SSD heat sink fixing structure

Abstract

This invention provides an SSD heatsink mounting structure, including a bracket with a mounting slot for mounting an SSD. The heatsink is detachably connected to the bracket via a plug-in method, forming a gap between the heatsink and the SSD filled with a thermally conductive layer. The heatsink has heat dissipation fins. A magnetic module is located at the bottom of the bracket, comprising alternating permanent magnets and soft magnetic strips to adapt to the mounting surfaces of different metal chassis. This invention effectively solves the technical problem of existing heatsink structures being unable to adapt to SSDs of different thicknesses and diverse chassis environments.

Description

Technical Field

[0001] This utility model relates to the field of computer hard drive heat dissipation technology, specifically to an SSD heat sink fixing structure. Background Technology

[0002] As the solid-state drive (SSD) interface protocol has evolved from PCIe 3.0 to PCIe 5.0 / 6.0, its data transfer rate has exceeded 14GB / s, and the peak power consumption of the controller chip has correspondingly increased to 12-15W (such as Phison PS5026-E26 and Ingenic IG5236). The heat buildup caused by high power consumption leads to a sharp drop in SSD performance (triggering temperature-controlled speed limits) and even hardware damage (accelerated NAND flash memory lifespan degradation). Current mainstream cooling solutions have the following shortcomings:

[0003] First, many M.2 SSD heatsinks rely on screws for mounting (e.g., the 2280 specification requires four M.2 x 3mm screws). The installation process requires precise alignment of the screw holes, and repeated disassembly and reassembly can easily lead to stripped screws or PCB deformation. Dell Precision workstation user feedback indicates that 23% of SSD failures are due to scratches on the gold fingers caused by improper installation.

[0004] Secondly, thermal grease is prone to drying and cracking at high temperatures, which increases the contact thermal resistance. At the same time, the existing heat dissipation structure is difficult to adapt to SSDs of different thicknesses and diverse chassis environments. Utility Model Content

[0005] The purpose of this invention is to provide an SSD heatsink fixing structure that can effectively solve the technical problem that the heat dissipation structure in the prior art is difficult to adapt to SSDs of different thicknesses and diverse chassis environments.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0007] An SSD heatsink fixing structure includes a bracket with a mounting slot for mounting an SSD solid-state drive. The structure also includes a heatsink frame, which is detachably connected to the bracket via an insertion method. A gap is formed between the heatsink frame and the SSD solid-state drive, and the gap is filled with a thermally conductive layer. The heatsink frame is provided with heat dissipation fins.

[0008] The bottom of the bracket is equipped with a magnetic module, which includes alternating permanent magnets and soft magnetic strips to adapt to the mounting surfaces of different metal chassis.

[0009] Furthermore, the bracket is provided with elastic buckles on both sides, and the heat sink is provided with a corresponding insertion slot, so that the buckles and insertion slots can be used to fix the device in place.

[0010] Furthermore, slots are provided on both sides of the bracket, and the heat sink is inserted into the slots; the side of the heat sink is provided with elastic protrusions, which deform after contacting the bracket.

[0011] Furthermore, the heat dissipation fins are heat dissipation fins arranged in equal rows on the heat dissipation frame.

[0012] Furthermore, the heat dissipation fins have a biomimetic tree-like fractal structure, and the heat dissipation fins include main fins and secondary branch fins connected to the main fins. The height of the main fins is 3-5mm, and the spacing between the secondary branch fins is 0.8-1.2mm.

[0013] Furthermore, the thermally conductive layer is a phase change material layer, comprising 5%-15% by mass of graphene nanosheets and a matrix phase change polymer. The matrix phase change polymer comprises the following components by mass: 40%-60% paraffin-based PCM, 30-50% silicone rubber matrix, 5-15% graphene nanosheets, and 0.5-2% coupling agent. The phase change temperature is 45℃-65℃, and the phase change polymer has an energy storage density ≥150J / g and a liquid thermal conductivity ≥2.5W / (m·K) within the 45℃-65℃ range.

[0014] Furthermore, the bracket is integrally formed from magnesium alloy, with mounting strips on both sides of the bracket, and the magnetic module is mounted on the mounting strips, which are provided with screw holes.

[0015] Furthermore, the thickness of the gap is 0.3-0.8 mm, and it decreases gradually towards the edge along the SSD controller chip area.

[0016] Furthermore, an optical fiber temperature sensor is embedded in the heat-conducting layer, and the sensor signal output terminal is connected to an LED status indicator light outside the heat sink.

[0017] Furthermore, the heat sink can be extended to connect to an auxiliary heat dissipation module, which includes a mounting bracket, a cooling fan, and a shroud. The cooling fan and shroud are mounted on the mounting bracket and can be quickly assembled via a snap-fit ​​interface.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] In practical use, this utility model enables quick assembly and disassembly through elastic buckles or slots. At the same time, it is filled with phase change composite material, dynamically adjusts the thermal interface contact, and the set permanent magnet and soft magnetic strip are suitable for metal chassis. This utility model can effectively solve the technical problem that the heat dissipation structure in the prior art is difficult to adapt to SSDs of different thicknesses and diverse chassis environments. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of the heat sink bracket described in this utility model.

[0022] Figure 2 This is a schematic diagram of the overall structure of this utility model.

[0023] Figure 3 For the present utility model Figure 1 Top view.

[0024] Figure 4 This is a schematic diagram showing the positional relationship between the auxiliary heat dissipation module and the bracket of this utility model.

[0025] Figure label:

[0026] 101 Bracket, 102 SSD solid-state drive, 103 Heatsink bracket, 104 Heatsink fins, 105 Slot, 106 Flexible protrusion, 107 Mounting strip, 108 Screw, 109 Auxiliary heatsink module, 110 Cooling fan, 111 Airflow guide, 112 Mounting bracket, 113 Set screw, 114 Mounting clearance. Detailed Implementation

[0027] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0028] In the description of the embodiments of this utility model, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0031] In this embodiment of the invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] The following disclosure provides many different implementations or examples for different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0033] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0034] See Figures 1-4This embodiment discloses an SSD heatsink fixing structure, including a bracket 101, on which a mounting slot is provided for mounting an SSD solid-state drive 102. This embodiment also includes a heatsink bracket 103, which is detachably connected to the bracket 101 via an insertion method. A gap is formed between the heatsink bracket 103 and the SSD solid-state drive 102, and a thermally conductive layer is filled in the gap. Heatsink bracket 103 is provided with heat dissipation fins 104.

[0035] The bottom of the bracket 101 is provided with a magnetic module, which includes alternating permanent magnets and soft magnetic strips to adapt to the mounting surfaces of different metal chassis.

[0036] In practical applications, neodymium iron boron permanent magnets and electrical pure iron soft magnetic strips are arranged at a 1:2 ratio, and the flatness of the adsorption surface is ≤0.05mm.

[0037] This embodiment achieves rapid heat dissipation through the heat-conducting layer and heat dissipation fins 104. The heat sink 103 is detachably connected to the bracket 101 via a plug-in method. The contact pressure is generated by elastic deformation to reduce the risk of installation damage. A controllable gap is reserved to accommodate the phase change material and avoid direct pressure on the SSD surface components. The magnetic module facilitates the installation of different chassis models.

[0038] Furthermore, the bracket 101 has elastic buckles on both sides, and the heat sink 103 has a corresponding insertion slot. The buckles and insertion slots work together to achieve insertion and fixation. The connection between the heat sink 103 and the bracket 101 is achieved by the cooperation of the elastic buckles and insertion slots, which improves installation efficiency.

[0039] Furthermore, in some preferred embodiments, slots 105 are provided on both sides of the bracket 101, and the heat sink 103 is inserted into the slots 105; the side of the heat sink 103 is provided with an elastic protrusion 106, which deforms after contacting the bracket 101. An installation gap 114 will be formed between the elastic protrusion 106 and the side of the heat sink 103.

[0040] The heat sink 103 is fixed by the slot 105 and the elastic protrusion 106.

[0041] Furthermore, in practical applications, there are multiple elastic protrusions 106 to achieve the purpose of multi-point fixation and improve the locking stability of the heat sink 103.

[0042] Furthermore, in some preferred embodiments, the elastic protrusion 106 may be provided only on one side of the heat sink 103, while the other side is reinforced with a set screw 113 to fix the heat sink 103 to the bracket 101.

[0043] Furthermore, the heat dissipation fins 104 are heat dissipation fins arranged in equal rows on the heat dissipation frame 103. The heat dissipation fins 104 can further improve heat dissipation.

[0044] Furthermore, in some preferred embodiments, the heat dissipation fins 104 have a biomimetic tree-like fractal structure, comprising main fins and secondary branch fins connected to the main fins. The main fins have a height of 3-5 mm, and the secondary branch fins have a spacing of 0.8-1.2 mm. In this embodiment, the main fins have a height of 4 mm, and the secondary branch fins have a spacing of 1 mm.

[0045] Furthermore, the branching angle is 45°±5%, mimicking the veins of plant leaves. Through multi-level branching, airflow is guided to form vortices, improving heat dissipation efficiency. Tests show that the heat dissipation efficiency is improved by ≥25%.

[0046] In some preferred embodiments, the thermally conductive layer is a phase change material layer comprising 5%-15% by mass of graphene nanosheets and a matrix phase change polymer. The matrix phase change polymer comprises the following components by mass fraction: 40%-60% paraffin-based PCM, 30-50% silicone rubber matrix, 5-15% graphene nanosheets, and 0.5-2% coupling agent. The phase change temperature is 45℃-65℃, and the phase change polymer has an energy storage density ≥150J / g and a liquid thermal conductivity ≥2.5W / (m·K) in the 45℃-65℃ range.

[0047] Furthermore, the matrix phase change polymer comprises the following components by mass fraction: 50% paraffin-based PCM, 40% silicone rubber matrix, 14% graphene nanosheets, and 1% coupling agent, mixed and cured; the phase change temperature is tested to be 52°C.

[0048] The coupling agent is a silane coupling agent, specifically KH-550 (γ-aminopropyltriethoxysilane, NH2(CH2)3Si(OC2H5)3) or KH-560 (γ-glycidyl etheroxypropyltrimethoxysilane, C9H 20 O5Si). Paraffin wax provides latent heat storage, graphene nanosheets are used to construct a three-dimensional thermally conductive network, and a silicone rubber matrix inhibits PCM leakage.

[0049] The bracket 101 is integrally formed from magnesium alloy. Mounting strips 107 are provided on both sides of the bracket 101, and magnetic modules are mounted on the mounting strips 107. Screw holes 108 are provided on the mounting strips 107. Screws 108 are installed in the screw holes 108 for fixing the bracket to the chassis.

[0050] Furthermore, in some preferred embodiments, the thickness of the gap is 0.3-0.8 mm, and it decreases gradually towards the edge along the SSD controller chip area. The gap in the controller chip area is 0.8 mm, decreasing to 0.3 mm at the edge, utilizing the liquid flowability of PCM to conduct heat to the edge fin area; reducing the temperature difference between the controller and NAND flash memory, while improving the uniformity of pressure distribution on the SSD surface.

[0051] Furthermore, in some preferred embodiments, a fiber optic temperature sensor is embedded in the thermally conductive layer, and the sensor's signal output is connected to an LED status indicator on the outside of the heat sink 103. The FBG fiber grating (wavelength 1550nm ± 0.2nm) of the fiber optic temperature sensor is embedded in the thermally conductive layer. Temperature changes cause wavelength shifts, which are converted into photoelectric signals to drive the LED, effectively improving temperature measurement accuracy, achieving EMI immunity, and making it suitable for high electromagnetic environments in data centers. Using FBG fiber, the wavelength shift is 0.1nm / ℃, and the LED status indicator switches to a red alarm at 70℃.

[0052] Furthermore, the heat sink 103 can be extended to connect to an auxiliary heat dissipation module 109. The auxiliary heat dissipation module 109 includes a mounting bracket 112, a cooling fan 110, and a shroud 111. The cooling fan 110 and the shroud 111 are mounted on the mounting bracket 112, and the mounting bracket 112 and the bracket 101 are quickly assembled via a snap-fit ​​interface. The shroud 111 is inclined on the mounting bracket 112 to concentrate airflow and cover the heat dissipation fins 104, thereby improving heat dissipation efficiency.

[0053] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0054] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An SSD heatsink mounting structure, comprising a bracket, wherein the bracket is provided with a mounting slot for mounting an SSD solid-state drive, characterized in that: It also includes a heat sink, which is detachably connected to the bracket by a plug-in method. A gap is formed between the heat sink and the SSD solid-state drive, and a thermally conductive layer is filled in the gap. Heat sink fins are provided on the heat sink. The bottom of the bracket is equipped with a magnetic module, which includes alternating permanent magnets and soft magnetic strips to adapt to the mounting surfaces of different metal chassis.

2. The SSD heatsink fixing structure according to claim 1, characterized in that: The bracket has elastic buckles on both sides, and the heat sink has a corresponding insertion slot. The buckles and insertion slots work together to fix the device in place.

3. The SSD heatsink fixing structure according to claim 1, characterized in that: The bracket has slots on both sides, and the heat sink is inserted into the slots; the heat sink has elastic protrusions on its sides, which deform when they come into contact with the bracket.

4. The SSD heatsink fixing structure according to claim 1, characterized in that: The heat dissipation fins are heat dissipation fins arranged in equal rows on the heat dissipation frame.

5. The SSD heatsink fixing structure according to claim 1, characterized in that: The heat dissipation fins have a biomimetic tree-like fractal structure, and the heat dissipation fins include main fins and secondary branch fins connected to the main fins.

6. The SSD heatsink fixing structure according to claim 1, characterized in that: The bracket is integrally formed from magnesium alloy, and mounting strips are provided on both sides of the bracket. The magnetic module is mounted on the mounting strips, and screw holes are provided on the mounting strips.

7. An SSD heatsink fixing structure according to any one of claims 1-6, characterized in that: The heat sink can be extended to connect to an auxiliary heat sink module, which includes a mounting bracket, a cooling fan, and a shroud. The cooling fan and shroud are mounted on the mounting bracket and can be quickly assembled via a snap-fit ​​interface.

8. An SSD heatsink fixing structure according to any one of claims 1-6, characterized in that: An optical fiber temperature sensor is embedded in the heat-conducting layer, and the sensor signal output terminal is connected to an LED status indicator on the outside of the heat sink.

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