PCB integrated high-power coupler

Abstract

The utility model discloses a kind of PCB board integrated high-power coupler, including coupler, it is connected with PCB board, the coupler one end is connected with radio frequency head, the coupler is provided with heat-conducting conductive layer at the junction with PCB board.The utility model power capacity breakthrough: copper base microstrip+PCB+copper aluminum heat dissipation can realize 1500W continuous power transmission (traditional scheme <200W);Impedance stability: characteristic impedance excursion <1% under full power working condition, reflected power (S11) <‑25dB, protect radio frequency power amplifier;Solve thermal stress problem: by adding conductive heat-conducting material between coupler and PCB board, effectively solve the thermal stress problem, ensure the characteristic impedance stability of coupler when high-power working, reduce reflection, improve the stability of system.

Description

Technical Field

[0001] This utility model belongs to the technical field of shortwave and ultrashortwave therapy devices, specifically relating to a high-power coupler integrated on a PCB board. Background Technology

[0002] In shortwave and ultrashortwave therapy devices, the coupler is a key component for realizing radiofrequency energy transmission and monitoring. Traditional couplers come in various forms, some of which are microstrip couplers. However, microstrip couplers have limited power handling capabilities, generally only able to withstand 100W-200W of radiofrequency power. For shortwave and ultrashortwave therapy devices that require higher power output, this type of low-power-handling coupler cannot meet the requirements.

[0003] Furthermore, traditional coupler modules are typically independent units connected to other components via cables. This connection method suffers from cable loss, and unreliable cable connections can lead to excessive reflections, potentially damaging the RF power amplifier and reducing the overall reliability and stability of the therapeutic device system.

[0004] Traditional technologies have the following drawbacks:

[0005] 1. Power bottleneck: Traditional microstrip line couplers are limited by substrate materials (FR4, etc.), and the power capacity is only 100-200W. Under 1500W conditions, the characteristic impedance mismatch (Z offset > 5%) caused by temperature rise leads to reflected power (S11 > -5dB) and causes the RF power amplifier to burn out.

[0006] 2. Cable loss: The coupler is connected to the PCB by an RF cable. The interface loss is ≥0.8dB, and the VSWR (VSWR>2.0) increases sharply after the cable joint is oxidized.

[0007] 3. Poor mechanical reliability: Cable connections are easily loosened by vibration, causing instantaneous reflected power >50%, which increases the equipment failure rate. Utility Model Content

[0008] The purpose of this invention is to provide a high-power coupler integrated on a PCB board to solve the problems mentioned in the background art.

[0009] To achieve the above objectives, this utility model provides the following technical solution: a high-power coupler integrated on a PCB board, comprising...

[0010] Coupler, which connects to the PCB board;

[0011] One end of the coupler is connected to an RF head;

[0012] A thermally and electrically conductive layer is provided at the connection between the coupler and the PCB board.

[0013] Preferably, the coupler is a copper strip.

[0014] In any of the above solutions, it is preferred that the PCB board has mounting positions and connection lines corresponding to the coupler.

[0015] In any of the above solutions, it is preferred that the coupler is fixed to the PCB board with screws.

[0016] In any of the above embodiments, it is preferred that a heat sink is provided on the side of the PCB board away from the coupler.

[0017] In any of the above solutions, it is preferred that the output end of the coupler adopts a threaded RF head.

[0018] The technical effects and advantages of this utility model are as follows:

[0019] 1. Breakthrough in power capacity: Copper-based microstrip + PCB + copper-aluminum heat dissipation can achieve 1500W continuous power transmission (traditional solutions <200W);

[0020] 2. Impedance stability: Characteristic impedance deviation <1% under full power conditions, reflected power (S11) < -25dB, protecting the RF power amplifier;

[0021] 3. Solving thermal stress problems: By adding conductive and thermally conductive materials between the coupler and the PCB board, the thermal stress problem is effectively solved, ensuring the stability of the characteristic impedance of the coupler when operating at high power, reducing reflections, and improving the stability of the system.

[0022] 4. Improved connection reliability: The integrated design and reasonable connection methods (screw fixing and threaded connection) reduce cable connection loss, avoid excessive reflection and RF power amplifier damage caused by unreliable connection, increase system reliability and stability, and reduce maintenance costs and equipment downtime. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of this utility model;

[0024] Figure 2 This is a top view of the present invention;

[0025] Figure 3 This is the front view of the present invention.

[0026] In the diagram: 1. RF head; 2. Coupler; 3. PCB board; 4. Thermally conductive and electrically conductive layer; 5. Heat sink. Detailed Implementation

[0027] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding of this utility model, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0028] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0030] This utility model provides, for example Figure 1-3 The illustrated high-power coupler integrated on a PCB board includes

[0031] Coupler 2 is designed as a copper strip and processed into a microstrip-like form according to design requirements.

[0032] The PCB board 3 has mounting positions and connection lines corresponding to the coupler 2 on its surface. A thermally and electrically conductive layer 4, such as thermally conductive silicone, is filled between the coupler 2 and the PCB board 3. The coupler 2 is fixed to the PCB board 3 with screws to ensure a firm connection and to ensure that the conductive and thermally conductive materials are evenly distributed to achieve good electrical and thermal conductivity. A heat sink 5 is fixed with screws on the side of the PCB board 3 away from the coupler 2. The heat sink 5 is a conventional technology and will not be described in detail here.

[0033] The output end of coupler 2 uses a threaded connection to RF head 1, such as type L29, to ensure a tight connection, avoid loosening, eliminate the need for cable adapters, and reduce insertion loss. After the connection is completed, the electrical performance of the entire system is tested, including parameters such as reflection coefficient and transmission efficiency, to ensure that the system works normally.

[0034] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A high-power coupler integrated on a PCB board, characterized in that: include Coupler (2), which is connected to PCB board (3); One end of the coupler (2) is connected to an RF head (1); A thermally conductive and electrically conductive layer (4) is provided at the connection between the coupler (2) and the PCB board (3).

2. The PCB board integrated high-power coupler according to claim 1, characterized in that: The coupler (2) is a copper strip.

3. A high-power coupler integrated on a PCB board according to claim 2, characterized in that: The PCB board (3) is provided with mounting positions and connection lines corresponding to the coupler (2).

4. A high-power coupler integrated on a PCB board according to claim 3, characterized in that: The coupler (2) is fixed to the PCB board (3) with screws.

5. A high-power coupler integrated on a PCB board according to claim 1, characterized in that: A heat sink (5) is provided on the side of the PCB board (3) away from the coupler (2).

6. A high-power coupler integrated on a PCB board according to claim 1, characterized in that: The output end of the coupler (2) is connected to the RF head (1) by a threaded screw.

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