Double-sided anti-static structure of high-temperature-resistant polyimide adhesive tape
By constructing nano-metal oxides, metal fiber weaving, and conductive polymer antistatic layers on both sides of polyimide tape, the problem of antistatic and adhesive performance failure at high temperatures is solved, achieving all-round electrostatic protection and stable adhesion in high-temperature environments, thus broadening the application fields.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- PREMIER PRINTING TECH (SUZHOU) CO LTD
- Filing Date
- 2024-12-18
- Publication Date
- 2026-06-19
AI Technical Summary
Existing polyimide tapes are prone to failure in antistatic and adhesive properties under high-temperature environments, failing to provide comprehensive electrostatic protection and stable adhesion, thus affecting the safety and reliability of electronic components and aerospace applications.
A comprehensive antistatic system is constructed on both sides of the polyimide tape, including a nano-metal oxide antistatic layer, a metal fiber braided antistatic layer, a conductive polymer antistatic layer, and a high-temperature stable adhesive layer. By combining various high-temperature resistant materials and through reasonable structural design and composite process, the antistatic and adhesive properties are maintained at high temperatures.
At a high temperature of 350℃, the double-sided antistatic performance of the tape changes by no more than 8%, and the adhesion remains at more than 70% of its initial value, providing comprehensive electrostatic protection and stable bonding performance. It is suitable for extreme environments such as high-temperature electronic manufacturing and aerospace.
Smart Images
Figure CN224377950U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of high-temperature resistant tape technology, and in particular to a double-sided antistatic structure of a high-temperature resistant polyimide tape. Background Technology
[0002] In today's advanced manufacturing fields such as electronics, aerospace, and automobile manufacturing, the requirements for the antistatic and high-temperature resistance of materials are becoming increasingly stringent. Polyimide tape is widely used due to its good mechanical properties, chemical stability, and certain high-temperature resistance. However, traditional polyimide tape has obvious limitations in terms of antistatic properties.
[0003] Many existing polyimide tapes either lack anti-static capabilities altogether, making them highly susceptible to damage during the processing, transportation, and assembly of electronic components due to static electricity buildup. For example, in the manufacturing workshop of very large-scale integrated circuits, even minute electrostatic discharges can cause chip failure. While some polyimide tapes do offer anti-static properties, they often focus only on single-sided anti-static design. In practical applications, static electricity can still be generated and accumulated when the non-anti-static side of the tape rubs or comes into contact with other objects, failing to provide comprehensive and effective anti-static protection for the entire working environment and the electronic devices involved. While providing protection, existing technologies have also failed to adequately address the synergistic effect of high-temperature resistance and antistatic properties. Many traditional antistatic coatings undergo chemical structural changes or decomposition at high temperatures, resulting in a sharp decline or even complete loss of their antistatic properties. Similarly, conventional adhesives experience a significant reduction in adhesion under high-temperature conditions, causing the tape to fail to adhere firmly to the surface of the object being bonded, severely impacting product reliability and safety. For instance, in the electronic control systems of aero-engines, the failure of the antistatic and adhesive properties of ordinary antistatic polyimide tapes under high-temperature environments could lead to serious safety hazards.
[0004] To address this, a double-sided antistatic structure for high-temperature resistant polyimide tape is proposed. Utility Model Content
[0005] The purpose of this invention is to provide a double-sided antistatic structure for high-temperature resistant polyimide tape, which can solve the problem that the structure may change under high temperature, resulting in reduced adhesion or antistatic performance in the prior art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a double-sided antistatic structure for a high-temperature resistant polyimide tape, comprising a polyimide main layer, a nano-metal oxide antistatic layer on the outer side of the polyimide main layer, a metal fiber woven antistatic layer on the outer side of the nano-metal oxide antistatic layer, a high-temperature resistant protective coating on the outer side of the metal fiber woven antistatic layer, a conductive polymer antistatic layer on the inner side of the polyimide main layer, a high-temperature stable adhesive layer on the inner side of the conductive polymer antistatic layer, and a release paper layer on the inner side of the high-temperature stable adhesive layer.
[0007] Preferably, the nano-metal oxide antistatic layer is made of titanium dioxide material, with a nanoparticle ratio of 15%-35%, a thickness of 3-10 μm, and a surface resistivity between 10^6-10^9 Ω / sq.
[0008] Preferably, the metal fiber woven antistatic layer is woven from stainless steel fibers with a fiber diameter of 5-20 μm, a mesh size of 0.3-1.5 mm, and a thickness of 5-15 μm.
[0009] Preferably, the high-temperature resistant protective coating is a polytetrafluoroethylene coating with a thickness of 2-8 μm, and can withstand a maximum temperature of not less than 380°C.
[0010] Preferably, the conductive polymer antistatic layer is made of polyaniline, with a thickness of 4-12 μm and a surface resistivity between 10^5-10^8 Ω / sq.
[0011] Preferably, the high-temperature stable adhesive layer is a silicone-modified phenolic adhesive with a thickness of 18-50 μm and an adhesion retention rate of not less than 75% at a high temperature of 320℃.
[0012] Preferably, the polyimide main layer has a thickness of 25-100 μm, a tensile strength of not less than 220 MPa, and an elongation at break of not less than 35%.
[0013] Preferably, the nano-metal oxide antistatic layer is composited with the polyimide main layer, the metal fiber braided antistatic layer with the nano-metal oxide antistatic layer, and the high-temperature resistant protective coating with the metal fiber braided antistatic layer through a hot-pressing process, and the adhesion of the composite is not less than 1.8 N / cm; the conductive polymer antistatic layer is composited with the polyimide main layer, the high-temperature stable adhesive layer with the conductive polymer antistatic layer through a UV curing process, and the adhesion of the composite is not less than 2 N / cm.
[0014] Preferably, the release paper layer has a peel force of 3-15 N / m and high temperature resistance, and does not deform at 200°C.
[0015] Preferably, after being placed in a high-temperature environment of 350°C for 1.5 hours, the change rate of the double-sided antistatic properties of the high-temperature resistant polyimide tape does not exceed 8%, the overall structure of the tape is not significantly damaged, and the adhesion remains at more than 70% of the initial adhesion.
[0016] Compared with the prior art, the beneficial effects of this utility model are:
[0017] 1. This application constructs a complete antistatic system on the upper and lower surfaces of the polyimide main layer, namely, a nano-metal oxide antistatic layer combined with a metal fiber braided antistatic layer on the upper surface, and a conductive polymer antistatic layer on the lower surface. This effectively suppresses the generation and accumulation of static electricity in all application scenarios and contact surfaces of the tape, providing comprehensive and seamless electrostatic protection for electronic components, precision equipment, etc., completely solving the limitations of traditional single-sided antistatic tapes. It adopts a variety of high-temperature resistant materials, such as the polyimide main layer, a high-temperature resistant protective coating, and a high-temperature stable adhesive layer. Through reasonable structural design and composite process, the tape can maintain stable antistatic, mechanical, and adhesive properties even at a high temperature of 350℃. This effectively overcomes the problem of easy failure of antistatic and adhesive properties at high temperatures in existing technologies, greatly expanding the application fields of the tape and meeting the usage requirements in extreme environments such as high-temperature electronic manufacturing and aerospace. Attached Figure Description
[0018] Figure 1 This is an overall structural diagram of the double-sided antistatic structure of the high-temperature resistant polyimide tape of this utility model.
[0019] Figure 2 This is a schematic diagram of the outer layer of this utility model;
[0020] Figure 3 This is a schematic diagram of the inner layer structure of this utility model;
[0021] Figure 4 This is a schematic diagram of the main structure of this utility model.
[0022] In the diagram, 1. Polyimide substrate layer; 2. Nano-metal oxide antistatic layer; 3. Metal fiber woven antistatic layer; 4. High-temperature resistant protective coating; 5. Conductive polymer antistatic layer; 6. High-temperature stable adhesive layer; 7. Release paper layer. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] Please see Figure 1-4 The present invention provides the following technical solution:
[0025] A double-sided antistatic structure of a high-temperature resistant polyimide tape includes a polyimide main layer 1, a nano-metal oxide antistatic layer 2 on the outer side of the polyimide main layer 1, a metal fiber braided antistatic layer 3 on the outer side of the nano-metal oxide antistatic layer 2, a high-temperature resistant protective coating 4 on the outer side of the metal fiber braided antistatic layer 3, a conductive polymer antistatic layer 5 on the inner side of the polyimide main layer 1, a high-temperature stable adhesive layer 6 on the inner side of the conductive polymer antistatic layer 5, and a release paper layer 7 on the inner side of the high-temperature stable adhesive layer 6.
[0026] In this embodiment, by constructing a complete antistatic system on the upper and lower surfaces of the polyimide main layer 1, namely, combining the nano-metal oxide antistatic layer 2 and the metal fiber braided antistatic layer 3 on the upper surface, and the conductive polymer antistatic layer 5 on the lower surface, the generation and accumulation of static electricity can be effectively suppressed in all application scenarios and contact surfaces of the tape. This provides all-round, all-around antistatic protection for electronic components, precision equipment, etc., completely solving the limitations of traditional single-sided antistatic tapes. By using a variety of high-temperature resistant materials, such as the polyimide main layer 1, the high-temperature resistant protective coating 4, and the high-temperature stable adhesive layer 6, and through reasonable structural design and composite process, the tape can still maintain stable antistatic performance, mechanical properties, and adhesive properties at a high temperature of 350℃. This effectively overcomes the problem of easy failure of antistatic performance and adhesive properties at high temperatures in the prior art, greatly expanding the application field of the tape and meeting the usage requirements in extreme environments such as high-temperature electronic manufacturing and aerospace.
[0027] Specifically, such as Figure 1 , Figure 2 , Figure 4 As shown, the nano-metal oxide antistatic layer 2 is made of titanium dioxide material, with a nanoparticle ratio of 15%-35%, a thickness of 3-10μm, and a surface resistivity between 10^6-10^9Ω / sq.
[0028] Specifically, such as Figure 1 , Figure 2 , Figure 4As shown, the metal fiber woven antistatic layer 3 is woven from stainless steel fibers with a fiber diameter of 5-20μm, a mesh size of 0.3-1.5mm, and a thickness of 5-15μm.
[0029] Specifically, such as Figure 1 , Figure 2 , Figure 4 As shown, the high-temperature resistant protective coating 4 is a polytetrafluoroethylene coating with a thickness of 2-8μm, and can withstand a maximum temperature of not less than 380℃.
[0030] In this embodiment: the nano-metal oxide antistatic layer 2 utilizes the semiconductor properties of nano-metal oxides to effectively dissipate static electricity, and the presence of high-temperature resistant resin ensures its stability in high-temperature environments. The mesh structure woven from metal fibers can form an efficient conductive path, further enhancing the antistatic effect. Its good high-temperature resistance and mechanical properties provide strong support for the tape as a whole. The polytetrafluoroethylene coating or ceramic coating mainly protects the internal antistatic structure from external factors such as high temperature, wear, and chemical corrosion, greatly extending the service life and application range of the tape.
[0031] Specifically, such as Figure 1 , Figure 3 , Figure 4 As shown, the conductive polymer antistatic layer 5 is made of polyaniline, with a thickness of 4-12 μm and a surface resistivity between 10^5-10^8 Ω / sq.
[0032] Specifically, such as Figure 1 , Figure 3 , Figure 4 As shown, the high-temperature stable adhesive layer 6 is an organosilicon-modified phenolic adhesive with a thickness of 18-50 μm and an adhesion retention rate of not less than 75% at a high temperature of 320℃.
[0033] In this embodiment: the conductive polymer antistatic layer 5 has good flexibility and antistatic properties, which can effectively prevent the generation and accumulation of static electricity on the lower surface. The high-temperature stable adhesive layer 6 can still maintain high adhesion at high temperatures, ensuring that the tape can be firmly adhered to the object and meet the requirements for use in high-temperature environments.
[0034] Specifically, such as Figure 1 As shown, the thickness of the polyimide main layer 1 is 25-100μm, the tensile strength is not less than 220MPa, and the elongation at break is not less than 35%.
[0035] Specifically, such as Figure 2 , Figure 3 , Figure 4As shown, the nano-metal oxide antistatic layer 2 is bonded to the polyimide main layer 1, the metal fiber braided antistatic layer 3 is bonded to the nano-metal oxide antistatic layer 2, and the high-temperature resistant protective coating 4 is bonded to the metal fiber braided antistatic layer 3 through a hot-pressing process. The adhesion of the bonded layers is not less than 1.8 N / cm. The conductive polymer antistatic layer 5 is bonded to the polyimide main layer 1, and the high-temperature stable adhesive layer 6 is bonded to the conductive polymer antistatic layer 5 through a UV curing process. The adhesion of the bonded layers is not less than 2 N / cm.
[0036] Specifically, such as Figure 3 ,and Figure 4 As shown, the release paper layer 7 has a peel force of 3-15 N / m and high temperature resistance, and does not deform at 200℃.
[0037] Specifically, such as Figure 1 , Figure 4 As shown, after being placed in a high-temperature environment of 350℃ for 1.5 hours, the change rate of the double-sided antistatic performance of the high-temperature resistant polyimide tape does not exceed 8%, the overall structure of the tape is not significantly damaged, and the adhesion remains at more than 70% of the initial adhesion.
[0038] In this embodiment, the composite process ensures that the layers are tightly bonded together to form a stable overall structure, effectively avoiding delamination and other adverse phenomena during use. After being placed in a high-temperature environment of 350°C for 1.5 hours, the change rate of its double-sided antistatic performance does not exceed 8%, the overall structure of the tape is not significantly damaged, and the adhesion remains above 70% of the initial adhesion. This enables the tape to play a stable and reliable role in fields with extremely high requirements for antistatic and high-temperature resistance, such as high-temperature electronics manufacturing and aerospace.
[0039] Working Principle: The main polyimide layer 1 has a thickness of 60 μm, a tensile strength of 250 MPa, and an elongation at break of 40%. The nano-metal oxide antistatic layer 2 is a mixture of titanium dioxide nanoparticles and high-temperature resistant resin, with nanoparticles comprising 25% of the material, a thickness of 6 μm, and a surface resistivity of 10^7 Ω / sq. The metal fiber woven antistatic layer 3 is woven from stainless steel fibers with a fiber diameter of 12 μm, a mesh size of 1 mm, and a thickness of 10 μm. The high-temperature resistant protective coating 4 is a ceramic coating with a thickness of 5 μm. The conductive polymer antistatic layer 5 is composed of polyaniline, with a thickness of 8 μm and a surface resistivity of 10^6 Ω / sq. The high-temperature stable adhesive layer 6 has a thickness of 30 μm and an adhesion retention rate of 80% at 320℃. The release paper layer 7 has a peel force of 8 N / m. After the tape was placed in a high-temperature environment of 350℃ for 1.5 hours, the change rate of the double-sided antistatic performance was 6%. The overall structure of the tape was intact, with no delamination or cracking. The adhesion remained at 72% of the initial adhesion, which can meet the requirements for use in high-temperature environments.
[0040] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A double-sided anti-static structure of a high-temperature-resistant polyimide adhesive tape, comprising a polyimide main body layer (1), characterized in that: The polyimide main layer (1) has a nano-metal oxide antistatic layer (2) on its outer side, a metal fiber braided antistatic layer (3) on its outer side, a high-temperature resistant protective coating (4) on its outer side, a conductive polymer antistatic layer (5) on its inner side, a high-temperature stable adhesive layer (6) on its inner side, and a release paper layer (7) on its inner side.
2. The double-sided anti-static structure of the high-temperature-resistant polyimide tape according to claim 1, characterized in that: The metal fiber woven antistatic layer (3) is woven from stainless steel fibers with a fiber diameter of 5-20μm, a mesh size of 0.3-1.5mm, and a thickness of 5-15μm.
3. The double-sided anti-static structure of the high-temperature-resistant polyimide tape according to claim 1, characterized in that: The high-temperature resistant protective coating (4) is a polytetrafluoroethylene coating with a thickness of 2-8 μm, and can withstand a maximum temperature of not less than 380℃.
4. The double-sided antistatic structure of a high-temperature resistant polyimide tape according to claim 1, characterized in that: The conductive polymer antistatic layer (5) is made of polyaniline, with a thickness of 4-12 μm and a surface resistivity between 10^5-10^8 Ω / sq.
5. The double-sided anti-static structure of the high-temperature-resistant polyimide tape according to claim 1, characterized in that: The high-temperature stable adhesive layer (6) is an organosilicon-modified phenolic adhesive with a thickness of 18-50 μm and an adhesion retention rate of not less than 75% at a high temperature of 320℃.
6. The double-sided anti-static structure of the high-temperature-resistant polyimide tape according to claim 1, characterized in that: The polyimide main layer (1) has a thickness of 25-100 μm, a tensile strength of not less than 220 MPa, and an elongation at break of not less than 35%.
7. The double-sided anti-static structure of the high-temperature-resistant polyimide tape according to claim 1, characterized in that: The nano-metal oxide antistatic layer (2) is combined with the polyimide main layer (1), the metal fiber braided antistatic layer (3) is combined with the nano-metal oxide antistatic layer (2), and the high-temperature resistant protective coating (4) is combined with the metal fiber braided antistatic layer (3) through a hot pressing process. The adhesion of the combined layers is not less than 1.8 N / cm. The conductive polymer antistatic layer (5) is combined with the polyimide main layer (1), and the high-temperature stable adhesive layer (6) is combined with the conductive polymer antistatic layer (5) through a UV curing process. The adhesion of the combined layers is not less than 2 N / cm.
8. The double-sided anti-static structure of the high-temperature-resistant polyimide tape according to claim 1, characterized in that: The release paper layer (7) has a peel force of 3-15 N / m and high temperature resistance, and does not deform at 200℃.