Chip test socket
By designing the probe assembly and connector structure of the chip test socket, the problems of inconvenience in carrying and chip scratching in the existing technology are solved, realizing portable and stable chip testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- VERIZON UNITED SEMICONDUCTOR (BEIJING) CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-06-19
AI Technical Summary
Existing chip test connectors suffer from problems such as inconvenience in carrying, chip scratches, and broken test probes.
A chip test socket is designed, including a test socket body and a probe assembly. The probe assembly includes first and second probe groups, which are respectively connected to the circuit board and the chip under test. Multiple connectors and a protective cover structure are used to ensure stable connection and protection between the chip and the probes.
It achieves portability and signal transmission stability of the chip test socket, while effectively protecting the chip and probes, preventing chip scratches and probe drops.
Smart Images

Figure CN224383385U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component testing technology, and in particular to a chip test socket. Background Technology
[0002] Currently, the global semiconductor industry is developing rapidly, especially with the increasing demand for various types of chips. The functional and integrated requirements of chips are also becoming increasingly stringent. To save space and simplify circuit design, multiple functional circuits are integrated and packaged into a single chip module. Before mass production of chips, it is often necessary to customize connectors to perform various functional, system, and stability tests. Connectors serve as the medium connecting the chip and the test circuit. Currently, there are various types of connectors on the market, and many connectors suffer from problems such as inconvenience in carrying during chip testing, chip scratches, and broken test probes.
[0003] Therefore, it is necessary to provide a new chip test socket to solve the above problems. Utility Model Content
[0004] The purpose of this invention is to provide a portable chip test socket that can effectively protect the chip and probes.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] A chip test socket includes a test socket body and a probe assembly, wherein:
[0007] The probe assembly includes a first probe group and a second probe group disposed on the test socket body. The first probe group is configured to connect to a circuit board, and the second probe group is configured to connect the chip under test and the circuit board.
[0008] As a further improvement to this utility model, the test socket body includes a first connector, a second connector, and a third connector connected in sequence, wherein:
[0009] The first connector is configured to secure the circuit board, and the first probe group passes through the first connector;
[0010] The second connector is connected to the third connector to the second probe group, and the second connector is also configured to fix the chip under test.
[0011] As a further improvement of the present invention, the chip test socket also includes a protective cover connected to the first connector, and the second connector and the third connector are located between the first connector and the protective cover.
[0012] As a further improvement of the present invention, the first connector is provided with an axially penetrating first hollow portion and a first probe hole, the first hollow portion being limited to the second connector and the first probe hole being limited to the first probe group.
[0013] As a further improvement of the present invention, the second connector is provided with a second hollow portion and a second probe hole that penetrate through the axis. The second hollow portion is limited to the third connector, and the second probe hole is limited to the second probe group.
[0014] As a further improvement of the present invention, the second connector is further provided with a detection hole, which is located near the second hollow part.
[0015] As a further improvement of this utility model, the second connector is provided with an operating groove.
[0016] As a further improvement of the present invention, the third connector is provided with an axially penetrating third probe hole, which is assembled and cooperated with the second probe group.
[0017] As a further improvement of the present invention, the protective cover is provided with a first pinhole and a second pinhole, the first pinhole being in a limiting fit with the first probe group, and the second pinhole being in a limiting fit with the second probe group.
[0018] As a further improvement of this utility model, the first probe group is disposed on the periphery of the second probe group.
[0019] Compared to existing technologies, the advantages of this chip test socket are as follows: The chip test socket includes a test socket body and a probe assembly. The probe assembly includes a first probe group and a second probe group disposed on the test socket body. The two ends of the second probe group are respectively connected to the chip under test and the circuit board. The first probe group extends out of the test socket body and connects to the circuit board to form a continuity test circuit. This chip test socket has a simple structure, is easy to carry, provides stable signal transmission, and can effectively protect the chip and probes, preventing the chip from being scratched and the probes from falling out. Attached Figure Description
[0020] Figure 1 This is a three-dimensional structural diagram of a chip test socket according to a specific embodiment of the present invention;
[0021] Figure 2 This is a three-dimensional structural schematic diagram of a chip test socket according to a specific embodiment of the present invention from another perspective;
[0022] Figure 3 This is an exploded view of a chip test socket according to a specific embodiment of the present invention;
[0023] Figure 4 This is a three-dimensional structural diagram of the first connector according to a specific embodiment of the present utility model;
[0024] Figure 5 This is a three-dimensional structural schematic diagram of the first connector of a specific embodiment of the present invention from another perspective;
[0025] Figure 6 This is a three-dimensional structural diagram of the second connector according to a specific embodiment of the present invention;
[0026] Figure 7 This is a three-dimensional structural schematic diagram of the second connector from another perspective of a specific embodiment of the present invention;
[0027] Figure 8 This is a cross-sectional view of the second connector according to a specific embodiment of the present invention;
[0028] Figure 9 This is a three-dimensional structural diagram of the third connector according to a specific embodiment of the present utility model;
[0029] Figure 10 This is a three-dimensional structural schematic diagram of the third connector from another perspective of a specific embodiment of the present utility model;
[0030] Figure 11 This is a three-dimensional structural diagram of the protective cover according to a specific embodiment of the present utility model. Detailed Implementation
[0031] The exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. If several embodiments exist, features in these embodiments may be combined with each other without conflict. When the description refers to the drawings, unless otherwise stated, the same numbers in different drawings represent the same or similar elements. The descriptions in the following exemplary embodiments do not represent all embodiments consistent with the present invention; rather, they are merely examples of apparatuses, products, and / or methods consistent with some aspects of the present invention as set forth in the claims.
[0032] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the scope of protection of this invention. The singular forms “a,” “the,” or “the” used in the specification and claims of this invention are also intended to include the plural forms, unless the context clearly indicates otherwise.
[0033] It should be understood that the terms "first," "second," and similar words used in the specification and claims of this utility model do not indicate any order, quantity, or importance, but are merely used to distinguish the features. Similarly, the terms "an" or "a" do not indicate a quantity limitation, but rather indicate the presence of at least one. Unless otherwise stated, the terms "front," "back," "left," "right," "upper," "lower," and similar words appearing in this utility model are for ease of explanation only and are not limited to a specific location or spatial orientation. The terms "comprising" or "including" are an open-ended expression, meaning that the element preceding "comprising" or "including" covers the element following "comprising" or "including" and its equivalents, which does not exclude that the element preceding "comprising" or "including" may also include other elements. If "several" appears in this utility model, it means two or more.
[0034] Please see Figures 1 to 11 As shown in the figure, this utility model embodiment discloses a chip test socket, including a test socket body and a probe assembly. The probe assembly includes a first probe group 4 and a second probe group 5 disposed on the test socket body. The first probe group 4 is configured to connect to a circuit board, and the second probe group 5 is configured to connect the chip under test and the circuit board, thereby forming a continuity test circuit.
[0035] Please see Figures 1 to 3 As shown, the test socket body includes a first connector 1, a second connector 2, and a third connector 3 connected in sequence. The first connector 1 is configured to fix the circuit board, and a first probe group 4 passes through the first connector 1. The second connector 2 is configured to fix the chip under test, and the second connector 2 and the third connector 3 are connected to the second probe group 5. With this configuration, the circuit board and the chip under test are fixed to the chip test socket to ensure structural stability and signal transmission stability.
[0036] Please see Figure 1 , Figure 3 , Figure 4 , Figure 6 and Figure 8As shown, the first connector 1 has an axially penetrating first hollow portion 11 and a first probe hole 12. The first hollow portion 11 is fitted with the second connector 2 for limiting. Specifically, the second connector 2 is at least partially located in the first hollow portion 11, and the two are structurally adapted to limit the relative position of the second connector 2 and the first connector 1. The second connector 2 has an axially penetrating second hollow portion 21, which is fitted with the third connector 3 for limiting. Specifically, the third connector 3 is at least partially located in the second hollow portion 21, and the two are structurally adapted to limit the relative position of the third connector 3 and the second connector 2. The third connector 3 has an axially penetrating third probe hole 31. The chip under test is placed inside the second connector 2, and the third probe hole 31 is assembled with the second probe group 5. Specifically, the probes in the second probe group 5 can pass through the third probe hole 31. The first cutout portion 11 is located at the center of the first connector 1. Multiple first probe holes 12 are located radially around the outer periphery of the first cutout portion 11. The first probe holes 12 are mutually locking with the first probe group 4. At least a portion of the probes in the first probe group 4 are located within the first probe holes 12, and at least a portion of both ends extend outside the first probe holes 12. The second cutout portion 21 is located at the center of the second connector 2. Multiple third probe holes 31 are located in the middle of the third connector 3. At least a portion of the probes in the second probe group 5 are located within the third probe holes 31, and at least a portion of both ends extend outside the third probe holes 31. The first probe group 4 is located on the periphery of the second probe group 5. With this configuration, the overall structure of the chip test socket is symmetrical and stable. The first probe group 4 is located on the periphery, with one end extending out of the first connector 1 and electrically connected to the circuit board to ground the circuit board. The second probe group 5 is located in the middle, with both ends electrically connected to the circuit board and the chip under test, respectively, to form a continuity test circuit.
[0037] Please see Figure 2 , Figure 3 and Figure 6 As shown, the second connector 2 includes a connecting portion 22 and a main body 23. A second hollow portion 21 is disposed radially inner to the main body 23, and the connecting portion 22 is disposed radially outer to the main body 23. The connecting portion 22 is used for fixed connection with the first connector 1. The main body 23 is at least partially located within the first hollow portion 11, and the main body 23 is adapted to the first hollow portion 11. Specifically, the two connecting portions 22 are respectively disposed on both radial sides of the main body 23, and the connecting portions 22 are axially away from the first probe group 4. This arrangement ensures a stable connection between the second connector 2 and the first connector 1 while minimizing the material used in the connecting portions 22, thus reducing costs to some extent.
[0038] Further, please refer to Figure 2 , Figure 5 and Figure 6As shown, the lower surface of the first connector 1 is provided with a first recess 13, and the connecting part 22 is adapted to be disposed in the first recess 13. The thickness of the connecting part 22 is equal to the depth of the first recess 13. This arrangement improves the structural fit and tightness between the first connector 1 and the second connector 2, resulting in better stability and space saving.
[0039] Please see Figure 1 , Figure 3 and Figure 6 As shown, the upper surface of the main body 23 is provided with a second recess 231 for placing the chip under test. The width of the second recess 231 gradually decreases from top to bottom, and the minimum width of the second recess 231 is greater than the width of the second cutout portion 21. This arrangement can effectively protect the chip under test from scratches, and the width of the second recess 231 is set to guide the placement of the chip under test.
[0040] Please see Figure 1 and Figure 6 As shown, the second connector 2 is provided with an operation slot 20 for convenient placement and removal of the chip under test, facilitating hand handling by the operator. Specifically, in this embodiment, the operation slot 20 is disposed on the main body 23, and the operation slot 20 extends radially outward from the side wall of the second recess 231.
[0041] Please see Figure 1 , Figure 3 , Figure 6 and Figure 7 As shown, the main body 23 is provided with a second probe hole 232, which extends axially from the bottom wall of the second recess 231 to the lower surface of the main body 23. Multiple second probe holes 232 are arranged around the radial outer periphery of the second hollow portion 21. The second probe holes 232 are fitted with the second probe group 5, and at least part of the probes in the second probe group 5 are located within the second probe holes 232, with at least both ends extending outside the second probe holes 232. Specifically, the probes located radially outside the second hollow portion 21 in the second probe group 5 are disposed in the second probe holes 232, and the probes located radially inside the second hollow portion 21 are disposed in the third probe holes 31. This arrangement improves the connection stability between the second connector 2 and the third connector 3, while also improving signal transmission efficiency.
[0042] Please see Figure 3 , Figure 9 and Figure 10 As shown, the third connector 3 includes a base 32 and a limiting part 33. The base 32 is adapted to the second hollow part 21 and is located in the second hollow part 21. The third probe hole 31 axially penetrates the base 32. The limiting part 33 is disposed below the base 32, and the width of the limiting part 33 is greater than the width of the base 32. The limiting part 33 abuts against the lower surface of the main body 23. This configuration further improves the connection stability between the second connector 2 and the third connector 3.
[0043] Please see Figure 3 , Figure 6 and Figure 7 As shown, a boss 234 is provided on the lower surface of the main body 23. The width of the boss 234 is greater than the minimum width of the second recess 231. The second probe hole 232 extends axially from the bottom wall of the second recess 231 to the boss 234. The width of the limiting part 33 is less than the width of the boss 234, and the limiting part 33 abuts against the boss 234. Further, in the radial direction, the outer edge of the limiting part 33 is located between the second hollow part 21 and the second probe hole 232. With this configuration, the limiting part 33 abuts against the boss 234 so that the second connector 2 and the third connector 3 are limited and connected, while the limiting part 33 does not affect the setting of the second probe group 5 in the second probe hole 232.
[0044] Please see Figure 8 As shown, in some embodiments, the second connector 2 is further provided with a detection hole 233, which is close to the second hollow portion 21. In this embodiment, the detection hole 233 is disposed on the main body portion 23, located radially outside the second recess 231 and not connected to the second recess 231. Specifically, the detection hole 233 extends axially, connecting the lower surface of the main body portion 23 but not the upper surface, i.e., the detection hole 233 is a blind hole. With this configuration, when the sidewall of the second recess 231 is worn down to the detection hole 233, exposing the detection hole 233 and making it connected to the second recess 231, the second connector 2 is scrapped and needs to be replaced. This achieves a simple structure and low cost, enabling a direct assessment of the wear level of the second connector 2, thereby preventing the chip under test from being scratched. The detection hole 233 is easy to manufacture, and its position can be set according to different situations in practical applications.
[0045] Please see Figure 2 , Figure 3 and Figure 11As shown, the chip test socket in this embodiment also includes a protective cover 6. A second connector 2 and a third connector 3 are located between the first connector 1 and the protective cover 6. The circuit board is disposed on the side of the protective cover 6 facing away from the first connector 1. The protective cover 6 has a first pinhole 61 and a second pinhole 62. The first pinhole 61 is fitted with a first probe group 4, and the second pinhole 62 is fitted with a second probe group 5. The first pinhole 61 is axially aligned with the first probe hole 12, and the second pinhole 62 is axially aligned with the second probe hole 232 and the third probe hole 31. The diameter of the end of the first pinhole 61 and the second pinhole 62 furthest from the first connector 1 is smaller than the diameter of the end closest to the first connector 1. In this embodiment, the first pinhole 61 and the second pinhole 62 are stepped holes. The diameter of the end of the first pinhole 61 closest to the first connector 1 is equal to the diameter of the first probe hole 12, and the diameter of the end of the second pinhole 62 closest to the first connector 1 is equal to the diameter of the second probe hole 232 and the third probe hole 31. With this configuration, the protective cover 6 can effectively prevent the first probe group 4 and the second probe group 5 from falling off, and the protective cover 6 is fixedly connected to the first connector 1 and the second connector 2, thereby improving the overall structural stability of the chip test socket.
[0046] Please see Figure 2 , Figure 3 , Figure 7 , Figure 10 and Figure 11 As shown, the upper surface of the protective cover 6 is provided with a third recess 64, which includes a first groove 641 and a second groove 642. The second groove 642 continues to be recessed downward from the bottom wall of the first groove 641. A boss 234 is adapted to be located in the first groove 641, and a limiting part 33 is adapted to be located in the second groove 642. The thickness of the boss 234 is equal to the depth of the first groove 641, and the thickness of the limiting part 33 is equal to the depth of the second groove 642. This configuration improves the matching degree and connection tightness between the protective cover 6 and the second connector 2 and the third connector 3, making the lower surface of the chip test socket relatively flat.
[0047] Please see Figure 2 , Figure 3 , Figure 5 and Figure 11 As shown, the radial outer edge of the protective cover 6 is located within the first connector 1. The lower surface of the first connector 1 is also provided with a recessed groove 14. The protective cover 6 is fitted within the recessed groove 14, and the thickness of the protective cover 6 is equal to the depth of the recessed groove 14. The first recess 13 continues to curve upwards from the bottom wall of the recessed groove 14. This design improves the matching degree and connection tightness between the first connector 1 and the protective cover 6, improves the flatness of the lower surface of the chip test socket, and thus makes the chip test socket easier to carry and less prone to damage.
[0048] Please see Figures 2 to 6 , Figure 11As shown, the first connector 1 has a first mounting hole 18, the second connector 2 has a second mounting hole 26, the second mounting hole 26 is located in the connecting part 22, and the protective cover 6 has a third mounting hole 67. The three are fixedly connected using screws 9. Specifically, after the protective cover 6 is positioned, screws 9 are passed through the third mounting hole 67, the second mounting hole 26, and the first mounting hole 18 sequentially from bottom to top and then tightened to secure it, and / or screws 9 are passed through the third mounting hole 67 and the first mounting hole 18 sequentially from bottom to top and then tightened to secure it. This arrangement ensures that the protective cover 6 is stably installed below the chip test socket.
[0049] Please see Figure 2 , Figure 10 and Figure 11 As shown, in the third connector 3, the lower surface of the limiting part 33 is provided with a plurality of positioning posts 331, and the protective cover 6 is provided with a plurality of positioning holes 68 accordingly, with the positioning posts 331 at least partially located in the positioning holes 68. This arrangement improves the connection strength between the protective cover 6 and the third connector 3.
[0050] Please see Figure 1 , Figure 3 and Figure 4 As shown, the upper surface of the first connector 1 is provided with a fourth recess 15. The axial projection of the first probe hole 12 is located within the fourth recess 15. The first probe hole 12 extends downward from the bottom wall of the fourth recess 15 to the lower surface of the first connector 1. The lower end of the first probe assembly 4 is electrically connected to the circuit board, and the upper end of the first probe assembly 4 is at least partially located within the fourth recess 15. This arrangement facilitates the installation of the first probe assembly 4 and protects the upper end of the first probe assembly 4.
[0051] Please see Figures 1 to 4 , Figure 6 and Figure 11 As shown, the first connector 1 has a first through hole 16, the second connector 2 has a second through hole 24, and the protective cover 6 has a third through hole 65. The first through hole 16, the second through hole 24, and the third through hole 65 are axially aligned and are fixedly connected by a bolt assembly 7. In this embodiment, there are four first through holes 16, two second through holes 24, and four third through holes 65. The two second through holes 24 are respectively located at two connecting parts 22. The bolt assembly 7 passes through the first through hole 16, the second through hole 24, and the third through hole 65 in sequence, and / or the bolt assembly 7 passes through the first through hole 16 and the third through hole 65 in sequence. This arrangement further improves the overall stability of the chip test socket.
[0052] Please see Figure 2 , Figure 3 , Figure 5 , Figure 6 and Figure 11As shown, the first connector 1 has a first limiting hole 17, the second connector 2 has a second limiting hole 25, the second limiting hole 25 is located at the connecting part 22, and the protective cover 6 has a third limiting hole 66. The first limiting hole 17, the second limiting hole 25, and the third limiting hole 66 are axially corresponding and are positioned relative to each other by a positioning pin 8. Specifically, during installation, the positioning pin 8 is first placed in the first limiting hole 17, and then the second connector 2, the third connector 3, and the protective cover 6 are positioned and connected in sequence, thereby positioning and connecting the various components of the chip test socket. This arrangement improves installation efficiency and reduces installation errors.
[0053] In summary, compared with existing technologies, the chip test socket of this utility model has the following advantages: The chip test socket includes a test socket body and a probe assembly. The probe assembly includes a first probe group 4 and a second probe group 5 disposed on the test socket body. The two ends of the second probe group 5 are respectively connected to the chip under test and the circuit board. The first probe group 4 extends out of the test socket body and connects to the circuit board to form a continuity test circuit. This chip test socket has a simple structure, is easy to carry, provides stable signal transmission, and can effectively protect the chip and probes, preventing the chip from being scratched and the probes from falling out.
[0054] The above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.
Claims
1. A chip test socket, characterized in that, Includes the test socket body and probe assembly, wherein: The probe assembly includes a first probe group (4) and a second probe group (5) disposed on the main body of the test socket. The first probe group (4) is configured to connect to a circuit board, and the second probe group (5) is configured to connect the chip under test and the circuit board.
2. The chip test socket according to claim 1, characterized in that: The test socket body includes a first connector (1), a second connector (2), and a third connector (3) connected in sequence, wherein: The first connector (1) is configured to fix the circuit board, and the first probe group (4) passes through the first connector (1); The second connector (2) is connected to the third connector (3) to the second probe group (5), and the second connector (2) is also configured to fix the chip under test.
3. The chip test socket according to claim 2, characterized in that: The chip test socket also includes a protective cover (6) connected to the first connector (1), and the second connector (2) and the third connector (3) are located between the first connector (1) and the protective cover (6).
4. The chip test socket according to claim 2, characterized in that: The first connector (1) is provided with an axially penetrating first hollow portion (11) and a first probe hole (12). The first hollow portion (11) is in a limiting fit with the second connector (2), and the first probe hole (12) is in a limiting fit with the first probe group (4).
5. The chip test socket according to claim 2, characterized in that: The second connector (2) is provided with an axially penetrating second hollow part (21) and a second probe hole (232). The second hollow part (21) is in a limiting fit with the third connector (3), and the second probe hole (232) is in a limiting fit with the second probe group (5).
6. The chip test socket according to claim 5, characterized in that: The second connector (2) is also provided with a detection hole (233) inside, which is close to the second hollow part (21).
7. The chip test socket according to claim 2, characterized in that: The second connector (2) is provided with an operating slot (20).
8. The chip test socket according to claim 2, characterized in that: The third connector (3) is provided with an axially penetrating third probe hole (31), which is assembled and fitted with the second probe group (5).
9. The chip test socket according to claim 3, characterized in that: The protective cover (6) is provided with a first pinhole (61) and a second pinhole (62). The first pinhole (61) is in a limiting fit with the first probe group (4), and the second pinhole (62) is in a limiting fit with the second probe group (5).
10. The chip test socket according to any one of claims 1-9, characterized in that: The first probe group (4) is disposed around the second probe group (5).