Layered heat dissipation circuit board structure

Abstract

The utility model discloses layered heat dissipation circuit board structure, include: board body, the board body is divided into low temperature area, medium temperature area and high temperature area from left to right one side, the bottom of low temperature area is equipped with phase change material, the phase change material is with suitable to the low temperature area carries out heat dissipation, the bottom of medium temperature area is equipped with heat conduction plate, the heat conduction plate is with suitable to the heat of medium temperature area conduction to the bottom of board body, the bottom of high temperature area is equipped with water cooling assembly and air cooling assembly, water cooling assembly and air cooling assembly can be alone or simultaneously emit the heat of high temperature area, with suitable to the temperature of high temperature area is reduced fast.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a layered heat dissipation circuit board structure. Background Technology

[0002] Circuit board names include: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board (copper etching technology), etc.

[0003] Circuit boards can be divided into low-temperature, medium-temperature, and high-temperature zones. The heat dissipation components of the circuit board are usually located at the bottom of the high-temperature zone, while the low-temperature and medium-temperature zones can only rely on natural airflow for heat dissipation. This results in uneven temperature distribution on the circuit board, leading to poor circuit board performance. Utility Model Content

[0004] This utility model aims to at least partially solve one of the technical problems in related technologies. Therefore, one objective of this utility model is to provide a layered heat dissipation circuit board structure, comprising:

[0005] The plate is divided into a low-temperature zone, a medium-temperature zone, and a high-temperature zone from left to right.

[0006] The bottom of the low-temperature zone is provided with a phase change material, which is suitable for dissipating heat from the low-temperature zone;

[0007] A heat-conducting plate is provided at the bottom of the medium-temperature zone, and the heat-conducting plate is adapted to conduct the heat of the medium-temperature zone to the bottom of the plate.

[0008] The bottom of the high-temperature zone is equipped with a water-cooling component and an air-cooling component. The water-cooling component and the air-cooling component can dissipate the heat of the high-temperature zone individually or simultaneously, so as to quickly reduce the temperature of the high-temperature zone.

[0009] Preferably, a first fixing groove is provided on the left side of the plate body, and the phase change material is filled in the first fixing groove.

[0010] Preferably, the phase change material is a paraffin-based composite material.

[0011] Preferably, a second fixing groove is provided in the middle of the plate body, and multiple ventilation holes are provided at both ends of the second fixing groove, with the multiple ventilation holes arranged at equal intervals.

[0012] Preferably, the heat-conducting plate has a plurality of heat dissipation holes along its width, the plurality of heat dissipation holes extending through both sides of the heat-conducting plate, and the plurality of heat dissipation holes corresponding to the plurality of ventilation holes.

[0013] Preferably, the heat-conducting plate is further provided with a plurality of connecting holes along its length, the plurality of connecting holes being connected to a plurality of ventilation holes, and the plurality of connecting holes being arranged at equal intervals.

[0014] Preferably, a third fixing groove is provided on the right side of the plate body, the third fixing groove extends through the bottom of the plate body, and a high thermal conductivity ceramic substrate is provided in the third fixing groove.

[0015] Preferably, a graphite sheet is provided at the bottom of the plate, the graphite sheet is attached to the high thermal conductivity ceramic substrate, and the graphite sheet is arranged in a downward stepped manner from left to right.

[0016] Preferably, the water-cooling assembly includes:

[0017] A heat pipe is laid at the bottom left side of the graphite sheet;

[0018] A micro water pump is located at the bottom of the plate and is connected to the outlet and inlet of the heat pipe.

[0019] Coolant, which fills the heat pipe.

[0020] Preferably, the air-cooled component includes:

[0021] Heat dissipation teeth are laid on the bottom right side of the graphite sheet;

[0022] Multiple cooling fans are provided at equal intervals at the bottom of the cooling fins.

[0023] The above-described solution of this utility model has at least the following beneficial effects:

[0024] When the board is powered on, the low-temperature zone dissipates heat through the phase change material, the medium-temperature zone absorbs heat through the heat-conducting plate and conducts the heat to the outside of the board, while the high-temperature zone can dissipate heat through the water-cooling component or the air-cooling component. If the high temperature exceeds the preset temperature threshold, the water-cooling component and the air-cooling component can dissipate heat at the same time to ensure that the board can work normally.

[0025] By using phase change materials, heat-conducting plates, water-cooling components, and air-cooling components, the low-temperature, medium-temperature, and high-temperature zones of the plate can achieve a relatively balanced heat dissipation effect during operation.

[0026] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the layered heat dissipation circuit board structure provided in the embodiment of this utility model;

[0029] Figure 2 This is a schematic diagram of the plate structure provided in the embodiment of this utility model;

[0030] Figure 3 yes Figure 1 A schematic diagram of the AA cross-sectional structure;

[0031] Figure 4 yes Figure 1 A schematic diagram of the BB cross-sectional structure;

[0032] Figure 5 yes Figure 2 Enlarged view of part C;

[0033] Figure 6 yes Figure 2 Enlarged view of part D;

[0034] Figure 7 yes Figure 2 Enlarged view of part E.

[0035] Explanation of icon numbers:

[0036] 1. Plate body, 2. Phase change material, 3. Heat-conducting plate, 4. Water-cooling assembly, 5. Air-cooling assembly, 6. Ventilation hole, 7. Heat dissipation hole, 8. Connecting hole, 9. High thermal conductivity ceramic substrate, 10. Graphite sheet.

[0037] 401. Heat pipe; 402. Miniature water pump;

[0038] 501, heat dissipation fins; 502, cooling fan.

[0039] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0040] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0041] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0043] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0044] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0045] The layered heat dissipation circuit board structure of this utility model embodiment is described in detail below with reference to the accompanying drawings.

[0046] Please see Figures 1-7 In this embodiment, the plate includes: a plate body 1, which is divided into a low-temperature zone, a medium-temperature zone, and a high-temperature zone from left to right; a phase change material 2 is provided at the bottom of the low-temperature zone, which is suitable for dissipating heat from the low-temperature zone; a heat-conducting plate 3 is provided at the bottom of the medium-temperature zone, which is suitable for conducting heat from the medium-temperature zone to the bottom of the plate body 1; a water-cooling component 4 and an air-cooling component 5 are provided at the bottom of the high-temperature zone, which can dissipate heat from the high-temperature zone individually or simultaneously, in order to quickly reduce the temperature of the high-temperature zone; when the plate body 1 is powered on, the low-temperature zone dissipates heat through the phase change material 2, the medium-temperature zone absorbs heat through the heat-conducting plate 3 and conducts the heat to the outside of the plate body 1, and the high-temperature zone can dissipate heat through the water-cooling component 4 or the air-cooling component 5. If the high-temperature zone exceeds a preset temperature threshold, the water-cooling component 4 and the air-cooling component 5 can dissipate heat simultaneously, thereby ensuring that the plate body 1 can work normally.

[0047] The phase change material 2, heat-conducting plate 3, water-cooling component 4, and air-cooling component 5 enable the low-temperature zone, medium-temperature zone, and high-temperature zone of the plate 1 to achieve a relatively balanced heat dissipation effect during operation.

[0048] In this embodiment, a first fixing groove is provided on the left side of the plate 1, and the phase change material 2 is filled in the first fixing groove; the heat of the low temperature zone is conducted to the phase change material 2 through the plate 1, and then the phase change material 2 absorbs the heat of the low temperature zone, thereby reducing the temperature of the low temperature zone.

[0049] In this embodiment, the phase change material 2 is a paraffin-based composite material. Paraffin, as a phase change material 2, has high heat capacity and latent heat, and can absorb or release a large amount of heat during the phase change process. When the plate 1 heats up, the paraffin phase change material 2 absorbs heat and undergoes a phase change, converting the heat into latent heat, keeping the temperature near the phase change temperature, thereby achieving a highly efficient heat dissipation effect. The paraffin-based composite material can keep the temperature of the plate 1 fluctuating near the phase change temperature, avoiding a sharp rise or fall in temperature, thereby extending the service life of the equipment. Furthermore, the phase change process of the paraffin-based composite material does not require external energy input, reducing energy consumption, and does not generate noise or vibration.

[0050] In this embodiment, a second fixing groove is provided in the middle of the plate body 1, and multiple ventilation holes 6 are provided at both ends of the second fixing groove. The multiple ventilation holes 6 are arranged at equal intervals. The temperature of the medium temperature zone is conducted to the heat-conducting plate 3, and the multiple ventilation holes 6 can guide natural wind to the heat-conducting plate 3 so that the temperature of the heat-conducting plate 3 drops.

[0051] In this embodiment, the heat-conducting plate 3 has multiple heat dissipation holes 7 along its width, which extend through both sides of the heat-conducting plate 3 and correspond to multiple ventilation holes 6. The heat-conducting plate 3 also has multiple connecting holes 8 along its length, which are connected to the multiple ventilation holes 6 and are arranged at equal intervals. Natural air enters the multiple ventilation holes 6 through the multiple ventilation holes 6, and the ventilation holes 6 are connected by the multiple connecting holes 8, so that a large amount of natural air can circulate in the heat-conducting plate 3, avoiding the problem of uneven heat dissipation in the middle temperature zone.

[0052] In this embodiment, a third fixing groove is provided on the right side of the plate 1. The third fixing groove extends through the bottom of the plate 1, and a high thermal conductivity ceramic substrate 9 is provided in the third fixing groove. The heat in the high temperature area is conducted to the water cooling component 4 and the air cooling component 5 at the bottom of the plate 1 through the high thermal conductivity ceramic substrate 9, so that the high temperature area can dissipate heat quickly.

[0053] In this embodiment, a graphite sheet 10 is provided at the bottom of the plate 1. The graphite sheet 10 is attached to the high thermal conductivity ceramic substrate 9, and the graphite sheet 10 is arranged in a downward stepped manner from left to right. The high thermal conductivity ceramic substrate 9 conducts the heat from the high temperature area to the graphite sheet 10, and the graphite sheet 10 then conducts the heat to the water cooling component 4 and the air cooling component 5.

[0054] The graphite sheets 10 are arranged in a stepped manner so that the water cooling component 4 can quickly reduce the heat in the high-temperature area. The remaining heat after being cooled by the water cooling component 4 can be dissipated by the air cooling component 5, thus avoiding the water cooling component 4 from working under overload and reducing its heat dissipation effect.

[0055] In this embodiment, the water-cooling assembly 4 includes: a heat pipe 401, which is laid on the bottom left side of the graphite sheet 10; a micro water pump 402, which is located at the bottom of the plate 1 and connected to the outlet and inlet of the heat pipe 401; and coolant, which is filled inside the heat pipe 401. The micro water pump 402 enables the coolant to circulate within the heat pipe 401, so that the graphite sheet 10 can dissipate heat evenly and the coolant can quickly reduce the temperature, thus preventing the components in the high-temperature area from overheating when working.

[0056] In this embodiment, the air-cooling component 5 includes: heat dissipation teeth 501, which are laid on the bottom right side of the graphite sheet 10; and multiple heat dissipation fans 502, which are equally spaced at the bottom of the heat dissipation teeth 501. The heat after being cooled by the water-cooling component 4 is conducted to the heat dissipation teeth 501 through the graphite sheet 10. The multiple heat dissipation fans 502 can work simultaneously to dissipate the heat from the heat dissipation teeth 501, thereby keeping the components of the high-temperature paint within a preset temperature threshold.

[0057] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0058] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A layered heat dissipation circuit board structure, characterized in that, include: The plate is divided into a low-temperature zone, a medium-temperature zone, and a high-temperature zone from left to right. The bottom of the low-temperature zone is provided with a phase change material, which is suitable for dissipating heat from the low-temperature zone; A heat-conducting plate is provided at the bottom of the medium-temperature zone, and the heat-conducting plate is adapted to conduct the heat of the medium-temperature zone to the bottom of the plate. The bottom of the high-temperature zone is equipped with a water-cooling component and an air-cooling component. The water-cooling component and the air-cooling component can dissipate the heat of the high-temperature zone individually or simultaneously, so as to quickly reduce the temperature of the high-temperature zone.

2. The layered heat dissipation circuit board structure according to claim 1, characterized in that, The plate body has a first fixing groove on the left side, and the phase change material is filled in the first fixing groove.

3. The layered heat dissipation circuit board structure according to claim 1, characterized in that, The phase change material is a paraffin-based composite material.

4. The layered heat dissipation circuit board structure according to claim 1, characterized in that, The plate body has a second fixing groove in the middle, and multiple ventilation holes are provided at both ends of the second fixing groove. The multiple ventilation holes are arranged at equal intervals.

5. The layered heat dissipation circuit board structure according to claim 4, characterized in that, The heat-conducting plate has multiple heat dissipation holes along its width, which extend through both sides of the heat-conducting plate and correspond to multiple ventilation holes.

6. The layered heat dissipation circuit board structure according to claim 5, characterized in that, The heat-conducting plate is also provided with a plurality of connecting holes along its length, and the plurality of connecting holes are connected to a plurality of ventilation holes, and the plurality of connecting holes are arranged at equal intervals.

7. The layered heat dissipation circuit board structure according to claim 1, characterized in that, A third fixing groove is provided on the right side of the plate body. The third fixing groove extends through the bottom of the plate body and a high thermal conductivity ceramic substrate is provided in the third fixing groove.

8. The layered heat dissipation circuit board structure according to claim 7, characterized in that, The bottom of the plate is provided with a graphite sheet, which is attached to the high thermal conductivity ceramic substrate, and the graphite sheet is arranged in a downward stepped shape from left to right.

9. The layered heat dissipation circuit board structure according to claim 8, characterized in that, The water-cooling assembly includes: A heat pipe is laid at the bottom left side of the graphite sheet; A micro water pump is located at the bottom of the plate and is connected to the outlet and inlet of the heat pipe. Coolant, which fills the heat pipe.

10. The layered heat dissipation circuit board structure according to claim 8, characterized in that, The air-cooling component includes: Heat dissipation teeth are laid on the bottom right side of the graphite sheet; Multiple cooling fans are provided at equal intervals at the bottom of the cooling fins.

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