A wideband quartz crystal oscillator signal enhancement and stabilization device

CN224356344UActive Publication Date: 2026-06-12SHENZHEN HONGJINGBAO TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN HONGJINGBAO TECHNOLOGY CO LTD
Filing Date
2025-07-21
Publication Date
2026-06-12

AI Technical Summary

Technical Problem

Existing broadband quartz crystal oscillator signal enhancement and stabilization equipment is prone to overheating in harsh environments, leading to reduced stability.

Method used

A device including a heat dissipation device and a replacement device was designed. The cooling chip can be installed and replaced through the cooperation of the support frame and the card block. The isolation plate is used for continuous cooling to prevent the device from overheating.

🎯Benefits of technology

It effectively reduces equipment temperature, improves equipment stability, simplifies the replacement process of cooling chips, and ensures stable operation of the equipment within the rated range.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to wideband quartz crystal vibration technical field, concretely to a kind of wideband quartz crystal vibration signal enhancement and stabilizing equipment, including strengthening device, the lower surface of strengthening device is equipped with circuit board, the surface of strengthening device is provided with heat dissipation device, heat dissipation device includes main cover, and both sides of strengthening device are fixedly connected with main cover, the surface of main cover is equipped with first placement slot, and support frame is connected by being inserted in the inside of first placement slot, cooling chip is arranged between the two support frames, cooling chip is located above strengthening device, the lower surface of cooling chip is fixedly connected with isolation plate, isolation plate is placed on strengthening device, the surface of main cover is provided with limit component. The utility model, by setting heat dissipation device, can effectively cool strengthening device, avoid the process that enhancement and stabilizing equipment are used in the process of exceeding rated range, and then the stability of enhancement and stabilizing equipment is improved.
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Description

Technical Field

[0001] This utility model relates to the field of broadband quartz crystal oscillator technology, and in particular to a broadband quartz crystal oscillator signal enhancement and stabilization device. Background Technology

[0002] Wideband quartz crystal oscillator signal enhancement and stabilization equipment is a functional device designed to address issues such as signal strength attenuation and insufficient frequency stability when quartz crystal oscillators operate over a wide frequency range. It is primarily used in high-end fields requiring wideband and high-stability signals, such as 5G communication base stations, satellite communications, radar navigation, test and measurement instruments, industrial IoT, and military applications.

[0003] When workers need to enhance the signal of a broadband quartz crystal oscillator, they install the enhancement and stabilization equipment on a circuit board and electrically connect it to the broadband quartz crystal oscillator. However, the existing enhancement and stabilization equipment may overheat during use due to harsh working environments, causing it to exceed its rated range and thus reducing its stability. Utility Model Content

[0004] The purpose of this invention is to solve the problem that the stability of enhancement and stabilization devices in the prior art may decrease, and to propose a broadband quartz crystal oscillator signal enhancement and stabilization device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a broadband quartz crystal oscillator signal enhancement and stabilization device, comprising an enhancement device, a circuit board mounted on the lower surface of the enhancement device, a heat dissipation device provided on the surface of the enhancement device, the heat dissipation device comprising a main sleeve, the main sleeve being fixedly connected to both sides of the enhancement device, a first placement groove being formed on the surface of the main sleeve, a support frame being inserted and connected inside the first placement groove, a cooling chip being disposed between the two support frames, the cooling chip being located above the enhancement device, an isolation plate being fixedly connected to the lower surface of the cooling chip, the isolation plate being placed on the enhancement device, a limiting component being provided on the surface of the main sleeve, the limiting component comprising a locking block, the locking block being fixedly connected to the surface of the main sleeve, the locking block being located above the circuit board, the locking block being able to cooperate with the main sleeve to achieve the purpose of supporting the locking block.

[0006] Preferably, the surface of the support frame is provided with a storage groove, and the card block is inserted into the inside of the storage groove. The storage groove can cooperate with the support frame to achieve the purpose of storing the card block.

[0007] Preferably, the surface of the support frame is provided with a replacement device, the replacement device including a second placement groove, the second placement groove being formed on the surface of the support frame, the second placement groove being able to cooperate with the support frame to achieve the purpose of storing the stabilizing block.

[0008] Preferably, a stabilizing block is fixedly connected to the surface of the cooling chip. The stabilizing block is placed inside the second placement slot and can cooperate with the cooling chip to achieve the purpose of supporting the stabilizing block.

[0009] Preferably, a receiving hole is provided on one side of the stabilizing block. The receiving hole is located above the reinforcing device and can cooperate with the stabilizing block to achieve the purpose of receiving the threaded block.

[0010] Preferably, the surface of the support frame is provided with a threaded hole, which is aligned with the receiving hole. A threaded block is threadedly connected inside the threaded hole, and the threaded block is inserted into the receiving hole. The threaded hole can cooperate with the threaded block to guide the threaded block.

[0011] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0012] 1. In this utility model, by setting a heat dissipation device, when the worker needs to cool down the strengthening device, the worker inserts the support frame into the first placement slot of the main sleeve. The support frame drives the cooling chip and the isolation plate. One end of the support frame will squeeze the locking block, causing the locking block to bend and stick tightly to the surface of the support frame. When the support frame slides to the designated position, the isolation plate is placed on the strengthening device. The locking block elastically resets and is inserted into the storage slot. The worker controls the cooling chip to cool down. The temperature of the strengthening device surface is transferred to the isolation plate. The cooling chip cools the isolation plate, and the isolation plate continuously absorbs heat from the strengthening device. By setting a heat dissipation device, the strengthening device can be effectively cooled down, preventing the strengthening and stabilizing equipment from exceeding the rated range during use, thereby improving the stability of the strengthening and stabilizing equipment.

[0013] 2. In this utility model, by setting a replacement device, when the worker needs to replace the cooling chip, the worker uses an auxiliary tool to rotate the threaded block. The threaded block is guided by the threaded hole, and the threaded block retracts and disengages from the receiving hole. The worker then removes the cooling chip from the support frame. By setting a replacement device, it is possible to effectively facilitate the worker in replacing the cooling chip, avoiding inconvenience when the worker replaces the cooling chip, and thus helping the worker maintain the cooling chip. Attached Figure Description

[0014] Figure 1 This utility model provides a three-dimensional structural schematic diagram of a broadband quartz crystal oscillator signal enhancement and stabilization device;

[0015] Figure 2 This utility model provides a schematic diagram of a heat dissipation device for a broadband quartz crystal oscillator signal enhancement and stabilization device.

[0016] Figure 3 This invention proposes a broadband quartz crystal oscillator signal enhancement and stabilization device. Figure 2 Enlarged structural diagram at point A in the middle;

[0017] Figure 4 This utility model provides a schematic diagram of the replacement device structure for a broadband quartz crystal oscillator signal enhancement and stabilization equipment;

[0018] Figure 5 This invention proposes a broadband quartz crystal oscillator signal enhancement and stabilization device. Figure 4 Enlarged structural diagram at point B.

[0019] Legend:

[0020] 1. Reinforcing device; 2. Circuit board; 3. Heat dissipation device; 31. Cooling chip; 32. Isolation plate; 33. Card block; 34. Storage slot; 35. Support frame; 36. First placement slot; 37. Main sleeve; 4. Replacement device; 41. Storage hole; 42. Stabilizing block; 43. Threaded block; 44. Second placement slot; 45. Threaded hole. Detailed Implementation

[0021] Please see Figures 1-5 This utility model provides a technical solution: a broadband quartz crystal oscillator signal enhancement and stabilization device, including an enhancement device 1, a circuit board 2 mounted on the lower surface of the enhancement device 1, and a heat dissipation device 3 provided on the surface of the enhancement device 1.

[0022] The specific setup and function of its heat dissipation device 3 and replacement device 4 will be explained below.

[0023] In this embodiment: the heat dissipation device 3 includes a main sleeve 37, which is fixedly connected to both sides of the reinforcing device 1. A first placement groove 36 is opened on the surface of the main sleeve 37. A support frame 35 is inserted and connected inside the first placement groove 36. A cooling chip 31 is arranged between the two support frames 35. The cooling chip 31 is located above the reinforcing device 1. An isolation plate 32 is fixedly connected to the lower surface of the cooling chip 31. The isolation plate 32 is placed on the reinforcing device 1. A limit component is provided on the surface of the main sleeve 37.

[0024] Specifically, the limiting component includes a locking block 33, which is fixedly connected to the surface of the main sleeve 37. The locking block 33 is located above the circuit board 2 and can cooperate with the main sleeve 37 to support the locking block 33.

[0025] Specifically, the surface of the support frame 35 is provided with a storage groove 34, and the locking block 33 is inserted into the storage groove 34.

[0026] In this embodiment, the storage slot 34 can cooperate with the support frame 35 to achieve the purpose of storing the card block 33.

[0027] In this embodiment, a replacement device 4 is provided on the surface of the support frame 35. The replacement device 4 includes a second placement groove 44, which is formed on the surface of the support frame 35. The second placement groove 44 can cooperate with the support frame 35 to achieve the purpose of storing the stabilizing block 42.

[0028] Specifically, a stabilizing block 42 is fixedly connected to the surface of the cooling chip 31, and the stabilizing block 42 is placed inside the second placement slot 44.

[0029] In this embodiment, the stabilizing block 42 can cooperate with the cooling chip 31 to support the stabilizing block 42.

[0030] Specifically, a storage hole 41 is provided on one side of the stabilizing block 42. The storage hole 41 is located above the reinforcing device 1. The storage hole 41 can cooperate with the stabilizing block 42 to achieve the purpose of storing the threaded block 43.

[0031] Specifically, the support frame 35 has a threaded hole 45 on its surface, which is aligned with the receiving hole 41. The threaded hole 45 is threaded with a threaded block 43 inside, and the threaded block 43 is inserted into the receiving hole 41.

[0032] In this embodiment, the threaded hole 45 can cooperate with the threaded block 43 to guide the threaded block 43.

[0033] Working Principle: By setting up the heat dissipation device 3, when the operator needs to cool down the strengthening device 1, the operator inserts the support frame 35 into the first placement slot 36 of the main sleeve 37. The support frame 35 drives the cooling chip 31 and the isolation plate 32. One end of the support frame 35 will press the locking block 33, causing the locking block 33 to bend and press against the surface of the support frame 35. When the support frame 35 slides to the designated position, the isolation plate 32 is placed on the strengthening device 1. The locking block 33 elastically resets and inserts into the storage slot 34. The operator controls the cooling chip 31 to perform cooling. The temperature of the surface of the strengthening device 1 is transferred to the isolation plate 32. The cooling chip 31 cools the isolation plate 32, and the isolation plate 32 continuously absorbs heat from the strengthening device 1. By setting up the heat dissipation device 3, the temperature of the strengthening device 1 can be effectively reduced, preventing the strengthening and stabilizing equipment from exceeding the rated range during use, thereby improving the stability of the strengthening and stabilizing equipment. In addition, by setting up the replacement device 4, when the worker needs to replace the cooling chip 31, the worker uses an auxiliary tool to rotate the threaded block 43. The threaded block 43 is guided by the threaded hole 45, and the threaded block 43 retracts and disengages from the receiving hole 41. The worker can then remove the cooling chip 31 from the support frame 35. By setting up the replacement device 4, the worker can effectively and conveniently replace the cooling chip 31, avoiding inconvenience when replacing the cooling chip 31, and thus facilitating the worker's maintenance of the cooling chip 31.

Claims

1. A broadband quartz crystal oscillator signal enhancement and stabilization device, comprising an enhancement device (1), characterized in that: A circuit board (2) is mounted on the lower surface of the strengthening device (1); The surface of the strengthening device (1) is provided with a heat dissipation device (3), the heat dissipation device (3) includes a main sleeve (37), and the main sleeve (37) is fixedly connected to both sides of the strengthening device (1). The surface of the main sleeve (37) is provided with a first placement groove (36), and a support frame (35) is inserted and connected inside the first placement groove (36). A cooling chip (31) is arranged between the two support frames (35). The cooling chip (31) is located above the strengthening device (1). An isolation plate (32) is fixedly connected to the lower surface of the cooling chip (31). The isolation plate (32) is placed on the strengthening device (1). A limit component is provided on the surface of the main sleeve (37).

2. The broadband quartz crystal oscillator signal enhancement and stabilization device according to claim 1, characterized in that: The limiting component includes a locking block (33), which is fixedly connected to the surface of the main sleeve (37) and is located above the circuit board (2).

3. The broadband quartz crystal oscillator signal enhancement and stabilization device according to claim 2, characterized in that: The surface of the support frame (35) is provided with a storage groove (34), and the card block (33) is inserted into the inside of the storage groove (34).

4. The broadband quartz crystal oscillator signal enhancement and stabilization device according to claim 3, characterized in that: The support frame (35) is provided with a replacement device (4), which includes a second placement groove (44) and is formed on the surface of the support frame (35).

5. The broadband quartz crystal oscillator signal enhancement and stabilization device according to claim 1, characterized in that: A stabilizing block (42) is fixedly connected to the surface of the cooling chip (31), and the stabilizing block (42) is placed inside the second placement slot (44).

6. The broadband quartz crystal oscillator signal enhancement and stabilization device according to claim 5, characterized in that: The stabilizing block (42) has a storage hole (41) on one side, and the storage hole (41) is located above the reinforcing device (1).

7. The broadband quartz crystal oscillator signal enhancement and stabilization device according to claim 6, characterized in that: The support frame (35) has a threaded hole (45) on its surface. The threaded hole (45) is aligned with the receiving hole (41). A threaded block (43) is threadedly connected inside the threaded hole (45). The threaded block (43) is inserted into the receiving hole (41).