Ultrasonic consolidation graphite-reinforced copper-aluminum gradient composite functional structure

By using ultrasonic consolidation technology to form a copper-aluminum gradient composite structure, embedding graphite rods and three-dimensional flow channels, the problems of interface compound formation and defects are solved, and efficient thermal management of copper-aluminum composite materials is achieved, which is suitable for electronic equipment and new energy devices.

CN224375075UActive Publication Date: 2026-06-19YANTAI IND RES XINHE NEW MATERIAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
YANTAI IND RES XINHE NEW MATERIAL CO LTD
Filing Date
2025-07-07
Publication Date
2026-06-19

AI Technical Summary

⚠Technical Problem

Existing technologies for copper-aluminum composites suffer from the problem of intermetallic compound formation at the interface, which affects bonding strength and thermal conductivity. Furthermore, traditional melt-forming processes are prone to generating pores and cracks, making it difficult to achieve non-destructive embedded fabrication of the second phase and failing to meet the requirements for efficient thermal management.

⚗Method used

A copper-aluminum gradient composite structure is formed using ultrasonic consolidation technology, with embedded graphite rods, combined with three-dimensional flow channels and heat dissipation fins. Low-temperature solid-phase bonding is used to avoid the formation of intermetallic compounds, integrating liquid cooling and air cooling systems.

🎯Benefits of technology

It achieves high thermal conductivity (300W/(m・K) and low density (60% pure copper), making it suitable for efficient thermal management of electronic equipment and new energy devices, and has significant engineering application value.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses an ultrasonically consolidated graphite-reinforced copper-aluminum gradient composite functional structure, comprising a layered matrix formed by alternating consolidation of aluminum and copper layers, and a graphite rod embedded in the layered matrix. The layered matrix has a three-dimensional flow channel structure internally, and heat dissipation fins are disposed on its surface. The layered matrix is ​​fabricated using an ultrasonic consolidation device. By alternately consolidating copper and aluminum foil to form the layered matrix, and integrating internal cooling channels and external heat dissipation fins, it achieves coordinated heat dissipation through liquid and air cooling. This structure utilizes ultrasonic low-temperature solid-state bonding technology to avoid the formation of intermetallic compounds, and possesses high thermal conductivity, low density, and multifunctional heat dissipation characteristics. It is suitable for efficient thermal management in fields such as electronic equipment and new energy devices, and its manufacturing process is simple with significant engineering application value.
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