A server chip-based heat dissipation structure

Abstract

This invention relates to the field of chip heat dissipation technology and discloses a heat dissipation structure based on a server chip, comprising: a bracket; copper pipes; fins; a mounting frame; a cooling fan; a drive mechanism; an outer frame; and a rotating rod. The rotating rod is rotatably mounted on the outer frame, and several spiral plates are arranged around its periphery. The drive mechanism drives the rotating rod to rotate the spiral plates, thereby reducing the distance between adjacent sets of fins. By setting the drive mechanism and the rotating rod in a coordinated manner, the airflow generated when the cooling fan speeds up is used as the driving force to drive the rotating rod to rotate and cause the spiral plates to press down on the fins, thus uniformly reducing the overall distance between adjacent fins. This dynamic adjustment mechanism can effectively reduce the boundary layer thickness on the fin surface when the chip generates high heat, while appropriately increasing the wind resistance to optimize the airflow velocity, thereby significantly improving the convective heat transfer coefficient and solving the problem of decreased heat transfer efficiency caused by the short airflow residence time in traditional air-cooled heat sinks under high airflow conditions.

Description

Technical Field

[0001] This invention relates to the field of chip heat dissipation technology, and more specifically to a heat dissipation structure based on server chips. Background Technology

[0002] With the rapid development of artificial intelligence technology, AI computing servers have become the core infrastructure supporting large-scale computing tasks. To meet the high computing power requirements of deep learning training and inference, the power consumption of chips (such as GPUs and ASICs) in AI computing servers has increased dramatically, with their heat dissipation generally exceeding 800W. Ensuring the long-term reliable operation of chips under high heat flux density is a key challenge currently facing server thermal design.

[0003] Currently, the mainstream heat dissipation solution for such high heat flux density chips is still air-cooled heat sinks. The basic working principle is: heat is quickly absorbed by copper heat pipes attached to the chip and conducted to a large-area fin array; then, a fan generates forced convection, and the heat is carried away by the flow of cool air across the fin surface, thus completing the heat exchange process.

[0004] However, when dealing with extreme heat loads of 800W and above, traditional air-cooled radiators reveal the following inherent drawbacks: First, there's the issue of reduced heat exchange efficiency under high airflow. When the heat generated by the chip increases dramatically, the motherboard typically increases the fan speed to increase airflow and attempt to improve heat dissipation. However, excessively high airflow speeds drastically shorten the residence time of the airflow between the fins, creating an "airflow short-circuit" phenomenon. This means the airflow leaves before it has fully exchanged heat with the fins, resulting in a reduced convective heat transfer coefficient and an inability to effectively remove the high heat flux from the fins, thus reducing the overall cooling effect.

[0005] Secondly, there's the issue of heat dissipation blind spots caused by motor obstruction. Due to the fan's inherent structure, the motor itself occupies the core of the fan blade rotation area. The area that truly generates effective airflow is primarily the rotational region from the two-thirds of the fan blade's length to the blade tip. Therefore, the fins directly facing the motor's projection area (usually located in the center of the radiator) struggle to receive direct, vertical airflow. Furthermore, after passing over the motor's surface, the airflow creates a low-speed turbulence zone or even a recirculation zone on its leeward side. This means that the fins in the middle of the radiator, directly facing the motor, not only lack the direct impact of high-speed cool air but are also easily enveloped by the heated, turbulent airflow, forming localized hot spots that severely restrict the overall temperature uniformity and heat dissipation limits of the radiator.

[0006] In summary, existing air-cooled heat sinks suffer from low local heat dissipation efficiency and central heat dissipation dead zones due to airflow characteristics when dealing with ultra-high power AI chips, making it difficult to meet the heat dissipation requirements of AI computing servers for long-term high-efficiency operation. Summary of the Invention

[0007] The purpose of this invention is to address the shortcomings of existing technologies by providing a heat dissipation structure based on server chips, so as to achieve efficient and uniform heat dissipation and eliminate heat dissipation dead zones.

[0008] The objective of this invention can be achieved through the following technical solutions: A heat dissipation structure based on a server chip includes a base, and the structure further includes: The bracket is fixedly mounted on the base; The copper tubes are provided in several groups, and the groups of copper tubes are U-shaped and pass through the base; The fins are provided in several groups, with the groups of fins distributed at intervals and each group being sleeved on several copper tubes. Mounting frame, the mounting frame is mounted on one side of the bracket, the mounting frame is located on one side of a plurality of fins; A cooling fan, which is fixedly mounted on the side of the mounting frame; A drive mechanism is installed inside the mounting frame, and the air source of the cooling fan is the drive source of the drive mechanism. The outer frame is provided in two sets, with the two sets of outer frames located on opposite sides of several fins, and the outer frame is fixed on the bracket; A rotating rod is rotatably mounted on the outer frame. Several spiral plates are provided around the rotating rod. The driving mechanism drives the rotating rod to rotate the spiral plates, thereby reducing the distance between adjacent sets of fins.

[0009] As a further embodiment of the present invention: the driving mechanism includes a wind-gathering plate and a fixed ring. The fixed ring is fixed in the mounting frame by several sets of connecting rods. The wind-gathering plate is movably sleeved on the outside of the fixed ring. Several elastic elements are connected between the wind-gathering plate and the end of the fixed ring. Two sets of multi-segment bending plates are symmetrically arranged on the wind-gathering plate. The multi-segment bending plates pass through the mounting frame. The mounting frame is provided with guide grooves for the movement of the multi-segment bending plates. A rack is provided at the other end of the multi-segment bending plates. A gear is provided at the end of the rotating rod. The rack and the gear mesh with each other.

[0010] As a further aspect of the present invention: the bottom extension of the spiral plate abuts against the top extension of the fin, and the height difference between the top and bottom ends of several spiral plates gradually increases from bottom to top.

[0011] As a further aspect of the present invention, a plurality of ball bearings are rotatably mounted on the outer edge of the bottom of the spiral plate.

[0012] As a further aspect of the present invention: a plurality of elastic elements are provided inside the outer frame, and the bottom surface of the fin abuts against the top of the elastic element.

[0013] As a further aspect of the present invention: a sleeve is provided in the area where the fin penetrates the copper tube, the fin moves along the axial direction of the sleeve, and the sleeve is tightly fitted around the outside of the copper tube.

[0014] As a further aspect of the present invention: the air-gathering plate faces the back mounting plate of the cooling fan, the outer ring of the projection of the back mounting plate of the cooling fan is inside the air-gathering plate, the outer ring of the side of the air-gathering plate facing the back mounting plate of the cooling fan is provided with an annular slope, and several through holes are opened on the air-gathering plate.

[0015] As a further aspect of the present invention: the stacked fins are located outside the mounting frame.

[0016] The beneficial effects of this invention are: (1) In this invention, by setting the linkage between the drive mechanism and the rotating rod, the airflow generated when the cooling fan speeds up is used as the driving force to drive the rotating rod to rotate and drive the spiral plate to press down the fins, so that the spacing between adjacent fins is uniformly reduced. This dynamic adjustment mechanism can effectively reduce the boundary layer thickness on the surface of the fins when the chip is generating high heat, while moderately increasing the wind resistance to optimize the airflow velocity, thereby significantly improving the convective heat transfer coefficient and solving the problem that the heat exchange efficiency of traditional air-cooled heat sinks decreases due to the short airflow residence time under high airflow. (2) In this invention, a ball bearing is mounted on the outer edge of the bottom of the spiral plate and an elastic element is provided inside the outer frame, so that the fins vibrate slightly as they move down with the spiral plate. This vibration can, on the one hand, break the boundary layer on the surface of the fins, promote the formation of turbulent airflow, enhance the intense mixing of air particles, and greatly improve the heat transfer efficiency from the fins to the air; on the other hand, the vibration can shake off the dust and other impurities attached to the surface of the fins and discharge them with the airflow, ensuring that the fins always maintain a clean heat exchange area and further improving the heat dissipation stability during long-term operation. (3) In this invention, by setting a concentrator plate in the drive mechanism and opening through holes and setting an annular slope on the concentrator plate, some of the cold air flow can pass through the through holes and blow directly onto the fins facing the motor projection area. This structure effectively solves the problem of heat dissipation blind spots caused by motor obstruction in traditional fans, ensuring that the fins in the middle area of ​​the radiator can also obtain vertically blown cold air, avoiding the formation of local high temperature hot spots, and realizing the overall uniform heat dissipation of the fin array. Attached Figure Description

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram showing the positional relationship between the cooling fan and the drive mechanism in this invention; Figure 3This is a schematic diagram of the disassembled drive mechanism in this invention; Figure 4 This is a schematic cross-sectional view of the drive mechanism in this invention; Figure 5 This is a schematic diagram of the outer frame structure in this invention; Figure 6 This is a schematic diagram of the sleeve structure in this invention; Figure 7 This is a schematic diagram of the elastic element 2 and the spiral plate structure in this invention; Figure 8 This is a schematic diagram of the spiral plate distribution structure in this invention; Figure 9 This is a schematic diagram showing the positional relationship between the spiral plate and the fins in this invention.

[0019] In the picture: 1. Base; 2. Bracket; 3. Copper pipe; 4. Fin; 41. Sleeve; 5. Mounting frame; 51. Guide groove; 6. Cooling fan; 7. Drive mechanism; 71. Air concentrator; 711. Through hole; 712. Circular slope; 72. Fixing ring; 721. Connecting rod; 722. Elastic component one; 73. Multi-segment bending plate; 731. Rack; 8. Outer frame; 81. Elastic component two; 9. Rotating rod; 91. Gear; 92. Spiral plate; 921. Ball bearing. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] like Figures 1-9As shown, a heat dissipation structure based on a server chip includes a base 1. The structure further includes: a bracket 2, which is fixedly mounted on the base 1; copper pipes 3, which are arranged in several groups, and the groups of copper pipes 3 are U-shaped and pass through the base 1; fins 4, which are arranged in several groups, and the groups of fins 4 are spaced apart and each is sleeved on the copper pipes 3; a mounting frame 5, which is mounted on one side of the bracket 2 and located on one side of the fins 4; a cooling fan 6, which is fixedly mounted on the side of the mounting frame 5; a drive mechanism 7, which is installed inside the mounting frame 5, and the air source of the cooling fan 6 is the drive source of the drive mechanism 7; an outer frame 8, which is arranged in two groups, and the two groups of outer frames 8 are located on opposite sides of the fins 4, and the outer frame 8 is fixed on the bracket 2; and a rotating rod 9, which is rotatably mounted on the outer frame 8, and the rotating rod 9 is surrounded by several spiral plates 92. The drive mechanism 7 drives the rotating rod 9 to rotate the spiral plates 92, thereby reducing the distance between adjacent groups of fins 4. Several stacked fins 4 are located outside the mounting frame 5.

[0022] In practical application, TIM material is applied between the copper tube 3 and the chip. The heat generated by the chip is absorbed by the copper tube 3, and the copper tube 3 then transfers the heat to the array fins 4. The cooling fan 6 blows external cold air toward the fin array 4, thereby allowing the cold air to carry away the heat from the surface of the fins 4. When the heat generated by the chip increases, the motherboard connected to the chip controls the cooling fan 6 to speed up. This increases the airflow speed, and the high-speed airflow drives the drive mechanism 7. The drive mechanism 7 then drives the rotating rod 9 to rotate, causing several spiral plates 92 on the rod 9 to rotate. The rotating spiral plates 92 press down on the fins 4, shortening the distance between adjacent sets of fins 4. By pre-setting the dimensions of the drive mechanism 7, the rotating rod 9, and the spiral plates 92, the distance between adjacent sets of fins 4 is prevented from shrinking indefinitely, avoiding excessive air resistance when the airflow passes through adjacent sets of fins 4, which would reduce the cooling effect instead of increasing it. When the airflow passes through the channel between two sets of fins 4, the extremely thin layer of air adhering to the fins 4 is stationary (due to viscous force), and the heat must... Heat must pass through this boundary layer via thermal conduction to be carried away by the mainstream cold air. This boundary layer acts like a blanket, hindering heat transfer. The thicker the boundary layer, the greater the thermal resistance. When the chip generates a lot of heat, the distance between two adjacent sets of fins 4 is slightly reduced. With the heat dissipation area of ​​fins 4 remaining unchanged, the boundary layer between the two adjacent sets of fins 4 becomes thinner. At the same time, the slight reduction in the distance between the two adjacent sets of fins 4 will slightly increase the wind resistance in the channel. This will slow down the airflow speed in the channel. Although the airflow stays in the channel for a shorter time than when the chip generates less heat, the thinner boundary layer makes it easier for heat to be conducted from the fins 4 to the air, increasing the heat transfer coefficient and thus improving the overall heat dissipation effect.

[0023] Furthermore, the drive mechanism 7 includes a wind-gathering plate 71 and a fixing ring 72. The fixing ring 72 is fixed in the mounting frame 5 by several sets of connecting rods 721. The wind-gathering plate 71 is movably sleeved on the outside of the fixing ring 72. Several elastic elements 722 are connected between the ends of the wind-gathering plate 71 and the fixing ring 72. Two sets of multi-segment bending plates 73 are symmetrically arranged on the wind-gathering plate 71. The multi-segment bending plates 73 penetrate the mounting frame 5. The mounting frame 5 is provided with guide grooves 51 for the multi-segment bending plates 73 to move. The other end of the multi-segment bending plates 73 is provided with a rack 731. The end of the rotating rod 9 is provided with a gear 91. The rack 731 and the gear 91 mesh with each other.

[0024] The bottom extension of the spiral plate 92 abuts against the top extension of the fin 4, and the height difference between the top and bottom of several spiral plates 92 gradually increases from bottom to top.

[0025] In one embodiment, the height difference between the top and bottom ends of the spiral plate 92 is h. The heights of the spiral plates 92 are arranged in an arithmetic sequence. Looking from bottom to top, when the height of the first spiral plate 92 is H, the height of the second spiral plate 92 is 2H, the height of the third spiral plate 92 is 3H, that is, the height of the i-th spiral plate 92 is i times that of the first one, and so on. At the same time, the distance between the highest ends of two adjacent sets of spiral plates 92 is equal, so that the several sets of spiral plates 92 correspond to several sets of fins 4. In addition, the number of turns of the several spiral plates 92 is equal. In the initial state, the spacing between adjacent fins 4 is equal. The elastic element 722 can be a spring or other components that can provide rebound capability.

[0026] In practical application, when the heat generated by the chip increases, the motherboard connected to the chip will control the cooling fan 6 to speed up. At this time, the airflow speed increases, and the high-speed airflow applies a force to the air-collecting plate 71 towards the fixing ring 72, causing the air-collecting plate 71 to move towards the fixing ring 72. At the same time, several elastic elements 722 are compressed, and the multi-section bent plate 73 moves along the guide groove 51 towards the rotating rod 9, causing the rack 731 to gradually approach the gear 91 and mesh with the gear 91, thereby driving the gear 91 to rotate. This causes the rotating rod 9 to drive several spiral plates 92 to rotate, and each spiral plate 92 pushes the corresponding fin 4 downward. Since the number of rotations of several spiral plates 92 is equal, but the height is proportional to the sequence number, therefore... The lead of each spiral plate 92 is also proportional to the serial number. The downward movement of fin 4 is equal to the lead multiplied by the rotation angle. Therefore, the downward movement of fin 4 is also proportional to the serial number. Since the spacing between adjacent fins 4 is equal in the initial state and the difference in the downward movement of fin 4 is constant, the distance between two adjacent sets of fins 4 remains equal during and after the downward movement of fin 4. That is, the spacing between two adjacent sets of fins 4 is uniformly reduced as a whole. This fine-tunes the reduction in the distance between two adjacent sets of fins 4. With the heat dissipation area of ​​fin 4 remaining unchanged, the boundary layer between two adjacent sets of fins 4 becomes thinner, making it easier for heat to be conducted from fin 4 to the air, thereby increasing the heat transfer coefficient and thus improving the overall heat dissipation effect. When the heat generated by the chip decreases, the speed of the cooling fan 6 also decreases. At this time, the force exerted by the airflow on the air-collecting plate 71 will decrease. Through the rebound of the elastic element 722, the air-collecting plate 71 moves away from the fixed ring 72, thereby causing the multi-section bending plate 73 to move away from the rotating rod 9, causing the rotating rod 9 to reverse, thereby making the overall spacing between the two adjacent sets of fins 4 uniformly increase and return to the original spacing value.

[0027] Furthermore, a number of ball bearings 921 are rotatably mounted on the outer edge of the bottom of the spiral plate 92.

[0028] The outer frame 8 is provided with several elastic elements 81, and the bottom surface of the fin 4 abuts against the top of the elastic element 81.

[0029] In one embodiment, the elastic element 81 may be a spring or other component capable of providing rebound capability.

[0030] In practical application, when the spiral plate 92 rotates, the outer edge of the top of the fin 4 moves along the spiral line of the bottom edge of the spiral plate 92 relative to the spiral plate 92. When the fin 4 moves to the ball 921, the fin 4 will have a large displacement. When the fin 4 passes the ball 921, the elastic element 81 rebounds or extends, causing the fin 4 to vibrate slightly. This vibration may disrupt the boundary layer at the fin 4, allowing the cold air to contact the surface of the fin 4 more directly and carry away heat, further improving the heat transfer coefficient and the overall heat dissipation effect. At the same time, this vibration will cause the airflow through the channel to be in a chaotic turbulent state. The intense mixing of air particles in the turbulence can greatly improve the heat transfer efficiency from the fin 4 to the air, thereby further improving the overall heat dissipation effect. In addition, when dust and other impurities are attached to the fins 4, this vibration can make the stationary dust and other impurities shake, which can shake them off to a certain extent and separate them from the fins 4 with the airflow, thereby ensuring the heat exchange area of ​​the fins 4, improving the heat exchange effect of the fins 4, and thus improving the overall heat dissipation effect.

[0031] Furthermore, a sleeve 41 is provided in the area where the fin 4 penetrates the copper tube 3, and the fin 4 moves along the axial direction of the sleeve 41, with the sleeve 41 tightly fitted around the outside of the copper tube 3.

[0032] In practical application, the fins 4 move along the direction of the sleeve 41 when they move. The sleeve 41 protects the copper tube 3 and prevents the copper tube 3 from being scratched, thereby improving the service life of the copper tube 3. The inner wall of the sleeve 41 is tightly fitted to the inner wall of the copper tube 3, thereby ensuring the heat conduction efficiency of heat transfer from the copper tube 3 to the sleeve 41 and from the sleeve 41 to the fins 4.

[0033] like Figures 2-4 As shown, the air-gathering plate 71 faces the back mounting plate of the cooling fan 6. The outer ring of the projection of the back mounting plate of the cooling fan 6 is inside the air-gathering plate 71. The outer ring of the side of the air-gathering plate 71 facing the back mounting plate of the cooling fan 6 is provided with an annular slope 712. Several through holes 711 are opened on the air-gathering plate 71.

[0034] In practical application, the cold airflow generated by the cooling fan 6 enters the air-collecting plate 71 through the gap between the annular slope 712 extending from the outer edge of the air-collecting plate 71 and the back of the motor mounting plate, thereby pushing the air-collecting plate 71 to move. Part of the airflow is used to push the air-collecting plate 71 to move, while another part of the airflow passes through several through holes 711 and fixing rings 72 and blows onto several fins 4, so that the fins 4 facing the motor projection area receive a vertically blowing direct cold airflow, ensuring that all areas of several fins 4 can be in uniform contact with the cold airflow, avoiding the existence of heat dissipation blind spots, thereby further improving the overall heat dissipation effect.

[0035] Working principle: When the server chip is working, the heat generated by the chip is transferred to the copper pipe 3 on the base 1 through the TIM material. The copper pipe 3 conducts the heat to several sets of fins 4 sleeved around it. In the initial state, the cooling fan 6 runs at normal speed, and the generated airflow blows towards the fin array 4, taking away the heat on the surface of the fin 4, thus completing the basic heat dissipation. When the heat generated by the chip increases dramatically, the motherboard controls the cooling fan 6 to speed up, increasing the airflow velocity. The high-speed airflow blows towards the air-collecting plate 71, and the airflow enters the gap between the air-collecting plate 71 and the mounting plate on the back of the cooling fan 6 along the annular slope 712, applying pressure to the air-collecting plate 71. This causes it to overcome the elastic force of the elastic element 722 and move towards the fixing ring 72. As the air-collecting plate 71 moves, it drives the multi-segment bent plates 73 to slide along the guide groove 51 towards the rotating rod 9. The racks 731 at the ends of the multi-segment bent plates 73 mesh with the gears 91 at the ends of the rotating rod 9, driving the gears 91 to rotate, which in turn drives the rotating rod 9 to rotate. When the rotating rod 9 rotates, the several spiral plates 92 arranged around it rotate accordingly. Since the bottom extension of the spiral plates 92 abuts against the top extension of the fins 4, and The height of several spiral plates 92 increases gradually from bottom to top (in an arithmetic sequence). Each spiral plate 92 pushes the corresponding fin 4 to move down along the sleeve 41, and the amount of downward movement is proportional to the number of the spiral plate 92. This makes the overall spacing between adjacent fins 4 uniformly reduced. With the heat dissipation area of ​​the fins 4 remaining unchanged, the boundary layer between two adjacent sets of fins 4 becomes thinner, making it easier for heat to be conducted from the fins 4 to the air, thus increasing the heat transfer coefficient and improving the overall heat dissipation effect. At the same time, when the fins 4 move to the ball bearing 921 at the bottom of the spiral plate 92, the fins 4 produce a large displacement. After passing the ball bearing 921, the elastic element 81 in the outer frame 8 rebounds, causing the fins 4 to vibrate slightly, breaking the boundary layer on the surface of the fins 4 and shaking off the attached impurities. During this process, another portion of the cool air generated by the cooling fan 6 passes through several through holes 711 and the fixing ring 72 on the air-collecting plate 71, and blows directly onto the fins 4 facing the motor projection area, ensuring that this area can also receive vertically blown cool air and eliminating heat dissipation blind spots. When the heat generated by the chip decreases and the speed of the cooling fan 6 decreases, the pressure of the airflow on the air-collecting plate 71 decreases, the elastic element 1 722 rebounds, pushing the air-collecting plate 71 to reset. Through the reverse transmission of the rack 731 and the gear 91, the rotating rod 9 reverses, the spiral plate 92 moves upward, and the fins 4 return to the initial spacing under the push of the elastic element 2 81, completing the adaptive adjustment process.

Claims

1. A heat dissipation structure based on a server chip, comprising a base (1), characterized in that, The structure also includes: The bracket (2) is fixedly installed on the base (1); Copper tube (3), the copper tube (3) is provided in several groups, the several groups of copper tube (3) are U-shaped and pass through the base (1); Fins (4), the fins (4) are provided in several groups, the several groups of fins (4) are distributed at intervals and are all sleeved on the outside of several copper tubes (3); Mounting frame (5), the mounting frame (5) is mounted on one side of bracket (2), the mounting frame (5) is located on one side of several fins (4); Cooling fan (6), the cooling fan (6) is fixedly installed on the side of the mounting frame (5); The drive mechanism (7) is installed in the mounting frame (5), and the air source of the cooling fan (6) is the drive source of the drive mechanism (7). The outer frame (8) is provided in two sets, and the two sets of outer frames (8) are respectively located on opposite sides of a number of fins (4). The outer frame (8) is fixed on the bracket (2). Rotating rod (9), the rotating rod (9) is rotatably mounted on the outer frame (8), and a number of spiral plates (92) are provided around the rotating rod (9). The driving mechanism (7) drives the rotating rod (9) to rotate and drive the number of spiral plates (92) to reduce the distance between adjacent sets of fins (4).

2. The heat dissipation structure based on a server chip according to claim 1, characterized in that, The drive mechanism (7) includes a wind-gathering plate (71) and a fixing ring (72). The fixing ring (72) is fixed in the mounting frame (5) by several sets of connecting rods (721). The wind-gathering plate (71) is movably sleeved on the outside of the fixing ring (72). Several elastic elements (722) are connected between the ends of the wind-gathering plate (71) and the fixing ring (72). Two sets of multi-segment bending plates (73) are symmetrically arranged on the wind-gathering plate (71). The multi-segment bending plates (73) penetrate the mounting frame (5). The mounting frame (5) is provided with a guide groove (51) for the multi-segment bending plates (73) to move. A rack (731) is provided at the other end of the multi-segment bending plates (73). A gear (91) is provided at the end of the rotating rod (9). The rack (731) and the gear (91) mesh with each other.

3. The heat dissipation structure based on a server chip according to claim 2, characterized in that, The bottom extension of the spiral plate (92) abuts against the top extension of the fin (4), and the height difference between the top and bottom of several spiral plates (92) gradually increases from bottom to top.

4. The heat dissipation structure based on a server chip according to claim 3, characterized in that, Several balls (921) are rotatably mounted on the outer edge of the bottom of the spiral plate (92).

5. The heat dissipation structure based on a server chip according to claim 4, characterized in that, The outer frame (8) is provided with a plurality of elastic elements (81), and the bottom surface of the fin (4) abuts against the top of the elastic elements (81).

6. The heat dissipation structure based on a server chip according to claim 5, characterized in that, The area through which the fin (4) penetrates the copper tube (3) is provided with a sleeve (41), the fin (4) moves along the axial direction of the sleeve (41), and the sleeve (41) is tightly fitted around the copper tube (3).

7. The heat dissipation structure based on a server chip according to claim 2, characterized in that, The air-gathering plate (71) faces the back mounting plate of the cooling fan (6), and the outer ring of the projection of the back mounting plate of the cooling fan (6) is inside the air-gathering plate (71). The outer ring of the side of the air-gathering plate (71) facing the back mounting plate of the cooling fan (6) is provided with an annular slope (712), and several through holes (711) are opened on the air-gathering plate (71).

8. The heat dissipation structure based on a server chip according to claim 1, characterized in that, Several stacked fins (4) are located outside the mounting frame (5).

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