High thermal conductive gel with large contact surface and low hardness

Abstract

The utility model discloses a kind of high-thermal-conductivity gels of large low hardness contact surface, including colloid and pressure structure;The utility model when colloid is located between heating body and radiator, and is compressed and has elasticity when being pressed, and the compression ring of being pressed will make contact bottom together be pressed in the surface of compression sheet, and the compression of guide glue piece will push colloid, so that colloid is deformed, so that two compression rings will be convex, then be pressed in the surface of heating body or radiator, with the contact surface increase when being pressed, improve heat conduction capacity, heating body heats, will be transferred to compression ring by colloid, then compression ring is transferred to the other side of colloid by compression sheet, simultaneously, heat also improves heat conduction capacity by heat-conducting filler, and heat-conducting wire will disperse the heat on compression sheet, then transfer, with heat transfer, improve heat transfer effect, with high heat conduction capacity.

Description

Technical Field

[0001] This utility model relates to the field of high thermal conductivity gel technology, specifically a high thermal conductivity gel with a large contact surface and low hardness. Background Technology

[0002] Thermal conductive gel is an interface material with high thermal conductivity and low thermal resistance. It is commonly used as a heat transfer medium between heat-generating components (such as CPUs, GPUs, and power chips) and heat sinks in electronic devices. Its performance is between that of thermal grease and thermal pads. It has both fluidity and compressibility, and can fill irregular surface gaps, effectively reducing contact thermal resistance.

[0003] Existing high thermal conductivity gels have the following problems:

[0004] Most existing high thermal conductivity gels are formed from a single thermally conductive silicon material, with a simple structure, and they come into contact with the heat source and heat sink through pressure. Utility Model Content

[0005] The purpose of this invention is to provide a high thermal conductivity gel with a large contact surface and low hardness to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a high thermal conductivity gel with a large contact surface and low hardness, comprising a colloid, wherein a pressure-bearing structure is provided on the colloid, the pressure-bearing structure includes an anti-compression sheet, the anti-compression sheet is provided in the colloid, a pressure ring is provided in the colloid, a contact bottom is provided in the pressure ring, and a thermally conductive filler is provided in the contact bottom.

[0007] Preferably, the colloid is provided with pressure rings at both the upper and lower ends, and the anti-compression sheet is located between the two pressure rings.

[0008] Preferably, the pressure ring is provided with a guide sheet, which is arc-shaped.

[0009] Preferably, the colloid has a protrusion formed on the surface of the pressure ring.

[0010] Preferably, the end of the compression-resistant sheet is provided with an elbow.

[0011] Preferably, a heat-conducting wire is provided between the two pressure rings, the heat-conducting wire passes through the pressure-resistant sheet.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] When the colloid is located between the heating element and the heat sink and is under pressure, the colloid is compressed and becomes elastic. The pressure ring causes the contact bottom to be pressed against the surface of the pressure-resistant sheet. The downward pressure of the guide sheet pushes the colloid, causing it to deform and bulge between the two pressure rings, which then press against the surface of the heating element or heat sink. This increases the contact area under pressure, improving thermal conductivity. When the heating element heats up, the heat is transferred from the colloid to the pressure ring, and then from the pressure ring to the other side of the colloid through the pressure-resistant sheet. At the same time, the heat is also improved by the thermally conductive filler, and the thermally conductive wire disperses the heat on the pressure-resistant sheet before transferring it. This dispersed heat transfer improves the heat transfer effect and provides high thermal conductivity. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a frontal cross-sectional view of the present invention.

[0016] Figure 3 This is a schematic diagram of the pressure-bearing structure of this utility model.

[0017] In the diagram: Colloid-1, Pressure-bearing structure-2, Pressure-resistant sheet-21, Pressure ring-22, Contact bottom-23, Thermally conductive filler-24, Colloid sheet-25, Protrusion-26, Elbow-27, Thermal wire-28. Detailed Implementation

[0018] To further explain the technical solution of this utility model, a detailed description is provided below through specific embodiments.

[0019] Please see Figure 1 and Figure 2 This utility model provides a high thermal conductivity gel with a large contact surface and low hardness, including a colloid 1, which is made of silicon oxide, and a pressure-bearing structure 2 is provided on the colloid 1.

[0020] Please see Figure 2 and Figure 3 This utility model provides a high thermal conductivity gel with a large contact surface and low hardness. The pressure structure 2 includes an anti-compression sheet 21. The anti-compression sheet 21 is fixed inside the colloid 1 and is located in the middle of the colloid 1. Pressure rings 22 are fixed at both the upper and lower ends inside the colloid 1. The anti-compression sheet 21 is located between the two pressure rings 22. A contact bottom 23 is integrally formed on the pressure ring 22. The contact bottom 23 is elastic and is provided with a thermally conductive filler 24. The thermally conductive filler 24 is boron nitride, which has a high thermal conductivity.

[0021] The pressure ring 22 is provided with a guide sheet 25, which is arc-shaped.

[0022] In this embodiment, the colloid 1 has a protrusion 26 formed on the surface of the pressure ring 22.

[0023] The end of the compression plate 21 is provided with an elbow 27.

[0024] A heat-conducting wire 28 is provided between the two pressure rings 22, and the heat-conducting wire 28 passes through the pressure-resistant sheet 21.

[0025] Specifically, when the colloid 1 is located between the heating element and the heat sink and is under pressure, the colloid 1 is compressed and becomes elastic, while simultaneously pushing the pressure ring 22. At this time, the contact bottom 23 is also pressed against the surface of the pressure-resistant sheet 21. Meanwhile, when the pressure ring 22 is under pressure, it is affected by the pressure-resistant sheet 21 and the elbow 27, thus preventing it from being stretched under pressure. When the pressure ring 22 is under pressure, the guide sheet 25 pushes down and pushes the colloid 1, causing the colloid 1 to deform, resulting in a bulge between the two pressure rings 22, which then presses against the surface of the heating element or heat sink. This increases the contact area under pressure, improving thermal conductivity. When the heating element heats up, the heat is transferred from the colloid 1 to the pressure ring 22, and then from the pressure ring 22 to the other side of the colloid 1 through the pressure-resistant sheet 21. At the same time, the heat is also improved by the thermally conductive filler 24, and the thermally conductive wire 28 disperses the heat on the pressure-resistant sheet 21 and then transfers it. This disperses the heat for transfer, improving the heat transfer effect and providing high thermal conductivity.

[0026] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high thermal conductivity gel with a large contact surface and low hardness, comprising a colloid (1), characterized in that: It also includes a pressure-bearing structure (2), on which the colloid (1) is provided a pressure-bearing structure (2), the pressure-bearing structure (2) includes an anti-compression sheet (21), the colloid (1) is provided with an anti-compression sheet (21), the colloid (1) is provided with a pressure ring (22), the pressure ring (22) is provided with a contact bottom (23), and the contact bottom (23) is provided with a thermally conductive filler (24).

2. The high thermal conductivity gel with a large contact surface and low hardness according to claim 1, characterized in that: The colloid (1) is provided with pressure rings (22) at both the upper and lower ends, and the anti-compression sheet (21) is located between the two pressure rings (22).

3. The high thermal conductivity gel with a large contact surface and low hardness according to claim 2, characterized in that: The pressure ring (22) is provided with a guide sheet (25), which is arc-shaped.

4. The high thermal conductivity gel with a large contact surface and low hardness according to claim 1, characterized in that: The colloid (1) has a protrusion (26) formed on the surface of the pressure ring (22).

5. The high thermal conductivity gel with a large contact surface and low hardness according to claim 1, characterized in that: The end of the pressure-resistant sheet (21) is provided with an elbow (27).

6. The high thermal conductivity gel with a large contact surface and low hardness according to claim 2, characterized in that: A heat-conducting wire (28) is provided between the two pressure rings (22), the heat-conducting wire (28) is between the two pressure rings (22), and the heat-conducting wire (28) passes through the pressure-resistant sheet (21).

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