A computer with externally mounted water immersion cooling

Abstract

The utility model discloses a computer of external hanging water immersion type heat dissipation, including host computer shell, be located in the built -in heat dissipation module of host computer shell inside and be located at the external water cooling module of host computer shell outside, the side or rear of host computer shell is provided with the heat dissipation interface, the external water cooling module is directly connected with built -in heat dissipation module through heat dissipation interface. The computer of external hanging water immersion type heat dissipation of the utility model, the external water cooling module is directly connected with built -in heat dissipation module through heat dissipation interface, and the heat of built -in heat dissipation module of computer is conducted away rapidly through the external water cooling module, and the external water cooling module adopts water immersion type heat dissipation, and need not use fan, water pump and other devices, has low cost, does not increase power consumption, does not produce new noise, long service life, maintenance is simple, and the advantages such as extremely high cost performance.

Description

Technical Field

[0001] This utility model relates to the field of electronic product technology, and in particular to a computer with external water-immersion cooling. Background Technology

[0002] As the power consumption of computer CPUs and GPUs continues to increase, the requirements for heat dissipation are also getting higher and higher. External cooling is a good auxiliary cooling method. By connecting an external cooling module, adverse effects such as sudden frequency reduction and system crashes can be avoided.

[0003] Currently available external water-cooled computers typically use external water-cooling devices that are attached to the heat source inside the computer case via adhesive or pressing. This requires opening the computer case for installation, making installation and maintenance difficult. Water-cooling devices also require fans, water pumps, and other equipment, which are expensive and have a very low cost-performance ratio. Furthermore, using fans and water pumps increases power consumption and generates new noise. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to provide a computer that can be externally connected to a water-cooled computer, so as to solve the problems of difficult installation and maintenance of the external water-cooling device of the existing external water-cooled computer, as well as the problems of increased power consumption and new noise generated by the external water-cooling device of the existing external water-cooled computer.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A computer with external water-cooling capability includes a host casing, a built-in heat dissipation module inside the host casing, and an external water-cooling module outside the host casing. The host casing has a heat dissipation interface on its side or rear, and the external water-cooling module is directly connected to the built-in heat dissipation module through the heat dissipation interface.

[0007] Preferably, the built-in heat dissipation module is provided with a heat-conducting block extending to the heat dissipation interface, and the heat-conducting block is provided with a connection structure for the external water cooling module to be connected.

[0008] Preferably, the built-in heat dissipation module includes a heat-conducting plate and an internal heat pipe. The top surface of the heat-conducting plate is in close contact with the heat source, and the bottom surface of the heat-conducting plate is in close contact with one end of the internal heat pipe. The other end of the internal heat pipe is connected to a heat-conducting block, and the heat-conducting block is provided with an insertion hole. The external water-cooling module includes a water storage tank and an external heat pipe. One end of the external heat pipe is inserted into the insertion hole on the heat-conducting block through a heat dissipation interface, and the other end of the external heat pipe is immersed in the cold water in the water storage tank.

[0009] Preferably, the insertion end of the external heat pipe is coated with thermally conductive silicone grease.

[0010] Preferably, the water storage tank is an open water storage tank, and the opening of the water storage tank is not covered.

[0011] Preferably, the external water-cooling module adopts a split structure, and the water storage tank and the external heat pipe are two independent structures.

[0012] Preferably, the external water-cooling module adopts an integrated structure, and the water storage tank and the external heat pipe form an inseparable whole structure.

[0013] Preferably, a sealing ring is provided between the heat-conducting block and the heat dissipation interface.

[0014] Preferably, the external heat pipe includes a first heat pipe segment, a second heat pipe segment, and a third heat pipe segment connected in sequence. The second heat pipe segment is bent relative to the first heat pipe segment, and the third heat pipe segment is bent relative to the second heat pipe segment. The end of the first heat pipe segment away from the second heat pipe segment is inserted into a socket on the heat-conducting block.

[0015] Preferably, the heat source includes a CPU and a GPU mounted on the PCB.

[0016] The aforementioned computer with external water-cooling capability connects directly to the internal cooling module via a heat dissipation interface, making installation and maintenance simple. The external water-cooling module uses water-cooling technology, eliminating the need for fans, water pumps, or other devices, thus requiring no additional power and generating no new noise. It is simple, practical, and extremely cost-effective. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a computer with external water-immersion cooling in one embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the structure of an external heat pipe in one embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of a split external water-cooling module in one embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the integrated external water-cooling module in one embodiment of the present invention.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1-PCB, 2-Heat source, 3-Heat conduction plate, 4-Internal heat pipe, 5-Main unit casing, 6-Heat conduction block, 7-Thermal conductive silicone, 8-Heat dissipation interface, 9-External heat pipe, 91-First heat pipe section, 92-Second heat pipe section, 93-Third heat pipe section, 10-Water storage tank, 11-Cold water. Detailed Implementation

[0023] To enable those skilled in the art to more clearly understand the purpose, technical solution and advantages of this utility model, the present utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0024] This invention provides a computer with external water-immersion cooling.

[0025] like Figure 1 As shown, in one embodiment of this utility model, the computer with external water immersion cooling includes a host casing 5, a built-in heat dissipation module disposed inside the host casing 5, and an external water cooling module disposed outside the host casing 5. The host casing 5 is provided with a heat dissipation interface 8 on the side or back. The external water cooling module is directly connected to the built-in heat dissipation module through the heat dissipation interface 8. The external water cooling module adopts water immersion cooling.

[0026] This utility model relates to an externally mounted, water-immersion cooling computer. The external water-cooling module is directly connected to the internal cooling module through a heat dissipation interface, making installation and maintenance simple. The external water-cooling module uses water immersion cooling, eliminating the need for fans, water pumps, or other devices. It consumes no additional power and produces no new noise, making it simple, practical, and extremely cost-effective.

[0027] In a preferred embodiment of this invention, the built-in heat dissipation module is provided with a heat-conducting block 6 extending to the heat dissipation interface 8, and the heat-conducting block 6 is provided with a connection structure for the external water-cooling module to connect to. The heat-conducting block 6 allows for rapid connection and heat exchange between the built-in heat dissipation module and the external water-cooling module.

[0028] In a preferred embodiment of this utility model, the built-in heat dissipation module includes a heat-conducting plate 3 and an internal heat pipe 4. The top surface of the heat-conducting plate 3 is in close contact with the heat source 2, which includes components such as a CPU and GPU mounted on a PCB 1. The bottom surface of the heat-conducting plate 3 is in close contact with one end of the internal heat pipe 4, and the other end of the internal heat pipe 4 is connected to a heat-conducting block 6, which has an insertion hole. The external water-cooling module includes a water storage tank 10 and an external heat pipe 9. One end of the external heat pipe 9 is inserted into the insertion hole on the heat-conducting block 6 through a heat dissipation interface 8 and is directly connected to the heat-conducting block 6 on the built-in heat dissipation module. The other end of the external heat pipe 9 is immersed in cold water 11 in the water storage tank 10.

[0029] In a preferred embodiment of the present invention, in order to ensure sufficient contact between the external heat pipe 9 and the heat-conducting block 6, the insertion end of the external heat pipe 9 (the end inserted into the heat-conducting block 6) is coated with thermal grease 7.

[0030] like Figure 2As shown, in a preferred embodiment of this utility model, the external heat pipe 9 includes a first heat pipe section 91, a second heat pipe section 92, and a third heat pipe section 93 connected in sequence. The second heat pipe section 92 is bent relative to the first heat pipe section 91, and the third heat pipe section 93 is bent relative to the second heat pipe section 92. The end of the first heat pipe section 91 away from the second heat pipe section 92 is inserted into the insertion hole on the heat-conducting block 6. By designing the external heat pipe 9 to be bent, it is possible to better extend the external heat pipe 9 into the water storage tank 10 and immerse it in the cold water 11 within the water storage tank 10.

[0031] In a preferred embodiment of this utility model, a sealing ring is provided between the heat-conducting block 6 and the heat dissipation interface 8, which can play a role in waterproofing and dustproofing.

[0032] In a preferred embodiment of this utility model, the water storage tank 10 is an open water storage tank, and the opening of the water storage tank 10 is not covered, which facilitates adding cold water, adding ice and changing water.

[0033] like Figure 3 As shown, in a preferred embodiment of this utility model, the external water-cooling module adopts a split structure, and the water storage tank 10 and the external heat pipe 9 are two independent structures.

[0034] like Figure 4 As shown, in a preferred embodiment of this utility model, the external water-cooling module adopts an integrated structure, and the water storage tank 10 and the external heat pipe 9 constitute an inseparable integral structure.

[0035] In summary, the computer with external water-cooling capability of this invention has an external water-cooling module that is directly connected to the internal cooling module through a heat dissipation interface. The external water-cooling module quickly conducts heat away from the internal cooling module. The external water-cooling module uses water-immersion cooling, eliminating the need for fans, water pumps, or other devices. It has advantages such as low cost, no increase in power consumption, no new noise, long service life, simple maintenance, and extremely high cost-effectiveness.

[0036] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Those skilled in the art can make various equivalent changes and improvements based on the above embodiments. All equivalent changes or modifications made within the scope of the claims should fall within the protection scope of the present utility model.

Claims

1. A computer with external water-immersion cooling, characterized in that: It includes a host casing, a built-in heat dissipation module inside the host casing, and an external water cooling module outside the host casing. The host casing has a heat dissipation interface on its side or back, and the external water cooling module is directly connected to the built-in heat dissipation module through the heat dissipation interface. The built-in heat dissipation module is provided with a heat-conducting block that extends to the heat dissipation interface, and the heat-conducting block is provided with a connection structure that allows the external water cooling module to be connected. The built-in heat dissipation module includes a heat-conducting plate and an internal heat pipe. The top surface of the heat-conducting plate is in close contact with the heat source, and the bottom surface of the heat-conducting plate is in close contact with one end of the internal heat pipe. The other end of the internal heat pipe is connected to a heat-conducting block, which has an insertion hole. The external water-cooling module includes a water storage tank and an external heat pipe. One end of the external heat pipe is inserted into the insertion hole on the heat-conducting block through a heat dissipation interface, and the other end of the external heat pipe is immersed in the cold water in the water storage tank.

2. The computer with external water-immersion cooling as described in claim 1, characterized in that: The insertion end of the external heat pipe is coated with thermal grease.

3. The computer with external water-immersion cooling as described in claim 1, characterized in that: The water storage tank is an open water storage tank, and the opening of the water storage tank is not covered.

4. The computer with external water-immersion cooling as described in claim 1, characterized in that: The external water-cooling module adopts a split structure, with the water storage tank and the external heat pipe being two independent structures.

5. The computer with external water-immersion cooling as described in claim 1, characterized in that: The external water-cooling module adopts an integrated structure, and the water storage tank and the external heat pipe form an inseparable whole structure.

6. The computer with external water-immersion cooling as described in claim 1, characterized in that: A sealing ring is provided between the heat-conducting block and the heat dissipation interface.

7. The computer with external water-immersion cooling as described in claim 1, characterized in that: The external heat pipe includes a first heat pipe section, a second heat pipe section, and a third heat pipe section connected in sequence. The second heat pipe section is bent relative to the first heat pipe section, and the third heat pipe section is bent relative to the second heat pipe section. The end of the first heat pipe section away from the second heat pipe section is inserted into a hole on the heat-conducting block.

8. The computer with external water-immersion cooling as described in any one of claims 1-7, characterized in that: The heat source includes the CPU and GPU mounted on the PCB.

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