generating components such as the motherboard 8. This heat is then transferred to the air blown out by the fan assembly 1 through components such as the heat pipe 24 and heat-conducting fins 21, achieving heat dissipation. Within the equipment chassis, the first direction is horizontal, and the second direction is vertical. The fan assembly 1 is fixed to the ventilation window along the first direction. Because the rotating bracket 3 is first rotatably connected to the fan assembly 1, and then securely connected to the heat-conducting fins 21 of the heat-conducting assembly 2 along the second direction, the electric screwdriver 10 only needs to be tightened vertically to fix the heat-conducting assembly 2 and the fan assembly 1 together, reducing the installation difficulty, facilitating user self-installation and maintenance, and improving the operability of the equipment. The spring screw 9 is elastic and can effectively buffer the vibration generated during the operation of the equipment when fixing the heat-conducting assembly 2 to the motherboard 8. Compared with ordinary screws, the spring screw 9 will not easily loosen due to vibration, ensuring that the heat-conducting assembly 2 and the motherboard 8 are always in close contact. This close contact helps heat to be quickly conducted from the motherboard 8 to the heat-conducting assembly 2, and then transferred to the air through the heat pipe 24, heat-conducting fins 21 and other structures in the heat-conducting assembly 2, achieving efficient heat dissipation. The connection between the heat dissipation module and the various components of the equipment chassis is stable, especially the connection method between the heat-conducting assembly 2 and the motherboard 8, which can effectively resist the interference of external factors such as vibration, ensuring that the heat dissipation module can work stably in various operating environments and improving the overall reliability of the equipment.

[0056] In the description of this disclosure, it should be understood that the orientation or positional relationship indicated by directional terms is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this disclosure and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this disclosure; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0057] For ease of description, spatial relative terms such as "above," "over," "on the upper surface of," and "above" are used herein to describe the spatial positional relationship between one or more components or features shown in the figures and other components or features. It should be understood that spatial relative terms include not only the orientation of the component as depicted in the figures but also different orientations during use or operation. For example, if the components in the figures are inverted as a whole, "above" or "above other components or features" will include cases where the component is "below" or "under" other components or features. Thus, the exemplary term "above" can include both "above" and "below." Furthermore, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this document intends to include all such cases.

[0058] It should be noted that the terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the exemplary implementations according to this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, parts, components, and / or combinations thereof.

[0059] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in sequences other than those illustrated or described herein.

[0060] This disclosure has been described through the above embodiments; however, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit this disclosure to the described embodiments. Furthermore, those skilled in the art will understand that this disclosure is not limited to the above embodiments, and many more variations and modifications can be made based on the teachings of this disclosure, all of which fall within the scope of protection claimed by this disclosure. The scope of protection of this disclosure is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation module, characterized in that, include: Fan assembly (1); The heat-conducting component (2) is fastened to the fan assembly (1) along a first direction; as well as A rotating bracket (3) is connected to the fan assembly (1) along the first direction and can rotate relative to the fan assembly (1) about an axis. The rotating bracket (3) is engaged with the heat-conducting fins (21) of the heat-conducting assembly (2) through a folded edge structure (4) and is fastened to the heat-conducting fins (21) along the second direction to press the folded edge structure (4). Wherein, the first direction and the second direction satisfy the perpendicular condition.

2. The heat dissipation module according to claim 1, characterized in that, The heat-conducting fin (21) includes a heat-conducting part (211) and a connecting part (212) connected to each other. The connecting part (212) is fastened to the rotating bracket (3). The heat-conducting part (211) is placed at the air outlet of the fan assembly (1).

3. The heat dissipation module according to claim 2, characterized in that, The rotating bracket (3) includes a support portion (31), which is connected to the connecting portion (212) by a first fastener (5).

4. The heat dissipation module according to claim 3, characterized in that, The connecting part (212) is provided with a first through hole (2121), and the bearing part (31) is provided with a locking hole (311). The first fastener (5) passes through the first through hole (2121) and is locked and fixed with the locking hole (311); wherein, the first through hole (2121) is an elliptical through hole.

5. The heat dissipation module according to claim 3, characterized in that, The folded edge structure (4) includes a first folded edge (41) and a second folded edge (42). The first folded edge (41) is formed on the rotating bracket (3), and the second folded edge (42) is formed on the heat-conducting fin (21). The first folded edge (41) and the second folded edge (42) abut against each other.

6. The heat dissipation module according to claim 5, characterized in that, The first fold (41) is connected to the support portion (31) and is inclined relative to the second direction toward the side away from the support portion (31). The first fold (41) is formed on the connecting portion (212), and the inclination of the first fold (41) is adapted to the inclination of the second fold (42).

7. The heat dissipation module according to claim 1, characterized in that, The rotating bracket (3) is provided with a rotating shaft (32), and the rotating bracket (3) is rotatably connected to the fan assembly (1) through the rotating shaft (32). The axis of the rotating shaft (32) is located in the first direction.

8. The heat dissipation module according to claim 1, characterized in that, The heat-conducting component (2) and the fan component (1) are connected in the first direction by a second fastener (6). The heat-conducting component (2) has a second through hole (22), and the second fastener (6) passes through the second through hole (22) and is connected to the fan component (1). The second through hole (22) is an elliptical through hole.

9. A device chassis, comprising a housing (7), wherein the housing (7) is provided with ventilation windows, characterized in that, It also includes a heat dissipation module as described in any one of claims 1-8, wherein the fan assembly (1) is mounted at the ventilation window, and one end of the heat conduction component (2) away from the fan assembly (1) is fixedly connected to the motherboard (8).

10. The equipment chassis according to claim 9, characterized in that, The heat-conducting component (2) is fixed to the main board (8) by spring screws (9).

Images