Flexible selective plating board step recess poor design structure

Abstract

The utility model discloses a kind of flexible selected plating plate step recess defective design structures, belong to FPC flexible circuit board selection field, a kind of flexible selected plating plate step recess defective design structure, including substrate, the substrate is specifically L-shaped bending flexible circuit board, wherein bending position both sides are equipped with selected plating layer, the selected plating layer includes front selected plating pattern, back selected plating pattern, the front selected plating pattern is set on the substrate upper surface The utility model has the advantages compared with prior art: the structure selected plating exposure will line part be designed into wave shape, the upper limit of front and back line is staggered 0.3MM, so that product front and back have one copper under support, reduce the risk of not being pressed when vacuum film is pasted, prevent appearing line is bitten and etched defective, improve product bending property.

Description

Technical Field

[0001] This utility model belongs to the field of FPC flexible circuit board selection technology, specifically relating to a design structure for a flexible plated board with stepped depressions. Background Technology

[0002] To improve flexibility, the currently produced double-sided solar panels are designed with height differences at the bending points. The steps are formed by selective plating and additional plating processes. However, the selectively plated steps are uniform from top to bottom. During the film lamination process in circuit production, poor air venting can easily lead to incomplete film lamination, resulting in the circuit being etched and reducing the product's flexibility. Utility Model Content

[0003] The purpose of this invention is to provide a design structure for a flexible selective plated plate with poor stepped recesses, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a design structure for a stepped recessed defect in a flexible selective plating plate, comprising a substrate, specifically an L-shaped bent flexible circuit board, wherein selective plating layers are provided on both sides of the bent portion, the selective plating layers including a front selective plating pattern and a back selective plating pattern, the front selective plating pattern being disposed on the upper surface of the substrate, the back selective plating pattern being disposed on the lower surface of the substrate, and the front selective plating pattern and the back selective plating pattern corresponding to each other, the sides of the front selective plating pattern and the back selective plating pattern being wavy, and the wavy sides being staggered, wherein the horizontal misalignment of the wavy sides is 0.3mm.

[0005] Preferably, the height difference between the peaks and troughs of the wave side on the front and back selective plating patterns is 0.33 mm, and the wavelength of the wave side is 0.83 mm.

[0006] The technical effects and advantages of this utility model are as follows: When the plating exposure is selected, the circuit part is designed in a wave shape, and the upper limit of the circuit on the front and back is staggered by 0.3MM, so that there is a copper support on both the front and back of the product, which reduces the risk of poor pressure during vacuum film application, prevents the circuit from being bitten and damaged, and improves the product's flexibility. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of the structure of this utility model;

[0008] Figure 2 This is a cross-sectional view of the plated step of this utility model;

[0009] Figure 3 This is a schematic diagram of a traditional selective plating structure;

[0010] Figure 4 This is a cross-sectional view of the traditional plated step.

[0011] In the diagram: 101, substrate; 102, front-side optional plating pattern; 103, back-side optional plating pattern. Detailed Implementation

[0012] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0013] This utility model provides, for example Figure 1-4 The illustrated flexible selective plating plate step recess defect design structure includes a substrate 101;

[0014] Specifically, the substrate 101 is an L-shaped flexible circuit board with selective plating layers on both sides of the bent portion. The selective plating layers include a front selective plating pattern 102 and a back selective plating pattern 103. The front selective plating pattern 102 is located on the upper surface of the substrate 101, and the back selective plating pattern 103 is located on the lower surface of the substrate 101. The front selective plating pattern 102 and the back selective plating pattern 103 correspond to each other. The sides of the front selective plating pattern 102 and the back selective plating pattern 103 are both wavy, and the wavy sides are staggered, with the horizontal misalignment of the wavy sides being 0.3 mm.

[0015] Specifically, the height difference between the peaks and troughs of the waves on the front and back selective plating patterns 102 and 103 is 0.33 mm, and the wavelength of the waves is 0.83 mm. Example

[0016] In traditional flexible battery panel selective plating designs, the selective plating pattern is usually a single-sided wavy pattern or no pattern. When such selective plating patterns are laminated during circuit production, the uniformity of the selective plating steps leads to poor air venting during vacuum lamination, which can easily cause incomplete lamination and result in etched circuits, reducing the product's bendability. This design changes the selective plating pattern 102 on the front and 103 on the back, using a wavy pattern design on both sides, with a 0.3mm offset in the wavy pattern on the sides. This ensures that both sides have a copper support, reducing the risk of incomplete lamination during vacuum lamination and improving the product's bendability.

[0017] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flexible selective plating plate with stepped recessed design structure, comprising a substrate (101), characterized in that: The substrate (101) is specifically an L-shaped flexible circuit board with selective plating layers on both sides of the bent portion. The selective plating layers include a front selective plating pattern (102) and a back selective plating pattern (103). The front selective plating pattern (102) is located on the upper surface of the substrate (101), and the back selective plating pattern (103) is located on the lower surface of the substrate (101). The front selective plating pattern (102) and the back selective plating pattern (103) correspond to each other. The sides of the front selective plating pattern (102) and the back selective plating pattern (103) are both wavy, and the wavy sides are staggered, with the horizontal plane of the wavy sides being staggered by 0.3 mm.

2. The flexible selective plating plate stepped recessed defect design structure according to claim 1, characterized in that: The height difference between the peak and trough of the wave side on the front selective plating pattern (102) and the back selective plating pattern (103) is 0.33 mm, and the wavelength of the wave side is 0.83 mm.

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