Electronic substrate device

Abstract

As an example, we aim to obtain an electronic circuit board device that can prevent electronic components from detaching from the substrate even if the solder melts. [Solution] An electronic substrate device according to the embodiment includes, as an example, an electronic component having a first electrode and a second electrode; a substrate having a first pad, a second pad, and a land at least partially lower than the highest position of the first pad and the second pad; a first soldering material connecting the first electrode and the first pad; a second soldering material connecting the second electrode and the second pad; and a third soldering material adhering to the land. When the first soldering material and the second soldering material melt due to the heat generated by the electronic component when current is applied, the electronic component moves relative to the substrate such that it is electrically separated from at least one of the first pad and the second pad, and the first electrode or the second electrode comes into contact with the third soldering material.

Claims

1. An electronic component having a first electrode and a second electrode, A substrate having a surface oriented in a direction intersecting the vertical direction, a first pad provided on the surface, a second pad provided on the surface, and a land provided on the surface and at least partially located lower than the highest position of the first pad and the second pad, A first solder that connects the first electrode and the first pad, A second solder that connects the second electrode and the second pad, A third solder that adheres to the aforementioned land and is separated from the aforementioned electronic component, It is equipped with, When the first solder and the second solder melt due to the heat generated by the electronic component when current is applied, the electronic component moves relative to the substrate, at least by gravity, such that it is electrically separated from at least one of the first pad and the second pad, and the first electrode or the second electrode comes into contact with the third solder. When the electronic component is electrically isolated from at least one of the first pad and the second pad and electrically connected to the land, the current flowing through the electronic component is limited to zero, or to an amount such that the temperature of the electronic component is lower than the melting point of the first solder, the second solder, and the third solder. Electronic board equipment.

2. The aforementioned land has a plurality of partitioned lands that are spaced apart from each other. The third solder has a plurality of segmented solders, each of which is attached to one of the plurality of segmented lands. The electronic circuit board apparatus according to claim 1.

3. When the first solder and the second solder melt due to the heat generated by the electronic component when current is applied, the electronic component moves relative to the substrate, at least by gravity, such that the first electrode remains bonded to the first pad by the first solder while the second electrode is electrically separated from the second pad. The land is located on a virtual circle that extends around a point on the first pad and passes through a point on the second pad. The electronic circuit board apparatus according to claim 1.

4. The distance around a point on the first pad between the second pad and the land is greater than the maximum length of the second electrode. The electronic circuit board apparatus according to claim 3.

5. When the first solder and the second solder melt due to the heat generated by the electronic component when an electric current is applied, the electronic component moves in the first direction, at least by gravity. The land tapers in a second direction opposite to the first direction. The electronic circuit board apparatus according to claim 1.

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