MLCC with sandwich and soft termination structure

Abstract

The utility model discloses a kind of MLCC with sandwich and soft terminal structure, it is related to MLCC structure technical field, including MLCC ontology, the inside of MLCC ontology is provided with ceramic medium, and the inside of ceramic medium is provided with internal electrode, the upper and lower sides of ceramic medium are provided with first high-strength porcelain medium and second high-strength porcelain medium respectively, the left and right sides of MLCC ontology are provided with end electrode, and the inside of end electrode is provided with electroplated resin silver paste layer, electroplated nickel layer and electroplated tin layer.The MLCC with sandwich and soft terminal structure, through the double design of sandwich structure and soft terminal structure, effectively enhance the stress resistance of product, greatly reduce the probability of crack and open circuit under various complex environments, significantly improve the reliability of MLCC ontology, guarantee the stable operation of electronic equipment.

Description

Technical Field

[0001] This utility model relates to the field of MLCC structure technology, specifically to an MLCC with a sandwich and soft terminal structure. Background Technology

[0002] In the context of the rapid development of today's electronics and information industry, MLCCs, with their advantages of small size, large capacity, and good stability, are widely used in consumer electronics, automotive electronics, communication equipment, aerospace, and other fields. With the rise of emerging technologies such as 5G communication, artificial intelligence, and the Internet of Things, electronic devices are placing higher demands on the performance, reliability, and integration of MLCCs. Traditional MLCC structures are gradually becoming insufficient to meet the needs of complex circuit environments. Traditional MLCC product structures have the following problems:

[0003] During packaging and PCBA nozzle placement, nozzle impacts generate external forces; during reflow soldering, rapid temperature changes cause significant internal stress due to differences in material thermal conductivity and expansion coefficients; PCB bending and excessive soldering during PCB separation also stress the product. These stresses often lead to cracks at the junction of the body and terminal electrodes, or at the body or terminal electrodes, resulting in open circuit problems and failing to meet the design requirements of high-capacity circuit boards with mechanical stress.

[0004] Therefore, we propose an MLCC with a sandwich and soft terminal structure to address the problems mentioned above. Utility Model Content

[0005] The purpose of this invention is to provide an MLCC with a sandwich and soft terminal structure to solve the problem mentioned in the background art that the traditional MLCC products on the market have cracks at the junction of the body and the terminal electrode, or at the body or the terminal electrode, which leads to open circuit problems and cannot meet the design requirements of circuit boards with high capacitance and mechanical stress.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an MLCC with a sandwich and soft terminal structure, comprising an MLCC body, wherein a ceramic dielectric is disposed inside the MLCC body, and an internal electrode is disposed inside the ceramic dielectric; a first high-strength ceramic dielectric and a second high-strength ceramic dielectric are disposed on the upper and lower sides of the ceramic dielectric, respectively; and end electrodes are disposed on the left and right sides of the MLCC body, wherein an electroplated resin silver paste layer, an electroplated nickel layer and an electroplated tin layer are disposed inside the end electrodes.

[0007] Preferably, the internal electrode is designed with multiple layers inside the ceramic medium.

[0008] The above structural design increases the capacitance of the MLCC body, meeting the design requirements of high capacitance circuit boards; at the same time, the stacked structure enhances the stability of the internal structure, allowing the internal electrodes to support each other, which helps to disperse stress and reduce the possibility of internal damage to the internal electrodes and other internal structures due to stress.

[0009] Preferably, the inner electrode layer is located between the first high-strength ceramic dielectric and the second high-strength ceramic dielectric, and the first high-strength ceramic dielectric and the second high-strength ceramic dielectric are respectively printed on the upper and lower sides of the ceramic dielectric.

[0010] With the above structural design, the first and second high-strength ceramic dielectrics, with their high mechanical strength and good insulation properties, can effectively disperse stress and protect the inner electrodes when subjected to external stress; their insulation can also prevent short circuits between the inner electrodes, thereby improving the electrical performance and reliability of the product.

[0011] Preferably, the internal electrode is wrapped by a first high-strength ceramic dielectric and a second high-strength ceramic dielectric to form a sandwich structure.

[0012] The above structural design can buffer and disperse stress when faced with external forces such as nozzle impact, reflow soldering thermal stress, and PCB depaneling stress, greatly reducing the risk of cracks in the internal electrodes and ceramic dielectric, and significantly enhancing the overall strength and stress resistance of the MLCC body.

[0013] Preferably, the end electrode is provided with an electroplating tank, in which the electroplating resin silver paste layer, the electroplating nickel layer and the electroplating tin layer are all electroplated.

[0014] The above structural design helps to improve the conductivity and corrosion resistance of the end electrodes, enhance the connection performance between the end electrodes and external circuits, improve the mechanical strength of the end electrodes themselves, and reduce the possibility of damage to the end electrodes caused by external forces.

[0015] Preferably, the electroplating resin silver paste layer, electroplating nickel layer and electroplating tin layer are electroplated according to a specific current. After electroplating, each product is tested for capacity, loss, insulation resistance and withstand voltage.

[0016] The above structural design allows each electroplating layer to perform at its best. After electroplating, multiple performance tests are conducted, including capacity, loss, insulation resistance, and withstand voltage. This allows qualified MLCC bodies to be screened out, ensuring product quality consistency and stability, improving the reliability of MLCC bodies in circuits, and avoiding circuit failures caused by poor performance.

[0017] Preferably, the electroplating of the silver paste layer, nickel plating layer, and tin plating layer is performed after the electrode paste is dried.

[0018] The above structural design ensures that the terminal electrode paste forms a stable structure after drying, which is conducive to the adhesion of the electroplating layer. It ensures that the electroplated silver paste layer, electroplated nickel layer, and electroplated tin layer have good bonding force with the terminal electrode paste, thereby avoiding problems such as electroplating layer peeling off. This improves the integrity and reliability of the terminal electrode and enhances the ability of the MLCC body to resist various stresses.

[0019] Compared with the prior art, the beneficial effects of this utility model are: the MLCC with sandwich and soft terminal structure:

[0020] 1. High reliability: Through the dual design of sandwich structure and soft terminal structure, the product's stress resistance is effectively enhanced, greatly reducing the probability of cracks and open circuits in various complex environments, significantly improving the reliability of the MLCC body, and ensuring the stable operation of electronic equipment.

[0021] 2. High performance: The multilayer internal electrode stack design improves capacitance, meeting the design requirements of high-capacitance circuit boards. At the same time, the excellent electrical performance enables the MLCC body to work stably in high-performance circuits, improving the overall performance of electronic devices. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the main cross-section of the present invention;

[0023] Figure 2 This utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0024] Figure 3 This is a schematic diagram of the first high-strength ceramic substrate location structure of this utility model;

[0025] Figure 4 This is a schematic diagram of the overall main structure of this utility model.

[0026] In the figure: 1. MLCC body; 2. Ceramic dielectric; 3. Internal electrode; 4. First high-strength ceramic dielectric; 5. Second high-strength ceramic dielectric; 6. Terminal electrode; 7. Electroplated resin silver paste layer; 8. Electroplated nickel layer; 9. Electroplated tin layer. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1-4This utility model provides a technical solution: an MLCC with a sandwich and soft terminal structure, including an MLCC body 1, a ceramic dielectric 2, an internal electrode 3, a first high-strength ceramic dielectric 4, a second high-strength ceramic dielectric 5, a terminal electrode 6, an electroplated resin silver paste layer 7, an electroplated nickel layer 8, and an electroplated tin layer 9. The ceramic dielectric 2 is disposed inside the MLCC body 1, and the internal electrode 3 is disposed inside the ceramic dielectric 2. The internal electrode 3 is designed with multiple layers within the ceramic dielectric 2. This multi-layer design increases the electrode area of ​​the MLCC body 1, improving the capacitance of the MLCC body 1 within a limited volume, meeting the requirements of high-capacitance circuit board designs. Simultaneously, the layered structure allows the internal electrodes 3 to support each other, enhancing capacitance. The stability of the internal structure of the MLCC body 1 helps to disperse stress and reduce internal structural damage caused by stress. The upper and lower sides of the ceramic dielectric 2 are respectively provided with a first high-strength ceramic dielectric 4 and a second high-strength ceramic dielectric 5. The inner electrode 3 is wrapped by the first high-strength ceramic dielectric 4 and the second high-strength ceramic dielectric 5, forming a sandwich structure. The first high-strength ceramic dielectric 4 and the second high-strength ceramic dielectric 5 act as a "protective layer," buffering and dispersing stress when faced with external forces such as nozzle impact, reflow soldering thermal stress, and PCB depaneling stress, greatly reducing the risk of cracks in the inner electrode 3 and the ceramic dielectric 2, and significantly enhancing the overall strength and stress resistance of the product. End electrodes 6 are provided on both the left and right sides of the MLCC body 1, and the interior of the end electrodes 6 is provided with an electroplated resin silver paste layer 7. The terminal electrode 6 has a nickel plating layer 8 and a tin plating layer 9. An electroplating tank is located inside the terminal electrode 6. The electroplating of the resin silver paste layer 7, nickel plating layer 8, and tin plating layer 9 is performed in this tank. The electroplating tank ensures the stability and uniformity of the electroplating process, allowing the resin silver paste layer 7, nickel plating layer 8, and tin plating layer 9 to uniformly cover the terminal electrode 6. This helps improve the conductivity and corrosion resistance of the terminal electrode 6, enhances the connection performance between the terminal electrode 6 and external circuits, and improves the mechanical strength of the terminal electrode 6 itself, reducing the possibility of damage caused by external forces. The resin silver paste layer 7, nickel plating layer 8, and tin plating layer 9 are electroplated according to a specific current. After electroplating, each product undergoes tests for capacity, loss, insulation resistance, and withstand voltage. Specific current electroplating allows for precise... Controlling the thickness and quality of the electroplated layers ensures that the electroplated resin silver paste layer 7, electroplated nickel layer 8, and electroplated tin layer 9 perform optimally. Multiple performance tests screen out qualified products, guaranteeing product quality consistency and stability, improving product reliability in circuits, and preventing circuit failures caused by poor performance. The electroplating of the electroplated resin silver paste layer 7, electroplated nickel layer 8, and electroplated tin layer 9 is carried out after the paste for the coated end electrode 6 has dried. This ensures that the end electrode 6 paste forms a stable base structure after drying, which is conducive to the adhesion of the electroplated resin silver paste layer 7, electroplated nickel layer 8, and electroplated tin layer 9. It ensures that they have good bonding force with the end electrode 6 paste, avoiding problems such as electroplating layer peeling, thereby improving the overall performance and reliability of the end electrode 6 and enhancing the product's ability to resist various stresses.

[0029] The creation process of MLCC body 1:

[0030] S1. First, the ceramic medium 2 is prepared by ball milling, stirring and impurity removal of ceramic raw materials to form a uniform ceramic slurry, and then forming a ceramic film by casting or printing.

[0031] S2. Print the paste of the inner electrode 3 on the ceramic film, and stack multiple layers according to the design requirements to form a composite structure of the inner electrode 3 and the ceramic medium 2.

[0032] S3. Print the first high-strength ceramic substrate 4 and the second high-strength ceramic substrate 5 paste on the upper and lower sides of the composite structure. After drying, sintering and other processes, the first high-strength ceramic substrate 4 and the second high-strength ceramic substrate 5 are firmly bonded to the ceramic dielectric 2 and the internal electrode 3 to form a sandwich structure MLCC chip.

[0033] S4. Cut and chamfer the MLCC chip to achieve the specified size and shape.

[0034] S5. Apply end electrode paste to the end electrode 6 position, dry it, and place it in the electroplating tank. Electroplat the resin silver paste layer 7, the nickel layer 8, and the tin layer 9 in sequence according to specific current parameters.

[0035] S6. After electroplating, a comprehensive performance test is performed on each MLCC body 1, including the testing of indicators such as capacity, loss, insulation resistance, and withstand voltage. Qualified products are selected for packaging and shipment.

[0036] Working principle: When using an MLCC with a sandwich and soft terminal structure, firstly, when current flows through the MLCC body 1, the internal electrode 3 acts as a conductive part, storing and releasing charge under the action of the ceramic dielectric 2. Because the internal electrode 3 adopts a multi-layer stacked design, the effective plate area of ​​the capacitor is greatly increased, enabling it to store more charge, thus meeting the requirements of high-capacitance circuits.

[0037] When facing external stress, the sandwich structure plays a key role. The first high-strength ceramic dielectric 4 and the second high-strength ceramic dielectric 5, with their high mechanical strength, act like a sturdy shield to effectively disperse the external stress, reduce the direct impact on the inner electrode 3 and the ceramic dielectric 2, and reduce the risk of crack formation.

[0038] The flexible terminal structure, with its electroplated nickel layer 8 and electroplated tin layer 9, possesses excellent conductivity and corrosion resistance, ensuring a stable connection between the terminal electrode 6 and the external circuit, reducing resistance loss. The electroplated resin silver paste layer 7 enhances the bonding force between the terminal electrode 6 and the ceramic body, and to a certain extent buffers the stress caused by differences in the thermal expansion coefficients of the materials. During reflow soldering, rapid thermal changes cause different materials to expand and contract to varying degrees. The electroplated resin silver paste layer 7 can alleviate this stress, preventing cracks between the terminal electrode 6 and the ceramic body, ensuring the stable electrical performance of the MLCC body 1, thus completing a series of functions. Content not described in detail in this specification constitutes prior art known to those skilled in the art.

[0039] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An MLCC with a sandwich and soft terminal structure, comprising an MLCC body (1), characterized in that: The MLCC body (1) has a ceramic dielectric (2) inside, and an internal electrode (3) is provided inside the ceramic dielectric (2). A first high-strength ceramic dielectric (4) and a second high-strength ceramic dielectric (5) are provided on the upper and lower sides of the ceramic dielectric (2). End electrodes (6) are provided on both the left and right sides of the MLCC body (1), and an electroplated resin silver paste layer (7), an electroplated nickel layer (8), and an electroplated tin layer (9) are provided inside the end electrodes (6).

2. The MLCC with a sandwich and soft terminal structure according to claim 1, characterized in that: The inner electrode (3) is designed to be stacked inside the ceramic medium (2), and the inner electrode (3) has multiple layers.

3. The MLCC with a sandwich and soft terminal structure according to claim 1, characterized in that: The inner electrode (3) layer is located between the first high-strength ceramic substrate (4) and the second high-strength ceramic substrate (5), and the first high-strength ceramic substrate (4) and the second high-strength ceramic substrate (5) are respectively printed on the upper and lower sides of the ceramic substrate (2).

4. The MLCC with a sandwich and soft terminal structure according to claim 3, characterized in that: The inner electrode (3) is wrapped by a first high-strength ceramic dielectric (4) and a second high-strength ceramic dielectric (5) to form a sandwich structure.

5. The MLCC with a sandwich and flexible terminal structure according to claim 1, characterized in that: An electroplating tank is provided inside the terminal electrode (6).

Images