A seam spring buckle spot welding paste machine

Abstract

This utility model discloses a welded spring clip spot solder paste machine, including a frame. The frame is equipped with a feeding mechanism for conveying spring clips, and a conveying mechanism for receiving and stepping the spring clips from the feeding mechanism. Along the spring clip's moving direction, the frame is sequentially equipped with a paste application mechanism and a release mechanism. The paste application mechanism applies solder paste to the spring clips conveyed by the conveying mechanism. The release mechanism allows the solder-pasted spring clips to detach from the conveying mechanism. A collection mechanism is located on the side of the frame near the release mechanism. The feeding mechanism conveys spring clips to the conveying mechanism. After the conveying mechanism carries the spring clips, it first steps them to the paste application mechanism, where solder paste is applied. Then, the conveying mechanism steps the solder-pasted spring clips to the release mechanism, which detaches them from the conveying mechanism. The collection mechanism directionally collects the solder-pasted spring clips that have detached from the conveying mechanism.

Description

Technical Field

[0001] This utility model relates to the technical field of spring buckle welding equipment, specifically to a weld paste machine for seamed spring buckles. Background Technology

[0002] Among the types of spring clasps, there are seamless spring clasps and seamed spring clasps. The difference between seamed and seamless spring clasps is that seamed spring clasps have a seam in the middle, which is created during the bending and shaping process. After the seamed spring clasp is formed, the seam needs to be sealed by welding. Spring clasps used in jewelry are relatively small. To ensure the welding quality of the seam, solder paste needs to be applied to the seam. If the solder paste is applied manually, it is time-consuming and laborious just to handle the spring clasp. If solder paste is not applied and the welding equipment is used directly, the weld quality is difficult to guarantee, resulting in defective products. Defective products require further processing after sorting, which delays the normal production process. There is an urgent need for a spot solder paste machine for seamed spring clasps that can automatically apply solder paste to the seam of the clasp. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a weld paste machine for welded spring clips that can automatically apply solder paste to the seams of welded spring clips.

[0004] To solve the above-mentioned technical problems, this utility model includes a frame, which is equipped with a feeding mechanism for conveying slotted spring buckles. Its structural features are: the frame is equipped with a conveying mechanism that receives spring buckles from the feeding mechanism and conveys them stepwise; the frame is sequentially equipped with a solder paste application mechanism and a release mechanism along the spring buckle's moving direction; the solder paste application mechanism applies solder paste to the spring buckles conveyed by the conveying mechanism; the release mechanism allows the solder paste-coated spring buckles to detach from the conveying mechanism; and a collecting mechanism is provided on the side of the frame near the release mechanism, which directionally collects the solder paste-coated spring buckles that have detached from the conveying mechanism.

[0005] With the above structure, the feeding mechanism conveys the spring clips to the conveying mechanism. The conveying mechanism, carrying the spring clips, first steps them to the solder paste application mechanism, where solder paste is applied to the spring clips. Then, the conveying mechanism steps the solder paste-coated spring clips to the ejector, where the ejector detaches the spring clips from the conveying mechanism. The collecting mechanism then collects the solder paste-coated spring clips that have detached from the conveying mechanism. This achieves automatic application of solder paste to the seams of the seamed spring clips, improving overall work efficiency compared to manual application.

[0006] Furthermore, the conveying mechanism includes a drive unit mounted on a frame. The drive unit has an output end capable of step-rotation, and the output end of the drive unit is provided with a material tray. A support plate located below the material tray is fixed on the frame or the drive unit. The material tray has a plurality of material holes around its perimeter. The support plate is provided with a first detection element. The first detection element can detect the positioning state of the spring buckle in the material hole near the feeding mechanism. The first detection element is controlled and connected to the drive unit. The support plate provides bottom support for the spring buckle located in the material hole and moving from the side near the feeding mechanism to the side near the ejector. By setting up the conveying mechanism, the drive unit can drive the material tray to rotate step by step. When an empty material hole on the material tray reaches a position near the feeding mechanism through the rotation of the material tray, the feeding mechanism conveys the spring buckle into the material hole. The first detection element detects that the material hole is carrying material and sends a signal to the drive unit to continue outputting step-rotation force. The drive unit continues to drive the material tray to rotate step by step until the material hole carrying the spring buckle moves toward the direction of the coating mechanism. The spring buckle abuts against the support plate and moves toward the coating mechanism under the push of the material hole.

[0007] Furthermore, the tray has a clearance hole on the side near the collecting mechanism. The diameter of the clearance hole is larger than the outer diameter of the spring clip. The clearance hole corresponds vertically to the material hole that the stepper moves to near the collecting mechanism. The ejector is rod-shaped and can move up and down. The ejector is located above the clearance hole and corresponds vertically to the clearance hole. By setting the clearance hole and the ejector, when the spring clip with solder paste applied reaches above the clearance hole under the push of the material hole on the stepper rotating tray, the ejector moves downward to press down on the top of the spring clip with solder paste applied in the material hole. The spring clip with solder paste applied disengages downward from the material hole and the clearance hole and is collected by the collecting mechanism. The ejector ensures the stable disengagement of the spring clip with solder paste applied from the material hole.

[0008] Furthermore, the collection mechanism includes a mounting frame on the frame, the mounting frame having a conveyor belt capable of receiving spring clips from the clearance holes, and a discharge slide capable of receiving spring clips from the conveyor belt, the discharge slide being inclined downwards from the side closer to the conveyor belt to the side farther away from the conveyor belt. By setting up the collection mechanism, the conveyor belt receives the solder paste-coated spring clips from the clearance holes and transfers them to the discharge slide, which in turn receives the spring clips from the conveyor belt and allows them to slide downwards under gravity into an external collection container, thus achieving stable collection of solder paste-coated spring clips.

[0009] Furthermore, the solder paste application mechanism includes a sliding frame mounted on the frame and capable of reciprocating up and down. The sliding frame is equipped with a dispensing valve, and the output end of the dispensing valve has a discharge rod. The diameter of the discharge rod is adapted to the inner diameter of the spring clip. The discharge rod has several discharge holes arranged in a ring. The side of the discharge rod closest to the discharge holes can move into the discharge holes under the drive of the sliding frame. By setting up the solder paste application mechanism, the dispensing valve provides precise quantitative delivery of the contained solder paste. After the solder paste reaches the discharge rod from the dispensing valve, it is squeezed out from the several discharge holes. The several ring-shaped discharge holes ensure effective application of the solder paste. By setting up the sliding frame, the downward movement of the sliding frame allows the discharge rod on the dispensing valve to approach the spring clip in the discharge hole, ensuring the discharge hole is aligned with the joint and guaranteeing the accuracy of the solder paste application position. After application, the sliding frame moves upward to move the dispensing valve and discharge rod away from the discharge holes and spring clip, preventing interference between the tray and the discharge rod.

[0010] Furthermore, the frame is equipped with a vertically movable pressure rod. The pressure rod is positioned above the material tray in the vertical direction and between the feeding mechanism and the solder paste application mechanism in the direction of spring clip movement. When the conveying mechanism steps the spring clip to a position below the pressure rod, the pressure rod moves downwards to press the top of the spring clip within the material hole. By setting the pressure rod, the spring clip's posture can be adjusted before solder paste is applied. The drive unit causes the material tray to rotate stepwise until the material hole carrying the unpainted spring clip reaches below the pressure rod. The pressure rod moves downwards to contact and press the spring clip, preventing it from tilting within the material hole and ensuring stable contact between the bottom of the spring clip and the support plate.

[0011] Furthermore, the frame is equipped with a second detection element, which is located between the ejector and the feeding mechanism in the direction of spring clip movement. This second detection element can detect the unloaded state of the feed hole as it moves away from the pallet and closer to the feeding mechanism. The second detection element is controlled and connected to the drive unit. By setting up the second detection element, it detects whether the spring clip with solder paste applied has detached from the feed hole. When a spring clip with solder paste applied remains in the feed hole, the drive unit stops, allowing operators to perform timely maintenance and preventing multiple spring clips from stacking in one feed hole, thus ensuring the continuity and accuracy of subsequent operations.

[0012] Furthermore, the frame is fixedly equipped with a stop member, which has a stop groove that can avoid the discharge rod. The maximum inner diameter of the stop groove is smaller than the outer diameter of the spring clip, and the maximum inner diameter of the stop groove is larger than the inner diameter of the spring clip. The stop groove is located vertically between the discharge rod and the feed hole that is gradually approaching the discharge rod. By setting the stop member, when the discharge rod moves upward away from the spring clip that has been coated with solder paste, it prevents the discharge rod and the spring clip from sticking together through the solder paste, thus preventing the discharge rod from sticking the spring clip upward. When the spring clip and the discharge rod are stuck together through the solder paste and the spring clip is lifted upward by the discharge rod, the spring clip can abut against the bottom surface of the stop member until the spring clip detaches from the discharge rod and the solder paste on the discharge rod, and the spring clip finally falls back into the feed hole.

[0013] In summary, this utility model has the advantages of reasonable structure and convenient use. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0015] Figure 2 yes Figure 1 Enlarged view of a portion of area A in the middle;

[0016] Figure 3 yes Figure 2 Enlarged view of a section in area B;

[0017] Figure 4 yes Figure 2 A magnified view of a section in area C;

[0018] Figure 5 This is a three-dimensional structural diagram of the stop component;

[0019] Figure 6 It is a three-dimensional structural diagram of the tray and pallet in their combined state;

[0020] Figure 7 yes Figure 6 Enlarged view of a section in area D;

[0021] Figure 8 This is a structural diagram illustrating the explosion effect of the material tray and pallet;

[0022] Figure 9 It is a three-dimensional structural diagram of the frame and the paste application mechanism;

[0023] Figure 10 yes Figure 9 A magnified view of a section in area E;

[0024] Figure 11 This is a schematic diagram of the structure from the front view of this utility model;

[0025] Figure 12 yes Figure 11 Enlarged view of a section in the F region;

[0026] Figure 13 This is a three-dimensional structural diagram of a spring clip with seams;

[0027] In the diagram: 1. Frame; 11. Pressure bar; 12. Second inspection piece; 13. Stop piece; 131. Stop groove; 2. Feeding mechanism; 3. Conveying mechanism; 31. Drive component; 32. Material tray; 321. Material hole; 33. Support plate; 331. Clearance hole; 34. First inspection piece; 4. Paste application mechanism; 41. Sliding frame; 42. Dispensing valve; 421. Discharge rod; 4211. Paste discharge hole; 5. Unloading component; 6. Collection mechanism; 61. Mounting frame; 62. Conveyor belt; 63. Discharge chute. Detailed Implementation

[0028] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention. For ease of understanding, Figure 11 The top part is the top part of this utility model. Figure 11 The bottom part is the bottom part of this utility model. Figure 13 A seam spring buckle, hereinafter referred to as a spring buckle, is shown.

[0029] Reference Figures 1 to 13 This utility model includes a frame 1. The frame 1 is equipped with a feeding mechanism 2 for conveying spring buckles. The feeding mechanism 2 includes a vibratory feeder mounted on the frame 1 and a feed channel connected to the vibratory feeder. The feed channel is roughly inverted L-shaped, rotating up and down. The spring buckles can move from the vibratory feeder onto the feed channel under the action of vibration. The upright spring buckles move along the feed channel, then rotate and lie flat, falling downwards to a designated position. The frame 1 may be equipped with a proximity switch to detect whether a spring buckle has passed on the feed channel. The vibratory feeder and feed channel are common conveying components in the field of spring buckles, and their structural principles are well known to those skilled in the art and will not be described in detail here. The frame 1 is equipped with a conveying mechanism 3 that can receive spring buckles from the feeding mechanism 2 and convey them step by step. The frame 1 is sequentially equipped with a paste application mechanism 4 and a release component 5 along the direction of spring buckle movement. The paste application mechanism 4 applies solder paste to the spring buckles conveyed by the conveying mechanism 3, and the release component 5 allows the spring buckles with applied solder paste to detach from the conveying mechanism 3. A collection mechanism 6 is provided on the side of the frame 1 near the ejector 5. The collection mechanism 6 collects the spring clips that have been ejected from the conveying mechanism 3 and have been coated with solder paste.

[0030] Reference Figures 1 to 12The conveying mechanism 3 includes a drive unit 31 mounted on the frame 1. The drive unit 31 has an output end capable of step-rotation. In this embodiment, the drive unit 31 includes a motor, a camshaft, and a cam divider. The motor drives the camshaft to rotate via a synchronous pulley and belt mechanism. The camshaft drives the cam divider to move via a chain and sprocket mechanism. The output end of the drive unit 31 is the output end of the cam divider. The drive unit 31 can also be a servo motor. The output end of the drive unit 31 is provided with a material tray 32. A support plate 33 located below the material tray 32 is fixed on the frame 1 or the drive unit 31. When using the cam divider, the support plate 33 can be directly fixed to the housing of the cam divider, or it can be directly fixed to the frame 1. The material tray 32 is provided with a plurality of material holes 321. The support plate 33 is provided with a first detection element 34. The first detection element 34 can detect the position of the spring clip in the material hole 321 near the feeding mechanism 2. The first detection element 34 is controlled and connected to the drive unit 31. The first detection component 34 includes a detection rod and a controller. The detection rod is insulated from the support plate 33 via an insulating component. The detection rod is electrically connected to the controller, which controls a motor connected to the drive component 31. The support plate 33 has a through hole for avoiding the detection rod. The top of the detection rod is used to contact a spring buckle that has fallen from the feeding mechanism 2 into a material hole 321 near the feeding mechanism 2. After the top of the detection rod abuts against the spring buckle in place, the controller sends a signal to the drive component 31, and then the drive component 31 causes the material tray 32 to rotate stepwise. The support plate 33 provides bottom support for the spring buckle located in the material hole 321, which has moved from the side near the feeding mechanism 2 to the side near the ejector component 5. Figure 2 The arrows indicate the rotation direction of the tray 32, which is also the direction of movement of the spring clip. The support plate 33 prevents the spring clip from detaching from the feed hole 321 before solder paste is applied.

[0031] Reference Figures 1 to 12By setting the conveying mechanism 3, the driving component 31 can drive the material tray 32 to rotate step by step. When an empty material hole 321 on the material tray 32 reaches a position close to the feeding mechanism 2 through the rotation of the material tray 32, the feeding mechanism 2 delivers a spring buckle to the material hole 321. The first detection component 34 detects that the material hole 321 is carrying material. The first detection component 34 gives the driving component 31 a signal to continue outputting the stepping rotation force. The driving component 31 continues to drive the material tray 32 to rotate step by step until the material hole 321 carrying the spring buckle moves toward the paste application mechanism 4. The spring buckle abuts against the support plate 33 and moves toward the paste application mechanism 4 under the push of the material hole 321. The tray 33 has a clearance hole 331 on the side near the collection mechanism 6. The diameter of the clearance hole 331 is larger than the outer diameter of the spring clip. The clearance hole 331 corresponds vertically to the material hole 321 that moves to the collection mechanism 6. The ejector 5 is rod-shaped and can move up and down. The ejector 5 is located above the clearance hole 331 and corresponds vertically to the clearance hole 331. By setting the clearance hole 331 and the ejector 5, when the spring clip with solder paste is pushed by the material hole 321 on the stepping rotating tray 32 to the clearance hole 331, the ejector 5 moves downward to press down on the top of the spring clip with solder paste in the material hole 321. The spring clip with solder paste is disengaged from the material hole 321 and the clearance hole 331 and is collected by the collection mechanism 6. The ejector 5 ensures that the spring clip with solder paste is stably disengaged from the material hole 321.

[0032] Reference Figures 1 to 12 Preferably, the frame 1 is equipped with a vertically movable pressure rod 11. The pressure rod 11 is located above the material tray 32 in the vertical direction and between the feeding mechanism 2 and the paste application mechanism 4 in the direction of spring clip movement. When the conveying mechanism 3 conveys the spring clip stepwise to below the pressure rod 11, the pressure rod 11 moves downward to press the top of the spring clip in the material hole 321. By setting the pressure rod 11, the pressure rod 11 can adjust the posture of the spring clip before the solder paste is applied. The driving component 31 causes the material tray 32 to rotate stepwise until the material hole 321, which carries the spring clip without solder paste, reaches below the pressure rod 11. The pressure rod 11 moves downward to contact and press the spring clip, preventing the spring clip from tilting in the material hole 321 and ensuring stable contact between the bottom of the spring clip and the support plate 33. In this embodiment, a cam is provided on the camshaft of the drive unit 31, and a rocker arm assembly that cooperates with the cam is provided on the frame 1. The rocker arm assembly passes upward through the cam divider and the material tray 32, and is connected to a crossbar at its upper part. The pressure rod 11 and the ejector 5 are both provided on the crossbar. The pressure rod 11 and the ejector 5 can also be moved up and down reciprocally by a screw and nut mechanism driven by a cylinder or servo motor. Optionally, the crossbar is provided with an insulating seat made of insulating material, and a signal connecting piece made of metal is installed on the insulating seat. The pressure rod 11 is made of metal and is connected to the signal connecting piece. The signal connecting piece is electrically connected to the controller. The pressure rod 11 can not only adjust the posture of the spring buckle by pressing the spring buckle, but also realize the function of detecting materials.

[0033] Reference Figure 1 , Figure 2 , Figures 9 to 12 The paste application mechanism 4 includes a sliding frame 41 mounted on the frame 1, capable of reciprocating up and down. In this embodiment, a cam is also provided on the camshaft of the drive component 31, and a rocker arm assembly that cooperates with the cam is provided on the frame 1. The sliding frame 41 is connected to the rocker arm assembly, and the sliding frame 41 moves up and down through the rocker arm assembly that cooperates with the cam. The sliding frame 41 can also move up and down through a screw and nut mechanism driven by a cylinder or servo motor. The sliding frame 41 is provided with a dispensing valve 42, and the output end of the dispensing valve 42 is provided with a discharge rod 421. The diameter of the discharge rod 421 is adapted to the inner diameter of the spring buckle, and the diameter of the discharge rod 421 is smaller than the inner diameter of the spring buckle to reduce interference between the discharge rod 421 and the spring buckle. When the spring buckle is placed flat on a plane, the projection curve of the spring buckle in the top view includes two arcs with a smaller diameter surrounded by an arc with a larger diameter. The diameter of the smaller diameter arc is the inner diameter of the spring buckle. The discharge rod 421 is provided with several discharge holes 4211. The side of the discharge rod 421 near the discharge holes 4211 can move into the discharge hole 321 under the drive of the sliding frame 41. The top of the discharge rod 421 has a downwardly recessed inner cavity, which is connected to the output end of the dispensing valve 42. The solder paste delivered by the dispensing valve 42 reaches the external environment through the output end of the dispensing valve 42, the inner cavity of the discharge rod 421, and the discharge holes 4211. The dispensing valve 42 provides precise quantitative delivery of the contained solder paste. After the solder paste reaches the discharge rod 421 from the dispensing valve 42, it is squeezed out from the several discharge holes 4211. The several ring-shaped discharge holes 4211 ensure effective application of the solder paste. By setting the sliding frame 41, the sliding frame 41 moves downward so that the dispensing rod 421 on the dispensing valve 42 can approach the spring buckle in the material hole 321, so that the paste dispensing hole 4211 can be aligned with the joint, ensuring the accuracy of the solder paste application position. After the application is completed, the sliding frame 41 moves upward so that the dispensing valve 42 and the dispensing rod 421 are away from the material hole 321 and the spring buckle, avoiding interference between the material tray 32 and the dispensing rod 421.

[0034] Reference Figure 1 , Figure 2 , Figure 11 and Figure 12The collection mechanism 6 includes a mounting frame 61 mounted on the frame 1. The mounting frame 61 has a conveyor belt 62 that can receive spring clips from the clearance hole 331. The conveyor belt 62 can be driven by a motor mounted on the mounting frame 61. The mounting frame 61 has a discharge slide 63 that can receive spring clips from the conveyor belt 62. The discharge slide 63 is inclined downward from the side closer to the conveyor belt 62 to the side farther away from the conveyor belt 62. By setting up the collection mechanism 6, the conveyor belt 62 receives the spring clips with solder paste applied from the clearance hole 331 and transfers the spring clips to the discharge slide 63. The discharge slide 63 receives the spring clips from the conveyor belt 62 and causes the spring clips to slide down in a direction under the action of gravity to an external collection container, thereby achieving stable collection of spring clips with solder paste applied.

[0035] Reference Figures 1 to 5 , Figure 11 and Figure 12 Preferably, the frame 1 is equipped with a second detection element 12, which is located between the ejector 5 and the feeding mechanism 2 in the direction of spring clip movement. The second detection element 12 can detect the unloaded state of the material hole 321, which is moving away from the pallet 33 and closer to the feeding mechanism 2. The second detection element 12 is controlled and connected to the drive unit 31. The second detection element 12 can be a commonly available detection sensor. By setting the second detection element 12, the second detection element 12 detects whether the spring clip with solder paste has detached from the material hole 321. When the spring clip with solder paste remains in the material hole 321, the drive unit 31 stops, allowing operators to perform timely maintenance and avoiding the situation where multiple spring clips are stacked in one material hole 321, thus ensuring the continuity and accuracy of subsequent operations. Preferably, the frame 1 is fixedly provided with a stop member 13. The stop member 13 has a stop groove 131 that can avoid the discharge rod 421. The maximum inner diameter of the stop groove 131 is smaller than the outer diameter of the spring buckle, and the maximum inner diameter of the stop groove 131 is larger than the inner diameter of the spring buckle. The stop groove 131 is located between the discharge rod 421 and the feed hole 321 that is stepping closer to the discharge rod 421. By setting the stop member 13, when the discharge rod 421 moves upward away from the spring buckle that has been coated with solder paste, it is prevented that the discharge rod 421 and the spring buckle will stick together with the solder paste, so that the discharge rod 421 will stick the spring buckle upward. When the spring buckle and the discharge rod 421 are stuck together with the solder paste and the spring buckle is lifted upward by the discharge rod 421, the spring buckle can abut against the bottom surface of the stop member 13 until the spring buckle is separated from the discharge rod 421 and the solder paste on the discharge rod 421. The spring buckle finally falls back into the feed hole 321.

[0036] In use, the feeding mechanism 2 feeds the spring clips to the conveying mechanism 3. After the conveying mechanism 3 carries the spring clips, it first steps them to the paste-applying mechanism 4, where solder paste is applied to the spring clips. Then, the conveying mechanism 3 steps the solder-applied spring clips to the ejector 5, which detaches the spring clips from the conveying mechanism 3. The collecting mechanism 6 then collects the solder-applied spring clips that have detached from the conveying mechanism 3. This achieves automatic application of solder paste to the seams of the seamed spring clips, improving overall work efficiency compared to manual application. In summary, this invention has advantages such as reasonable structure and ease of use.

[0037] The above description is merely an example and illustration of the structure of this utility model. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the structure of the utility model or exceed the scope defined by the claims of this patent, they should all fall within the protection scope of this utility model.

Claims

1. A machine for spot welding spring hasp with seam, comprising a frame (1) provided with a feeding mechanism (2) for feeding spring hasp, characterized in that: The frame (1) is provided with a conveying mechanism (3) that can receive spring buckles from the feeding mechanism (2) and convey the spring buckles step by step. The frame (1) is provided with a paste application mechanism (4) and a release member (5) in sequence along the moving direction of the spring buckles. The paste application mechanism (4) applies solder paste to the spring buckles conveyed by the conveying mechanism (3). The release member (5) can make the spring buckles after applying solder paste detach from the conveying mechanism (3). The frame (1) is provided with a collection mechanism (6) on the side near the release member (5). The collection mechanism (6) collects the spring buckles that have detached from the conveying mechanism (3) and have been coated with solder paste in a directional manner.

2. The seamless spring clip welding paste machine according to claim 1, characterized in that: The conveying mechanism (3) includes a drive member (31) mounted on a frame (1). The drive member (31) has an output end that can rotate in steps. The output end of the drive member (31) is provided with a material tray (32). A support plate (33) located below the material tray (32) is fixed on the frame (1) or the drive member (31). The material tray (32) is provided with a plurality of material holes (321). The support plate (33) is provided with a first detection element (34). The first detection element (34) can detect the position of the spring buckle in the material hole (321) near the feeding mechanism (2). The first detection element (34) is controlled to be connected to the drive member (31). The support plate (33) provides bottom support for the spring buckle located in the material hole (321) that moves from the side near the feeding mechanism (2) to the side near the ejector (5).

3. The welded spring clip spot welding paste machine according to claim 2, characterized in that: The pallet (33) has a clearance hole (331) on the side near the collection mechanism (6). The diameter of the clearance hole (331) is larger than the outer diameter of the spring buckle. The clearance hole (331) corresponds vertically to the material hole (321) that moves to the collection mechanism (6) by stepping. The ejector (5) is rod-shaped and can move up and down. The ejector (5) is located above the clearance hole (331) and corresponds vertically to the clearance hole (331).

4. The welded spring clip spot welding paste machine according to claim 3, characterized in that: The collecting mechanism (6) includes a mounting frame (61) on the frame (1), the mounting frame (61) having a conveyor belt (62) that can receive spring buckles from the clearance hole (331), the mounting frame (61) having a discharge slide (63) that can receive spring buckles from the conveyor belt (62), the discharge slide (63) being inclined downward from the side closer to the conveyor belt (62) to the side farther away from the conveyor belt (62).

5. The welded spring clip soldering paste machine according to claim 2, characterized in that: The paste application mechanism (4) includes a sliding frame (41) mounted on the frame (1) and capable of reciprocating up and down. The sliding frame (41) is equipped with a dispensing valve (42). The output end of the dispensing valve (42) is equipped with a discharge rod (421). The diameter of the discharge rod (421) is adapted to the inner diameter of the spring buckle. The discharge rod (421) is provided with a plurality of paste outlet holes (4211). The side of the discharge rod (421) near the paste outlet hole (4211) can move into the paste hole (321) under the drive of the sliding frame (41).

6. The seamless spring clip welding paste machine according to claim 2, characterized in that: The frame (1) is provided with a pressure rod (11) that can move up and down. The pressure rod (11) is located above the material tray (32) in the vertical direction. The pressure rod (11) is located between the feeding mechanism (2) and the paste application mechanism (4) in the spring buckle moving direction. When the conveying mechanism (3) steps the spring buckle to the bottom of the pressure rod (11), the pressure rod (11) moves down to the top of the spring buckle in the pressing material hole (321).

7. The seamless spring clip welding paste machine according to claim 2, characterized in that: The frame (1) is provided with a second detection element (12). The second detection element (12) is located between the ejector (5) and the feeding mechanism (2) in the direction of spring buckle movement. The second detection element (12) can detect the empty state of the material hole (321) that is moving away from the pallet (33) and close to the feeding mechanism (2). The second detection element (12) is controlled and connected to the drive element (31).

8. The welded spring clip soldering paste machine according to claim 5, characterized in that: The frame (1) is fixedly provided with a stop (13), the stop (13) is provided with a stop groove (131) that can avoid the discharge rod (421), the maximum inner diameter of the stop groove (131) is smaller than the outer diameter of the spring buckle, the maximum inner diameter of the stop groove (131) is larger than the inner diameter of the spring buckle, and the stop groove (131) is located between the discharge rod (421) and the material hole (321) that is stepping close to the discharge rod (421) in the vertical position.

Images