A heat dissipation system with embedded micro-porous air channels and a heat dissipation structure thereof

Abstract

The application relates to the technical field of electronic equipment heat dissipation, and discloses a heat dissipation system with embedded micro-pore air channels and a heat dissipation structure thereof, wherein the heat dissipation system comprises a heat dissipation structure, an external cold source and a temperature control assembly; the heat dissipation structure comprises a shell body with a micro-pore air channel and an air inlet arranged inside, and a heat dissipation micro-pore is arranged on the inner surface of the shell body and is communicated with the micro-pore air channel to directly spray cooling air flow to a heating element; a circuit board, an insulating isolation layer with an avoiding hole and a cover plate with an air outlet hole are sequentially assembled at the open end of the shell body and jointly penetrate to form a waste gas exhaust channel; a controller of the temperature control assembly dynamically calculates and adjusts the opening degree of the air inlet control valve according to the difference between the real-time temperature collected by a temperature sensor and a preset threshold value. The independent and accurate cooling is realized through the micro-pore array jet flow direct blowing, and the closed-loop control is combined with the on-demand distribution of cooling air, so that the heat exchange efficiency and the overall energy efficiency ratio of the equipment are obviously improved.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, specifically to a heat dissipation system and its heat dissipation structure with embedded microporous air channels. Background Technology

[0002] With the rapid development of electronic communication and industrial control equipment, the operating power of internal heat-generating components is constantly increasing, resulting in a significant increase in the heat generated during equipment operation. Currently, conventional air-cooling methods for electronic equipment typically rely on external fans or air sources to guide airflow parallel to the surface of the heat-generating components. This advection cooling method easily forms a thermal boundary layer on the heat-generating surface, reducing the convective heat transfer efficiency between the airflow and the heat source. Simultaneously, cool air tends to diffuse randomly within the chassis, making it difficult to concentrate cooling air pressure on the core high-power component area, thus making it difficult to eliminate localized hot spots.

[0003] Regarding airflow within the chassis, traditional designs typically lack clearly defined exhaust channels. High-temperature exhaust gases generated after heat exchange by the heating elements can easily stagnate inside the equipment or diffuse to other non-heat-resistant electronic components, causing an overall increase in internal ambient temperature and affecting the safety and stability of equipment operation. Furthermore, some existing air-cooled cooling systems use a fixed airflow rate to continuously input cooling gas, failing to dynamically adjust the airflow based on real-time temperature changes of the heating elements. When the equipment is under low load, a continuous high airflow rate leads to higher overall system energy consumption. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a heat dissipation system and its heat dissipation structure with embedded microporous air channels, which solves the problems of low air-cooling heat exchange efficiency, easy accumulation of internal exhaust gas, and high system energy consumption caused by the inability to adjust the air intake volume as needed in existing electronic devices.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation system with embedded microporous air channels, comprising:

[0006] A heat dissipation structure, wherein the heat dissipation structure has an air inlet, a microporous air channel, a heat dissipation chamber in which a heating element is installed, and an exhaust channel.

[0007] The air inlet, the microporous air channel, the heat dissipation chamber, and the exhaust channel are connected in sequence to allow the cooling airflow to penetrate the thermal boundary layer and dissipate heat from the heat-generating element.

[0008] An external cold source, which is connected to the air inlet;

[0009] The temperature control assembly includes a temperature sensor, a control valve installed at the air inlet, and a controller;

[0010] The controller is electrically connected to the temperature sensor and the control valve, and is used to dynamically adjust the opening of the control valve based on the real-time temperature of the detected heating element.

[0011] Preferably, the controller has a preset temperature threshold, and the controller is equipped with an opening adjustment module. The opening adjustment module calculates and outputs the opening command of the control valve in real time based on the difference between the real-time temperature collected by the temperature sensor and the temperature threshold.

[0012] Preferably, the heat dissipation structure is provided with a plurality of heating elements, which are spaced apart, and the microporous air channel is provided with a set of heat dissipation micropores communicating with the microporous air channel at the position of each heating element.

[0013] A heat dissipation structure with embedded microporous air channels, characterized in that it comprises:

[0014] The housing body has an open end and an internal microporous air channel and an air inlet. The inner surface of the housing body has heat dissipation micropores that communicate with the microporous air channel. The heat dissipation micropores constitute an outlet for jetting airflow to the heating element.

[0015] A circuit board is fixed inside the housing body. The heating element is mounted on the side of the circuit board facing the inner surface of the housing body. The heat dissipation micro-holes face the surface of the heating element, and the circuit board is provided with exhaust through holes.

[0016] A cover plate that covers the open end of the housing body, and an air outlet is provided on the cover plate;

[0017] An insulating isolation layer is sandwiched between the circuit board and the cover plate, and the insulating isolation layer is provided with clearance holes;

[0018] The exhaust passage, the clearance hole, and the air outlet are connected to form an exhaust channel.

[0019] Preferably, the housing body further includes an airflow distribution cavity located between the air inlet and the microporous air channels. Multiple parallel microporous air channels are arranged, and the airflow distribution cavity connects to these channels. The heat dissipation micropores are arrayed on the inner surface of the housing body.

[0020] Preferably, the clearance hole is located at the center of the insulating layer, the exhaust through hole on the circuit board is connected to the clearance hole, the air outlet is directly opposite the clearance hole, and the air outlet is connected to the clearance hole and extends through the two opposite sides of the cover plate.

[0021] Preferably, the housing body is integrally formed from metal material, and heat dissipation fins are provided on the outer surface of the housing body away from the heating element, with multiple heat dissipation fins arranged alternately with the microporous air channels.

[0022] Preferably, an air nozzle interface is fixed at the air inlet, the inner wall of the air nozzle interface is provided with internal threads, and the air nozzle interface protrudes from the side of the housing body.

[0023] Preferably, the opening edge of the housing body is provided with an annular sealing groove, and a sealing ring is embedded in the annular sealing groove. The cover plate is locked and fixed to the housing body by fasteners, and the inner side of the cover plate is tightly pressed against the sealing ring.

[0024] Preferably, the edge of the insulating layer is tightly fitted to the inner surface of the housing body, and the circuit board and the inner surface of the housing body together form a heat dissipation chamber, with the heating element located inside the heat dissipation chamber.

[0025] This invention provides a heat dissipation system and its structure with embedded microporous air channels. It has the following beneficial effects:

[0026] 1. This invention creates heat dissipation micro-holes on the inner surface of the housing, which are connected to rectangular micro-orifice air channels, and aligns the heat dissipation micro-holes with the heat-generating elements on the circuit board. Since the diameter of the heat dissipation micro-holes is smaller than the height of the micro-orifice air channels, the cold air generates a throttling and pressurization effect at this point, and is sprayed vertically downward at a higher flow rate, directly impacting the surface of the heat-generating elements. This effectively penetrates the thermal boundary layer on the surface of the heat-generating elements, shortens the heat exchange path between the cooling airflow and the heat source, and improves the local convective heat transfer intensity, thereby preventing high-power electronic components from throttling or being damaged due to excessive temperature.

[0027] 2. The present invention provides an exhaust through hole on the circuit board at the position corresponding to the avoidance hole of the insulating isolation layer, and together with the exhaust port through the cover plate, constructs an exhaust channel from the heating area directly to the outside of the equipment; the high temperature gas generated after the heating element heats up can smoothly pass through the circuit board and the insulating isolation layer and be discharged to the outside under the positive pressure of the subsequently continuously injected cold air; this directional exhaust structure prevents the high temperature waste heat from being retained inside the casing or spreading disorderly to the surrounding non-heat-resistant areas, and ensures the physical smoothness of the circulation of hot and cold gas inside the equipment.

[0028] 3. The system of the present invention integrates a temperature sensor, a controller, and a control valve installed at the air inlet; the controller receives the temperature data of the heating element monitored in real time by the temperature sensor, compares it with the internal preset temperature threshold, calculates the difference, and then dynamically adjusts the opening of the control valve; this closed-loop adjustment mechanism realizes the automatic matching of the external cold source air volume with the actual heat load of the equipment, avoids the continuous blind input of a large amount of cold air when the equipment is under low load or low temperature, and reduces the overall operating energy consumption of the system. Attached Figure Description

[0029] Figure 1 This is a perspective view of the present invention;

[0030] Figure 2 This is a schematic diagram of the disassembled structure of the present invention;

[0031] Figure 3 This is a schematic diagram of the system architecture of the present invention.

[0032] The components are as follows: 1. Housing body; 2. Heat dissipation micropores; 3. Circuit board; 4. Insulation layer; 5. Cover plate; 6. Air outlet; 7. Heating element; 8. Temperature sensor; 9. Air inlet; 10. Control valve; 11. Microporous air channel; 12. Heat dissipation chamber; 13. Exhaust channel; 14. Controller. Detailed Implementation

[0033] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Please see the appendix Figure 3 This invention provides a heat dissipation system with embedded microporous air channels, comprising:

[0035] The heat dissipation structure has an air inlet 9, a microporous air channel 11, a heat dissipation chamber 12 with a heating element installed, and an exhaust channel 13 inside.

[0036] The air inlet 9, the microporous air channel 11, the heat dissipation chamber 12 and the exhaust channel 13 are connected in sequence to allow the cooling airflow to penetrate the thermal boundary layer and dissipate heat from the heat-generating element.

[0037] An external cold source is connected to the air inlet 9;

[0038] The temperature control assembly includes a temperature sensor 8, a control valve 10 installed at the air inlet 9, and a controller 14;

[0039] The controller 14 is electrically connected to the temperature sensor 8 and the control valve 10, and is used to dynamically adjust the opening of the control valve 10 based on the real-time temperature of the detected heating element.

[0040] The air inlet 9 is used to introduce external cooling gas, thus preventing the inability of cold air to effectively enter the equipment and ensuring a stable airflow supply at the front end of the system. The microporous air channel 11 works in conjunction with the air inlet 9 to directionally transmit the cooling airflow, achieving the effect of accurately guiding the cold air to the internal heating area. The heating element is a high-power electronic chip or power device inside the equipment, which performs electrical signal processing and logic operations during equipment operation. The heat dissipation chamber 12 is used to centrally accommodate the heating element and limit the range of airflow, thereby preventing the disorderly diffusion of high-temperature exhaust gas to the surrounding non-heat-resistant areas and causing damage to other components, thus improving the standardization of internal thermal management of the equipment.

[0041] The air inlet 9, microporous air channel 11, heat dissipation chamber 12 and exhaust channel 13 are connected in sequence to allow the cooling airflow to penetrate the thermal boundary layer and dissipate heat from the heat-generating elements. The exhaust channel 13 works in conjunction with the microporous air channel 11 and heat dissipation chamber 12 to guide the directional circulation of hot and cold airflows within the equipment, achieving the effect of discharging the high-temperature exhaust gas after absorbing heat to the outside of the equipment through the shortest path.

[0042] The external cold source is a chassis air conditioner or an independent vortex tube cooling device, which provides a continuous and stable low-temperature cooling gas to the inside of the equipment.

[0043] Temperature sensor 8 is used to monitor and collect temperature data on the surface of the heating element in real time, thereby avoiding the phenomenon that the system cannot sense the actual heat load change, resulting in heat dissipation lag or blindly opening the air volume, and providing a precise basis for system adjustment; control valve 10 is a miniature flow regulating solenoid valve, which controls the cold air input flow and on / off state at the air inlet 9.

[0044] The controller 14, together with the temperature sensor 8 and the control valve 10, performs automated closed-loop control of the air intake, achieving the effect of allocating the amount of cold air input as needed based on the real-time heat load of the heating element and reducing the overall energy consumption of the equipment.

[0045] Please see the appendix Figure 3 The controller 14 has a preset temperature threshold and an opening adjustment module. The opening adjustment module calculates and outputs the opening command of the control valve 10 in real time based on the difference between the real-time temperature collected by the temperature sensor 8 and the temperature threshold.

[0046] The set temperature threshold is used to set the baseline for the device to start cooling or adjust the heat dissipation intensity, thereby avoiding the phenomenon of excessive energy consumption caused by the device continuously inputting full cold air at low temperatures, and improving the energy efficiency ratio of the system cooling. The opening degree adjustment module is a logic operation program chip built into the controller 14. Its function is to calculate and compare the received temperature data and generate corresponding control signals. The opening degree adjustment module works with the control valve 10 to dynamically adjust the cross-sectional area of ​​the air intake channel, achieving the effect of accurately distributing the amount of cold air entering according to the actual heat load.

[0047] The opening adjustment module has a built-in proportional-integral control algorithm. The formula for calculating the real-time opening percentage of control valve 10 is as follows:

[0048] ;

[0049] in, For control valve 10 in Real-time opening percentage at any given moment; For temperature sensor 8 in Real-time temperature data collected continuously; The preset temperature threshold; The set proportional adjustment coefficient; The integral adjustment coefficient is set. This represents the initial basic opening of the system.

[0050] By introducing the above proportional-integral control algorithm, the controller 14 can effectively eliminate the steady-state error of the system, avoid the oscillation phenomenon of the control valve 10 frequently opening and closing due to the heat transient of the heating element, and make the cooling gas input amount smoothly transition with temperature changes.

[0051] Please see the appendix Figure 3 The heat dissipation structure is equipped with multiple heating elements, which are distributed at intervals. Each heating element is provided with a set of heat dissipation micro-holes connected to the micro-hole air channel 11.

[0052] Multiple heating elements distributed at intervals are used to disperse the total heat generated during system operation, thereby avoiding the phenomenon that local hot spots are difficult to eliminate due to excessive concentration of multiple high-power heat sources, and improving the uniformity of heat distribution of the overall equipment; each group of heat dissipation micro-holes, together with the heating elements at their corresponding positions, carry out directional direct blowing of cold air for heat exchange, achieving the effect of independent and precise cooling of multiple dispersed heat sources in the equipment.

[0053] Please see the appendix Figure 1 and attached Figure 2 A heat dissipation structure with embedded microporous air channels, comprising:

[0054] The housing body 1 has an open end, and a microporous air channel 11 and an air inlet 9 are provided inside. The inner surface of the housing body 1 is provided with heat dissipation micro-holes 2 that communicate with the microporous air channel 11. The heat dissipation micro-holes 2 constitute the outlet for jetting airflow to the heating element 7.

[0055] Circuit board 3 is fixed inside housing body 1. Heating element 7 is installed on the side of circuit board 3 facing the inner surface of housing body 1. Heat dissipation microhole 2 is directly opposite the surface of heating element 7, and exhaust through hole is provided on circuit board 3.

[0056] The cover plate 5 covers the open end of the housing body 1, and the cover plate 5 has an air outlet 6.

[0057] An insulating isolation layer 4 is sandwiched between the circuit board 3 and the cover plate 5, and an avoidance hole is provided on the insulating isolation layer 4;

[0058] Among them, the exhaust passage, the clearance hole and the air outlet 6 are connected to form the exhaust channel 13.

[0059] The housing 1 houses the internal electronic components, preventing them from being exposed and damaged by external forces, thus improving the overall protection of the equipment. The microporous air duct 11 guides the cooling airflow within the housing 1, preventing disordered diffusion of cold air and resulting in pressure loss, thereby improving gas transmission efficiency. The air inlet 9 connects to an external cold source, working in conjunction with the external cold source to input cooling gas, effectively directing external cold air into the microporous air duct 11. The heat dissipation micro-holes 2 work with the microporous air duct 11 to vertically inject airflow, quickly drawing the cooling gas out of the duct. The circuit board 3 is a copper-clad epoxy glass cloth laminate, serving to support electronic components and provide electrical connections; its exhaust holes guide the hot airflow from the front to the back. The heating element 7 is a high-power chip or IGBT module. The function of the heat dissipation micro-holes 2 is to realize the electrical signal processing or power output of the equipment; the heat dissipation micro-holes 2 work with the heating element 7 to carry out direct convection heat exchange of cold air, achieving the effect of direct air cooling of the heating element 7 at zero distance, thereby avoiding the phenomenon of frequency reduction or burnout of the heating element 7 due to excessive temperature, and improving the operational stability of the equipment; the cover plate 5 is made of metal and is used to seal the opening of the housing body 1, thereby preventing external dust or impurities from falling into the equipment and causing short circuit damage to electronic components, thus protecting the safety of the internal structure; the air outlet 6 is used to discharge the high-temperature gas after heat absorption inside the equipment, thereby preventing the accumulation of hot air inside and causing the overall ambient temperature to rise, ensuring smooth airflow circulation and heat exchange; the insulating isolation layer 4 is used to physically isolate the circuit board 3 from the cover plate 5, thereby preventing the pins or lines on the back of the circuit board 3 from directly contacting the cover plate 5 and causing electrical short circuits, thus ensuring electrical safety.

[0060] Please see the appendix Figure 1 and attached Figure 2 The housing body 1 also includes an airflow distribution cavity, which is located between the air inlet 9 and the microporous air channel 11. Multiple microporous air channels 11 are provided and are parallel to each other. The airflow distribution cavity connects multiple microporous air channels 11. The heat dissipation micropores 2 are distributed in an array on the inner surface of the housing body 1.

[0061] The airflow distribution cavity is designed to buffer and equalize the high-speed cooling airflow entering from the air inlet 9, thereby avoiding uneven airflow distribution in the subsequent air ducts due to excessively fast cold air velocity and ensuring the stability of airflow distribution. The airflow distribution cavity, together with multiple micro-perforated air ducts 11, performs synchronous diversion and transmission of cooling gas, achieving the effect of uniformly guiding the cold air to each designated heat-generating area inside the housing body 1. The arrayed heat dissipation micro-holes 2 are used to provide dense airflow to the lower heat-generating area at multiple points, thereby avoiding the phenomenon of heat dissipation dead corners or uneven temperature distribution on the surface of the heat-generating element caused by single-hole airflow, and improving the heat exchange efficiency of the overall heat-generating area.

[0062] Please see the appendix Figure 1 and attached Figure 2 The housing body 1 is integrally formed from metal. The outer surface of the housing body 1 away from the heating element 7 is provided with heat dissipation fins, and multiple heat dissipation fins and microporous air channels 11 are arranged alternately.

[0063] The housing body 1 is made of a high thermal conductivity metal such as aluminum alloy, which serves to provide basic structural support and accelerate the conduction and dissipation of internal heat. The one-piece molded structure enhances the overall structural strength of the device, thereby avoiding the leakage of internal cooling gas due to gaps caused by the splicing and assembly of multiple parts, and ensuring the sealing of the internal microporous air channel 11. The heat dissipation fins increase the contact heat exchange area between the outer surface of the housing body 1 and the external ambient air, thereby preventing the accumulation of heat inside the housing body 1 and improving the passive heat dissipation capacity of the equipment. Multiple heat dissipation fins, together with the internal microporous air channel 11, perform bidirectional auxiliary heat exchange, achieving the effect of synergistic cooling by internal active airflow and external passive diffusion.

[0064] Please see the appendix Figure 1 and attached Figure 2 Air inlet 9 is fixed with air nozzle interface, the inner wall of air nozzle interface is provided with internal thread, and air nozzle interface protrudes from the side of housing body 1.

[0065] The air nozzle interface is designed for quick connection to the external cold source's air supply line, thus avoiding the loosening and leakage that can easily occur when the external air supply line is directly connected to the air inlet 9, improving the stability of the cold air input connection. The internal thread on the inner wall of the air nozzle interface is used to rotate and tighten the external air supply line connector, achieving a secure lock and good sealing effect on the air supply line. The protruding structure provides ample space for construction personnel to insert and remove pipes, thus avoiding difficulties in connecting pipes or interference with other components due to concealed interfaces, improving the convenience of equipment installation and subsequent maintenance.

[0066] Please see the appendix Figure 1 and attached Figure 2 The opening edge of the housing body 1 is provided with an annular sealing groove, and a sealing ring is embedded in the annular sealing groove. The cover plate 5 is locked and fixed to the housing body 1 by fasteners, and the inner side of the cover plate 5 is tightly pressed against the sealing ring.

[0067] The annular sealing groove provides precise installation positioning and limiting protection for the sealing ring, preventing it from being squeezed and misaligned during pressure assembly or impact from internal airflow, thus ensuring the stability of the sealing structure. The sealing ring is made of high-temperature resistant silicone rubber or fluororubber, an elastic material, and fills the tiny mechanical gaps between the housing body 1 and the cover plate 5. The fasteners are high-strength screws or bolts, providing a stable and reliable mechanical connection preload. The cover plate 5, in conjunction with the sealing ring, performs pressure deformation closure, preventing pressurized cooling airflow from leaking outwards from the housing joints, thus maintaining stable internal air pressure and improving the overall airtightness of the equipment.

[0068] Please see the appendix Figure 1 and attached Figure 2 The edge of the insulating layer 4 is tightly attached to the inner surface of the housing body 1. The circuit board 3 and the inner surface of the housing body 1 together form a heat dissipation chamber 12, and the heating element 7 is located in the heat dissipation chamber 12.

[0069] The tightly fitted structure of the insulating isolation layer 4 is used to seal the rear assembly gap, thereby preventing the disorderly leakage of internal cooling gas from the edge and the resulting reduction in air pressure in the heat exchange area, ensuring the airtightness of airflow transmission; the circuit board 3 works in conjunction with the inner surface of the housing body 1 to enclose the space, achieving the effect of constructing an independent and centralized heat exchange space inside the equipment; the heat dissipation chamber 12 is used to centrally accommodate the heating element 7 and restrict the airflow direction, thereby preventing the high temperature heat emitted by the heating element 7 from spreading randomly to other non-heat-resistant areas of the equipment and causing the overall internal temperature to run out of control, improving the airflow utilization rate of the cooling gas for centralized heat dissipation of the heating element 7.

[0070] Working principle: During equipment operation, the heating element 7 on the circuit board 3 continuously generates heat. The temperature sensor 8 fixed on the circuit board 3 monitors the temperature around the heating element 7 in real time and transmits the collected temperature data to the controller 14. The opening adjustment module in the controller 14 compares the real-time temperature with the preset temperature threshold and calculates the difference between the two to dynamically adjust the opening of the control valve 10 installed at the air inlet 9. Cooling gas provided by the external cold source is introduced into the equipment as needed through the air nozzle interface. This process realizes automatic matching of air intake volume according to real-time heat load and avoids ineffective energy consumption of the system.

[0071] After the cooling gas enters the housing body 1 through the air inlet 9, it first enters the airflow distribution chamber for buffering and pressure equalization, thereby ensuring that the airflow velocity entering the subsequent air passages is uniform and stable. The equalized cold air is simultaneously introduced into multiple parallel microporous air passages 11. Since the width dimension of the microporous air passage 11 is greater than its height dimension, the cold air is transmitted forward in a horizontally spread state within the flat rectangular microporous air passage 11, maximizing the coverage area of ​​the airflow above the heat-generating area. At the same time, after the housing body 1 absorbs heat, it works with the heat dissipation fins arranged interlaced with the air passages on its exterior to conduct some of the heat to the external natural environment, realizing the synergy of internal active air cooling and external passive heat dissipation.

[0072] When the cold air transported in the microporous air channel 11 flows through the heat dissipation micro-holes 2 arrayed above each heating element 7, the cold air undergoes a throttling and pressurization effect because the aperture size of the heat dissipation micro-holes 2 is smaller than the height size of the microporous air channel 11. The flow rate increases dramatically in an instant, and the high-speed cold air is vertically injected downward into the sealed heat dissipation chamber 12 formed by the inner surface of the housing body 1 and the circuit board 3. It directly impacts the surface of the spaced heating elements 7. The high-speed jet airflow effectively penetrates the thermal boundary layer on the surface of the heating elements 7, performing direct convection heat transfer with zero path, and quickly stripping away and carrying away the concentrated high-temperature heat.

[0073] The high-temperature exhaust gas formed after absorbing heat from the heating element 7 is prevented from spreading and leaking into other non-heat-resistant areas inside the casing due to the physical barrier of the insulating layer 4. Driven by the positive pressure of the cold air continuously injected into the heat dissipation chamber 12, the high-temperature exhaust gas flows upward along the preset shortest exhaust path, smoothly passes through the exhaust holes on the circuit board 3 and the clearance hole opened in the center of the insulating layer 4, and is finally discharged directly to the outside of the equipment from the air outlet 6 opposite the clearance hole and penetrating both sides of the cover plate 5. This process completes a complete hot and cold gas circulation heat exchange, ensuring the heat circulation balance inside the equipment and the safe and stable operation of electronic components.

Claims

1. A heat dissipation system with embedded microporous air channels, characterized in that, include: The heat dissipation structure has an air inlet (9), a microporous air channel (11), a heat dissipation chamber (12) on which a heating element is installed, and an exhaust channel (13). The air inlet (9), the microporous air channel (11), the heat dissipation chamber (12) and the exhaust channel (13) are connected in sequence to allow the cooling airflow to penetrate the thermal boundary layer and dissipate heat from the heat-generating element; An external cold source, which is connected to the air inlet (9); The temperature control assembly includes a temperature sensor (8), a control valve (10) installed at the air inlet (9), and a controller (14). The controller (14) is electrically connected to the temperature sensor (8) and the control valve (10) to dynamically adjust the opening of the control valve (10) based on the real-time temperature of the detected heating element.

2. The heat dissipation system with embedded microporous air channels according to claim 1, characterized in that, The controller (14) has a preset temperature threshold. The controller (14) is equipped with an opening adjustment module. The opening adjustment module calculates and outputs the opening command of the control valve (10) in real time based on the difference between the real-time temperature collected by the temperature sensor (8) and the temperature threshold.

3. The heat dissipation system with embedded microporous air channels according to claim 1, characterized in that, The heat dissipation structure is provided with a plurality of heating elements, which are distributed at intervals, and the microporous air channel (11) is provided with a set of heat dissipation micropores communicating with the microporous air channel (11) for each heating element.

4. A heat dissipation structure with embedded microporous air channels, characterized in that, include: The housing body (1) has an open end and is provided with a microporous air channel (11) and an air inlet (9) inside. The inner surface of the housing body (1) is provided with a heat dissipation microhole (2) that connects to the microporous air channel (11). The heat dissipation microhole (2) forms an outlet for jetting airflow to the heating element (7). The circuit board (3) is fixed inside the housing body (1), the heating element (7) is installed on the side of the circuit board (3) facing the inner surface of the housing body (1), the heat dissipation micro-hole (2) is facing the surface of the heating element (7), and the circuit board (3) is provided with exhaust through holes; A cover plate (5) is provided on the opening end of the housing body (1), and an air outlet (6) is provided on the cover plate (5). An insulating isolation layer (4) is sandwiched between the circuit board (3) and the cover plate (5), and an avoidance hole is provided on the insulating isolation layer (4); The exhaust passage, the clearance hole and the air outlet (6) are connected to form an exhaust channel (13).

5. The heat dissipation structure with embedded microporous air channels according to claim 4, characterized in that, The housing body (1) also includes an airflow distribution cavity, which is located between the air inlet (9) and the microporous air channel (11). The microporous air channel (11) is provided in multiple parallel lines. The airflow distribution cavity connects multiple microporous air channels (11). The heat dissipation micropores (2) are arranged in an array on the inner surface of the housing body (1).

6. The heat dissipation structure with embedded microporous air channels according to claim 4, characterized in that, The clearance hole is located at the center of the insulating isolation layer (4). The exhaust through hole on the circuit board (3) is connected to the clearance hole. The air outlet (6) is directly opposite the clearance hole. The air outlet (6) is connected to the clearance hole and passes through the opposite sides of the cover plate (5).

7. The heat dissipation structure with embedded microporous air channels according to claim 4, characterized in that, The housing body (1) is integrally formed of metal material. The outer surface of the housing body (1) away from the heating element (7) is provided with heat dissipation fins, and multiple heat dissipation fins are arranged alternately with the microporous air channel (11).

8. The heat dissipation structure with embedded microporous air channels according to claim 4, characterized in that, An air nozzle interface is fixed at the air inlet (9), and the inner wall of the air nozzle interface is provided with internal threads. The air nozzle interface protrudes from the side of the housing body (1).

9. The heat dissipation structure with embedded microporous air channels according to claim 4, characterized in that, The opening edge of the housing body (1) is provided with an annular sealing groove, and a sealing ring is embedded in the annular sealing groove. The cover plate (5) is locked and fixed to the housing body (1) by fasteners, and the inner side of the cover plate (5) is tightly pressed against the sealing ring.

10. The heat dissipation structure with embedded microporous air channels according to claim 4, characterized in that, The edge of the insulating layer (4) is closely attached to the inner surface of the housing body (1), and the circuit board (3) and the inner surface of the housing body (1) together form a heat dissipation chamber (12), and the heating element (7) is located in the heat dissipation chamber (12).

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