A liquid cooling heat dissipation system for a server chip

Abstract

The utility model relates to server liquid cooling heat dissipation system technical field, concretely is a kind of server chip liquid cooling heat dissipation system, including the server chip of connection installation in the top of circuit board, the top of circuit board is equipped with the cooling box that the server chip is cooled, the upper portion of cooling box is fixedly installed with the liquid storage tank for the circulation of cooling liquid, the center of liquid storage tank is fixedly sealed and installed with auxiliary cooling assembly. Through the circulating flow of cooling liquid between liquid storage tank and cooling box, the cooling box can heat absorption cooling to server chip, when the server operating power is larger, by starting semiconductor refrigeration piece operation, the refrigeration side of semiconductor refrigeration piece and cooling fin contact cooling, can cool the cooling liquid that flows through the cooling fin contact in liquid storage tank, cooling liquid from liquid storage tank to cooling box better cooling server chip, ensure that server carries out normal use.

Description

Technical Field

[0001] This utility model relates to the technical field of server liquid cooling heat dissipation systems, specifically a server chip liquid cooling heat dissipation system. Background Technology

[0002] With the advancement of information technology, people have increasingly higher requirements for servers, resulting in more powerful chips with increasingly robust functions. This increased functionality translates to higher power consumption and consequently, higher heat generation. This presents a greater challenge for thermal design.

[0003] Currently, most server chips are cooled by cooling fans while in operation, which can meet some of the cooling needs.

[0004] However, when the server operates at high power, it generates a lot of heat. Ordinary fan cooling cannot meet the current cooling requirements, which will reduce the operating capacity of the server chip. Prolonged operation at high temperatures can damage the server chip and hinder the normal use of the server. Utility Model Content

[0005] The purpose of this invention is to provide a liquid cooling system for server chips, which has the characteristic of good heat dissipation effect.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a server chip liquid cooling heat dissipation system, comprising a server chip connected and installed on the top of a circuit board, a cooling box for dissipating heat from the server chip being installed on the top of the circuit board, a storage tank for circulating coolant being fixedly installed above the cooling box, and an auxiliary cooling component being fixedly and sealed in the center of the storage tank.

[0007] The auxiliary cooling component includes a thermoelectric cooler and a cooling plate fixedly mounted to the bottom of the thermoelectric cooler. A heat dissipation fin is fixedly mounted on the top of the thermoelectric cooler, and a fan for heat dissipation is provided on the top of the heat dissipation fin.

[0008] In order to ensure the circulation of coolant, as a preferred embodiment of the server chip liquid cooling system of this utility model, a return pipe is fixedly installed at the top output end of the cooling box, and a connecting pipe is fixedly installed at the top input end of the cooling box.

[0009] To facilitate coolant flow, in a preferred embodiment of the server chip liquid cooling system of this utility model, a flow channel is provided on the inner side of the cooling box, and the two ends of the flow channel are fixedly connected to the connecting pipe and the return pipe, respectively.

[0010] In order to provide the flow power of the coolant, as a preferred embodiment of the server chip liquid cooling system of this utility model, a circulation pump is fixedly installed at the right output end of the liquid storage tank, and the output end of the circulation pump is fixedly installed with the connecting pipe.

[0011] In order to inject coolant, as a preferred embodiment of the server chip liquid cooling system of this utility model, the left input end of the liquid storage tank is fixedly installed with the return pipe, and a sealing cover is provided on the top of the liquid storage tank.

[0012] For ease of installation and fixation, in a preferred embodiment of the server chip liquid cooling system of this utility model, two sets of mounting components are fixedly installed on the top of the circuit board. Each set of mounting components includes two mounting bases, the top of which is threaded with screws. A mounting bracket is fixedly installed on the top of the two mounting bases, and the mounting bracket is fixedly installed to the mounting base by screws.

[0013] For secure support, in a preferred embodiment of the server chip liquid cooling system of this utility model, the cooling box is located between two mounting brackets and fixedly installed, and the liquid storage tank is located on top of the two mounting brackets and fixedly installed.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] By circulating the coolant between the reservoir and the cooling box, the cooling box can absorb heat and cool the server chips. When the server is operating at high power, the semiconductor cooling chip is activated, and its cooling side contacts the cooling plate to cool the coolant flowing through the reservoir and into the cooling box. This coolant further cools the server chips, improving their performance and ensuring normal server operation. Attached Figure Description

[0016] Figure 1 This is a top-down perspective view of the structure of this utility model.

[0017] Figure 2 This is a rear top view of the three-dimensional structure of this utility model;

[0018] Figure 3 This is one of the partial structural diagrams of this utility model;

[0019] Figure 4 This is a second partial structural diagram of the present invention;

[0020] Figure 5 This is a structural diagram of the cooling box of this utility model.

[0021] In the diagram: 1. Circuit board; 2. Server chip; 3. Cooling box; 4. Mounting base; 5. Mounting bracket; 6. Screw; 7. Liquid reservoir; 8. Semiconductor cooling chip; 9. Heat sink; 10. Fan; 11. Cooling plate; 12. Circulation pump; 13. Connecting pipe; 14. Return pipe; 15. Sealing cap; 16. Liquid flow tank. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this utility model and are not intended to limit it. In the description of this utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must be set in a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] Please see Figures 1 to 5 A server chip liquid cooling system includes a server chip 2 connected to and installed on the top of a circuit board 1. A cooling box 3 for cooling the server chip 2 is installed on the top of the circuit board 1. A storage tank 7 for circulating coolant is fixedly installed above the cooling box 3. An auxiliary cooling component is fixedly and sealed in the center of the storage tank 7.

[0024] The auxiliary cooling component includes a thermoelectric cooler 8, a cooling plate 11 fixedly mounted to the bottom of the thermoelectric cooler 8, a heat dissipation fin 9 fixedly mounted to the top of the thermoelectric cooler 8, and a fan 10 for heat dissipation on the top of the heat dissipation fin 9.

[0025] In this embodiment: thermal grease is applied between the cooling box 3 and the server chip 2 to improve thermal conductivity. The cooling box 3 can better absorb and cool the server chip 2 by circulating the coolant between the storage tank 7 and the cooling box 3. The cooling of the cooling chip 11 is achieved by activating the cooling on one side of the semiconductor cooling chip 8. The fan 10 is used to dissipate heat on the heating side of the heat sink 9 to ensure the normal use of the semiconductor cooling chip 8.

[0026] As a technical optimization of this utility model, a return pipe 14 is fixedly installed at the top output end of the cooling box 3, and a connecting pipe 13 is fixedly installed at the top input end of the cooling box 3.

[0027] In this embodiment, the liquid storage tank 7 and the cooling box 3 can be connected and installed as a whole through the connecting pipe 13 and the return pipe 14, which facilitates the circulation and use of the coolant.

[0028] As a technical optimization of this utility model, a liquid flow channel 16 is provided on the inner side of the cooling box 3, and the two ends of the liquid flow channel 16 are fixedly connected to the connecting pipe 13 and the return pipe 14 respectively.

[0029] In this embodiment, the coolant delivered to the cooling box 3 can be transported and flowed through the flow channel 16, and then returned to the storage tank 7 through the return pipe 14, so that the coolant can circulate and flow, and the cooling box 3 can achieve a better cooling effect on the server chip 2.

[0030] As a technical optimization of this utility model, a circulation pump 12 is fixedly installed on the right output end of the liquid storage tank 7, and the output end of the circulation pump 12 is fixedly installed with the connecting pipe 13; the left input end of the liquid storage tank 7 is fixedly installed with the return pipe 14, and a sealing cover 15 is provided on the top of the liquid storage tank 7.

[0031] In this embodiment: the coolant in the storage tank 7 is drawn out by the circulation pump 12 and transported to the cooling box 3 through the connecting pipe 13 to absorb heat and cool down the server chip 2. The coolant in the cooling box 3 is returned to the storage tank 7 through the return pipe 14 and then transported to the cooling box 3 through the connecting pipe 13 for cooling. It can be used in a cycle. The required coolant can be injected into the storage tank 7 through the sealing cap 15, which facilitates the circulation of coolant in the cooling box 3 and the storage tank 7.

[0032] As a technical optimization of this utility model, two sets of mounting components are fixedly installed on the top of the circuit board 1. Each set of mounting components includes two mounting seats 4. The top of the mounting seat 4 is threaded with a screw 6. The top of the two mounting seats 4 is fixedly installed with a mounting bracket 5. The mounting bracket 5 is fixedly installed to the mounting seat 4 by the screw 6. The cooling box 3 is located between the two mounting brackets 5 and fixedly installed. The liquid storage tank 7 is located on top of the two mounting brackets 5 and fixedly installed.

[0033] In this embodiment: the mounting bracket 5 is threadedly fixed to the top of the mounting base 4 by screws 6, so that the cooling box 3 and the server chip 2 can be better installed and in contact. The liquid storage tank 7 is supported and fixed to maintain the distance between the liquid storage tank 7 and the cooling box 3, so as to avoid direct contact between the liquid storage tank 7 and the cooling box 3 and affect the cooling effect.

[0034] Working principle: First, unscrew the sealing cap 15 and inject coolant into the storage tank 7. Then, start the circulation pump 12 to draw out the coolant from the storage tank 7 and transport it to the cooling box 3 through the connecting pipe 13. Then, continue to add coolant to the storage tank 7, circulating the coolant until the coolant level in the storage tank 7 is three-quarters of the volume. Tighten the sealing cap 15, then apply thermal grease to the top of the server chip 2. Install the cooling box 3 in contact with the server chip 2. Connect the mounting bracket 5 to the mounting base 4 using screws 6. The cooling box 3 is then installed via the circulation pump 12 and connecting pipe 13. The coolant in the storage tank 7 is drawn into the cooling box 3, flows through the flow channel 16 to the return pipe 14, and then flows back into the storage tank 7 for recycling. When the server chip 2 has a high power consumption, the semiconductor cooling chip 8 is started and the fan 10 is started to dissipate heat from the heat dissipation fins 9 on the heating side of the semiconductor cooling chip 8. At this time, the cooling side of the semiconductor cooling chip 8 cools the cooling plate 11, and the cooling plate 11 cools the coolant in the storage tank 7, thereby improving the heat absorption and cooling effect of the cooling box 3 on the server chip 2 and better ensuring the circulation and cooling of the coolant.

[0035] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as riveting and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art. All electrical equipment in this utility model is powered by an external power source.

[0036] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A server chip liquid cooling system, comprising a server chip (2) connected and mounted on the top of a circuit board (1), characterized in that: A cooling box (3) for dissipating heat from the server chip (2) is installed on the top of the circuit board (1). A liquid storage tank (7) for circulating coolant is fixedly installed above the cooling box (3). An auxiliary cooling component is fixedly and sealed in the center of the liquid storage tank (7). The auxiliary cooling component includes a thermoelectric cooler (8) and a cooling plate (11) fixedly installed at the bottom of the thermoelectric cooler (8). A heat dissipation fin (9) is fixedly installed on the top of the thermoelectric cooler (8), and a fan (10) for heat dissipation is provided on the top of the heat dissipation fin (9).

2. The server chip liquid cooling system according to claim 1, characterized in that: A return pipe (14) is fixedly installed at the top output end of the cooling box (3), and a connecting pipe (13) is fixedly installed at the top input end of the cooling box (3).

3. The server chip liquid cooling system according to claim 2, characterized in that: The cooling box (3) has a liquid flow channel (16) on its inner side, and the two ends of the liquid flow channel (16) are fixedly connected to the connecting pipe (13) and the return pipe (14) respectively.

4. The server chip liquid cooling system according to claim 2, characterized in that: A circulation pump (12) is fixedly installed on the right output end of the liquid storage tank (7), and the output end of the circulation pump (12) is fixedly installed with the connecting pipe (13).

5. The server chip liquid cooling system according to claim 2, characterized in that: The left input end of the liquid storage tank (7) is fixedly installed with the return pipe (14), and a sealing cover (15) is provided on the top of the liquid storage tank (7).

6. The server chip liquid cooling system according to claim 1, characterized in that: Two sets of mounting components are fixedly installed on the top of the circuit board (1). Each set of mounting components includes two mounting seats (4). The top of the mounting seats (4) is threaded with screws (6). The top of the two mounting seats (4) is fixedly installed with mounting brackets (5). The mounting brackets (5) are fixedly installed to the mounting seats (4) by screws (6).

7. A server chip liquid cooling system according to claim 6, characterized in that: The cooling box (3) is located between the two mounting brackets (5) and is fixedly installed, and the liquid storage tank (7) is located on top of the two mounting brackets (5) and is fixedly installed.

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