Shock isolation packaging device for chip transport

Abstract

This utility model relates to the field of chip transportation technology, and discloses a shock-absorbing packaging device for chip transportation. The device includes a transport box with a chip drawer inside. The chip drawer is equipped with a shock-absorbing mechanism for clamping and isolating the chips by inflating them. A clamping plate is rotatably disposed within the chip drawer. A cavity is formed inside the clamping plate, and a movable slot is formed at the bottom of the clamping plate, communicating with the inner cavity of the clamping plate. A diaphragm is fixedly connected inside the movable slot. This shock-absorbing packaging device for chip transportation utilizes a clamping plate rotatably connected to a rotating rod fixedly connected inside the chip drawer, with a cavity, a movable slot, and a diaphragm at its bottom. An air inlet valve and an air outlet valve are also provided at the top of the clamping plate to facilitate inflating the cavity and using the expansion of the diaphragm to fix and isolate the chips.

Description

Technical Field

[0001] This utility model relates to the field of chip transportation technology, specifically to a shock-absorbing packaging device for chip transportation. Background Technology

[0002] A chip, also known as an integrated circuit, is a miniature electronic device that integrates a large number of electronic components onto a tiny semiconductor material. Chips are the core of modern electronic devices and are widely used in computers, mobile phones, automobiles, home appliances, medical equipment and other fields. After chip production is completed, they are mostly fixed in slotted cardboard or plastic sheets and then packed for transportation.

[0003] The aforementioned device lacks a structure for chip-assisted fixing and shock-proof transportation. As a result, while the grooved cardboard and plastic sheet can provide fixation for the chip during transportation, the fixation of the chip's upper surface is still lacking, and the shock-proof effect during chip transportation is poor. Based on the shortcomings of existing technology, this utility model designs a shock-proof packaging device for chip transportation. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a shock-absorbing packaging device for chip transportation, which has the advantages of chip-assisted fixing and shock-absorbing transportation.

[0005] This utility model provides the following technical solution: a shock-absorbing packaging device for chip transportation, including a transport box, wherein a chip drawer is provided inside the transport box, and a shock-absorbing mechanism is provided on the chip drawer to facilitate inflation and clamping and shock-absorbing of the chip;

[0006] A vibration isolation mechanism includes a clamping plate, a cavity, a movable groove, a diaphragm, an air inlet valve, an air outlet valve, a pull bar, and a locking groove. The clamping plate is rotatably mounted inside the chip drawer. The cavity is located inside the clamping plate. The movable groove is located at the bottom of the clamping plate and communicates with the inner cavity of the clamping plate. The diaphragm is fixedly connected inside the movable groove. The air inlet valve is located on the upper surface of the clamping plate. The air outlet valve is located on the upper surface of the clamping plate. The pull bar is fixedly connected to the upper surface of the clamping plate. The locking groove is located on one side of the clamping plate.

[0007] As a preferred embodiment of this utility model, the bottom of the inner cavity of the chip drawer is provided with a fixing groove, the inner side of the chip drawer is provided with a spring locking tongue, the outer side of the chip drawer is fixedly connected with a second pull ring, and the inner side of the chip drawer is fixedly connected with a rotating rod.

[0008] As a preferred embodiment of this utility model, a slot is provided on one side of the transport box, and hinge seats are fixedly connected to both sides of the transport box. A card plate is rotatably connected inside the hinge seat, and a first pull ring is fixedly connected to the card plate.

[0009] In a preferred embodiment of this invention, the movable groove is positioned above the fixed groove, and the diaphragm is positioned above the fixed groove.

[0010] In a preferred embodiment of this utility model, the clamping plate is rotatably connected to the rotating rod, and the inner cavities of the intake valve and exhaust valve are connected to the cavity.

[0011] As a preferred embodiment of this invention, the chip drawer is disposed inside the slot.

[0012] As a preferred embodiment of this utility model, the spring locking tongue is movably engaged inside the lock groove.

[0013] As a preferred embodiment of this utility model, the outer side of the chip drawer is provided with a snap-fit ​​groove, and the snap-fit ​​groove on the outer side of the chip drawer is snapped into the card plate.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] This shock-absorbing packaging device for chip transportation involves placing the chip in a fixed slot and rotating a clamping plate to cover the slot and chip, securing it with a spring-loaded latch and locking groove. Then, an air injection pipe is connected to an air inlet valve for air injection. As the gas enters the cavity, the increased pressure compresses the diaphragm, causing it to expand outwards. The expanded diaphragm contacts the upper surface of the chip in the fixed slot, clamping and securing the chip using the slot and diaphragm. Simultaneously, during strong bumps, the diaphragm absorbs some vibration, reducing the chip's swaying arc and frequency within the fixed slot. Finally, the chip tray and chip are inserted into the slot and locked using a locking plate for transport. This device facilitates shock isolation and improves the securing effect during chip transportation. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the main structure of the chip transport shock-absorbing package of this utility model;

[0018] Figure 3 This is a schematic diagram of the connection structure of the transport box and slot of this utility model;

[0019] Figure 4 This is a schematic diagram of the internal structure of the chip drawer and fixing slot of this utility model;

[0020] Figure 5 This is a cross-sectional view of the chip drawer and vibration isolation mechanism of this utility model.

[0021] Figure 6 This is a schematic diagram of the clamping plate of this utility model viewed from below.

[0022] In the diagram: 1. Transport box; 101. Slot; 102. Hinge seat; 103. Card plate; 104. First pull ring; 2. Chip drawer; 201. Fixing slot; 202. Spring locking tongue; 203. Second pull ring; 204. Rotating rod; 3. Vibration isolation mechanism; 301. Clamping plate; 302. Cavity; 303. Movable slot; 304. Diaphragm; 305. Inlet valve; 306. Exhaust valve; 307. Pull bar; 308. Locking groove. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-6 A shock-absorbing packaging device for transporting chips includes a transport box 1, a chip drawer 2 inside the transport box 1, a shock-absorbing mechanism 3 on the chip drawer 2 for easy inflation to clamp and isolate the chips, a slot 101 on one side of the transport box 1, and hinge seats 102 fixedly connected to both sides of the transport box 1. A card plate 103 is rotatably connected inside the hinge seat 102, and a first pull ring 104 is fixedly connected to the card plate 103.

[0025] Please see Figure 5-6 The vibration isolation mechanism 3 includes a clamping plate 301, a cavity 302, a movable groove 303, a diaphragm 304, an air inlet valve 305, an air outlet valve 306, a pull bar 307, and a locking groove 308. The clamping plate 301 is rotatably disposed within the chip drawer 2. The cavity 302 is formed inside the clamping plate 301. The movable groove 303 is formed at the bottom of the clamping plate 301, and the cavity 302 communicates with the inner cavity of the clamping plate 301. The diaphragm 304 is fixedly connected to the inside of the movable groove 303. An intake valve 305 is located on the upper surface of a clamping plate 301, an exhaust valve 306 is located on the upper surface of a clamping plate 301, a pull bar 307 is fixedly connected to the upper surface of a clamping plate 301, a locking groove 308 is opened on one side of a clamping plate 301, a movable groove 303 is located above a fixed groove 201, a diaphragm 304 is located above a fixed groove 201, a clamping plate 301 is rotatably connected to a rotating rod 204, and the inner cavities of the intake valve 305 and the exhaust valve 306 are connected to a cavity 302.

[0026] By setting up a clamping plate 301, a pull bar 307, and a locking groove 308, with the locking groove 308 connected to a spring locking tongue 202, the clamping plate 301 is placed over the fixing groove 201 to prevent the chip from falling out of the chip drawer 2 and the fixing groove 201. By setting up a cavity 302, a movable groove 303, and a diaphragm 304, the air pressure in the cavity 302 is used to control the expansion of the diaphragm 304, thereby squeezing and fixing the chip in the fixing groove 201. By setting up an air inlet valve 305 and an air outlet valve 306, the air in the cavity 302 is filled and released, thereby controlling the expansion range of the diaphragm 304 and the strength of the squeezing and clamping fixation.

[0027] Please see Figure 4 The bottom of the inner cavity of the chip drawer 2 is provided with a fixing groove 201. The inner side of the chip drawer 2 is provided with a spring locking tongue 202. The outer side of the chip drawer 2 is fixedly connected with a second pull ring 203. The inside of the chip drawer 2 is fixedly connected with a rotating rod 204. The chip drawer 2 is inserted into the slot 101. The spring locking tongue 202 is movably engaged in the lock groove 308. The outer side of the chip drawer 2 is provided with a snap-fit ​​groove, and the snap-fit ​​groove on the outer side of the chip drawer 2 is engaged with the card plate 103.

[0028] By setting a fixing groove 201, the chip can be positioned and fixed. By setting a spring locking tongue 202, the opening and closing of the vibration isolation mechanism 3 can be controlled, thereby controlling the fixing of the chip in the fixing groove 201. By setting a snap-fit ​​groove on the outside of the chip drawer 2, and the snap-fit ​​groove is connected to the slot 101, the chip drawer 2 inserted in the slot 101 can be fixed.

[0029] Working principle: When a chip transport shockproof packaging device is used, in the initial state, the slot 101 is first opened on the front of the transport box 1. The chip drawer 2, which is inserted into the slot 101, has a fixed groove 201. The chip drawer 2 is held by the hinge seats 102 and the card plate 103 on both sides of the transport box 1, so as to place the chip in the transport box 1 for protective transport. The clamping plate 301, which is rotatably connected to the rotating rod 204 fixedly connected in the chip drawer 2, has a cavity 302, a movable groove 303 and a diaphragm 304 inside and at the bottom. The top of the clamping plate 301 is also provided with an air inlet valve 305 and an air outlet valve 306, so as to inflate the cavity 302 and use the expansion of the diaphragm 304 to fix and isolate the chip.

[0030] When it is necessary to improve the fixation effect by isolating the chip during transportation, firstly, place the chip in the fixing slot 201 and rotate the clamping plate 301 to cover the fixing slot 201 and the chip, and fix it with the spring locking tongue 202 and locking groove 308. Then, connect the air injection pipe to the air inlet valve 305 and perform air injection. After the gas enters the cavity 302, the pressure increases and squeezes the diaphragm 304 to expand outward. The outwardly expanded diaphragm 304 contacts the upper surface of the chip in the fixing slot 201. The chip is clamped and fixed by the fixing slot 201 and the diaphragm 304. At the same time, when strong bumps occur, the diaphragm 304 can absorb a certain amount of vibration and reduce the arc and frequency of the chip shaking in the fixing slot 201. Finally, insert the chip drawer 2 and the chip into the slot 101 and lock it with the locking plate 103 for transportation. This device facilitates the improvement of the fixation effect by isolating the chip during transportation.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A shock isolation packaging device for chip transport, comprising a transport case (1), characterized in that: The transport box (1) is equipped with a chip drawer (2), and the chip drawer (2) is equipped with a shock-absorbing mechanism (3) that facilitates the inflation of air to clamp and isolate the chip. The vibration isolation mechanism (3) includes a clamping plate (301), a cavity (302), a movable groove (303), a diaphragm (304), an air inlet valve (305), an air outlet valve (306), a pull bar (307), and a locking groove (308). The clamping plate (301) is rotatably disposed within the chip drawer (2). The cavity (302) is formed inside the clamping plate (301), and the movable groove (303) is formed within the clamping plate (301). The bottom of the cavity (302) is connected to the inner cavity of the clamping plate (301). The diaphragm (304) is fixedly connected to the inside of the movable groove (303). The air inlet valve (305) is located on the upper surface of the clamping plate (301). The exhaust valve (306) is located on the upper surface of the clamping plate (301). The pull bar (307) is fixedly connected to the upper surface of the clamping plate (301). The locking groove (308) is opened on one side of the clamping plate (301).

2. The shock-absorbing packaging device for chip transportation according to claim 1, characterized in that: The chip drawer (2) has a fixing groove (201) at the bottom of its inner cavity, a spring locking tongue (202) on the inner side of the chip drawer (2), a second pull ring (203) fixedly connected to the outer side of the chip drawer (2), and a rotating rod (204) fixedly connected to the inside of the chip drawer (2).

3. The shock-absorbing packaging device for chip transportation according to claim 1, characterized in that: A slot (101) is provided on one side of the transport box (1), and hinge seats (102) are fixedly connected to both sides of the transport box (1). A card plate (103) is rotatably connected inside the hinge seat (102), and a first pull ring (104) is fixedly connected to the card plate (103).

4. The shock-absorbing packaging device for chip transportation according to claim 1, characterized in that: The movable groove (303) is disposed above the fixed groove (201), and the diaphragm (304) is disposed above the fixed groove (201).

5. The shock-absorbing packaging device for chip transportation according to claim 1, characterized in that: The clamping plate (301) is rotatably connected to the rotating rod (204), and the inner cavities of the intake valve (305) and exhaust valve (306) are connected to the cavity (302).

6. The shock-absorbing packaging device for chip transportation according to claim 2, characterized in that: The chip drawer (2) is inserted into the slot (101).

7. The shock-absorbing packaging device for chip transportation according to claim 2, characterized in that: The spring latch (202) is movably engaged inside the lock groove (308).

8. The shock-absorbing packaging device for chip transportation according to claim 2, characterized in that: The chip drawer (2) has a snap-fit ​​groove on its outer side, and the snap-fit ​​groove on the outer side of the chip drawer (2) is snapped into the card plate (103).

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